EP3C10U256C6 - 10,320-Cell 500 MHz FPGA | Altera
MPN: EP3C10U256C6 ✗ انتهى عمره الإنتاجيEP3C10U256C6 نظرة عامة
An FPGA is a semiconductor device whose digital logic and interconnect structure can be programmed after manufacture. The Cyclone III family occupies the FPGA and CPLD hierarchy within programmable logic devices, offering a practical balance between logic capacity, I/O availability, power consumption, and design cost. Unlike a fixed-function application-specific integrated circuit, an FPGA can be updated during development to add interfaces, revise control sequences, or consolidate several supporting functions into one device.
The verified device data identifies 10,320 logic cells, 500 MHz operation, 65 nm fabrication, and a 1.2 V core supply. Its 256-LFBGA package provides 256 external terminals and supports compact board-level integration where routing density is important. The LFBGA form factor can also make inspection and prototype rework more demanding than a leaded package, so land-grid alignment, assembly capability, and package documentation should be checked before layout release.
Cyclone III devices are commonly used where design flexibility matters more than the very highest programmable logic capacity. Typical logic blocks can implement state machines, bus controllers, data acquisition logic, protocol interfaces, and peripheral bridges. Because the exact pin assignment, memory configuration, supported I/O standards, and bank power requirements are not included in the supplied verified data, they must be confirmed against the manufacturer device documentation before schematic capture or PCB layout.
The EP3C10U256C6 is appropriate for industrial automation modules, compact communications equipment, test and measurement products, video-processing interfaces, and embedded control systems. It is particularly attractive when multiple fixed functions need consolidated logic or when a late design change must be implemented without changing the PCB. Quartus compilation, pin assignment, timing closure, and programming-file generation should be performed using the supported Altera or Intel FPGA toolchain for the selected device.
Power, decoupling, and pin planning are critical in a 256-ball BGA implementation. Follow the manufacturer power-supply and decoupling guidance, route each supply plane carefully, and validate signal integrity and heat dissipation on the assembled PCB. Do not infer I/O voltage limits, pin names, or power-up requirements from the abbreviated distributor listings; obtain the complete device and package documentation before design release.
This product page consolidates the verified 10,320-cell, 500 MHz, 65 nm, 1.2 V, and 256-LFBGA attributes with sourcing links, application guidance, package considerations, and documented data gaps. It is intended to accelerate initial device selection while clearly separating verified specifications from information that still requires manufacturer documentation.
بدائل مباشرة لـ EP3C10U256C6 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3C10U256C6 (نفس عامل الشكل والبصمة) — يختلف في Terminal Form.
EP3C10U256C6N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C10U256C7
✅ بديل مباشرتواصل لمعرفة السعر
EP3C10U256C8N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C10U256C6 الحدود القصوى والخصائص الكهربائية
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Cell Count | 10,320 cells |
| Maximum Device Speed | 500 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| العلبة | 256-LFBGA |
| Number of Terminals | 256 balls |
| Package Shape | Square |
| Terminal Form | Ball |
| نوع التركيب | Surface mount |
| Programmable Device Category | FPGA |
| Product Family | Cyclone III |
| Manufacturer | Altera |
| RoHS Compliance | unknown |
| REACH Compliance | unknown |
دليل تكوين أطراف EP3C10U256C6 square
تكوين الأطراف لـ EP3C10U256C6 (حزمة square). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3C10U256C6.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3C10U256C6 مناسب لـ 6 التطبيقs: Industrial Automation and PLC Control, Communications and Network Interface, Test and Measurement Instrumentation, Embedded Video and Display Control, Consumer and Portable Embedded Products, Programmable Signal Conditioning.
Industrial Automation and PLC Control
The EP3C10U256C6 fits compact industrial control logic because its verified 10,320 logic cells can support state machines, sequencing, interlocks, and peripheral-control functions at up to a 500 MHz device speed. The 256-LFBGA package also provides a high pin-count interconnect option for parallel sensors, counters, and field-bus gateways. Before releasing an industrial design, confirm the device’s exact temperature grade, I/O voltage range, supported standards, and lifecycle commitment in the manufacturer documentation. Hardware should include defined reset behavior, configuration validation, watchdogs, and a recovery path so a programmable-logic fault does not create an unsafe machine state.
موصى به
Communications and Network Interface
The EP3C10U256C6 can implement protocol conversion, packet framing, test patterns, and custom interface logic in communications equipment. Its 10,320 logic cells provide enough fabric for parallel-to-serial data paths and control state machines, while the 500 MHz maximum device speed supports timing-critical logic paths when properly constrained. A communications design must budget the actual I/O standard, pin assignments, clock quality, and timing margins. The EP3C10U256C6 should be paired with a compatible transceiver or PHY, and engineers should validate signal integrity and protocol interoperability before production.
موصى به
Test and Measurement Instrumentation
The EP3C10U256C6 is suitable for programmable acquisition, trigger, timing, and instrument-control logic where flexible digital behavior is more valuable than a fixed application-specific integrated circuit. The verified 10,320-cell fabric and 500 MHz maximum speed support counters, digital correlation, waveform sequencing, and test-vector generation. For accurate instrumentation, engineers must define clock domains, constrain input timing, and account for package and board propagation delay. A precision reference and low-noise analog signal path should remain separate from the FPGA’s digital supply and I/O returns to reduce measurement error.
موصى به
Embedded Video and Display Control
The EP3C10U256C6 can implement pixel timing, display sequencing, overlay control, and custom video-interface logic for embedded display systems. Its 10,320 logic cells and 500 MHz maximum device speed are useful for parallel timing generation and synchronous control logic, while the 256-LFBGA package offers dense external connectivity. The actual usable bandwidth and pin count depend on the selected I/O standards and device speed grade, which are not supplied here. Designers should validate horizontal and vertical blanking, color depth, synchronization tolerance, and clocking margins in the target display environment.
موصى به
Consumer and Portable Embedded Products
The EP3C10U256C6 offers a compact programmable-logic option for consumer products that combine user-interface control, status logic, and multiple peripheral interfaces. Its 256-LFBGA package supports space-constrained boards, and its 10,320 logic cells can consolidate fixed control functions while preserving design flexibility. However, the verified data does not provide the operating-temperature range, power consumption, or lifecycle commitment required for a consumer product. Thermal validation, ESD design, BGA assembly capability, and long-term sourcing should therefore be resolved before committing the device to a high-volume design.
موصى به
Programmable Signal Conditioning
The EP3C10U256C6 can serve as the digital control and data-processing element in programmable sensor-conditioning equipment. The 10,320-cell fabric is suitable for digital calibration tables, filtering control, sample sequencing, and communication formatting, while the 500 MHz maximum speed supports high-rate decision logic when timing closure is achieved. The FPGA should receive clean, level-compatible sensor signals and use synchronized clocking for multi-channel acquisition. Engineers must confirm input thresholds, I/O standards, and available bank power in the manufacturer documentation, and should test channel skew and calibration repeatability across temperature.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3C10U256C6 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3C10U256C6N | EP3C10U256C7 | EP3C10U256C8N |
|---|---|---|---|---|
| Package | 256-LFBGA | 256-BGA - same package class | 256-LFBGA | 256-LFBGA |
| Brand | Altera | Altera | Altera | Altera |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
أبرز الفروقات
- Explicitly documented complete replacement (مقابلEP3C10U256C6N)
- Clear verified identity for design-in (مقابلEP3C10U256C7)
- Compact high-pin-count integration (مقابلEP3C10U256C8N)
ملاحظات التصميم
Treat the 256-LFBGA footprint as a controlled assembly interface. Obtain the manufacturer land pattern, ball-map table, and stack-up requirements before routing. Place decoupling and power-plane connections directly beneath the relevant device balls where the package guidance permits, and preserve solder-mask and paste-printing symmetry. Because the supplied data does not include the complete pinout, no ball assignments should be inferred from a generic BGA library.
Confirm the 1.2 V core-supply requirement and all I/O-bank supply limits in the complete manufacturer data before power-tree design. Follow the device-specific recommended capacitors, regulator tolerances, sequencing, and power-up behavior rather than copying a generic FPGA schematic. Check startup current, rail droop, and simultaneous I/O switching in a power-integrity simulation. These details are not available in the verified search snippets and must be obtained before schematic release.
Plan external clock, configuration, and high-speed interface routing as a dedicated signal-integrity task. Use a continuous return path beneath clocks and apply the manufacturer’s constraints for each I/O standard. Keep the FPGA, clock source, memory, and power regulators in a predictable placement that shortens high-speed loops. Complete timing analysis with realistic board models; the stated 500 MHz figure is a maximum device-speed attribute, not a guarantee that every design will close at 500 MHz.
Avoid substituting an FPGA solely because its logic-cell count and package are similar. Validate configuration behavior, JTAG pins, power rails, I/O standards, clock inputs, embedded memory, maximum pin voltage, and operating-temperature grade. The EP3C10U256C6N is explicitly described by the verified FindIC comparison as a complete replacement, while EP3C10U256C7 and EP3C10U256C8N remain candidates requiring further manufacturer-level comparison.
معلومات الامتثال
The supplied verified snippets do not provide explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. No compliance status has been assumed.
