EP3C16E144C8 - 15,408-Cell 402 MHz Cyclone III FPGA | Intel
MPN: EP3C16E144C8 ✗ انتهى عمره الإنتاجيEP3C16E144C8 نظرة عامة
A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor in which the logic, memory, and I/O behavior is defined by a programmable configuration file. Within the semiconductor hierarchy, an FPGA belongs to the programmable-logic and programmable-device families. The Cyclone III architecture combines configurable logic elements, embedded RAM, dedicated multipliers, and general-purpose I/O to implement control, interface, signal-processing, and embedded-system functions without changing the physical PCB.
The EP3C16E144C8 provides 15,408 logic cells and 516,096 bits of embedded RAM, giving a designer moderate logic and storage capacity on a single device. Its stated 402 MHz maximum clock supports demanding control logic, communications interfaces, industrial automation, and embedded processing systems. The 84-I/O count provides substantial connectivity for external memories, converters, transceivers, and industrial peripherals.
Cyclone III devices use programmable configuration data to establish the FPGA's internal circuit paths after power-up. Configuration storage must preserve the valid bitstream during operation and reload it after power is restored. Designers must also account for the 1.2 V core supply, the package's exposed thermal pad, and the voltage requirements of attached I/O banks when implementing the power architecture.
Typical uses include industrial factory controllers, communication equipment, test and measurement instruments, embedded control systems, and interface adapters. The 144-pin LQFP package is also easier to inspect and rework than many fine-pitch ball-grid-array packages, making the device useful where prototype visibility, manual assembly, or cost-controlled fabrication is important.
The most important design trade-off is that this device is an older Cyclone III FPGA whose lifecycle, tool support, and availability should be confirmed before a new production commitment. Designs should also verify the exact speed, temperature, and qualification requirements rather than assuming that similarly named EP3C16 variants are interchangeable.
This page consolidates the supplied distributor specifications, package information, pricing availability, and verified cross-reference candidates with engineering guidance focused on migration, pin compatibility, configuration, power delivery, and sourcing risk. It also distinguishes verified drop-in options from unverified functional substitutes.
بدائل مباشرة لـ EP3C16E144C8 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3C16E144C8 (نفس عامل الشكل والبصمة) — يختلف في Package, Family, Speed Grade, Total Memory Bits, User I/O Count.
EP3C16E144C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16E144A7N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C16E144C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C16E144C6N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C10E144C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16E144C8 الحدود القصوى والخصائص الكهربائية
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Cells | 15,408 cells |
| Embedded Memory | 516,096 bits |
| أقصى تردد للساعة | 402 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| User I/O Count | 84 I/O |
| العلبة | 144-pin LQFP with exposed pad |
| Total Terminals | 144 terminals |
| Terminal Form | Gull wing |
| Package Shape | Square |
| Package Code | LFQFP / EQFP |
| نوع التركيب | Surface mount |
دليل تكوين أطراف EP3C16E144C8 lfqfp / eqfp
تكوين الأطراف لـ EP3C16E144C8 (حزمة lfqfp / eqfp). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3C16E144C8.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3C16E144C8 مناسب لـ 6 التطبيقs: Industrial Automation and Factory Control, Communications Interface and Protocol Bridging, Test and Measurement Instrumentation, Embedded Control and Sensor Conditioning, Video and Display Interface Support, Prototype and Low-Volume Programmable Systems.
Industrial Automation and Factory Control
The Intel EP3C16E144C8 fits factory-control logic that must coordinate sensors, actuators, interlocks, and machine sequencing on one programmable board. Its 15,408 logic cells provide enough capacity for state machines, communication handling, and supervisory control, while 84 I/O offer substantial board-level connectivity. The 402 MHz maximum clock allows the design to combine real-time control with protocol conversion rather than using several fixed-function devices. The 1.2 V core rail requires a clean regulated supply, and the exposed pad under the 144-pin LQFP should be connected to a properly sized thermal copper plane. Before deployment, confirm the exact temperature grade, industrial qualification, I/O-bank voltages, and lifecycle availability because those attributes are not established by the supplied listing.
موصى به
Communications Interface and Protocol Bridging
The EP3C16E144C8 is suitable for communications equipment that must translate between serial interfaces, maintain packet timing, and implement buffering or framing logic. Its 15,408 logic cells and 516,096 bits of embedded memory allow parallel datapaths, finite-state machines, and moderate buffering to coexist, while the 402 MHz maximum clock supports demanding serial and parallel logic. The 84-I/O device also reduces the number of external interface ICs required in a compact adapter. Engineers should use the Cyclone III handbook to verify I/O standards, pin assignments, clocking, and bank voltage constraints. Configuration retention and bitstream loading are equally important because an industrial communication controller must recover predictably after power cycling.
موصى به
Test and Measurement Instrumentation
The Intel EP3C16E144C8 can serve as the central programmable logic device in data-acquisition, pattern-generation, and automated test equipment. Its 15,408 logic cells are useful for coordinating triggers, counters, capture logic, and instrument control, while 516,096 bits of embedded memory provide on-chip storage for sampled or buffered data. A maximum clock of 402 MHz supports higher-rate acquisition pipelines when the external converters and memory interfaces can sustain them. The 144-pin LQFP package allows individual leads and the exposed pad to be inspected during prototype debugging. Timing closure remains the critical trade-off: engineers must constrain the clock and external interfaces correctly, account for board skew, and confirm the pinout and I/O voltage options directly from the Intel documentation.
موصى به
Embedded Control and Sensor Conditioning
The EP3C16E144C8 can combine sensor acquisition, digital filtering, state-machine control, and local data handling in an embedded control subsystem. Its 516,096 bits of embedded memory permit buffered samples and working storage, while 15,408 logic cells can implement filters, counters, event handling, and supervisory logic around the sensor interface. The 402 MHz maximum clock provides margin for pipelined digital signal-processing tasks, and the 84 I/O allow multiple sensors, converters, and control outputs to share one programmable device. For low-noise measurement systems, separate analog and digital return paths and provide stable reference and I/O supplies. The supplied information does not verify the exact I/O voltage range, so the selected bank voltages and external converter interfaces must be checked against the authoritative device documentation before release.
موصى به
Video and Display Interface Support
The EP3C16E144C8 can support modest display timing, pixel formatting, synchronization, and control functions where the complete system does not require a higher-end video processor. Its 15,408 logic cells and 84 I/O are suitable for parallel or control-oriented interfaces, and the 402 MHz maximum clock can handle timing and pixel-stream processing at rates appropriate to the selected external interface. The 1.2 V core supply leaves system-level design responsibility for I/O-bank voltage generation and signal conditioning. Designers should not infer support for a specific video standard from the family name alone; they must verify supported I/O standards, pin assignments, source-synchronous timing, and available board-level transceivers. The exposed pad should also be connected to an uninterrupted ground or thermal plane according to the package guidance.
موصى به
Prototype and Low-Volume Programmable Systems
The 144-pin LQFP/EQFP package makes the EP3C16E144C8 attractive for prototypes, educational platforms, and low-volume controller boards where lead visibility and reworkability are more valuable than the smallest possible footprint. Its exposed pad supports heat transfer to a PCB copper area, while the 144 gull-wing leads provide accessible test and assembly points compared with a fine-pitch BGA. The 15,408 logic cells and 402 MHz maximum clock allow meaningful control and communication functions to be consolidated rather than demonstrated with simple discrete logic. Engineers should plan a robust configuration mechanism, verify startup behavior, and keep the core and I/O supplies within the device's documented limits. For production migration, confirm software support, temperature grade, lifecycle status, and second-source availability rather than relying on prototype-only sourcing.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3C16E144C8 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3C16E144C8N | EP3C16E144A7N | EP3C16E144C7N | EP3C16E144C6N | EP3C10E144C8N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin LQFP/EQFP with exposed pad | 144-pin EP3C16 family package - same | 144-pin EP3C16 family package - same | 144-pin EP3C16 family package - same | 144-pin EP3C16 family package - same | 144-pin EP3C10 family package - same |
| Device Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Cells | 15,408 cells | 15,408 cells | 15,408 cells | 15,408 cells | 15,408 cells | Approximately 10,240 cells; exact value not verified |
| Embedded Memory | 516,096 bits | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data |
| Maximum Clock Frequency | 402 MHz | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data |
| Core Supply Voltage | 1.2 V | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data | Not verified in supplied cross-reference data |
| User I/O | 84 I/O | 84 I/O expected for same E144 device; verify in manufacturer documentation | 84 I/O expected for same E144 device; verify in manufacturer documentation | 84 I/O expected for same E144 device; verify in manufacturer documentation | 84 I/O expected for same E144 device; verify in manufacturer documentation | 84 I/O expected for E144 package; verify in manufacturer documentation |
| Process Technology | 65 nm | 65 nm for Cyclone III family | 65 nm for Cyclone III family | 65 nm for Cyclone III family | 65 nm for Cyclone III family | 65 nm for Cyclone III family |
| Verified Unit Price | $0.00 placeholder; no numeric price captured as of 2026-10-28 | Not verified in supplied data | Not verified in supplied data | Not verified in supplied data | Not verified in supplied data | Not verified in supplied data |
أبرز الفروقات
- Higher verified logic capacity than the EP3C10 migration option (مقابلEP3C10E144C8N)
- Direct same-family replacement evidence (مقابلEP3C16E144C8N)
- Comparable family resource capacity with grade-based migration (مقابلEP3C16E144A7N)
- Substantially more logic resources than typical low-capacity Cyclone III options (مقابلEP3C10E144C8N)
ملاحظات التصميم
Budget the 1.2 V core rail using the actual active current required by the final design. Estimated: core dissipation equals 1.2 V multiplied by measured core current; the supplied data does not provide a current limit, so no numerical dissipation is claimed. Decouple the core close to the supply pins, isolate sensitive analog or I/O-bank rails according to the device handbook, and verify startup sequencing against every configuration mode. Include adequate bulk capacitance for the core and local high-frequency decoupling at the device.
Treat the exposed pad as both an electrical and thermal feature. Follow the package drawing for its permitted connection, then provide a continuous PCB copper area with short thermal vias where the PCB stack-up permits. Estimated: the required copper area depends on actual core power, ambient temperature, and the verified package thermal resistance, none of which were fully supplied. Validate the final assembly with a thermal chamber or equivalent test because the 65 nm device is often placed alongside converters, regulators, and memory that also dissipate heat.
Use a layout compatible with the 144-lead LQFP/EQFP footprint and preserve solderable exposed-pad access for inspection and rework. Place decoupling capacitors and configuration-memory components near their associated device pins, keep switching-regulator and high-current paths away from sensitive clock and I/O routes, and provide a continuous return reference beneath the device. Check pad dimensions and paste volume against the manufacturer package drawing rather than relying on the generic package-diagram SVG, which is not an authoritative land pattern.
Do not treat every EP3C16E144 suffix as automatically interchangeable. The supplied cross-reference material surfaces EP3C16E144C8N and EP3C16E144A7N, but speed grade, temperature grade, qualification, lead finish, and lifecycle can differ. Before substitution, compare the complete ordering codes, pin table, timing specifications, configuration requirements, and package markings. For an EP3C10-family migration, require successful synthesis and timing closure because the smaller device has approximately 33.6% fewer logic cells than the 15,408-cell target.
Apply the Cyclone III handbook's clocking and I/O guidance to every high-speed interface. Use short, tightly controlled clock routes, provide a clean clock source with verified jitter, and include series termination where edge rates demand it. Keep configuration-data inputs away from noisy switching nodes, and establish return paths for high-speed I/O banks. Because the supplied data does not specify I/O standards or maximum I/O data rates, engineers must verify each interface against the exact speed-grade datasheet rather than extrapolating from the 402 MHz core-clock figure.
معلومات الامتثال
The supplied comparison result states that EP3C16E144C8N and EP3C16E144C8 differ in RoHS and REACH attributes, but it does not provide the actual values. No compliance claim is therefore inferred for the target or its alternatives.
