EP3C16U484C8 - 15408-Logic-Cell FPGA | Altera Corporation
MPN: EP3C16U484C8 ✓ نشطEP3C16U484C8 نظرة عامة
A field-programmable gate array, or FPGA, is a programmable digital integrated circuit in which designers configure interconnected logic elements, memory blocks, and input/output resources to implement a hardware function. FPGAs occupy the broader semiconductor and programmable-logic hierarchy. Compared with application-specific integrated circuits, an FPGA allows design revisions to be implemented through configuration rather than by manufacturing a new custom silicon device. Its fixed package, pin resources, and internal architecture must therefore be evaluated against the intended system requirements.
The EP3C16U484C8 provides 15,408 logic cells and 346 I/O pins according to the verified DigiKey listing. These figures make the device relevant to designs that need more external connectivity than a small programmable logic device while retaining a mid-density Cyclone III implementation. The 484-FBGA package supports compact board layouts, although its fine-pitch construction requires careful PCB design, assembly process control, and inspection.
The device is associated with the Cyclone III FPGA family and is offered by Altera, an Intel company, through major distributors. Its verified ordering information includes a -40°C to +125°C operating-temperature specification, providing a useful indication of its industrial-temperature capability. Other detailed operating data, including core voltage ranges, configuration characteristics, I/O standards, and speed-dependent timing, were not included in the supplied verified records and are identified as data-needed rather than estimated.
Typical design uses include industrial control, communications equipment, test and measurement systems, embedded processing, and general-purpose digital interface logic. In each case, the key engineering question is whether the 15,408 logic-cell resource and 346 I/O capability align with the design's parallel logic, memory, connectivity, and external interface requirements. Software support and the selected configuration method also need to be confirmed for the complete toolchain before release to production.
For PCB implementation, designers should use the manufacturer's package drawing and pinout rather than relying on distributor photographs or generic BGA diagrams. The 484-FBGA footprint requires adequate escape routing, plane geometry, solder-mask and paste control, thermal-via planning, and assembly capability for the selected ball pitch. Because the supplied records do not expose a verified pin-by-pin assignment, this page does not fabricate individual pin names.
This page consolidates the verified distributor identity, resource counts, package information, temperature range, sourcing links, and engineering guidance for EP3C16U484C8. It also separates confirmed values from unavailable technical parameters, enabling engineers to assess sourcing quickly while still completing device-level validation against the official Cyclone III documentation.
بدائل مباشرة لـ EP3C16U484C8 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3C16U484C8 (نفس عامل الشكل والبصمة) — يختلف في Package, Embedded Memory, Process Technology, Speed Grade, Operating Temperature.
EP3C16F484C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16F484C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16U484C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C16F484C7N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C16U484C6N
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
EP3C16U484C8 الحدود القصوى والخصائص الكهربائية
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Cells | 15,408 |
| Logic Blocks | 516,096 |
| I/O Pins | 346 |
| العلبة | 484-FBGA |
| Package Type | Other, LEAD FREE, MS-034 |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40°C to +125°C |
| Lead-Free Status | LEAD FREE |
دليل تكوين أطراف EP3C16U484C8 other, lead free, ms-034
تكوين الأطراف لـ EP3C16U484C8 (حزمة other, lead free, ms-034). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3C16U484C8.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3C16U484C8 مناسب لـ 6 التطبيقs: Industrial Control and Automation, Communications Interface Equipment, Test and Measurement Systems, Embedded Data Acquisition, Programmable Interface Cards, Portable and Embedded Instruments.
Industrial Control and Automation
The EP3C16U484C8 fits industrial control logic that requires substantial programmable resources and a broad external interface count. Its verified 15,408 logic cells can host parallel control, sequencing, diagnostic, and communications functions, while 346 I/O pins provide connectivity for sensors, actuators, interlocks, and field-bus transceivers. The reported -40°C to +125°C operating range is particularly relevant to factory equipment exposed to temperature variation. In implementation, engineers must assign I/O standards, validate timing against the selected speed grade, and reserve PCB resources for configuration and programming. Because core voltage, power dissipation, PLL resources, and supported I/O standards are not included in the supplied records, the device should be checked against the official Cyclone III documentation and Quartus fit report before schematic and thermal release.
موصى به
Communications Interface Equipment
The EP3C16U484C8 is suitable for communications equipment that needs adaptable parallel logic and many external connections. Its 15,408 logic cells can support framing logic, buffers, status registers, protocol adapters, and test paths, while 346 I/O pins allow concurrent connections to transceivers, memories, and control devices. Placing the FPGA close to a communications backplane can reduce routing complexity, but the designer must still assign suitable I/O standards and verify board-level timing. The verified 484-FBGA package supports compact integration, although its fine-pitch footprint requires controlled escape routing, reference-plane integrity, and assembly process support. Detailed PLL count, memory capacity, supported transceivers, and maximum clock frequency are not available in the supplied records, so these constraints require validation with the official device documentation and Quartus compilation results.
موصى به
Test and Measurement Systems
The EP3C16U484C8 can serve in configurable test and measurement systems where acquisition, sequencing, and instrument-control logic must be adapted to different products. The 15,408 logic cells are suitable for parallel timing generation, pattern execution, data capture control, and status aggregation, while the 346 I/O pins offer extensive connections to measurement channels and support circuitry. Its verified -40°C to +125°C range supports evaluation across industrial environments, although the exact timing margin depends on the selected speed grade and design compilation. System planners should account for configuration storage, clocking resources, termination, and digital timing margins. Because the supplied data omits PLL count, memory-block count, I/O standard support, and timing tables, engineers must obtain the official Cyclone III handbook and complete a Quartus timing analysis before committing to the device.
موصى به
Embedded Data Acquisition
The EP3C16U484C8 is applicable to embedded data-acquisition designs that combine parallel sensor inputs with programmable control and buffering. Its 346 verified I/O pins can reduce the need for external multiplexing when many digital channels must be captured, and its 15,408 logic cells can implement control state machines, data formatting, counters, and interface protocols. The 484-FBGA package helps preserve board area in compact systems but requires careful component placement and thermal planning. A practical design should isolate sensitive analog inputs from digital switching activity, validate every I/O standard, and analyze power according to actual logic utilization. The supplied records do not identify embedded-memory capacity, differential I/O support, acquisition clock limits, or power coefficients, so those parameters must be obtained from official Altera/Intel documentation and confirmed through a complete Quartus compilation and board-level test.
موصى به
Programmable Interface Cards
The EP3C16U484C8 fits reusable interface cards that combine many digital lines with application-specific control logic. Its verified 346 I/O pins can support external data buses, status indicators, triggers, and peripheral connections, while 15,408 logic cells provide enough density for protocol conversion and data movement. Such cards benefit from an FPGA because one board design can support multiple field configurations after validation and deployment of a new configuration image. The 484-FBGA package is appropriate for compact card construction but depends on careful ball-escape and reference-plane design. Engineers must also verify connector signal integrity, clock topology, configuration scheme, and system reset behavior. Exact supported I/O standards, maximum clock rate, memory resources, and power data are absent from the supplied records, so the official package, timing, and power documents are required before production release.
موصى به
Portable and Embedded Instruments
The EP3C16U484C8 can support embedded instrument platforms that need flexible control logic in a compact package. Its 15,408 logic cells can implement measurement sequencing, local processing, calibration tables, and communication protocols, while 346 I/O pins reduce external interface complexity. The reported -40°C to +125°C range offers useful environmental margin for ruggedized equipment, but thermal performance still depends on package dissipation, PCB copper, airflow, and ambient conditions. The 484-FBGA assembly reduces board footprint but requires assembly-line process control and inspection appropriate for the ball pitch. The supplied verified records do not provide power coefficients, thermal resistance, configuration details, or I/O-standard restrictions. Consequently, the design should be compiled in Quartus, reviewed for timing and pin assignment, thermally analyzed, and tested against the target enclosure before deployment.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3C16U484C8 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3C16F484C8N | EP3C16F484C6N | EP3C16U484C7N | EP3C16F484C7N | EP3C16U484C6N |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA | 484-FBGA |
| Brand | Altera Corporation | Altera Corporation | Altera Corporation | Altera Corporation | Altera Corporation | Altera Corporation |
| Device Type | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA | Cyclone III FPGA |
| Logic Cells | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 | 15,408 |
| Logic Blocks | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| I/O Pins | 346 | 346 | 346 | 346 | 346 | 346 |
| Speed Grade | C8 | C8 | C6 | C7 | C7 | C6 |
أبرز الفروقات
- Verified 346-pin external connectivity (مقابلEP3C16F484C8N)
- Verified industrial temperature range (مقابلEP3C16F484C6N)
- Directly identified same-package family candidate (مقابلEP3C16F484C6N)
ملاحظات التصميم
Use the official 484-FBGA land pattern rather than constructing it from the package name alone. Route the EP3C16U484C8 with a continuous ground reference, place decoupling close to the applicable supply pins, and preserve symmetry around the device to limit package-related signal-integrity variation. The verified distributor data identifies the package but does not provide the complete pin map, so the PCB library and assembly drawing must be cross-checked against the manufacturer package data before fabrication.
Perform a worst-case thermal analysis using the selected Quartus power estimate, the official junction-temperature limits, and the actual PCB construction. The verified records confirm a -40°C to +125°C operating range but do not provide core voltage, power coefficients, or package thermal resistance, so no defensible junction-temperature calculation can be made here. At the upper ambient limit, provide sufficient board copper, thermal vias, enclosure heat spreading, and airflow to prevent sustained operation beyond the device limits.
Do not treat a shared package suffix as proof of interchangeability. The EP3C16F484C8N and EP3C16F484C6N alternatives use the same 484-FBGA format, but speed grade, temperature qualification, configuration method, and ordering suffix can affect the original design. Compare the official ordering guide, pinout, electrical tables, timing constraints, and software support. Also resolve the secondary listing that describes 256 pins, which conflicts with the verified 484-FBGA package designation.
معلومات الامتثال
The verified ChipDig summary describes the device as LEAD FREE and uses the MS-034 package reference. RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals statuses were not explicitly established by the supplied verified records.
