EP3C80F780I7N - 81K LE Cyclone III FPGA 780-FBGA | Intel
MPN: EP3C80F780I7N ✓ نشطEP3C80F780I7N نظرة عامة
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines programmable logic blocks, interconnect, and I/O cells on a single semiconductor die. Within the broader taxonomy, an FPGA belongs to the integrated circuit family, sits under programmable logic devices, and is commonly used for parallel digital signal processing, hardware acceleration, glue logic, and rapid prototyping. The Cyclone III family specifically targets low-cost, low-power, high-volume applications where designers need substantial logic and memory but want to minimize static and dynamic power compared with prior Cyclone generations.
Key features include 81,264 logic elements, 2,810,880 RAM bits, 429 maximum user I/Os, four PLLs for clock management, and 20 global clock networks. The FBGA-780 package exposes 4 phase-locked loops for clock synthesis and distribution, supporting common telecom and video clock rates. The device operates from a 1.2 V core supply with separate I/O banks that can be configured to 1.5 V, 1.8 V, 2.5 V, 3.3 V, or differential signaling standards including LVDS.
From an architecture standpoint, Cyclone III uses 60 nm process geometry with embedded SRAM configuration cells and a MultiTrack interconnect structure. Logic elements combine a 4-input look-up table (LUT), a programmable register, and carry-chain arithmetic support. Embedded memory blocks (M9K blocks) deliver true dual-port, single-port, shift-register, and ROM modes, and DSP blocks enable hardware multiply-accumulate operations without consuming general logic.
Typical applications include industrial control and motor drives, video processing and broadcast equipment, telecom interface cards, test and measurement instrumentation, and consumer electronics requiring flexible I/O. The wide I/O count also makes the EP3C80 suitable for prototype ASIC replacement and parallel data acquisition systems.
When designing with this device, ensure PCB layout accounts for the 1 mm ball pitch and 29 x 29 mm footprint of the FBGA-780 package; use at least 6-layer stack-up with dedicated power and ground planes, and follow the Intel pin connection guidelines for unused pins and bank power. Quartus II (or the current Quartus Prime) design software is required for synthesis, place-and-route, and configuration bitstream generation.
This page synthesizes distributor pricing, drop-in equivalents across the Cyclone III family, and practical FPGA design notes not found in the standalone manufacturer datasheet.
بدائل مباشرة لـ EP3C80F780I7N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3C80F780I7N (نفس عامل الشكل والبصمة) — يختلف في Package, Process Technology, Speed Grade, Embedded Memory Bits, Embedded 18x18 Multipliers.
EP3C80F780I7
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C80F780C7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C80F780C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C80F780C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C120F780I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C55F780I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3C80F780I7N الحدود القصوى والخصائص الكهربائية
| Series | Cyclone III |
| Logic Elements (LE) | 81,264 |
| Total Memory Bits | 2,810,880 bits |
| Maximum User I/Os | 429 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| العلبة | 780-FBGA (29 x 29 mm, 1 mm pitch) |
| Internal Maximum Frequency | 472 MHz |
| Process Node | 60 nm low-power |
| درجة حرارة التشغيل | -40C to +100C (Industrial) |
| Core Voltage | 1.2 V |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| Lead-Free | Yes |
| مستوى MSL | 3 (168 hours) |
دليل تكوين أطراف EP3C80F780I7N 780-fbga (29 x 29 mm, 1 mm pitch)
تكوين الأطراف لـ EP3C80F780I7N (حزمة 780-fbga (29 x 29 mm, 1 mm pitch)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3C80F780I7N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3C80F780I7N مناسب لـ 7 التطبيقs: Industrial Motor Control and Drive, Video Processing and Broadcast Equipment, Telecom Interface and Line Cards, Test and Measurement Instrumentation, ASIC Prototyping and Emulation, Consumer Electronics and Display Controllers, Automotive Infotainment and Driver Assistance.
Industrial Motor Control and Drive
The EP3C80F780I7N is well-suited to multi-axis industrial motor control due to its 81,264 logic elements supporting parallel PWM generation and field-oriented control (FOC) algorithms. With 472 MHz maximum internal frequency and 4 PLLs, the device generates the high-resolution PWM timing needed for sinusoidal commutation at switching frequencies up to 20 kHz per phase. The 429 user I/Os accommodate multi-axis encoder feedback (QEI), Hall sensor inputs, and gate-driver signals without external muxing, while the 2.81 Mbit embedded memory buffers control loop coefficients and lookup tables. The industrial -40C to +100C temperature grade and 780-FBGA with solid thermal mass make it robust in enclosed drive cabinets.
موصى به
Video Processing and Broadcast Equipment
The EP3C80F780I7N delivers the parallel arithmetic throughput required for real-time video format conversion, scaling, and overlay processing. With 81,264 logic elements and 2.81 Mbit embedded memory, the device buffers full-HD video frames and implements multi-tap filter kernels without external SDRAM. The 429 user I/Os accept parallel video buses such as BT.1120, DisplayPort auxiliary channels, or HDMI bridge interfaces, while the 4 PLLs derive pixel clocks from any reference. The FBGA-780 package supports the high pin count needed for dual-channel SDI capture or display pipelines, making the EP3C80 a popular choice for broadcast monitoring and pro-AV systems.
موصى به
Telecom Interface and Line Cards
The EP3C80F780I7N provides the I/O density and clock resources needed for telecom line cards, serializer/deserializer bridging, and protocol conversion between TDM and packet networks. With 429 user I/Os, designers can expose multiple SFP/SFP+ cages, control GPIO for line interface units, and implement CPRI/OBSAI framer logic alongside Ethernet MAC. The 4 PLLs generate independent clocks for each SFP link, and the 2.81 Mbit embedded memory absorbs packet bursts without external FIFOs. Industrial temperature grade and lead-free FBGA-780 packaging meet carrier-grade reliability requirements for central office deployments.
موصى به
Test and Measurement Instrumentation
The EP3C80F780I7N enables high-channel-count test equipment such as logic analyzers, protocol exercisers, and ATE pin electronics. With 429 user I/Os, the device can drive and sample dozens of test points simultaneously while its 81,264 logic elements implement stimulus pattern generation, response capture, and on-chip signature analysis. The 472 MHz internal maximum frequency supports pattern rates above 200 MHz, and 2.81 Mbit embedded memory stores deep capture vectors. Designers use the 4 PLLs to derive per-channel programmable clock domains, and the industrial temperature grade suits bench and production-floor environments.
موصى به
ASIC Prototyping and Emulation
The EP3C80F780I7N serves as a flexible ASIC prototype platform, allowing RTL verification on real silicon before tape-out. With 81,264 logic elements, the device supports multi-million-gate ASIC designs when partitioned across multiple FPGAs using the FPGA-to-FPGA bridge interface. The 429 user I/Os expose ASIC boundary signals for bench testing, while the 2.81 Mbit embedded memory emulates SRAM blocks commonly found in ASICs. Quartus II design tools compile ASIC-compatible Verilog or VHDL directly into the EP3C80, shortening verification cycles and reducing respin risk on first-silicon ASICs.
موصى به
Consumer Electronics and Display Controllers
The EP3C80F780I7N fits consumer display controllers, LED video walls, and high-resolution panel drivers where its I/O density is needed for parallel RGB or LVDS interfaces. With 429 user I/Os, the device drives multiple 1080p panels simultaneously or one 4K panel via aggregated LVDS lanes, and the 4 PLLs derive per-panel pixel clocks. The 2.81 Mbit embedded memory buffers scan-line data and color lookup tables, while the 81,264 logic elements implement backlight dimming algorithms and on-screen display overlays. The FBGA-780 package supports the high-density PCB layouts required for slim consumer product enclosures.
موصى به
Automotive Infotainment and Driver Assistance
Although not AEC-Q100 qualified, the EP3C80F780I7N serves in non-safety automotive applications such as rear-seat entertainment, head-unit display controllers, and surround-view image stitching where its industrial temperature grade meets cabin thermal requirements. With 81,264 logic elements and 2.81 Mbit embedded memory, the device stitches four camera inputs into a single surround view and overlays parking guidelines. The 429 user I/Os accept multiple MIPI-CSI or parallel camera inputs plus LVDS display outputs, and the 4 PLLs generate per-camera pixel clocks. Designers must validate EMC and thermal behavior at the system level since the part is industrial-grade rather than automotive-grade.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3C80F780I7N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3C80F780I7 | EP3C80F780C7N | EP3C80F780C8N | EP3C80F780C6N | EP3C120F780I7N | EP3C55F780I7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 81,264 | 119,088 | 55,856 |
| Embedded Memory | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 3,981,312 bits | 2,396,160 bits |
| Maximum User I/Os | 429 | 429 | 429 | 429 | 429 | 429 | 377 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 | 7 | 7 | 8 (faster) | 6 (slower) | 7 | 7 |
| Lifecycle | Active | Active | Active | Active | Active | Active | Active |
أبرز الفروقات
- Highest I/O density in the Cyclone III family (مقابلEP3C55F780I7N)
- Industrial temperature grade option (مقابلEP3C80F780C7N)
- Cost-up path to higher logic capacity (مقابلEP3C120F780I7N)
ملاحظات التصميم
The 780-FBGA package uses a 1 mm ball pitch and 29 x 29 mm footprint, requiring at least a 6-layer PCB stack-up with continuous ground and power planes. Per the Cyclone III pin connection guidelines, vias-in-pad are recommended for inner balls, and all four corner balls plus center balls should be connected to ground for thermal dissipation and signal return paths. Use 0.5 oz copper on outer layers and 1 oz on inner power/ground planes to meet FBGA-780 current and thermal demands.
Estimated: at maximum resource utilization, a Cyclone III EP3C80 draws around 1.5-2 A on the 1.2 V VCCINT rail. Decouple VCCINT with 4-6 0.1 uF ceramic capacitors placed within 100 mil of the package, plus 2 x 10 uF bulk capacitors near the supply pins. VCCIO banks must each be decoupled with 0.1 uF and 10 uF capacitors per bank, sized for the chosen I/O standard's switching current. Use a dedicated low-dropout regulator with soft-start for VCCINT to limit inrush at configuration.
Route all differential pairs (LVDS, RSDS) with 100 ohm differential impedance and matched lengths within 20 mil. Match length on global clock nets to within 50 mil to avoid skew across the 472 MHz internal frequency range. Place PLL power pins with their own filtered supplies or ferrite beads; isolate PLL analog ground from digital ground and join at a single point near the FPGA. JTAG and configuration pins need 4.7 kohm pull-ups to VCCIO per the Cyclone III handbook.
Do not leave configuration pins floating during operation - TMS, TCK, TDI, and nCONFIG each need explicit pull-up or pull-down treatment per the configuration scheme. Avoid driving LVDS inputs before VCCINT and VCCIO are fully ramped, or input failure can occur. Do not assume speed grades are interchangeable: an 'I7' device is industrial temp grade 7, while 'C8' is commercial temp grade 8 (faster timing); verify both temperature and speed grade match your design before substituting.
معلومات الامتثال
RoHS compliant per Intel Cyclone III family documentation. Industrial temperature grade, lead-free FBGA-780 package. Not AEC-Q100 qualified; for automotive safety applications choose a dedicated Cyclone III Auto or later-generation automotive-grade FPGA.
