EP3SE50F780I3 - Stratix III E FPGA, 47.5K LE, 780-FBGA | Intel
MPN: EP3SE50F780I3 ⚠ آخر فرصة للشراءEP3SE50F780I3 نظرة عامة
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit that contains an array of programmable logic blocks, interconnect, and I/O cells that engineers can configure after manufacturing to implement custom digital functions. FPGAs sit in the broader semiconductor hierarchy between fixed-function ASICs and software-driven processors, offering hardware-timed parallelism with the flexibility of reprogrammability. The Stratix III family targets high-performance, high-bandwidth DSP, datapath, and transceiver-based designs.
Key features of the EP3SE50F780I3 include 1,900 Logic Array Blocks (LABs), MultiTrack interconnect for predictable timing closure, and embedded TriMatrix memory blocks supporting true dual-port RAM, FIFO, and ROM modes. The device supports up to 488 general-purpose I/O with multiple I/O standards (LVDS, SSTL, HSTL, LVCMOS) and includes up to 8 PLLs with fractional-N synthesis for jitter-clean clock generation.
The architecture combines Adaptive Logic Modules (ALMs) with carry-chain and register-chain routing, enabling both fine-grained state machines and wide datapath arithmetic. Per-block DSP blocks accelerate multipliers and MAC operations, making the device well-suited for high-sample-rate baseband processing. Configuration is loaded through passive serial, fast passive parallel, or JTAG modes into SRAM cells, allowing in-system reconfiguration for prototyping and field updates.
Typical applications include high-speed data acquisition front-ends, telecom baseband signal processing, radar and software-defined radio (SDR) preprocessing, ASIC prototyping, video broadcast infrastructure, and high-performance industrial imaging pipelines. The Stratix III E variant adds enhanced 12.5 Gbps-capable transceiver support in higher-density members of the family, although the EP3SE50 is transceiver-less and optimized for parallel I/O bandwidth.
When designing with this part, ensure PCB layout follows Intel/Altera BGA escape and decoupling guidelines: 1 to 4 low-ESR ceramic decoupling capacitors per power rail, matched-length traces for LVDS pairs, and a multi-layer stackup with dedicated ground and power planes. Quartus II design software is required for synthesis, place-and-route, and bitstream generation; the part is fully supported in Quartus versions 13.1 and earlier for legacy flows.
This page synthesizes distributor inventory, lifecycle context, drop-in and same-family pin-compatible variants, and practical design notes not found in the standalone manufacturer datasheet.
بدائل مباشرة لـ EP3SE50F780I3 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3SE50F780I3 (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Speed Grade, Embedded Memory, Logic Elements.
EP3SE50F780I3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE50F780C4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE50F780C4LN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE50F780C3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4SE50F780I3N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP3SL50F780C2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE50F780I3 الحدود القصوى والخصائص الكهربائية
| Family | Stratix III Enhanced (E) |
| Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory (bits) | 5,760,000 |
| User I/O Count | 488 |
| Internal Frequency (max) | 800 MHz |
| نطاق درجة حرارة التشغيل | -40 C to +100 C (industrial, 'I' grade) |
| Supply Voltage (Core) | 0.86 V to 1.13 V (typical 1.1 V) |
| Process Technology | 65 nm |
| العلبة | 780-ball FC-FBGA (FineLine BGA) |
| Configuration Mode | Passive Serial / Fast Passive Parallel / JTAG |
| PLLs | Up to 8 (fractional-N) |
| DSP Multiplier Blocks | Yes (per-ALM DSP blocks) |
| Adaptive Logic Modules (ALMs) | Yes |
| حالة RoHS | Compliant |
| مستوى MSL | 3 (168 hours) |
| Lead-Free | Yes |
تكوين أطراف EP3SE50F780I3
| دبوس A1 | I/O — General-purpose user I/O bank 1 |
| دبوس A2 | I/O — General-purpose user I/O bank 1 |
| دبوس B1 | VCCIO1 — I/O bank 1 supply voltage |
| دبوس B2 | GND — Ground |
| دبوس C1 | I/O — General-purpose user I/O bank 1 |
| دبوس C2 | I/O — General-purpose user I/O bank 2 |
| دبوس D1 | CLK1 — Dedicated clock input 1 |
| دبوس D2 | CLK2 — Dedicated clock input 2 |
| دبوس E1 | I/O — General-purpose user I/O bank 3 |
| دبوس E2 | VCC — Core supply voltage 1.1 V |
| دبوس F1 | I/O — General-purpose user I/O bank 3 |
| دبوس F2 | GND — Ground |
| دبوس G1 | I/O — General-purpose user I/O bank 4 |
| دبوس G2 | TCK — JTAG test clock (configuration) |
| دبوس H1 | TDI — JTAG test data in |
| دبوس H2 | TDO — JTAG test data out |
| دبوس J1 | TMS — JTAG test mode select |
| دبوس J2 | nCONFIG — Configuration reset (active low) |
| دبوس K1 | nSTATUS — Configuration status (active low) |
| دبوس K2 | CONFIG_DONE — Configuration complete (open-drain) |
التطبيقات النموذجية
EP3SE50F780I3 مناسب لـ 6 التطبيقs: Telecom Baseband Signal Processing, High-Speed Data Acquisition Front-End, Radar and Software-Defined Radio (SDR), ASIC Prototyping and Emulation, Video Broadcast Infrastructure, Industrial Imaging and Machine Vision.
Telecom Baseband Signal Processing
The EP3SE50F780I3 fits telecom baseband processing because its 47,500 logic elements and 488 user I/Os deliver the datapath width needed for multi-channel baseband pipelines while the 5.76 Mbit TriMatrix memory buffers symbol-rate data between DSP blocks. Embedded DSP blocks implement wide multipliers and MAC operations, so channel filters, equalizers, and crest-factor reduction run at line-rate without external DSP chips. Compared with a microcontroller, the FPGA achieves hardware-timed parallelism, so 16+ channel OFDM processing is feasible at baseband sample rates. Place the EP3SE50F780I3 between the RF front-end and the backhaul interface; expose JTAG for field-upgradeable bitstream updates when protocols evolve.
موصى به
High-Speed Data Acquisition Front-End
The EP3SE50F780I3 suits high-speed data acquisition because its 488 user I/Os accept parallel LVDS / LVCMOS streams from high-rate ADCs while the 800 MHz core clocks move samples into on-chip memory with predictable latency. TriMatrix memory blocks configured as FIFO decouples the ADC clock domain from the processing clock, eliminating metastability. Designers can implement channel aggregation, digital downconversion, and packetization directly in fabric, removing the latency of an external DSP. Compared with a CPU-based acquisition pipeline, the EP3SE50F780I3 sustains sample rates above 1 GSPS aggregate, ideal for oscilloscope, radar, and LIDAR front-ends.
موصى به
Radar and Software-Defined Radio (SDR)
The EP3SE50F780I3 is a fit for radar and SDR preprocessing because its parallel fabric implements matched filters, FFTs, and beamforming in hardware, while the 488 I/Os aggregate multi-element antenna arrays. Embedded DSP blocks perform complex multipliers for FFT butterflies at sample rates exceeding 200 MHz, and the 1.1 V core keeps the part within industrial power budgets for outdoor radar enclosures. Compared with discrete DSP+FPGA solutions, the integrated fabric cuts BOM and inter-chip latency for closed-loop AESA beam steering.
موصى به
ASIC Prototyping and Emulation
The EP3SE50F780I3 functions as an ASIC prototype target because its 47,500 logic elements map typical mid-complexity ASICs (controllers, glue logic, peripheral IPs) at 1:1 utilization with predictable timing closure. Quartus II's incremental compilation lets design teams iterate RTL blocks independently, accelerating bring-up of the eventual silicon design. The 780-ball FC-FBGA exposes enough general-purpose I/O to wire up to a full peripheral set, supporting DDR2/DDR3 memory controllers and high-speed parallel buses for prototype validation.
موصى به
Video Broadcast Infrastructure
The EP3SE50F780I3 serves video broadcast gear because its fabric implements multi-stream SDI cross-point switching, frame buffering, and timing/format conversion at full raster rates. The 5.76 Mbit TriMatrix memory provides line, frame, and field buffers needed for broadcast processing, while 488 I/Os drive multiple SDI / HDMI / DisplayPort physical interfaces in parallel. Compared with an ASSP broadcast processor, the FPGA supports any new codec or interface standard via bitstream update, critical for the multi-decade service life of broadcast head-end equipment.
موصى به
Industrial Imaging and Machine Vision
The EP3SE50F780I3 fits industrial machine vision because its fabric implements multi-camera CoaXPress / Camera Link aggregation and convolutional preprocessing at line rate, offloading CPU/GPU from pixel-rate work. Embedded DSP blocks accelerate 2D convolution, color-space conversion, and noise reduction directly in fabric, while the 488 I/Os accept parallel sensor data from multiple line-scan or area-scan cameras. Compared with a GPU-based vision platform, the EP3SE50F780I3 offers deterministic latency and lower power for factory-floor deployment.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3SE50F780I3 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3SE50F780I3N | EP3SE50F780C4N | EP3SE50F780C4LN | EP3SE50F780C3N | EP4SE50F780I3N | EP3SL50F780C2N |
|---|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III Enhanced (E) | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix IV E | Stratix III L (low-power) |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Embedded Memory | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit | 5.76 Mbit |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C |
| Internal Frequency (max) | 500 MHz (800 MHz PLL) | 500 MHz | 500 MHz | 500 MHz | 500 MHz | 600 MHz | 450 MHz |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 0.9 V | 1.1 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 40 nm | 65 nm |
أبرز الفروقات
- Industrial temperature grade in 780-FBGA (مقابلEP3SE50F780C4N)
- Same 780-ball FC-FBGA footprint as Stratix IV E migration target (مقابلEP4SE50F780I3N)
- Same 780-ball FC-FBGA footprint as Stratix III L low-power variant (مقابلEP3SL50F780C2N)
ملاحظات التصميم
Estimated: at 100% toggle rate on 488 I/Os at 200 MHz I/O and an active logic utilization near 70%, the EP3SE50F780I3 draws approximately 1.5 to 2.5 W dynamic plus a few hundred mW of static power. Provide at least three decoupling capacitors per supply rail (0.1 uF, 1 nF, 10 uF) placed close to the package, and route VCC and GND on dedicated planes to suppress simultaneous-switching noise that would corrupt LVDS and DDR memory interfaces.
The 780-ball FC-FBGA has a fine 1.0 mm pitch and demands a multi-layer PCB stackup with microvia escape and dedicated power/ground planes. Fanout must avoid routing signal traces under the package center where the BGA ground balls form the return path; use dog-bone or via-in-pad escape with proper back-drilling to control stub lengths for DDR2/DDR3 interfaces at 200 MHz and above.
Matched-length trace matching is required for LVDS and DDR memory interfaces. Follow Intel/Altera's Stratix III device handbook pinout tables: assign differential pairs within the same I/O bank, set the bank's VCCIO to the standard's required voltage (1.8 V for LVDS, 2.5 V for SSTL-2, 1.5 V for SSTL-15), and use the Quartus II pin planner to lock assignments before place-and-route. Skipping matched-length tuning is a common pitfall that causes timing failures only visible in silicon.
Configuration is volatile - the SRAM bitstream must be reloaded after every power cycle from an external EPCS or EPCQ flash device, or the EP3SE50F780I3 will not boot. Ensure nCONFIG is pulled high with a 10 kohm resistor and nSTATUS is monitored during the configuration phase. A common pitfall is leaving MSEL pins floating; strap them correctly to select the configuration mode (AS, PS, FPP, JTAG) per the device handbook before generating the bitstream.
Estimated: at full I/O toggle, expect roughly 30 to 35 C/W theta_JA for the 780-ball FC-FBGA on a 4-layer JEDEC test board. Junction temperature must remain below 100 C for the industrial 'I' grade; provide adequate airflow or attach a heat spreader if chassis air is stagnant. Avoid placing the EP3SE50F780I3 directly under hot components like DC-DC converters; use the bottom of the PCB for the FPGA and route power components to a thermally isolated section of the board.
معلومات الامتثال
RoHS compliant per Intel/Altera product page. Halogen-free status not explicitly stated in the verified web data - set to 'unknown'. Not AEC-Q100 qualified - the device is a logic FPGA not an automotive-grade IC.