EP3SE80F1152C2N - 80K LEs Stratix III E FPGA, 1152-BGA | Altera
MPN: EP3SE80F1152C2N ✗ انتهى عمره الإنتاجيEP3SE80F1152C2N نظرة عامة
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy the top tier of the digital semiconductor hierarchy: programmable logic device -> FPGA -> high-density programmable logic -> ASIC prototyping silicon. Unlike fixed-function ASICs, FPGAs can be reconfigured in the field, making them ideal for low-volume production, rapid prototyping, and applications requiring hardware-level parallelism such as signal processing, packet inspection, and high-speed interfacing.
Key features of the EP3SE80F1152C2N include 6.84 Mbits of embedded memory, 488 (9x9) embedded multipliers for DSP, partial reconfiguration support, and dedicated circuitry for external memory interfaces (DDR, DDR2, DDR3, QDRII, RLDRAM). The Stratix III E architecture enhances logic and routing efficiency over earlier Stratix generations, while the 1.1V core reduces dynamic power consumption by up to 50% compared with 90nm predecessors. The FCBGA-1152 package provides a robust board-level interconnect suitable for multi-gigabit transceiver (transceiver-less) LVDS, PCI Express Gen1 endpoints, and gigabit Ethernet MAC implementations.
Typical applications include high-end ASIC prototyping, high-performance digital signal processing, video broadcast equipment, military radar signal processing, and wireline telecommunications line cards. The 80K LE density positions this part in the mid-density Stratix III E family, large enough for full-system emulation of multi-million-gate ASICs yet still cost-effective versus the larger EP3SE110 and EP3SE260 devices.
When designing with this part, allocate sufficient PCB layers (typically 12+ for 1152-ball BGA breakout) and use a Stratix III E reference design for power-rail sequencing, decoupling, and JTAG configuration. Altera Quartus II software (version 9.0 or later) is the required development environment for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in package-compatible alternatives from the Stratix III E family, and practical design notes not found in the manufacturer datasheet alone.
بدائل مباشرة لـ EP3SE80F1152C2N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3SE80F1152C2N (نفس عامل الشكل والبصمة) — يختلف في Package, Operating Temperature, Speed Grade, Process Technology, Family.
EP3SE80F1152C2
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE80F1152C3N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE110F1152C2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE50F1152C2N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP3SE260F1152C2N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE80F1152C2N الحدود القصوى والخصائص الكهربائية
| Family | Stratix III E |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements (LEs) | 80,000 |
| Logic Array Blocks (LABs) | 3,200 |
| Embedded Memory | 6,843,392 bits (6.84 Mbit) |
| Embedded Multipliers (9x9) | 488 |
| Maximum User I/Os | 744 |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.1 V |
| Internal Frequency (max) | 800 MHz |
| درجة حرارة التشغيل | 0C to +85C (Commercial) |
| العلبة | 1152-BBGA, FCBGA (FineLine BGA) |
| نوع التركيب | Surface Mount |
| Series | Stratix III E |
| مستوى MSL | 3 (168 hours) |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel |
دليل تكوين أطراف EP3SE80F1152C2N 1152-bbga, fcbga (fineline bga)
تكوين الأطراف لـ EP3SE80F1152C2N (حزمة 1152-bbga, fcbga (fineline bga)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3SE80F1152C2N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3SE80F1152C2N مناسب لـ 6 التطبيقs: High-Performance ASIC Prototyping, Digital Signal Processing (DSP) Systems, Wireline Telecommunications Line Cards, Video Broadcast and Image Processing, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
High-Performance ASIC Prototyping
The EP3SE80F1152C2N's 80,000 logic elements and 6.84 Mbit embedded memory provide sufficient capacity to emulate multi-million-gate ASIC designs at near-real-time speeds. With 488 9x9 embedded multipliers and 800 MHz internal operation, it supports full-system verification of DSP pipelines and custom processor cores. Placed on a multi-FPGA prototyping board alongside companion FPGAs in the Stratix III family, this part scales to prototype ASICs of 5-10 million gates. Designers benefit from Quartus II's incremental synthesis flow, which dramatically shortens compile times during iterative ASIC-to-FPGA conversions.
موصى به
Digital Signal Processing (DSP) Systems
The 488 embedded 9x9 multipliers combined with 6.84 Mbit block RAM make the EP3SE80F1152C2N well suited for high-throughput DSP applications such as radar pulse compression, channel cards in wireless base stations, and software-defined radio front-ends. The dedicated multiplier chain routing and 800 MHz fabric speed enable multi-tap FIR filters and FFT engines at sample rates exceeding 250 MHz. The FCBGA-1152 package supports LVDS pairs at DDR rates for high-speed ADC/DAC interfacing, while Quartus II DSP Builder blocks simplify FFT/iFFT pipeline generation.
موصى به
Wireline Telecommunications Line Cards
In telecom line cards, the EP3SE80F1152C2N implements multi-protocol packet processing, traffic management, and OTN/SONET framer functions. The 744 user I/Os accommodate multiple SFP+/XFP cage interfaces, while the embedded memory supports deep packet buffers. The Stratix III E architecture's enhanced routing reduces congestion in wide datapaths typical of 10G Ethernet MAC and framer designs. Power consumption is significantly lower than 90nm Stratix II predecessors, easing thermal design in densely-populated line-card chassis.
موصى به
Video Broadcast and Image Processing
The EP3SE80F1152C2N's combination of 80K logic elements, 488 multipliers, and 6.84 Mbit of embedded memory fits video processing pipelines for HD/3G-SDI broadcast equipment, video walls, and medical imaging pre-processors. Designs implement color-space conversion, scaling, deinterlacing, and real-time codec assist at full frame rate. The FCBGA-1152 package's 744 I/Os connect to multiple camera sensors, HDMI/DVI interfaces, and DDR2/DDR3 frame buffers. The 800 MHz fabric clock supports pixel rates up to 165 MHz for 1080p60 processing with headroom.
موصى به
Military and Aerospace Signal Processing
The commercial-grade EP3SE80F1152C2N serves as the prototype validation vehicle for military radar and electronic-warfare subsystems before transitioning to the industrial-temperature EP3SE80F1152I2N or radiation-hardened equivalents. The dense logic and DSP fabric accelerates SAR (synthetic aperture radar) image formation, EW pulse sorting, and adaptive beamforming computations. The FCBGA-1152 package and 65nm low-power architecture suit SWaP-constrained platform designs. For flight deployment, pair with companion FPGAs in the same family to scale to full mission-processor workloads.
موصى به
Test and Measurement Instrumentation
The EP3SE80F1152C2N is well suited to high-end oscilloscopes, logic analyzers, and protocol testers, where its 744 I/Os and high-speed LVDS capability drive multi-channel simultaneous sampling at GHz rates. The 6.84 Mbit embedded memory holds deep acquisition buffers, and the 488 multipliers accelerate FFT-based spectrum analysis in real time. The FCBGA-1152 package supports fine-pitch BGA PCB layouts required for high-channel-count probe interfaces. Quartus II's TimeQuest timing analyzer provides the timing closure assurance critical for instrumentation-grade products.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3SE80F1152C2N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3SE80F1152C2 | EP3SE80F1152C3N | EP3SE110F1152C2N | EP3SE50F1152C2N | EP3SE260F1152C2N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-BBGA, FCBGA | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same | 1152-BBGA, FCBGA - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 110,000 | 50,000 | 260,000 |
| Maximum User I/Os | 744 | 744 | 744 | 744 | 744 | 744 |
| Speed Grade | -2 (C2) | -2 | -3 (faster) | -2 | -2 | -2 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
أبرز الفروقات
- Identical FCBGA-1152 footprint across the Stratix III E family (مقابلEP3SE110F1152C2N / EP3SE50F1152C2N / EP3SE260F1152C2N)
- Higher logic density than entry-level Stratix III E options (مقابلEP3SE50F1152C2N)
- Lower power than larger Stratix III E options at similar workloads (مقابلEP3SE260F1152C2N)
ملاحظات التصميم
The 1152-ball FCBGA package requires a 12+ layer PCB for proper breakout. Use 1.0mm or 1.27mm ball pitch escape routing on inner layers with microvia technology (laser-drilled stacked vias) on the top two layers. Reference the Altera Stratix III board design guidelines for via-in-pad recommendations, antipad sizing, and stackup impedance targets.
Implement a multi-rail sequencing scheme for VCCINT (1.1V), VCCPD (2.5V/3.3V), and VCCIO (per-bank, 1.2V-3.3V). The Stratix III handbook mandates that VCCPD ramp before or simultaneously with VCCINT, and VCCIO must not precede VCCPD by more than 200ms. Use a dedicated power-supply sequencer IC to satisfy these requirements reliably.
Estimated: at full 80K LE utilization with 80% toggle rate at 500 MHz, the EP3SE80F1152C2N may dissipate 8-12W. With the FCBGA-1152 theta_JA typically 12 C/W on a 12-layer board with 1oz copper, junction-to-ambient rise is 96-144C. Either reduce toggle rate, lower utilization, or attach a heatsink with thermal interface material. Provide adequate airflow (200 LFM minimum) for production environments.
Do not program configuration data through JTAG with the wrong BSDL file - always use the EP3SE80F1152 device-specific BSDL. When migrating from a Stratix II design, recompile the entire Quartus project because the LAB architecture differs (Stratix III uses ALM/LAB while Stratix II uses LE/LAB). Ignoring this step will cause incorrect timing analysis and place-and-route failures.
معلومات الامتثال
RoHS and lead-free compliance per Altera/Intel product marking (suffix 'N' indicates lead-free). Halogen-free status not explicitly stated in verified distributor data. AEC-Q100 not applicable - this is a commercial-temperature FPGA, not an automotive-grade part. Refer to EP3SE80F1152I2N for industrial-grade variant.