EP3SE80F780I4LN - 80K LE Stratix III E FPGA, 780-FCBGA | Intel
MPN: EP3SE80F780I4LN ⚠ آخر فرصة للشراءEP3SE80F780I4LN نظرة عامة
A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream. Stratix III E sits within Altera's hierarchy as: FPGA -> programmable logic device (PLD) -> logic IC -> digital semiconductor. Compared with fixed-function ASICs, FPGAs accelerate time-to-market and enable in-system design changes, while compared with earlier FPGA generations Stratix III E achieves higher logic density per Watt thanks to its 65 nm low-power process and adaptive logic modules (ALMs).
Key differentiating features of the EP3SE80F780I4LN include: 80,000 logic elements (LEs) for high-density datapath and control-plane designs; 3,200 LABs/CLBs for parallel architectural flexibility; 488 maximum user I/Os (in this F780 package variant) for wide memory and high-speed transceiver interfaces; and embedded memory of 6,843,392 bits distributed in M9K/M144K blocks. The 'I4' speed grade corresponds to an industrial temperature range, and the 'N' suffix indicates lead-free / Pb-free terminations compliant with current RoHS directives.
Architecturally, the Stratix III E family uses Altera's adaptive logic module (ALM) building block, an 8-input fracturable LUT that can be reconfigured to implement any 7-input LUT or two independent 4-input LUTs. Combined with dedicated 18x18 multipliers, MLAB memory, and high-speed serial transceivers, the EP3SE80 enables DSP-intensive designs, memory-rich packet processing, and protocol bridging without external logic. The 780-FCBGA package provides ample signal integrity for high-speed DDR/DDR2/QDR II memory interfaces and LVDS-based chip-to-chip links.
Typical applications for the EP3SE80F780I4LN include wireline telecommunications line cards, military and aerospace signal processing, high-performance DSP prototyping, broadcast video processing, and ASIC prototyping for system architects who need >70 KLE in a single device. The industrial temperature range also suits ruggedized computing and test-and-measurement platforms.
When designing with this part, pay careful attention to power-rail sequencing for the 0.9 V core, 1.1 V PLL, and 1.8/2.5/3.3 V I/O banks, and follow Altera's Stratix III PowerPlay guidelines to estimate junction temperature with the device's thermal model. Designers new to Stratix III should use the Quartus II design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, package-level drop-in alternatives within the same Stratix III E family, and practical design notes that are not aggregated on the manufacturer product page.
بدائل مباشرة لـ EP3SE80F780I4LN — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP3SE80F780I4LN (نفس عامل الشكل والبصمة) — يختلف في Package, Logic Elements, Speed Grade, Transceivers, Operating Temperature.
EP3SE80F780I4N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE80F780I4L
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE80F780I4
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE50F780I4LN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE110F780I4LN
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP3SE260F780I4LN
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP3SE80F780I4LN الحدود القصوى والخصائص الكهربائية
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Number of LABs/CLBs | 3,200 |
| Total Memory Bits | 6,843,392 |
| Maximum User I/Os | 488 |
| Process Technology | 65 nm |
| Core Voltage | 0.9 V |
| Operating Frequency (max) | 375 MHz |
| العلبة | 780-BBGA, FCBGA (F780) |
| Pin/Ball Count | 780 |
| نوع التركيب | Surface Mount |
| درجة حرارة التشغيل | -40 °C to +100 °C (Industrial) |
| مستوى حساسية الرطوبة (MSL) | 3 (168 hours) |
| حالة RoHS | Compliant (Pb-free N suffix) |
| Design Tool | Quartus II Design Software |
دليل تكوين أطراف EP3SE80F780I4LN 780-bbga, fcbga (f780)
تكوين الأطراف لـ EP3SE80F780I4LN (حزمة 780-bbga, fcbga (f780)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP3SE80F780I4LN.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP3SE80F780I4LN مناسب لـ 6 التطبيقs: Telecommunications Line Cards, High-Performance DSP Prototyping, ASIC Prototyping, Military and Aerospace Signal Processing, Broadcast Video Processing, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP3SE80F780I4LN's 80,000 logic elements and 6,843,392 bits of embedded memory make it well-suited for mid-range packet processing and protocol bridging on telecom line cards. Its 488 user I/Os in the F780 FCBGA package connect to multiple external QSPI/SPI flash devices, DDR2/QDR II memories, and PHY interfaces without requiring glue logic. The industrial temperature grade supports deployment in controlled-environment central offices and edge aggregation platforms.
موصى به
High-Performance DSP Prototyping
Stratix III E devices feature dedicated 18x18 multipliers and DSP blocks that accelerate FIR, FFT, and matrix operations. The EP3SE80F780I4LN provides sufficient DSP bandwidth for radar signal processing chains, software-defined radio baseband, and beamforming prototypes. With 3,200 LABs and ample MLAB/M9K memory, multiple parallel DSP datapaths can be implemented in a single chip while leaving headroom for control and interface logic.
موصى به
ASIC Prototyping
ASIC prototyping platforms commonly use multiple FPGAs to emulate ASIC functionality. The EP3SE80F780I4LN's 80 KLE density and 488 I/Os enable chip-multiplexing with external cables or daughter-board interconnect, while Quartus II's TimeQuest timing analyzer provides ASIC-grade timing closure. The 780-FCBGA package offers robust power delivery for high-activity prototyping runs and supports deep-trace debug for SOC verification teams.
موصى به
Military and Aerospace Signal Processing
The industrial temperature range and rugged FCBGA package make the EP3SE80F780I4LN suitable for military and aerospace signal processing payloads. Its embedded memory supports buffering of high-bandwidth sensor streams from radar, EO/IR, and SIGINT subsystems. Combined with high-density DSP blocks, the part delivers real-time channelization and demodulation while operating reliably across extended thermal envelopes.
موصى به
Broadcast Video Processing
Broadcast video infrastructure uses FPGAs for format conversion, scaling, color-space conversion, and overlay composition. The EP3SE80F780I4LN's 488 I/Os and 6.8 Mbit embedded memory handle multi-stream HD/3G-SDI pipelines with on-chip frame buffering. The 0.9 V core voltage keeps dynamic power manageable in 24/7 broadcast headend deployments, while the F780 package simplifies PCB stack-up for typical 12-layer video board designs.
موصى به
Test and Measurement Instrumentation
Test and measurement platforms leverage FPGA flexibility for high-speed ADC/DAC capture, real-time DSP, and protocol-aware triggering. The EP3SE80F780I4LN integrates 488 I/Os to fan out to multiple ADC channels and LVDS-based digitizers, while its embedded memory and DSP blocks support real-time FFT and channelization. The industrial temperature grade suits laboratory and field-portable instrument enclosures with wide thermal variation.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP3SE80F780I4LN — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP3SE80F780I4N | EP3SE80F780I4L | EP3SE50F780I4LN | EP3SE110F780I4LN |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-BBGA, FCBGA (F780) | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same | 780-BBGA, FCBGA (F780) - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 50,000 (-37.5%) | 110,000 (+37.5%) |
| Number of LABs/CLBs | 3,200 | 3,200 | 3,200 | 2,000 | 4,400 |
| Embedded Memory (bits) | 6,843,392 | 6,843,392 | 6,843,392 | 4,324,608 | 9,564,544 |
| Maximum User I/Os | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Operating Temperature | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
أبرز الفروقات
- High-density 80 KLE with 488 I/Os in mid-range F780 package (مقابلEP3SE50F780I4LN)
- Industrial temperature grade with Last Time Buy status (مقابلEP3SE260F780I4N)
- Pin-compatible Stratix III E family in same F780 footprint (مقابلEP3SE110F780I4LN)
ملاحظات التصميم
The EP3SE80F780I4LN requires multiple power rails: 0.9 V for the core, 1.1 V for PLLs, and 1.8/2.5/3.3 V for I/O banks depending on bank configuration. Power sequencing must follow Altera's Stratix III PowerPlay guidelines to prevent latch-up. Use a dedicated POR (power-on-reset) supervisor for each rail and observe the tRAMP specification; failure to sequence properly can cause long-term reliability issues or configuration failures. Decoupling should include 0.1 µF X7R capacitors at each power pin plus bulk tantalum or ceramic on each rail.
Estimated: with all 80 KLE active at 375 MHz and 0.9 V core, dynamic power can reach 5–8 W depending on toggle rate. The 780-FCBGA package requires adequate PCB thermal management via thermal vias under the exposed die pad and inner copper planes. Without thermal vias, junction temperature can exceed the 100 °C industrial limit in still-air environments; a heatsink or forced-air cooling is recommended for high-activity designs.
The 780-FCBGA package has a 1.0 mm ball pitch and requires microvia or via-in-pad PCB technology for reliable breakout. Use a 12-layer or higher stack-up with dedicated ground and power planes. Matched-length routing is mandatory for LVDS, DDR2, and QDR II memory interfaces; follow Altera's Stratix III board design guidelines for skew budgets. Decoupling capacitors must be placed within 100 mils of their respective power pins to minimize parasitic inductance.
Common pitfalls: (1) leaving configuration mode pins (MSEL) floating; (2) using unsupported JTAG IDCODE values; (3) violating the absolute maximum 1.0 V on the 0.9 V core rail; (4) exceeding the 488 user I/O count in pin assignments; (5) ignoring Quartus II fitter warnings about I/O bank VCCIO constraints. Always run the Quartus II design assistant and TimeQuest timing analyzer before tape-out to catch these issues.
معلومات الامتثال
RoHS compliant per 'N' suffix designation indicating Pb-free terminations. MSL 3 (168 hours floor life). AEC-Q100 not applicable for FPGAs. REACH and halogen-free status not explicitly stated in verified data; consult Intel product environmental reports for confirmation.
