EP4CE55U19I7N - 55K LE Cyclone IV E FPGA, 484-UBGA | Intel
MPN: EP4CE55U19I7N ✓ نشطEP4CE55U19I7N نظرة عامة
An FPGA (Field-Programmable Gate Array) is a reconfigurable semiconductor device containing programmable logic blocks, interconnect, and I/O cells. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose CPUs/GPUs (software-defined) and ASICs (fixed-function). They are widely used for parallel processing, custom interface bridging, and pre-ASIC prototyping. The Cyclone IV E family specifically targets low-power, high-volume applications where cost-per-logic-element is critical.
Key features of the EP4CE55U19I7N include 55,856 logic elements, 4 PLLs, 2,396,160 bits of embedded SRAM (approximately 234 Kbit blocks distributed in M9K memory blocks), 156 dedicated 18x18 hardware multipliers, and 4 general-purpose I/O banks supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device operates from a 1.0 V or 1.2 V core supply with separate VCCPD and VCCIO rails.
Architecturally, the Cyclone IV E family uses a 60 nm SRAM-based logic fabric with built-in configuration memory, supporting active serial (AS), passive serial (PS), and JTAG configuration modes. The 484-ball UBGA package uses Intel's Ultra FineLine BGA pitch, optimizing signal integrity for high-density board layouts.
Typical applications include industrial motor control, video processing pipelines, communication infrastructure, low-cost ASIC prototyping, and embedded control systems. The combination of 55K logic elements and 156 multipliers makes it well-suited for DSP-intensive functions such as FIR filtering or video scaling.
When designing with this part, ensure proper decoupling of VCCINT, VCCPD, and VCCIO rails and confirm I/O bank voltage compatibility with connected peripherals. Configuration mode and JTAG chain design must follow the Cyclone IV handbook.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer datasheet alone.
بدائل مباشرة لـ EP4CE55U19I7N — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP4CE55U19I7N (نفس عامل الشكل والبصمة) — يختلف في Package, Logic Elements, Embedded 18x18 Multipliers, Operating Temperature, Core Voltage (VCCINT).
EP4CE55U19I8N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CE55U19C7N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CE55U19C8N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CE55U19A7N
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EP4CE40U19I7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CE115F29C8N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CE55U19I7N الحدود القصوى والخصائص الكهربائية
| Family | Cyclone IV E |
| Logic Elements | 55,856 |
| Embedded Memory (bits) | 2,396,160 |
| Maximum User I/O | 324 |
| Embedded 18x18 Multipliers | 156 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm |
| Core Voltage (VCCINT) | 1.0 V or 1.2 V |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) |
| العلبة | 484-ball UBGA (Ultra FineLine BGA) |
| Configuration Support | AS, PS, JTAG |
| درجة حرارة التشغيل | -40C to +100C (Industrial) |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
دليل تكوين أطراف EP4CE55U19I7N 484-ball ubga (ultra fineline bga)
تكوين الأطراف لـ EP4CE55U19I7N (حزمة 484-ball ubga (ultra fineline bga)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EP4CE55U19I7N.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EP4CE55U19I7N مناسب لـ 6 التطبيقs: Industrial Motor Control, Video Processing Pipeline, Communication Bridge and Protocol Conversion, ASIC Prototyping and Validation, DSP Signal Processing, Test and Measurement Equipment.
Industrial Motor Control
The EP4CE55U19I7N fits industrial motor control because its 156 dedicated 18x18 multipliers handle Field-Oriented Control (FOC) algorithms including Park/Clarke transforms and PI controllers in single-cycle throughput. The 2,396,160 embedded bits buffer ADC samples and current-loop state without external memory, while 324 user I/O drive multiple PWM channels, encoder interfaces (QEP), and CAN/RS-485 communications. Industrial -40C to +100C temperature grade ensures operation on factory floors and outdoor installations.
موصى به
Video Processing Pipeline
The EP4CE55U19I7N suits mid-resolution video processing where its 55,856 logic elements implement scaling, color-space conversion, and deinterlacing while 156 multipliers accelerate FIR filters for chroma upsampling. The 324 user I/O support parallel RGB/YUV interfaces, HDMI bridge chips, and memory ports to DDR2 SDRAM. M9K memory blocks buffer scan lines on-chip, reducing external memory pressure in camera and display applications.
موصى به
Communication Bridge and Protocol Conversion
The EP4CE55U19I7N bridges communication protocols such as UART/SPI/I2C to Ethernet, USB, or custom interfaces using its parallel logic fabric. The 4 PLLs generate multiple clock domains required for asynchronous protocol conversion (e.g., 100 MHz Ethernet MAC plus 48 MHz USB). 324 user I/O accommodate multiple bus channels simultaneously, and 2.4 Mbit embedded memory serves as FIFO buffer for rate matching between protocols.
موصى به
ASIC Prototyping and Validation
The EP4CE55U19I7N serves as a cost-effective ASIC prototype platform because it implements up to approximately 1.5M ASIC gates of logic in the Cyclone IV E fabric. Quartus II supports incremental compilation and Design Partitioning, allowing teams to validate RTL blocks before tape-out. The device is widely supported by ASIC prototyping flows, with libraries from Synopsys and Mentor enabling VCS/Questa integration.
موصى به
DSP Signal Processing
The EP4CE55U19I7N executes DSP functions like FIR filters, FFTs, and DCTs efficiently because its 156 dedicated 18x18 multipliers provide 156 multiply-accumulate operations per cycle. At 200 MHz, this delivers over 30 GMACs throughput, suitable for software-defined radio baseband, audio processing, or instrumentation. M9K memory blocks store tap coefficients and intermediate FFT stages on-chip.
موصى به
Test and Measurement Equipment
The EP4CE55U19I7N supports test and measurement applications requiring flexible digital pattern generation, custom protocol decoding, or real-time signal analysis. Its 324 user I/O drive multiple test channels simultaneously, while 4 PLLs synthesize arbitrary timing references from a single system clock. Industrial temperature grade ensures reliable operation in lab and production environments with strict calibration requirements.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP4CE55U19I7N — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP4CE55U19I8N | EP4CE55U19C7N | EP4CE55U19C8N | EP4CE55U19A7N | EP4CE40U19I7N | EP4CE115F29C8N |
|---|---|---|---|---|---|---|---|
| Package | 484-ball UBGA (U19) | 484-ball UBGA (U19) - same | 484-ball UBGA (U19) - same | 484-ball UBGA (U19) - same | 484-ball UBGA (U19) - same | 484-ball UBGA (U19) - same | 780-ball FBGA (F29) - DIFFERENT |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 55,856 | 39,600 | 114,480 |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 1,134,000 | 3,981,312 |
| Maximum User I/O | 324 | 324 | 324 | 324 | 324 | 324 | 528 |
| Speed Grade | I7 (industrial, fast) | I8 (industrial, slower) | C7 (commercial, fast) | C8 (commercial, slower) | A7 (automotive grade) | I7 (industrial, fast) | C8 (commercial, slower) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Automotive) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Embedded 18x18 Multipliers | 156 | 156 | 156 | 156 | 156 | 116 | 266 |
أبرز الفروقات
- Higher logic density than EP4CE40 series while sharing U19 footprint (مقابلEP4CE40U19I7N)
- Industrial temperature grade with maximum speed grade (مقابلEP4CE55U19C7N)
- Ultra FineLine BGA package for compact board layouts (مقابلEP4CE55F23I7N (standard FBGA))
ملاحظات التصميم
Estimated: at typical logic utilization of 50% and 200 MHz operation, the EP4CE55U19I7N core current is approximately 0.5-1 A from VCCINT (1.2 V). Add decoupling on VCCINT, VCCPD, and VCCIO with at least one 100 uF bulk + multiple 0.1 uF/0.01 uF ceramics near each ball. VCCPD must match the VCCIO of the bank used for configuration signals (typically 2.5 V or 3.3 V). Refer to Cyclone IV E PowerPlay Early Power Estimator for accurate budgeting. Severity: critical.
The 484-ball UBGA (U19) uses Ultra FineLine BGA pitch (0.8 mm), which requires PCB fabrication with laser-drilled microvias and ENIG or ENEPIG surface finish for reliable solder joints. Use 4-6 layer PCB stack-up with continuous GND planes beneath the BGA to control return paths. Escape routing requires dog-bone or via-in-pad fanout; allocate at least 0.5 mm BGA-to-edge clearance. Severity: critical.
LVDS and high-speed I/O interfaces require matched impedance routing (100 ohm differential). For DDR2 interfaces, route DQS and clock signals first with length-matching to within +/- 25 ps. Use IBIS models (available from Intel) for SI simulation. Place series termination resistors near the FPGA driver for SSTL/HSTL I/O standards. Severity: recommended.
Common pitfalls: (1) leaving JTAG pins floating (TDI should be pulled up, TCK pulled down); (2) failing to use CONFIG_DONE and nSTATUS pull-ups to VCCPD; (3) ignoring I/O bank VCCIO constraints when mixing 1.8 V and 3.3 V peripherals across banks; (4) omitting a proper MSEL[3..0] configuration to select the right configuration mode (AS vs PS vs JTAG). Severity: critical.
Estimated: at maximum utilization with 156 multipliers running continuously at 200 MHz, the EP4CE55U19I7N may dissipate up to 2-3 W. The 484-ball UBGA's thermal resistance (theta_JA) is approximately 12-15 C/W on a standard 4-layer PCB with minimal thermal vias. Add thermal via arrays (0.3 mm pitch) under the BGA and connect to internal GND planes for optimal heat spreading. Severity: recommended.
معلومات الامتثال
RoHS compliant per Altera/Intel product page. AEC-Q100 not applicable for FPGA logic density grade; AEC-Q100 equivalent screening available in EP4CE55U19A7N automotive-grade variant.
