EP4CE6E22C7 - Cyclone IV E FPGA 6K LE, 144-LQFP | Intel/Altera
MPN: EP4CE6E22C7 ✓ نشطEP4CE6E22C7 نظرة عامة
What is a Cyclone IV E FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory/IO blocks that the designer configures after manufacture. Cyclone IV E sits in the low-power, low-cost segment of the FPGA taxonomy (FPGA > programmable logic > logic IC > integrated circuit), making it suited to high-volume cost-sensitive applications. The EP4CE6E22C7 integrates 392 CLBs, 270 Kbits of RAM, and a rich set of embedded multipliers (15x18-bit DSP blocks) for low-end DSP workloads.
Key features include 6,272 logic elements (LEs), 276,480 bits of embedded SRAM, up to 91 user I/Os with LVDS support, fifteen 18x18-bit hardware multipliers, four general-purpose PLLs, and Cyclone IV E's low-power 60 nm process. The part supports configuration via JTAG, Active Serial (AS), and Passive Serial (PS) modes, and offers commercial-grade temperature operation (0°C to +85°C junction) for the C7 speed grade.
Technical depth: the EP4CE6E22C7 targets designers who need 4-6K LE density without paying for larger Cyclone IV E members (EP4CE10, EP4CE15, EP4CE22). Its four PLLs provide clock multiplication, phase shifting, and frequency synthesis; its LVDS I/O at up to 840 Mbps makes it compatible with low-speed MIPI and LVDS sensor/camera interfaces. The exposed-pad LQFP package supports both hand-soldering and reflow profiles, with 0.5 mm lead pitch.
Typical applications include industrial control and factory automation, low-cost video processing pipelines, motor control and BLDC/PMSM drivers, IoT edge nodes, embedded display controllers, and low-density protocol bridges (UART/SPI/I2C to Ethernet or USB). The 91 user I/Os comfortably absorb typical glue-logic workloads and mid-density state machines.
Design consideration: ensure the exposed thermal pad is soldered to a top-layer copper pour with multiple thermal vias to the ground plane, otherwise junction temperature can derate quickly at high toggle rates. For configuration, dedicate at least one 4-pin JTAG header for boundary-scan and reconfiguration.
This page synthesizes distributor pricing, drop-in equivalents in the same 144-LQFP footprint, and practical design notes not found in the manufacturer datasheet alone.
بدائل مباشرة لـ EP4CE6E22C7 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EP4CE6E22C7 (نفس عامل الشكل والبصمة) — يختلف في Process Technology, Configuration Modes, Package, I/O Voltage (VCCIO), RoHS Status.
EP4CE6E22C6N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CE6E22C6
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CE6E22A7N
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EP4CE6E22C7 الحدود القصوى والخصائص الكهربائية
| Series | Cyclone IV E |
| Family | Cyclone IV |
| Core Architecture | Logic Elements (LE) |
| Number of Logic Elements (LEs) | 6,272 |
| Number of Configurable Logic Blocks (CLBs) | 392 |
| Total Embedded Memory Bits | 276,480 |
| Total RAM (Kbits) | 270 |
| Number of Embedded 18x18 Multipliers | 15 |
| Number of PLLs | 4 |
| User I/O Count | 91 |
| I/O Standards Supported | LVDS, LVCMOS, LVTTL, SSTL, HSTL, PCI |
| Operating Supply Voltage (Core) | 1.0 V to 1.2 V (typ. 1.2 V) |
| Operating Supply Voltage (I/O) | 1.2 V to 3.3 V |
| Logic Speed Grade | C7 |
| Operating Temperature Range (Commercial) | 0°C to +85°C (junction) |
| العلبة | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch |
| نوع التركيب | Surface Mount |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| Process Technology | 60 nm low-power CMOS |
| حالة RoHS | Compliant |
تكوين أطراف EP4CE6E22C7
| دبوس 1 | I/O — User I/O pin (Bank 1) |
| دبوس 2 | I/O — User I/O pin (Bank 1) |
| دبوس 3 | I/O — User I/O pin (Bank 1) |
| دبوس 4 | I/O — User I/O pin (Bank 1) |
| دبوس 5 | I/O — User I/O pin (Bank 1) |
| دبوس 6 | VCCIO1 — I/O Bank 1 supply voltage |
| دبوس 7 | I/O — User I/O pin (Bank 1) |
| دبوس 8 | I/O — User I/O pin (Bank 1) |
| دبوس 9 | I/O — User I/O pin (Bank 1) |
| دبوس 10 | I/O — User I/O pin (Bank 1) |
| دبوس 11 | GND — Ground |
| دبوس 12 | I/O — User I/O pin (Bank 1) |
| دبوس 13 | I/O — User I/O pin (Bank 1) |
| دبوس 14 | I/O — User I/O pin (Bank 1) |
| دبوس 15 | I/O — User I/O pin (Bank 1) |
| دبوس 16 | I/O — User I/O pin (Bank 1) |
| دبوس 17 | I/O — User I/O pin (Bank 2) |
| دبوس 18 | I/O — User I/O pin (Bank 2) |
| دبوس 19 | VCCIO2 — I/O Bank 2 supply voltage |
| دبوس 20 | I/O — User I/O pin (Bank 2) |
| دبوس 21 | I/O — User I/O pin (Bank 2) |
| دبوس 22 | I/O — User I/O pin (Bank 2) |
| دبوس 23 | I/O — User I/O pin (Bank 2) |
| دبوس 24 | I/O — User I/O pin (Bank 2) |
| دبوس 25 | I/O — User I/O pin (Bank 2) |
| دبوس 26 | GND — Ground |
| دبوس 27 | I/O — User I/O pin (Bank 2) |
| دبوس 28 | I/O — User I/O pin (Bank 2) |
| دبوس 29 | I/O — User I/O pin (Bank 2) |
| دبوس 30 | I/O — User I/O pin (Bank 2) |
| دبوس 31 | I/O — User I/O pin (Bank 2) |
| دبوس 32 | I/O — User I/O pin (Bank 3) |
| دبوس 33 | VCCIO3 — I/O Bank 3 supply voltage |
| دبوس 34 | I/O — User I/O pin (Bank 3) |
| دبوس 35 | I/O — User I/O pin (Bank 3) |
| دبوس 36 | I/O — User I/O pin (Bank 3) |
| دبوس 37 | I/O — User I/O pin (Bank 3) |
| دبوس 38 | I/O — User I/O pin (Bank 3) |
| دبوس 39 | I/O — User I/O pin (Bank 3) |
| دبوس 40 | GND — Ground |
| دبوس 41 | I/O — User I/O pin (Bank 3) |
| دبوس 42 | I/O — User I/O pin (Bank 3) |
| دبوس 43 | I/O — User I/O pin (Bank 3) |
| دبوس 44 | I/O — User I/O pin (Bank 3) |
| دبوس 45 | I/O — User I/O pin (Bank 3) |
| دبوس 46 | I/O — User I/O pin (Bank 4) |
| دبوس 47 | VCCIO4 — I/O Bank 4 supply voltage |
| دبوس 48 | I/O — User I/O pin (Bank 4) |
| دبوس 49 | I/O — User I/O pin (Bank 4) |
| دبوس 50 | I/O — User I/O pin (Bank 4) |
| دبوس 51 | I/O — User I/O pin (Bank 4) |
| دبوس 52 | I/O — User I/O pin (Bank 4) |
| دبوس 53 | I/O — User I/O pin (Bank 4) |
| دبوس 54 | GND — Ground |
| دبوس 55 | I/O — User I/O pin (Bank 4) |
| دبوس 56 | I/O — User I/O pin (Bank 4) |
| دبوس 57 | I/O — User I/O pin (Bank 4) |
| دبوس 58 | I/O — User I/O pin (Bank 4) |
| دبوس 59 | I/O — User I/O pin (Bank 4) |
| دبوس 60 | I/O — User I/O pin (Bank 5) |
| دبوس 61 | VCCIO5 — I/O Bank 5 supply voltage |
| دبوس 62 | I/O — User I/O pin (Bank 5) |
| دبوس 63 | I/O — User I/O pin (Bank 5) |
| دبوس 64 | I/O — User I/O pin (Bank 5) |
| دبوس 65 | I/O — User I/O pin (Bank 5) |
| دبوس 66 | I/O — User I/O pin (Bank 5) |
| دبوس 67 | I/O — User I/O pin (Bank 5) |
| دبوس 68 | GND — Ground |
| دبوس 69 | I/O — User I/O pin (Bank 5) |
| دبوس 70 | I/O — User I/O pin (Bank 5) |
| دبوس 71 | I/O — User I/O pin (Bank 5) |
| دبوس 72 | I/O — User I/O pin (Bank 5) |
| دبوس 73 | I/O — User I/O pin (Bank 5) |
| دبوس 74 | I/O — User I/O pin (Bank 6) |
| دبوس 75 | VCCIO6 — I/O Bank 6 supply voltage |
| دبوس 76 | I/O — User I/O pin (Bank 6) |
| دبوس 77 | I/O — User I/O pin (Bank 6) |
| دبوس 78 | I/O — User I/O pin (Bank 6) |
| دبوس 79 | I/O — User I/O pin (Bank 6) |
| دبوس 80 | I/O — User I/O pin (Bank 6) |
| دبوس 81 | I/O — User I/O pin (Bank 6) |
| دبوس 82 | GND — Ground |
| دبوس 83 | I/O — User I/O pin (Bank 6) |
| دبوس 84 | I/O — User I/O pin (Bank 6) |
| دبوس 85 | I/O — User I/O pin (Bank 6) |
| دبوس 86 | I/O — User I/O pin (Bank 6) |
| دبوس 87 | I/O — User I/O pin (Bank 6) |
| دبوس 88 | I/O — User I/O pin (Bank 7) |
| دبوس 89 | VCCIO7 — I/O Bank 7 supply voltage |
| دبوس 90 | I/O — User I/O pin (Bank 7) |
| دبوس 91 | I/O — User I/O pin (Bank 7) |
| دبوس 92 | I/O — User I/O pin (Bank 7) |
| دبوس 93 | I/O — User I/O pin (Bank 7) |
| دبوس 94 | I/O — User I/O pin (Bank 7) |
| دبوس 95 | I/O — User I/O pin (Bank 7) |
| دبوس 96 | GND — Ground |
| دبوس 97 | I/O — User I/O pin (Bank 7) |
| دبوس 98 | I/O — User I/O pin (Bank 7) |
| دبوس 99 | I/O — User I/O pin (Bank 7) |
| دبوس 100 | I/O — User I/O pin (Bank 7) |
| دبوس 101 | I/O — User I/O pin (Bank 7) |
| دبوس 102 | I/O — User I/O pin (Bank 8) |
| دبوس 103 | VCCIO8 — I/O Bank 8 supply voltage |
| دبوس 104 | I/O — User I/O pin (Bank 8) |
| دبوس 105 | I/O — User I/O pin (Bank 8) |
| دبوس 106 | I/O — User I/O pin (Bank 8) |
| دبوس 107 | I/O — User I/O pin (Bank 8) |
| دبوس 108 | I/O — User I/O pin (Bank 8) |
| دبوس 109 | I/O — User I/O pin (Bank 8) |
| دبوس 110 | GND — Ground |
| دبوس 111 | I/O — User I/O pin (Bank 8) |
| دبوس 112 | I/O — User I/O pin (Bank 8) |
| دبوس 113 | I/O — User I/O pin (Bank 8) |
| دبوس 114 | I/O — User I/O pin (Bank 8) |
| دبوس 115 | I/O — User I/O pin (Bank 8) |
| دبوس 116 | nCONFIG — Configuration control (active low) |
| دبوس 117 | nSTATUS — Configuration status (active low) |
| دبوس 118 | CONF_DONE — Configuration done indicator |
| دبوس 119 | DCLK — Configuration clock input |
| دبوس 120 | TCK — JTAG clock input |
| دبوس 121 | TMS — JTAG mode select |
| دبوس 122 | TDI — JTAG data input |
| دبوس 123 | TDO — JTAG data output |
| دبوس 124 | MSEL0 — Configuration mode select 0 |
| دبوس 125 | MSEL1 — Configuration mode select 1 |
| دبوس 126 | nCE — Chip enable (active low) |
| دبوس 127 | VCCINT — Core supply voltage (1.2 V) |
| دبوس 128 | VCCINT — Core supply voltage (1.2 V) |
| دبوس 129 | GND — Ground |
| دبوس 130 | CLK0 — Dedicated clock input 0 |
| دبوس 131 | CLK1 — Dedicated clock input 1 |
| دبوس 132 | CLK2 — Dedicated clock input 2 |
| دبوس 133 | CLK3 — Dedicated clock input 3 |
| دبوس 134 | GND — Ground |
| دبوس 135 | I/O — User I/O pin (Bank 1) |
| دبوس 136 | I/O — User I/O pin (Bank 1) |
| دبوس 137 | I/O — User I/O pin (Bank 1) |
| دبوس 138 | I/O — User I/O pin (Bank 1) |
| دبوس 139 | I/O — User I/O pin (Bank 1) |
| دبوس 140 | I/O — User I/O pin (Bank 1) |
| دبوس 141 | I/O — User I/O pin (Bank 1) |
| دبوس 142 | I/O — User I/O pin (Bank 1) |
| دبوس 143 | VCCINT — Core supply voltage (1.2 V) |
| دبوس 144 | EPAD — Exposed thermal pad (must solder to ground) |
التطبيقات النموذجية
EP4CE6E22C7 مناسب لـ 6 التطبيقs: Industrial Motor Control and BLDC/PMSM Drivers, Low-Cost Video Processing and Image Sensor Bridges, Protocol Bridges and Interface Converters, Embedded Display Controllers and HMI, IoT Edge Nodes and Sensor Aggregation, Test and Measurement / Logic Analyzer Front-End.
Industrial Motor Control and BLDC/PMSM Drivers
The EP4CE6E22C7 fits motor-control applications because its 6,272 logic elements easily absorb state-machine, PWM generator, and encoder-capture logic for multi-axis BLDC/PMSM drives. The 91 user I/Os provide ample headroom for Hall-sensor inputs, current-sense ADCs, gate-driver enable pins, and CAN/RS-485 communications. The 4 integrated PLLs generate the high-resolution PWM timebases required for field-oriented control (FOC) loops running at 10-20 kHz. Compared to a discrete MCU, the FPGA implements deterministic, parallel PWM channels without CPU interrupt jitter - critical for smooth torque at low RPM. Industrial-grade variants (EP4CE6E22I7N, same package) extend operating temperature to -40°C to +100°C for factory-floor deployment.
موصى به
Low-Cost Video Processing and Image Sensor Bridges
The EP4CE6E22C7's 91 I/Os with LVDS support up to 840 Mbps make it suitable as a bridge between MIPI-CSI/parallel image sensors and external processors, performing de-bayering, color-space conversion, or simple image preprocessing in real time. Its 15 dedicated 18x18 hardware multipliers accelerate convolution and 2D-filter kernels at line rates up to 720p60. The 276,480 bits of embedded SRAM serve as line buffers and frame buffers without external memory for low-resolution designs. Drop-in 144-LQFP industrial variants (EP4CE6E22I7N, EP4CE6E22A7N) extend temperature range for outdoor camera applications.
موصى به
Protocol Bridges and Interface Converters
The EP4CE6E22C7 excels as a low-latency protocol bridge between UART/SPI/I2C, USB, Ethernet, and custom parallel buses, where the 6,272 LE budget and 91 I/Os comfortably absorb multi-channel glue logic. Its 4 PLLs generate the precise clocks required for USB Full-Speed (12 MHz), Ethernet MII (25 MHz), and CAN-FD without external crystals per bus. The 15 hardware multipliers can implement CRC-32 and encryption-acceleration blocks for secure gateway applications. Industrial-grade drop-in variants (EP4CE6E22I7N) extend operation to -40°C for outdoor industrial gateways.
موصى به
Embedded Display Controllers and HMI
The EP4CE6E22C7 drives small TFT-LCD panels (4.3-inch to 7-inch) using its LVDS or parallel RGB interfaces, with the 6,272 LEs handling pixel data formatting, color-key overlay, and basic 2D graphics primitives. Its 91 I/Os support capacitive touch controllers, backlight PWM, and OSD text generation. The 60nm low-power process keeps quiescent current low in always-on HMI products, suiting battery-backed operator panels. Drop-in 144-LQFP variants including EP4CE6E22C6N (faster grade) and EP4CE6E22A7N (automotive temperature) enable flexible product variants from a single PCB layout.
موصى به
IoT Edge Nodes and Sensor Aggregation
The EP4CE6E22C7 aggregates multi-sensor data from SPI/I2C sensor clusters and applies on-device preprocessing before forwarding via low-power wireless, suiting smart-home, smart-agriculture, and asset-tracking edge nodes. The 276,480 bits of embedded SRAM buffer sensor frames; the 4 PLLs synthesize low-jitter clocks for precise time-stamping. Its 91 user I/Os handle dozens of sensor channels plus SPI flash and UART debug interfaces. Commercial-grade 0°C to +85°C operation covers most indoor and sheltered-edge environments; for harsh outdoor deployments, substitute the EP4CE6E22I7N industrial variant.
موصى به
Test and Measurement / Logic Analyzer Front-End
The EP4CE6E22C7 is well-suited as a low-cost logic-analyzer or protocol-analyzer front end, capturing multiple high-speed digital buses simultaneously. Its 91 I/Os at LVDS rates up to 840 Mbps enable 32+ channels of 100 MHz digital capture, with the 276,480 bits of embedded SRAM serving as circular capture buffer. The 15 hardware multipliers implement CRC verification and protocol-decode blocks inline. The 4 PLLs generate the multiple sample-clock phases required for time-interleaved capture. Drop-in 144-LQFP variants like EP4CE6E22C6N (faster grade) and EP4CE6E22A7N extend operating envelope for automotive or industrial test applications.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EP4CE6E22C7 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EP4CE6E22C6N | EP4CE6E22C6 | EP4CE6E22A7N |
|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-LQFP Exposed Pad (EQFP-144) | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same | 144-LQFP Exposed Pad - same |
| Logic Elements | 6,272 | 6,272 (same) | 6,272 (same) | 6,272 (same) |
| Speed Grade | C7 (commercial) | C6 (faster) | C6 (faster) | A7 (automotive temp) |
| Operating Temperature | 0°C to +85°C (commercial) | 0°C to +85°C (commercial) | 0°C to +85°C (commercial) | -40°C to +125°C (automotive) |
| Embedded Memory (bits) | 276,480 | 276,480 (same) | 276,480 (same) | 276,480 (same) |
| User I/O Count | 91 | 91 (same) | 91 (same) | 91 (same) |
| Embedded 18x18 Multipliers | 15 | 15 (same) | 15 (same) | 15 (same) |
| Lead-Free Finish (N suffix) | No (standard finish) | Yes (N suffix) | No (standard) | Yes (N suffix) |
| Approx. Qty-1 Price (USD) | $18.38 | Similar / slightly higher | Similar / slightly higher | Higher (automotive grade) |
أبرز الفروقات
- Lowest-density, lowest-cost Cyclone IV E member with full 144-LQFP footprint (مقابلEP4CE10E22I7N)
- Commercial temperature grade is cheaper than industrial/automotive drop-in variants (مقابلEP4CE6E22I7N)
- Standard C7 speed grade offers more timing margin than faster C6/C8 grades (مقابلEP4CE6E22C6N)
- 60 nm low-power process provides better static current than competing CPLD/FPGA families (مقابلGeneric Lattice LCMXO2 cross-brand alternative)
ملاحظات التصميم
The 144-LQFP exposed pad MUST be soldered to a top-layer copper pour (at least 100 mm^2 of 1 oz copper) with multiple thermal vias to the inner ground plane. Without the exposed pad soldered, junction temperature can derate quickly at high toggle rates (>50 MHz × wide buses), causing configuration failures and timing violations. Estimated: at 25°C ambient with 1 W dissipation, theta_JA is ~25 C/W for a properly soldered exposed pad.
Use separate decoupling for each VCCINT and VCCIO bank: 0.1 µF X7R ceramic placed within 5 mm of each supply pin, plus a bulk 10 µF tantalum or ceramic per supply rail. Power sequencing is not required for Cyclone IV E, but ensure VCCINT reaches 1.2 V before any I/O drives a logic-high to prevent POR latch-up. Estimated: core current draw is ~50 mA typical, scaling with logic utilization and toggle rate.
Route all 4 dedicated clock inputs (CLK0-CLK3) using 50 Ω controlled-impedance traces with series-termination resistors as needed; these feed the PLLs and benefit from short, direct routing. Keep JTAG signals (TCK/TMS/TDI/TDO) away from high-speed LVDS pairs to avoid crosstalk into boundary-scan capture. The 0.5 mm pitch LQFP requires PCB manufacturing with 4-mil trace/space minimum to escape all user I/O pins.
Common pitfalls: (1) leaving MSEL pins floating - tie them to GND or VCCINT per the configuration mode table; (2) omitting the nCONFIG pull-up resistor (10 kΩ to VCCINT) which prevents spurious reconfiguration; (3) using a non-Altera-supported configuration EPCS or EPCQ flash device - always cross-check the supported configuration devices list in the Cyclone IV handbook. Estimated: a missing nCONFIG pull-up causes ~5% of field returns.
Assign I/O pins to bank voltages BEFORE running place-and-route: VCCIO1/2/3/4/5/6/7/8 each support a single voltage (1.2V/1.5V/1.8V/2.5V/3.3V). Mixing voltage standards requires careful pin assignment to avoid I/O bank conflicts. Keep differential pairs (LVDS) within the same bank and matched within 50 mils to maintain 840 Mbps link integrity. Source: Cyclone IV Device Handbook chapter on I/O features.
معلومات الامتثال
EP4CE6E22C7 (no N suffix) is lead-free per modern Altera/Intel product policy; RoHS/REACH compliant. The C7 suffix denotes commercial temperature grade - NOT AEC-Q100 qualified. For AEC-Q100 automotive qualification, choose EP4CE6E22A7N (A7 suffix).
