EPM5192AGC-20 - MAX 5000 EPLD, 192 Macrocells | Altera (Intel)
MPN: EPM5192AGC-20 ✗ انتهى عمره الإنتاجيEPM5192AGC-20 نظرة عامة
A MAX 5000-series EPLD is a member of the electrically-erasable programmable logic device (EEPLD) family. In the broader component taxonomy, an EPLD sits under programmable logic devices (PLDs) -> programmable logic -> digital logic ICs. MAX 5000 devices use a programmable AND/OR macrocell architecture with non-volatile EEPROM configuration memory, so designs retain their pattern after power-down without an external boot PROM - unlike SRAM-based FPGAs which require a configuration flash. Each macrocell contains a programmable AND plane feeding a fixed OR term, an output register, and a feedback path, allowing both combinatorial and registered logic to be implemented.
Key features of the EPM5192 include 192 macrocells, 12,000 usable gates, a 20 ns tPD (pin-to-pin delay), fCNT up to 100 MHz counter frequency, and 96 dedicated I/O pins organized into 8 LABs (Logic Array Blocks). Per the Altera MAX 5000 datasheet, the device supports 5 V in-system programmability via the IEEE 1149.1 JTAG interface, allowing reconfiguration without removal from the board. An enhanced security bit prevents pattern read-back, protecting proprietary designs.
Typical applications include high-speed glue logic between microprocessors and peripherals, bus arbitration and address decoding, state-machine replacement for legacy 74LS/74F TTL, and industrial control sequencers. The 20 ns tPD makes it appropriate for systems clocked up to ~33 MHz without pipeline insertion.
When designing with the EPM5192AGC-20, verify that the target application does not exceed 5.5 V VCC. Use a ceramic-socketed PGA footprint to take advantage of windowed UV erasure during prototyping. The ceramic 'G' package is rated for commercial 0C to 70C operation; for industrial temperatures use the equivalent -1 or -2 speed grade in a plastic package.
بدائل مباشرة لـ EPM5192AGC-20 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع EPM5192AGC-20 (نفس عامل الشكل والبصمة) — يختلف في Package, Mounting Type, Propagation Delay (tPD), Supply Voltage (VCC), Device Type.
EPM5192AGC-15
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM5192AGC
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←EPM5130GC
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
EPM5192AGC-20 الحدود القصوى والخصائص الكهربائية
| Family | MAX 5000 |
| Device Type | EPLD (EEPLD, UV-erasable) |
| Macrocells | 192 |
| Usable Gates | 12,000 |
| Propagation Delay (tPD) | 20 ns |
| Counter Frequency (fCNT) | 100 MHz (max) |
| Supply Voltage (VCC) | 5 V (4.75 V to 5.25 V) |
| Logic Array Blocks (LABs) | 8 |
| Dedicated I/O Pins | 96 |
| Programming Interface | IEEE 1149.1 JTAG |
| In-System Programmability | Yes (5 V ISP) |
| Security Bit | Yes (pattern read-back protected) |
| العلبة | PGA-132 (ceramic windowed, 'GC') |
| نوع التركيب | Through-hole (PGA socket) |
| درجة حرارة التشغيل | 0C to 70C (commercial) |
دليل تكوين أطراف EPM5192AGC-20 pga-132 (ceramic windowed, 'gc')
تكوين الأطراف لـ EPM5192AGC-20 (حزمة pga-132 (ceramic windowed, 'gc')). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ EPM5192AGC-20.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
EPM5192AGC-20 مناسب لـ 6 التطبيقs: High-Speed Glue Logic Replacement, Industrial Control State Machines, Microprocessor Bus Address Decoding, Legacy Communication Interface Bridging, Aerospace and Military Test Equipment, Education and Prototyping Platforms.
High-Speed Glue Logic Replacement
The EPM5192AGC-20's 192 macrocells and 20 ns tPD make it an ideal single-chip replacement for racks of 74LS/74F TTL glue logic. In legacy CPU-to-peripheral interfaces (e.g., 68030 or 80386 designs running at 25-33 MHz), dozens of discrete AND, OR, NAND, and latch packages can be consolidated into one PGA-132 EPLD. The 12,000 usable gates handle typical bus-arbiter plus address-decoder designs with margin, and the 5 V JTAG ISP interface lets the engineer rework the logic pattern without desoldering the part.
موصى به
Industrial Control State Machines
Factory automation sequencers built around 8051 or Z80 microcontrollers often need a Moore or Mealy state machine running in parallel to the CPU. The EPM5192AGC-20's 192 macrocells implement 8-state to 16-state FSMs with ease, and the 100 MHz fCNT (counter frequency) handles stepper-pulse generation, quadrature decoding, and watchdog timers in real time. The ceramic PGA package is mechanically rugged, tolerating the vibration profile of factory-floor cabinets. Designers use AHDL state-machine syntax under MAX+PLUS II to describe the FSM and fit it into a single LAB.
موصى به
Microprocessor Bus Address Decoding
The EPM5192AGC-20 is well suited to building a full 24-bit address decoder for 16-bit and 32-bit microprocessor systems. Its 96 dedicated I/O pins accept the full address bus plus chip-select outputs, and each macrocell implements a single product-term-based decode equation. With 20 ns tPD, the decoder fits between the CPU address valid signal and the peripheral /CS pin within a single clock cycle at 33 MHz. Compared to discrete 74LS138/139 decoder trees, the EPM5192 saves PCB area and reduces decode skew across multiple chip-selects.
موصى به
Legacy Communication Interface Bridging
Bridging between legacy parallel buses (e.g., PC/104, VME, Multibus) and modern peripherals is a classic MAX 5000 use case. The EPM5192AGC-20 converts 8-bit ISA bus cycles to 16-bit local-bus cycles, generates the /RD, /WR, and wait-state timing, and buffers data with its bidirectional I/O. The 100 MHz counter chain builds the wait-state generator and baud-rate divider for an RS-232/RS-485 transceiver. JTAG ISP allows the bridging logic to be patched in the field when protocols change.
موصى به
Aerospace and Military Test Equipment
Military-grade test stations require programmable logic that survives -55C to +125C and resists vibration; the ceramic PGA-132 package of the EPM5192AGC-20 meets this profile. Engineers use it to build reconfigurable stimulus/response sequencers in depot-level avionics testers. The UV-erasable window allows classified patterns to be wiped before board disposal, and the JTAG interface supports DoD-mandated boundary-scan testing per IEEE 1149.1. The 192 macrocells handle 32-channel parallel test vectors comfortably.
موصى به
Education and Prototyping Platforms
University digital-design labs have used the EPM5192AGC-20 since the 1990s as a teaching vehicle for AHDL, state-machine design, and JTAG boundary-scan. The ceramic windowed PGA-132 package lets students erase and re-program the device repeatedly using a UV lamp, making the part ideal for hands-on coursework. The 12,000-gate capacity supports full RISC CPU implementations (e.g., a multi-cycle MIPS) as semester projects. Modern courses migrate to MAX V CPLDs on dev boards, but many labs retain EPM5192 stocks for legacy curriculum.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ EPM5192AGC-20 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | EPM5192AGC-15 | EPM5192AGC | EPM5192AJC-15 | EPM5192JC-20 | EPM5130GC |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | PGA-132 (ceramic, windowed) | PGA-132 (ceramic, windowed) - same | PGA-132 (ceramic, windowed) - same | PLCC-132 (plastic) - different footprint | PLCC-132 (plastic) - different footprint | PGA-132 (ceramic, windowed) - same |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 128 (-33%) |
| Usable Gates | 12,000 | 12,000 | 12,000 | 12,000 | 12,000 | 8,000 (-33%) |
| I/O Pins | 96 | 96 | 96 | 96 | 96 | 64 (-33%) |
| Programming Interface | JTAG (IEEE 1149.1) ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP | JTAG ISP |
| Operating Temperature | 0C to 70C (commercial) | 0C to 70C | 0C to 70C | 0C to 70C | 0C to 70C | 0C to 70C |
أبرز الفروقات
- Highest macrocell density in MAX 5000 family with UV window (مقابلEPM5130GC)
- 20 ns speed grade offers best availability vs faster bins (مقابلEPM5192AGC-15)
- Ceramic PGA-132 with UV window enables erasure (مقابلEPM5192AJC-15 (plastic PLCC))
ملاحظات التصميم
The EPM5192AGC-20 in PGA-132 must be socketed (e.g., 3M Textool 132-pin PGA socket) so the part can be removed for UV erasure during prototyping and rework. The ceramic package is fragile; do not hand-solder directly. Provide a 0.1 uF decoupling capacitor on each VCC pin pair (VCC/GND) placed within 3 mm of the package pins, and bulk 10 uF tantalum on each VCC rail. The 132 PGA footprint requires the via-in-pad or dog-bone escape pattern to route signals out of the inner rows; route all signal traces on inner layers and use the outer layer for GND fill under the socket cavity.
Estimated: at 100 MHz fCNT toggling 50% of 96 outputs, ICC rises from 200 mA (static) to approximately 350 mA on a 5 V supply. Provide at least 2 A of 5 V headroom at the regulator and use a 4-layer PCB with a dedicated VCC plane. The MAX 5000 family is 5 V only; do NOT connect 3.3 V signals directly to any I/O pin or to VCC. For 3.3 V interfacing, use a 74HCT245 or 74LVTH245 buffer between the EPM5192 and 3.3 V peripherals, or migrate to a MAX II/MAX V 3.3 V CPLD.
The EPM5192 does NOT support modern Quartus Prime; use legacy Altera MAX+PLUS II version 9.x or earlier. Do not exceed 5.25 V VCC even momentarily - the EEPROM programming algorithm requires precise 5 V tolerance and will fail or damage the cell at higher voltages. The JTAG ISP pins (TDI/TDO/TMS/TCK) require 4.7 kohm pull-up resistors to VCC if no download cable is attached, otherwise the boundary-scan chain can latch-up into an undefined state at power-up.
PGA-132 signal integrity: route each signal trace over a continuous ground reference plane; avoid crossing split planes. The inner-row PGA pins are bonded to the die via short wire bonds, so source-series termination (22-33 ohm) on high-speed outputs above 50 MHz is recommended. For 20 MHz designs (the -20 speed grade), source-series termination is usually unnecessary. Keep the TCK JTAG clock trace under 50 mm and isolate it from switching outputs by at least 3 mm or a ground guard trace.
معلومات الامتثال
Ceramic-windowed PGA-132 package from the pre-RoHS era. RoHS compliance: non-compliant due to lead-bearing ceramic-package solder terminations. The plastic PLCC variants (e.g., EPM5192AJC-15) may be RoHS-compliant depending on date code - verify with the broker's Certificate of Compliance. AEC-Q100: not qualified (industrial/aerospace use only via -883B Mil-screening variants such as EPM5192GM883B).
