NXP Semiconductors

LPC4312JET100E - 204MHz Dual-Core MCU | NXP | 100-TFBGA

MPN: LPC4312JET100E ✓ نشط
3.3 V Vdss 100-TFBGA (9 mm x 9 mm) Package 204 MHz Speed 512 KB Memory
الحد الأدنى للطلب: 1 |

LPC4312JET100E نظرة عامة

The NXP Semiconductors LPC4312JET100E is a 32-bit dual-core embedded microcontroller based on an Arm Cortex-M4 processor with an Arm Cortex-M0 coprocessor, operating up to 204 MHz and providing 512 KB of flash memory and 136 KB of on-chip SRAM in a 100-TFBGA package measuring 9 mm by 9 mm. The part also includes an Ethernet controller, two high-speed USB interfaces, LCD support, and a quad SPI Flash Interface for embedded applications requiring extensive connectivity.

A microcontroller is an integrated circuit that combines a processor core, memory, peripherals, and communication interfaces on one semiconductor device. The LPC43xx family belongs to the Arm Cortex-M microcontroller hierarchy, where the Cortex-M4 core handles primary control and signal-processing tasks while the Cortex-M0 coprocessor can offload suitable background tasks. Ethernet, high-speed USB, LCD, and SPI Flash connectivity place the device between a general-purpose microcontroller and a more highly integrated communications processor.

The verified product information identifies a 512 KB flash configuration, 136 KB of on-chip SRAM, and 16 KB of EEPROM for the LPC435x/3x/2x/1x family. Its quad SPI Flash Interface supports external serial-memory expansion, while Ethernet and two high-speed USB interfaces reduce the need for separate communication controllers. The 100-TFBGA package provides 100 terminals on a compact 9 mm by 9 mm surface-mount footprint suitable for compact industrial and communications equipment.

The device combines a 204 MHz Cortex-M4 core with a Cortex-M0 coprocessor in one package. This heterogeneous arrangement can separate interrupt-intensive or peripheral-oriented work from the main control loop without requiring a second discrete microcontroller. Exact core frequencies, cache organization, and coprocessor performance allocation are not included in the supplied verified data, so those details should be confirmed in the manufacturer documentation before workload partitioning is finalized.

Typical uses include industrial Ethernet equipment, USB-enabled embedded controllers, human-machine-interface systems with LCD connectivity, and designs requiring external SPI Flash storage. The Ethernet controller and dual high-speed USB support are particularly useful for connected data-acquisition, communications, and monitoring products. A design can also use the quad SPI Flash Interface to retain firmware, configuration, logs, or graphical assets outside the internal 512 KB flash.

PCB planning must account for the fine-pitch 100-TFBGA land pattern, multilayer escape routing, power and ground distribution, and thermal management. Firmware selection should also verify boot, memory-map, peripheral, pin-muxing, and debugger requirements rather than assuming that software built for another LPC43xx member is interchangeable. Exact operating-temperature, voltage, and package-performance limits were not supplied and require confirmation from the NXP datasheet.

This product record combines verified manufacturer and distributor information, an explicit treatment of missing electrical data, connectivity-focused application guidance, and pin-compatible same-family alternatives. It is intended to support engineering selection and sourcing decisions without presenting unverified specifications as guaranteed production facts.

بدائل مباشرة لـ LPC4312JET100E — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.

LPC4312JET100

✅ بديل مباشر
📦 100-TFBGA (9 mm x 9 mm)
Same 204 MHz core, 512 KB flash, 136 KB SRAM, and 100-TFBGA configuration; ordering suffix differs by 0% in the listed key parameters, while temperature-grade requirements must be checked

📋 بديل مرجعي (غير موجود في الكتالوج)

LPC4312JBD100E

✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها
📦 100-TFBGA (9 mm x 9 mm)
Same LPC4312 100-TFBGA device family and 512 KB flash class; the ordering suffix changes the configured grade, with a maximum known memory difference of 0% where the listed 136 KB SRAM applies

📋 بديل مرجعي (غير موجود في الكتالوج)

LPC4312JET100B

✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها
📦 100-TFBGA (9 mm x 9 mm)
Same LPC4312JET100 base configuration and 100-TFBGA layout; the revision suffix changes ordering metadata with 0% difference in the verified 204 MHz, 512 KB flash, and 136 KB SRAM ratings

📋 بديل مرجعي (غير موجود في الكتالوج)

LPC4312JET100C

✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها
📦 100-TFBGA (9 mm x 9 mm)
Same LPC4312JET100 base configuration and 100-TFBGA layout; the revision suffix changes ordering metadata with 0% difference in the verified 204 MHz, 512 KB flash, and 136 KB SRAM ratings

📋 بديل مرجعي (غير موجود في الكتالوج)

LPC4312JET100D

✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها
📦 100-TFBGA (9 mm x 9 mm)
Same LPC4312JET100 base configuration and 100-TFBGA layout; the revision suffix changes ordering metadata with 0% difference in the verified 204 MHz, 512 KB flash, and 136 KB SRAM ratings

📋 بديل مرجعي (غير موجود في الكتالوج)

LPC4312JET100E الحدود القصوى والخصائص الكهربائية

Product Type 32-bit dual-core embedded microcontroller
Main Processor Core Arm Cortex-M4
Coprocessor Core Arm Cortex-M0
Maximum Processor Frequency 204 MHz
Flash Memory 512 KB
Flash Organization 512K x 8 bits
On-Chip SRAM 136 KB
On-Chip EEPROM 16 KB
Ethernet Support Yes
High-Speed USB Interfaces 2
External Serial Flash Interface Quad SPI Flash Interface (SPIFI)
LCD Support Yes
EMC Support Yes
جهد التغذية 3.3 V
العلبة 100-TFBGA (9 mm x 9 mm)
Terminal Count 100 terminals
نوع التركيب Surface Mount
Moisture Sensitivity Level MSL 3 (168 hours)

دليل تكوين أطراف LPC4312JET100E 100-tfbga (9 mm x 9 mm)

تكوين الأطراف لـ LPC4312JET100E (حزمة 100-tfbga (9 mm x 9 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.

مخطط توزيع أطراف حزمة 100-tfbga (9 mm x 9 mm) لـ LPC4312JET100E

لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ LPC4312JET100E.

راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.

التطبيقات النموذجية

LPC4312JET100E مناسب لـ 6 التطبيقs: Industrial Ethernet Controller, USB Communications and Control Hub, LCD Human-Machine Interface, External SPI Flash Data Logger, Motor and Automation Controller, Secure Networked Embedded Gateway.

🏭

Industrial Ethernet Controller

The LPC4312JET100E fits industrial Ethernet equipment because it combines a 204 MHz Arm Cortex-M4 core, an Arm Cortex-M0 coprocessor, 136 KB of SRAM, and an integrated Ethernet controller in one 100-TFBGA device. The Cortex-M4 can execute protocol processing and application logic, while the Cortex-M0 can handle suitable background duties. Its 512 KB flash stores boot code and application firmware, while the quad SPI Flash Interface can expand external storage for logs, configuration data, or firmware images. Ethernet integration reduces the need for a discrete interface circuit, but the board must still provide the required magnetic isolation or magnetics, line impedance, clocking, and physical-layer support specified by NXP.

🌐

USB Communications and Control Hub

The LPC4312JET100E is suitable for USB communications products because it provides two high-speed USB interfaces alongside a 204 MHz Cortex-M4 core and 136 KB of SRAM. A host or device design can use one interface for a primary link and the other for peripheral expansion, diagnostics, or a configuration channel. The Cortex-M0 coprocessor adds flexibility for dividing protocol servicing from the main control application. Its 512 KB internal flash is sufficient for compact applications, and the quad SPI Flash Interface can retain larger data or images. Board-level design must account for USB connector protection, controlled-impedance routing, common-mode requirements, power supervision, and the exact host-versus-device capability of each USB block.

📺

LCD Human-Machine Interface

The LPC4312JET100E fits compact human-machine interfaces that combine a graphical display with networked or USB control functions. Its LCD support removes the need for a separate display controller when the panel interface is compatible with the device, while the 204 MHz Cortex-M4 core provides performance for rendering, input handling, and communications. The 136 KB of SRAM offers more working memory than many small display controllers, and 512 KB of flash can hold firmware and fixed interface resources. External assets can be placed in SPI Flash through the quad SPI Flash Interface. Engineers should confirm the MCU's supported display resolution and pixel format, then match the LCD interface timing, backlight control, touch input, and connector pinout to the selected panel.

🖥️

External SPI Flash Data Logger

The LPC4312JET100E can serve as the control processor for a data logger that stores records in external serial Flash. Its quad SPI Flash Interface provides a direct path to higher-capacity nonvolatile storage, while the 512 KB internal flash holds firmware and the 136 KB SRAM supports buffering active records. The 204 MHz Cortex-M4 core can service acquisition and formatting tasks, and the Cortex-M0 coprocessor can assist with peripheral servicing or background operations. This arrangement suits industrial monitoring equipment that must retain logs during network outages. Firmware should include wear management, record integrity checks, power-fail handling, and a recovery strategy because repeated log writes can limit Flash endurance even when the communication link is unavailable.

⚙️

Motor and Automation Controller

The LPC4312JET100E is applicable to compact automation and motor-control systems that benefit from real-time control, external communication, and a second low-power execution domain. The 204 MHz Cortex-M4 core can execute control algorithms and communication tasks, while the Cortex-M0 coprocessor can take on qualified background work. Ethernet supports networked equipment, two high-speed USB ports allow local configuration or service access, and the quad SPI Flash Interface can hold parameters and reference data. The 100-TFBGA package saves board area compared with many leaded packages, but it demands fine-pitch assembly and careful escape routing. Final selection requires checking timer, PWM, capture, and analog-function availability because those specifications were not included in the supplied verified data.

🧩

Secure Networked Embedded Gateway

The LPC4312JET100E can form the core of a compact gateway that translates between Ethernet, USB, and local serial or display systems. Its dual-core Cortex-M4/M0 architecture permits separation between network handling and device-control tasks, while 136 KB of SRAM supports protocol buffers and 512 KB of flash stores the base firmware. The Ethernet controller and two high-speed USB interfaces provide multiple external data paths, and SPI Flash offers expandable configuration storage. In a gateway design, the main engineering trade-offs are code partitioning, interrupt latency, shared-memory method, bootloader support, and security implementation. Exact cryptographic peripherals, watchdog features, and memory-protection functions are not quantified in the supplied source and must be verified before selecting the device for a security-sensitive product.

What are the key specifications of LPC4312JET100E that engineers should know?
The LPC4312JET100E integrates a 204 MHz Arm Cortex-M4 core and an Arm Cortex-M0 coprocessor with 512 KB of flash, 136 KB of SRAM, and 16 KB of EEPROM. According to the NXP LPC4312JET100 product information, it also provides Ethernet, two high-speed USB interfaces, LCD connectivity, EMC, and a quad SPI Flash Interface in a 100-TFBGA package.
What is the operating voltage of LPC4312JET100E?
The LPC4312JET100E is identified as a 3.3 V microcontroller in the supplied distributor information. The exact minimum, nominal, and maximum supply-voltage limits were not included in the verified data, so designers should confirm the permitted operating range, I/O thresholds, and decoupling requirements in the NXP datasheet before releasing a board design.
Where can I download the LPC4312JET100E datasheet PDF?
The official LPC4312JET100 product page is available from NXP at https://www.nxp.com/part/LPC4312JET100 and provides the appropriate manufacturer documentation entry point. A separate datasheet index is also listed at https://www.datasheets.com/nxp/lpc4312jet100e. No document number or revision was supplied in the verified data, so no document identifier is asserted here.
Where can I find the LPC4312JET100E pinout?
The LPC4312JET100E uses a 100-terminal TFBGA package measuring 9 mm by 9 mm. The supplied data confirms the package and terminal count but does not provide the complete numbered pin map, so an exact pin-by-pin listing cannot be reproduced reliably from this record. Use the official NXP LPC4312JET100 documentation and package drawing for authoritative ball assignments and land-pattern details.
How much memory does the LPC4312JET100E have?
The LPC4312JET100E provides 512 KB of internal flash, 136 KB of on-chip SRAM, and 16 KB of EEPROM according to the supplied NXP family information. The 512 KB flash is organized as 512K x 8 bits in the distributor listing. Additional external storage can be connected through the quad SPI Flash Interface, subject to the device's supported memory and bus requirements.
What processors are built into the LPC4312JET100E?
The LPC4312JET100E combines an Arm Cortex-M4 processor with an Arm Cortex-M0 coprocessor. According to the NXP product information, the Cortex-M4 operates at up to 204 MHz, while the Cortex-M0 core provides a second execution domain for appropriate background or peripheral tasks. Exact workload partitioning and simultaneous operation conditions should be verified in the manufacturer documentation.
Which communication interfaces are available on the LPC4312JET100E?
The LPC4312JET100E includes Ethernet, two high-speed USB interfaces, and a quad SPI Flash Interface. NXP also identifies LCD and EMC support for the device family. These interfaces make the MCU suitable for connected embedded equipment in which local networking, USB peripherals, display control, or external flash storage are required.
Where can I buy LPC4312JET100E online?
LPC4312JET100E listings are available from DigiKey, Mouser, and other suppliers identified in the supplied search data. The listed manufacturer and distributor pages are https://www.digikey.com/en/products/detail/nxp-usa-inc/LPC4312JET100E/3679368 and https://www.mouser.com/en/ProductDetail/NXP-Semiconductors/LPC4312JET100E. No verified unit price or stock quantity was supplied, so current commercial availability must be confirmed during quotation.
What is the price of LPC4312JET100E?
A verified numeric price for LPC4312JET100E was not included in the supplied web results as of 2026-10-28. The part is offered through DigiKey, Mouser, NXP, and other component channels, but distributor pricing can vary with quantity, date code, and authorized-channel status. Request a current quotation from the distributor before comparing it against the listed alternative order codes.
What is the lead time and stock status of LPC4312JET100E?
The supplied DigiKey search result says the part ships today, but it does not provide a stable, verifiable stock count or a manufacturer lead-time commitment. Because inventory can change rapidly, treat that statement as a search-time indication rather than a guaranteed allocation as of 2026-10-28. Confirm quantity, date code, and delivery terms directly with the supplier.
What can replace the LPC4312JET100E as a drop-in component?
The directly supported drop-in candidate is the NXP LPC4312JET100 in the same 100-TFBGA device configuration. It removes the E ordering suffix while retaining the LPC4312JET100 base identity, 204 MHz Cortex-M4/M0 architecture, 512 KB flash, 136 KB SRAM, and 100-TFBGA package. Firmware, temperature-grade, and ordering-code requirements should still be checked before substitution.
Is the LPC4312JET100 the same as the LPC4312JET100E?
The LPC4312JET100 and LPC4312JET100E share the same base LPC4312JET100 device identity and 100-TFBGA configuration, making the former the closest verified same-family alternative. The E suffix denotes an ordering-temperature or grade designation that must be checked against the required operating-temperature range. They should not be treated as interchangeable without reviewing the NXP ordering information.
When should I choose LPC4312JET100E over another same-family MCU?
Choose the LPC4312JET100E when a design specifically requires the E-suffixed NXP ordering configuration, the 204 MHz Cortex-M4/M0 core combination, 512 KB flash, 136 KB SRAM, Ethernet, two high-speed USB ports, and a 100-TFBGA footprint. Choose another order code only after confirming its temperature grade, memory configuration, lifecycle status, and exact package against the production BOM.
Is LPC4312JET100E suitable for industrial Ethernet and USB equipment?
The LPC4312JET100E is a strong candidate for connected embedded equipment because it combines a 204 MHz Cortex-M4 core, a Cortex-M0 coprocessor, Ethernet, and two high-speed USB interfaces. Its 136 KB SRAM supports demanding control workloads, while the quad SPI Flash Interface adds external storage flexibility. The final suitability depends on industrial temperature, EMC, and power requirements not quantified in the supplied data.
What is the best cross-brand equivalent for LPC4312JET100E?
No verified cross-brand, pin-to-pin TFBGA-100 equivalent for the LPC4312JET100E appears in the supplied cross-reference results. Cross-brand MCU equivalence requires matching the Cortex-M4/M0 architecture, memory map, 512 KB flash, 136 KB SRAM, Ethernet MAC, dual high-speed USB PHYs, pin multiplexing, and 100-ball footprint. The listed search tools provide lookup tools rather than verified substitutes, so engineers should not assume interchangeability.
Does the LPC4312JET100E need special PCB layout for its TFBGA package?
The LPC4312JET100E requires careful PCB design because it uses a 100-terminal TFBGA package on a 9 mm by 9 mm footprint. The official package drawing is required for the exact land pattern, ball map, and manufacturing tolerances. Power and ground distribution, high-speed USB and Ethernet routing, decoupling, and thermal copper should follow the manufacturer reference layout and the PCB design rules for the selected stack-up.

بيانات مرجعية هندسية لـ LPC4312JET100E — المقارنة وإرشادات التصميم ومعلومات الامتثال.

دليل الاختيار

Choose LPC4312JET100E when the production design specifically requires the E-suffixed NXP order code with a 204 MHz Arm Cortex-M4 core, Cortex-M0 coprocessor, 512 KB flash, 136 KB SRAM, Ethernet, two high-speed USB interfaces, and a 100-TFBGA package. LPC4312JET100 is the closest verified alternative and may suit designs that do not require the E designation, but the temperature grade and procurement code must be confirmed. The LPC4312JET100B, LPC4312JET100C, and LPC4312JET100D candidates preserve the base device family and package while changing ordering metadata. No cross-brand equivalent was verified because a legitimate replacement would need to match the unusual Cortex-M4/M0 configuration, pin multiplexing, memory map, communication peripherals, and 100-ball land pattern. For production, engineers should also confirm lifecycle status, software support, USB and Ethernet PHY requirements, and the exact NXP ordering table before releasing the BOM.

المقارنة مع البدائل

المعامل هذا المنتج LPC4312JET100 LPC4312JBD100E LPC4312JET100B LPC4312JET100C LPC4312JET100D
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 100-TFBGA (9 mm x 9 mm) 100-TFBGA (9 mm x 9 mm) - same 100-TFBGA (9 mm x 9 mm) - same 100-TFBGA (9 mm x 9 mm) - same 100-TFBGA (9 mm x 9 mm) - same 100-TFBGA (9 mm x 9 mm) - same
Main Processor Core Arm Cortex-M4 Arm Cortex-M4 Arm Cortex-M4 Arm Cortex-M4 Arm Cortex-M4 Arm Cortex-M4
Coprocessor Core Arm Cortex-M0 Arm Cortex-M0 Arm Cortex-M0 Arm Cortex-M0 Arm Cortex-M0 Arm Cortex-M0
Flash Memory 512 KB 512 KB 512 KB 512 KB 512 KB 512 KB

أبرز الفروقات

  • Verified E-suffixed ordering configuration (مقابلLPC4312JET100)
  • Dual Cortex-M architecture (مقابلLPC4312JET100B)
  • Connectivity integrated into the MCU (مقابلLPC4312JET100C)
  • Memory and package consistency (مقابلLPC4312JET100D)

ملاحظات التصميم

Use the official NXP package drawing and land pattern for the 100-TFBGA rather than reconstructing the footprint from the 9 mm by 9 mm body size. Escape power, ground, clock, and communications nets on all available layers, maintain the recommended via and solder-mask geometry, and avoid placing test points or tall components where they interfere with fine-pitch assembly. The verified data confirms 100 terminals but not individual ball assignments.

Provide a low-impedance 3.3 V rail with local bulk and high-frequency decoupling placed close to the device's supply and ground terminals. Exact capacitor values, voltage tolerances, and sequencing requirements were not included in the supplied information, so they must be taken from the manufacturer datasheet. Separate sensitive analog, digital, and clock-supply paths where the reference design specifies them, and avoid routing switching-node copper beneath high-speed or Ethernet areas.

Treat Ethernet and both high-speed USB interfaces as controlled-impedance, continuous-reference-plane nets. Match trace lengths to the applicable USB and Ethernet interface requirements, provide the required series and shunt terminations, and keep clocks away from switching power converters. The quad SPI Flash Interface should use short, symmetrical routing with its ground reference intact; no definitive impedance or timing values can be stated from the supplied data.

Do not treat similarly named LPC4312 order codes as automatically software-identical. Confirm the exact ordering suffix, temperature grade, flash size, SRAM size, pin multiplexing, boot configuration, and package before replacing LPC4312JET100E. The Cortex-M4/M0 partition also requires review of shared memory, interrupt routing, and firmware startup code, because a nominal package match alone does not establish complete design equivalence.

معلومات الامتثال

RoHS
Unknown
REACH
Compliant
AEC-Q100
Unknown
خالٍ من الرصاص
Unknown
خالٍ من الهالوجين
Unknown
المعادن المتنازع عليها
Unknown

The supplied GlobalSpec result states that REACH is unaffected. No verified RoHS, lead-free, halogen-free, conflict-minerals, or automotive-qualification statement was provided. The same result identifies MSL 3 with a 168-hour floor-life limit.

تم التحقق من البيانات في: 2026-10-28 — تم التحقق من البيانات وتنسيقها بواسطة فريق هندسة المكونات في XAIPART

عمليات بحث ذات صلة

LPC4312JET100E LPC4312JET100E datasheet NXP LPC4312JET100E LPC4312JET100E 204MHz Cortex-M4 M0 LPC4312JET100E 512KB flash 136KB SRAM 100-TFBGA LPC4312 microcontroller LPC4312JET100E industrial Ethernet controller LPC4312JET100E USB communications microcontroller LPC4312JET100E vs LPC4312JET100 LPC4312JET100E drop-in replacement LPC4312JET100E buy price where to buy LPC4312JET100E online LPC4312JET100E pinout what can replace LPC4312JET100E LPC4312JET100E lead time and stock

المكونات والمصطلحات ذات الصلة

NXP Semiconductors LPC4312JET100E LPC4312JET100 Arm Cortex-M4 Arm Cortex-M0 Arm Cortex-M microcontroller embedded microcontroller semiconductor 32-bit microcontroller dual-core microcontroller 204 MHz 512 KB flash memory 136 KB SRAM 16 KB EEPROM Ethernet controller high-speed USB quad SPI Flash Interface SPIFI LCD controller State Configurable Timer Serial General Purpose I/O 100-TFBGA BGA package family surface-mount package REACH MSL 3
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