M2GL050-FGG896 - IGLOO2 FPGA 56K LEs, 377 I/O, 896-BGA | Microchip
MPN: M2GL050-FGG896 ✓ نشطM2GL050-FGG896 نظرة عامة
An FPGA (field-programmable gate array) is a reconfigurable digital integrated circuit whose logic fabric, interconnect and I/O can be programmed after manufacture. The M2GL050-FGG896 belongs to the IGLOO2 family, a low-density line that combines a fourth-generation flash-based FPGA fabric with high-performance communications interfaces on a single chip. IGLOO2 devices are positioned for general-purpose functions such as bridging, I/O expansion, system management and secure connectivity.
Key device attributes include 56,340 logic elements, 1,869,824 RAM bits and 377 user I/O, giving designers very high pin-count density for a single board-level device. The package is an 896-ball PBGA measuring 31 x 31 x 2.44 mm, supplied on a tray, and the core supply voltage is 1.2 V. Microchip lists the M2GL050 family status as In Production, and the part is marked RoHS compliant.
The IGLOO2 architecture embeds non-volatile flash configuration memory so the device retains its configuration without an external configuration PROM. Bank-based I/O architecture allows user pins to be grouped into voltage domains for flexible interfacing with mixed-voltage peripherals, and the family includes communications interfaces such as high-speed SERDES blocks in designated banks for link-oriented designs.
Typical applications include protocol bridging and bus translation, I/O expansion and pin multiplexing in industrial control equipment, system management and supervisory logic, secure connectivity and encryption acceleration in communications gear, and general-purpose glue logic for industrial, communications and consumer-adjacent equipment.
When designing around the M2GL050-FGG896, the large 896-ball footprint demands careful BGA fanout and via-in-pad or via-under-bump escaping on the PCB, plus attention to layer count for the 377 user I/O. Plan the power rails for the 1.2 V core and the peripheral banks separately, and confirm bank-level voltage compatibility in the IGLOO2 packaging and pin descriptions user guide.
This page consolidates device specifications, drop-in ordering-code alternatives, pin and packaging guidance, and practical design notes into one engineering reference for the IGLOO2 896-ball family.
بدائل مباشرة لـ M2GL050-FGG896 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع M2GL050-FGG896 (نفس عامل الشكل والبصمة) — يختلف في Configuration Memory, Package, RoHS Status.
M2GL050-FGG896I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
M2GL050-1FGG896I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
M2GL050TS-1FG896I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
M2GL050TS-FGG896
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
M2GL050-FG896
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←M2GL050-FGG896 الحدود القصوى والخصائص الكهربائية
| Series | IGLOO2 |
| Device Family | Embedded - FPGAs (Field Programmable Gate Array) |
| Logic Elements | 56,340 LE |
| Total RAM Bits | 1,869,824 bits |
| User I/O Count | 377 I/O |
| Configuration Memory | Fourth-generation flash-based FPGA fabric (non-volatile configuration) |
| العلبة | 896-ball PBGA (896 FBGA), 31 x 31 x 2.44 mm |
| Packaging | Tray |
| Core Supply Voltage | 1.2 V |
| جهد التغذية التشغيلي | 1.2 V |
| Minimum Operating Temperature | 0 °C |
| Maximum Operating Temperature | +85 °C |
| نمط التركيب | SMD/SMT, surface mount |
| حالة RoHS | Compliant |
| حالة دورة الحياة | In Production |
| Bank 1 Single-Ended User I/O | 21 I/O |
| SERDES Block Availability | Restricted by bank in the 896-ball IGLOO2 device; confirm per IGLOO2 packaging and pin descriptions user guide |
دليل تكوين أطراف M2GL050-FGG896 896-ball pbga (896 fbga), 31 x 31 x 2.44 mm
تكوين الأطراف لـ M2GL050-FGG896 (حزمة 896-ball pbga (896 fbga), 31 x 31 x 2.44 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ M2GL050-FGG896.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
M2GL050-FGG896 مناسب لـ 6 التطبيقs: Industrial Protocol Bridging and Bus Translation, I/O Expansion and Signal Conditioning, System Management and Supervisory Logic, Secure Connectivity and Encryption Acceleration, Communications Equipment Line Cards, High-Pin-Count Test and Measurement Front Ends.
Industrial Protocol Bridging and Bus Translation
The M2GL050-FGG896 fits protocol-bridging designs because its 377 user I/O across multiple I/O banks allow several dissimilar interfaces to be terminated on one device, while 56,340 logic elements and 1,869,824 RAM bits absorb packet buffering and state-machine logic. The 1.2 V core rail keeps supply design simple alongside 3.3 V and 2.5 V peripheral banks, and the on-chip non-volatile flash configuration lets the same board be reused for different protocol revisions. Compared with a hardwired bridge ASIC, the FPGA can absorb new framing, CRC and timeout logic in firmware without respinning the board.
موصى به
I/O Expansion and Signal Conditioning
With 377 user I/O in a 31 x 31 mm 896-ball PBGA, the M2GL050-FGG896 consolidates high-pin-count expansion tasks such as level translation, isolation, latch and mux stages onto a single configurable device. Banked I/O lets you assign groups of pins to different voltage domains in the same design, and the 1,869,824 bits of embedded RAM provide buffering for wide data paths. Because the fabric is flash-configured, an I/O expansion card can be re-targeted to a different connector pinout simply by replacing the configuration bitstream.
موصى به
System Management and Supervisory Logic
The M2GL050-FGG896 is well suited to supervisory and system-management roles such as power sequencing monitors, watchdog and fault-logging blocks, and configuration-override logic for larger systems. Its 56,340 logic elements are ample for multi-channel state machines and event logging, while 1,869,824 RAM bits capture fault traces without off-chip memory. The device runs from a 1.2 V core and is RoHS compliant, and the 0 °C to +85 °C envelope suits enclosure-internal industrial and communications equipment; select the industrial-grade ordering code for wider temperature environments.
موصى به
Secure Connectivity and Encryption Acceleration
Microchip positions the IGLOO2 family for secure connectivity tasks, and the M2GL050-FGG896 brings 56,340 logic elements and 1,869,824 RAM bits to crypto and link-control workloads that would otherwise need several ASICs. The large I/O count lets high-speed data lanes terminate close to the fabric, reducing board trace length, and flash-based configuration keeps sensitive key material and protocol logic in a non-volatile, field-updatable image. The IGLOO2 family also integrates communications interfaces, so designs can add SERDES-based links in the designated banks without changing the package.
موصى به
Communications Equipment Line Cards
In line-card and edge-node equipment, the M2GL050-FGG896 consolidates framing, backplane interfacing and alarm handling into one device with 377 user I/O for dense backplane connectivity. The 1.2 V core supply is straightforward to generate alongside standard telecom rails, and banked I/O supports mixed 1.8 V and 2.5 V backplane signaling without level translators. Because configuration lives in on-chip flash, field upgrades happen by reloading the bitstream rather than swapping hardware, which shortens service intervals for carrier-deployed equipment.
موصى به
High-Pin-Count Test and Measurement Front Ends
The 377 user I/O available on the M2GL050-FGG896 enable dense multi-channel acquisition and switching front ends where dozens of analog-muxed signals must be routed into a common processing fabric. The 56,340 logic elements handle channel tagging, gain control sequencing and calibration tables, and 1,869,824 RAM bits allow per-channel buffering of sample data. With a 1.2 V core and separate banked peripheral supplies, the device fits mixed-signal instrumentation where level translation would otherwise occupy board area, and the large package keeps routing short to the instrument connector.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ M2GL050-FGG896 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | M2GL050-FGG896I | M2GL050-1FGG896I | M2GL050TS-1FG896I | M2GL050TS-FGG896 | M2GL050-FG896 |
|---|---|---|---|---|---|---|
| Package | 896-ball PBGA (31 x 31 x 2.44 mm) | 896-ball PBGA - same | 896-ball PBGA - same | 896-ball PBGA - same | 896-ball PBGA - same | 896-ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 56,340 LE | 56,340 LE | 56,340 LE | 56,340 LE | 56,340 LE | 56,340 LE |
| Total RAM Bits | 1,869,824 bits | 1,869,824 bits | 1,869,824 bits | 1,869,824 bits | 1,869,824 bits | 1,869,824 bits |
| User I/O Count | 377 I/O | 377 I/O | 377 I/O | 377 I/O | 377 I/O | 377 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Delivery Packaging | Tray | Tray | Tray | Tape and reel | Tape and reel | Tray |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Lifecycle Status | In Production | In Production | In Production | In Production | In Production | In Production |
أبرز الفروقات
- Same 896-ball silicon across every ordering code, so no layout change is needed (مقابلM2GL050-FGG896I)
- Volume assembly format available without changing the device or footprint (مقابلM2GL050TS-FGG896)
- Very high user I/O density in a single device (مقابلM2GL050-FGG484I)
- Non-volatile on-chip configuration removes the external loader requirement (مقابلM2GL050-VFG400I)
ملاحظات التصميم
The 896-ball PBGA on a 31 x 31 mm body has an aggressive escape requirement when 377 user I/O must break out. Adopt a fine-pitch land pattern with via-in-pad or a dense via array directly under the device so signal escapes do not require routing between ball rows. Keep the ball field on an even signal layer count, maintain continuous ground planes between row escapes, and place the 1.2 V core decoupling on the same layer as the device to limit loop area. Follow the land pattern and mask definitions in the IGLOO2 packaging and pin descriptions user guide (DS0124) rather than approximating the footprint.
Plan at least three power domains: the 1.2 V core rail plus one rail per I/O bank, since banked supplies let each interface group run at its native voltage. Provide bulk capacitance for the core and per-bank local ceramic decoupling placed at the corresponding power and ground balls to control supply noise on the fabric. Verify that the total static and dynamic current budget, including configuration and I/O drive loads, stays inside the limits defined in the IGLOO2 data sheet (DS00004750), and derate the rail capacity for ambient temperature inside a sealed enclosure.
Bank assignments determine which user I/O can be used for high-speed SERDES functions, and the 896-ball IGLOO2 device does not offer SERDES in every bank. Before committing to a board, map the required lanes onto banks that provide the communications resources, and confirm the resulting ball assignments in the pin descriptions user guide (DS0124). Keep sensitive or high-speed pairs on adjacent ball rows with continuous reference planes underneath, and reserve unused user I/O for grounded stubs or test points rather than leaving them floating.
Two mistakes dominate IGLOO2 896-ball designs. First, treating the shorter ordering codes as different silicon - M2GL050-FGG896, M2GL050-FG896, M2GL050-FGG896I and the tape-and-reel and industrial codes all use the same 56,340 logic element die and the same 896-ball map, so a substitution requires no layout change. Second, mixing device codes from different package options such as the FGG484 or VFG400 variants into the same BOM line, because those have different ball counts and pin assignments and force a board redesign. Keep the package code consistent across the entire design.
معلومات الامتثال
RoHS compliance is stated for the 896-ball tray-packed M2GL050 device. REACH, halogen-free status, conflict-minerals declarations and AEC-Q100 qualification are not published for this part, so they are recorded as unknown. The M2GL050 family is listed by Microchip with status In Production.
