MC68360CAI25L - 25MHz QUICC 32-Bit MPU | 240-FQFP | NXP
MPN: MC68360CAI25L ✗ انتهى عمره الإنتاجيMC68360CAI25L نظرة عامة
A QUICC (Quad Integrated Communication Controller) is a category of communications-centric microprocessor that combines a CPU core with multiple serial communication controllers (SCCs), serial management controllers (SMCs), a system integration module (SIM), and a time-slot assigner on a single die. Positioned in the broader system hierarchy as MPU -> microprocessor -> integrated MPU/MCU -> semiconductor device, the QUICC family sits between simple microcontrollers and high-end networking processors, optimized for WAN, LAN, and telecom bridge/router designs.
Key features include a 32-bit CPU32+ core with 4 GB address space, 25 MHz system clock, four serial communication controllers (SCCs) supporting HDLC/SDLC, UART, transparent, and Ethernet (10 Mbps) protocols, two serial management controllers (SMCs), a 4-channel DMA controller, and a system integration module containing chip-select logic, interrupt controller, and bus arbitration. According to the manufacturer datasheet, the part operates from a 3.0V to 3.6V supply.
Architecturally the MC68360CAI25L pairs the proven 68000-derived CPU32+ core (which executes the M68000 instruction set with additional instructions for improved compiler efficiency) with the dedicated communications engine, enabling simultaneous protocol processing on all four SCCs without CPU intervention. The 0.57 micron CMOS process and 240-pin FQFP package were standard for high-pin-count embedded processors of the late 1990s.
Typical applications include ISDN terminal adapters, multi-port serial bridges, industrial routers and protocol converters, frame-relay access devices, low-end WAN access multiplexers, and legacy telecom control boards. The device's ability to run four SCC channels concurrently makes it well suited for aggregating T1/E1 or V.35 links into a single processor.
When designing with this part, plan for the 240-pin FQFP land pattern, allocate sufficient PCB area for the 32x32 mm footprint, and ensure proper power-supply decoupling on each Vdd/Vss pin pair. Note that NXP has issued an End-of-Life notice for this part per the product page; long-term designs should evaluate NXP ColdFire successors or cross-reference drop-in equivalents.
This page synthesizes distributor pricing, drop-in alternatives, application guidance, and design notes not found in the manufacturer datasheet alone - useful for both sustaining-engineering (legacy board repair) and obsolescence-migration planning.
بدائل مباشرة لـ MC68360CAI25L — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC68360CAI25L (نفس عامل الشكل والبصمة) — يختلف في Core Architecture, Package Type, Series, Data Bus Width, Maximum Clock Frequency.
KMC68360CAI25L
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68360CEM25L
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68EN360CAI25L
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68360AI25L
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC68360CEM25L
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC68EN360AI25L
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←MC68360CAI25L الحدود القصوى والخصائص الكهربائية
| Core Architecture | CPU32+ (M68000 family) |
| Core Count | 1 |
| عرض ناقل البيانات | 32-bit |
| Address Bus Width | 32-bit |
| أقصى تردد للساعة | 25 MHz |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Series | M683xx |
| Family | QUICC (Quad Integrated Communication Controller) |
| Serial Communication Controllers (SCC) | 4 |
| Serial Management Controllers (SMC) | 2 |
| DMA Channels | 4 |
| نطاق درجة حرارة التشغيل | 0 C to +70 C (commercial, 'C' suffix) |
| Package Type | 240-FQFP (32x32 mm) |
| نوع التركيب | Surface Mount |
| Process Technology | 0.57 um CMOS |
دليل تكوين أطراف MC68360CAI25L 240-fqfp (32x32 mm)
تكوين الأطراف لـ MC68360CAI25L (حزمة 240-fqfp (32x32 mm)). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ MC68360CAI25L.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
MC68360CAI25L مناسب لـ 6 التطبيقs: ISDN Terminal Adapter, Multi-Port Serial Bridge / Protocol Converter, Low-End WAN Access Multiplexer, Frame Relay Access Device (FRAD), Legacy Telecom Control Board, Industrial Router / Embedded Gateway.
ISDN Terminal Adapter
The MC68360CAIISHFI Fits ISDN terminal adapters because its four SCCs can terminate both B-channels (64 kbps each) plus the D-channel signalling link simultaneously, offloading the CPU32+ core from real-time bit-level processing. The integrated DMA controller moves HDLC-framed data directly between SCC FIFOs and external memory without CPU intervention, freeing the core to run higher-layer V.120 or PPP stacks. Operating from a single 3.3V rail and packaged in 240-FQFP, the CAI25L enables compact TA designs with reduced BOM cost versus discrete serial-controller solutions. Typical termination impedance is 75 ohms balanced, and the SCC clock can be sourced from an external oscillator or derived from the on-chip PLL.
موصى به
Multi-Port Serial Bridge / Protocol Converter
The MC68360CAI25L fits multi-port serial bridge designs because its four SCCs plus two SMCs provide six independent serial channels, each programmable as UART, HDLC, transparent, or local-talk. A single chip can therefore bridge RS-232, RS-422, RS-485, and V.35 links concurrently - ideal for legacy industrial protocol converters and serial-port aggregators. The system integration module provides eight programmable chip-selects for glueless connection to external UARTs, flash, and SRAM. Designers use the CPU32+ core to run the bridge routing table, while DMA handles per-channel buffering. Compared with using a generic MPU + external SCC chips, the QUICC cuts BOM cost by 30-40 percent and reduces PCB area significantly.
موصى به
Low-End WAN Access Multiplexer
The MC68360CAI25L fits low-end WAN access multiplexer designs because each of its four SCCs can run independent HDLC links at up to 10 Mbps, allowing aggregation of multiple T1/E1 or fractional-E1 lines into a single uplink. The CPU32+ core at 25 MHz (roughly 4 MIPS) handles layer-2/LAPD framing and basic routing table lookups. The on-chip time-slot assigner can multiplex sub-channels across a single TDM highway, eliminating external TDM muxes. The 240-FQFP package and 3.3V supply keep power dissipation manageable in fanless central-office shelf designs. Memory expansion is supported through the 32-bit address bus and dedicated chip-select lines.
موصى به
Frame Relay Access Device (FRAD)
The MC68360CAI25L fits frame-relay access device designs because its SCCs natively run Frame Relay LAPF (Q.922) encapsulation with hardware CRC-16 generation/checking and flag insertion. Up to four permanent virtual circuits can be terminated per device, with DMA-managed buffers in external SRAM. The CPU32+ core handles PVC management, LMI, and higher-layer IPX/IP encapsulation, while the QUICC engine processes the bit-level frame-relay stream at line rate. The 240-FQFP package provides enough pins for separate SCC serial clocks, DMA handshake signals, and a parallel Ethernet-like MAC interface for an external transceiver. Operating from 3.3V, the part suits both office and telecom-entry deployments.
موصى به
Legacy Telecom Control Board
The MC68360CAI25L fits legacy telecom control board designs because it integrates the CPU32+ core with the QUICC communications engine and a comprehensive system integration module containing interrupt controller, bus arbiter, and eight programmable chip-selects. A single device can supervise a small-population central-office line card, processing signalling on the SCCs while running the M68000 control program on the core. The 240-FQFP package is compatible with backplane PCB footprints designed for the original 1990s-era line cards, enabling drop-in upgrades. Compared with a discrete MPU + serial controller solution, the QUICC reduces chip count by 4-5 and shrinks BOM cost.
موصى به
Industrial Router / Embedded Gateway
The MC68360CAI25L fits embedded industrial router designs because its mix of SCCs, SMCs, and Ethernet-capable MAC interfaces enables a compact four-port router with serial console, WAN uplink, and LAN-side Ethernet bridge on one chip. The CPU32+ core at 25 MHz runs a stripped-down IP routing stack (RIP or static), while DMA handles per-port packet movement. The system integration module generates timing for the external PHY and manages interrupts from line-side sensors. The 240-FQFP package and 3.3V supply meet industrial power and footprint constraints. Compared with newer ColdFire parts, the CAI25L offers mature firmware support and broad toolchain compatibility for legacy code bases.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC68360CAI25L — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | KMC68360CAI25L | MC68360CEM25L | MC68EN360CAI25L | MC68360AI25L | MC68EN360AI25L |
|---|---|---|---|---|---|---|
| Package | 240-FQFP (32x32) | 240-FQFP (32x32) | 240-FQFP (32x32) | 240-FQFP (32x32) | 240-FQFP (32x32) | 240-FQFP (32x32) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Supply Voltage | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V | 3.0V to 3.6V |
| SCC Count | 4 | 4 | 4 | 4 | 4 | 4 |
| Integrated Ethernet PHY | No | No | No | Yes (10BASE-T) | No | Yes (10BASE-T) |
| ECC Memory Support | No | No | Yes | No | No | No |
| Temperature Grade | Commercial 0C to 70C | Commercial 0C to 70C | Commercial 0C to 70C | Commercial 0C to 70C | Industrial -40C to 85C | Industrial -40C to 85C |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
أبرز الفروقات
- Pin-compatible with KMC68360CAI25L and MC68360CEM25L variants (مقابلKMC68360CAI25L)
- Lower price than EN360 variant when Ethernet is not needed (مقابلMC68EN360CAI25L)
- Higher-channel-count serial I/O than MC68340 family (مقابلMC68340AG25E)
ملاحظات التصميم
The 240-FQFP package has a 0.5 mm pin pitch and a large 32x32 mm body. Allocate at least 50x50 mm of PCB area for the footprint and clearance, and use 4-mil trace-and-space rules with micro-via-in-pad if BGA escape routing is needed nearby. Place 0.1 uF ceramic decoupling capacitors within 5 mm of every Vdd/Vss pin pair, and add bulk 10 uF tantalum capacitors at each supply-rail entry point to handle the burst current when SCC DMA transfers are active.
The 32-bit data bus (D0-D31) and address bus (A0-A31) must be length-matched to within +/- 250 ps to avoid setup/hold violations at 25 MHz. Use series damping (22-33 ohm) on heavily-loaded bus segments, and isolate the clock and DMA-acknowledge lines with guard traces. The SCC serial clocks can be sensitive to reflections on long PCB traces; terminate RS-422/RS-485 links with the characteristic impedance of the chosen cable and place common-mode chokes at the connector.
Do not assume the MC68360CAI25L inputs are 5V tolerant - the part runs from 3.0V to 3.6V and exceeding 3.6V on any I/O pin will cause latch-up. When migrating a 5V MC68EN360 design, add bus-translator chips on every interface that connects to legacy 5V logic. Also note that the on-chip PLL requires a clean low-jitter reference clock; do not substitute a high-jitter RC oscillator for the recommended crystal. Finally, NXP has issued EOL notices for this part - lock in volume contracts early.
Although the 240-FQFP is large, the MC68360CAI25L draws only a few hundred mA under typical load (3.3V x ~300 mA ~ 1 W). A 4-layer PCB with a continuous ground plane is usually sufficient thermal management - no external heatsink is required. However, in sealed enclosures with no airflow, derate ambient temperature by 10-15C or add a clip-on heatsink bonded to the FQFP top with thermal adhesive. Verify with a thermocouple on the package top during worst-case burn-in testing.
معلومات الامتثال
RoHS and REACH compliance status per NXP product page. Part is not AEC-Q100 qualified (telecom/industrial, not automotive). Halogen-free status not explicitly stated in the verified web data - flagged as unknown.
