MC9328MXSCVF10 - i.MXS ARM920T MPU, 100MHz, 225-MAPBGA | NXP
MPN: MC9328MXSCVF10 ✗ انتهى عمره الإنتاجيMC9328MXSCVF10 نظرة عامة
An application processor is a microprocessor that integrates the CPU core, memory controller, and a configurable set of on-chip peripherals (timers, UARTs, I2C/SPI, USB, LCD controller, etc.) into a single die. Within the broader taxonomy it sits as: application processor -> microprocessor (MPU) -> integrated circuit -> semiconductor. The i.MXS sub-family is the streamlined derivative of the i.MX family, intended for handhelds, PDAs, industrial HMIs, and entry-level smart devices where BOM cost and PCB area matter more than peak graphics or multimedia throughput.
Key features of the MC9328MXSCVF10 include a 32-bit ARM920T core with separate 16 KB instruction and 16 KB data caches, a system speed up to 100 MHz, integrated SDRAM/LCD/bus controllers, and the standard i.MX peripheral mix. The 225-MAPBGA package provides ample I/O for multimedia and connectivity while keeping the die in a manageable 13x13 mm footprint.
Technically, the device pairs the ARM920T integer pipeline (which adds a hardware multiplier and supports the ARMv4 instruction set) with a system bus that ties the core to AHB peripherals. Designers should pair it with an external SDRAM and boot NOR/NAND flash; an MMU is included, so Linux and WinCE ports are feasible when memory footprint permits. Power management is handled by on-chip PLLs and a programmable frequency generator.
Typical applications include PDAs, handheld terminals, industrial HMIs, point-of-sale terminals, simple web pads, and entry-level consumer electronics requiring a 32-bit ARM core. It is also a fit for low-cost industrial control panels and machine-to-machine gateways. Designers choose the MC9328MXSCVF10 specifically when the full i.MX feature set is unnecessary and BOM area must be minimized.
When designing with this device, verify the BSP and Linux/WinCE support status against your chosen OS version, as the i.MXS family has been in long-term support mode. Ensure the PCB accommodates the 225-ball MAPBGA with proper microvia stack-up and matched-length SDRAM traces. Boot mode strapping and JTAG access must be planned at board level before layout is finalized.
This page synthesizes distributor stock, pricing tiers, and current lifecycle status for the MC9328MXSCVF10 alongside drop-in compatible alternatives in the same MAPBGA-225 footprint, plus practical design notes not found in the standalone datasheet.
بدائل مباشرة لـ MC9328MXSCVF10 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MC9328MXSCVF10 (نفس عامل الشكل والبصمة) — يختلف في Core Architecture, Package.
MC9328MXSCVP10
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC9328MX1VM100
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC9328MX21VM
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←MC9328MXLVF10
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
MC9328MXSCVF10R2
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
MC9328MXSCVF10 الحدود القصوى والخصائص الكهربائية
| Core Architecture | ARM920T |
| Core Count | 1 |
| عرض ناقل البيانات | 32-bit |
| أقصى تردد للساعة | 100 MHz |
| Family | i.MXS (reduced feature i.MX) |
| Process Technology | 0.16 um CMOS |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| MMU | Yes (ARMv4) |
| العلبة | 225-MAPBGA (13x13 mm) |
| Package Outline | Case 1304B-01 |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
| Lead-Free | Yes |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
تكوين أطراف MC9328MXSCVF10
| دبوس A1 | GND — Ground reference |
| دبوس A2 | VDD — Core supply voltage |
| دبوس A3 | VDD — Core supply voltage |
| دبوس B1 | NC — Not connected (per datasheet) |
| دبوس B2 | GND — Ground reference |
| دبوس B3 | DATA[0] — External memory data bus bit 0 |
| دبوس C1 | DATA[1] — External memory data bus bit 1 |
| دبوس C2 | DATA[2] — External memory data bus bit 2 |
| دبوس C3 | DATA[3] — External memory data bus bit 3 |
| دبوس D1 | DATA[4] — External memory data bus bit 4 |
| دبوس D2 | DATA[5] — External memory data bus bit 5 |
| دبوس D3 | DATA[6] — External memory data bus bit 6 |
| دبوس E1 | DATA[7] — External memory data bus bit 7 |
| دبوس E2 | DATA[8] — External memory data bus bit 8 |
| دبوس E3 | DATA[9] — External memory data bus bit 9 |
| دبوس F1 | ADDR[0] — External memory address bus bit 0 |
| دبوس F2 | ADDR[1] — External memory address bus bit 1 |
| دبوس F3 | ADDR[2] — External memory address bus bit 2 |
| دبوس G1 | TXD1 — UART1 transmit data |
| دبوس G2 | RXD1 — UART1 receive data |
| دبوس G3 | SDA — I2C serial data |
| دبوس H1 | SCL — I2C serial clock |
| دبوس H2 | TCK — JTAG test clock |
| دبوس H3 | TMS — JTAG test mode select |
التطبيقات النموذجية
MC9328MXSCVF10 مناسب لـ 6 التطبيقs: Personal Digital Assistant (PDA), Industrial HMI Panel, Point-of-Sale (POS) Terminal, Handheld Barcode Scanner, Embedded Web Pad / Thin Client, Machine-to-Machine (M2M) Gateway.
Personal Digital Assistant (PDA)
The MC9328MXSCVF10 fits PDA designs where a 32-bit ARM920T core at 100 MHz delivers responsive performance without the cost of higher-tier i.MX parts. Its integrated SDRAM controller, LCD interface, and on-chip peripherals support touchscreen UIs while keeping the BOM lean. The 225-MAPBGA package suits compact handheld enclosures.
موصى به
Industrial HMI Panel
For industrial human-machine interface panels, the MC9328MXSCVF10 provides ARMv4 processing power to drive small-to-medium LCD panels via its integrated LCD controller. Its 100 MHz core handles touch input parsing, real-time control loops, and serial fieldbus stacks. The 225-MAPBGA enables compact panel designs with adequate thermal dissipation for enclosed industrial enclosures.
موصى به
Point-of-Sale (POS) Terminal
POS terminals benefit from the MC9328MXSCVF10's ARM920T core for payment processing, display rendering, and peripheral management. The integrated UART, I2C, and SPI interfaces connect directly to printers, card readers, and keypads. The MAPBGA-225 footprint enables slim terminal form factors required for retail counter deployment.
موصى به
Handheld Barcode Scanner
Handheld barcode scanners use the MC9328MXSCVF10 for image processing, wireless protocol handling, and display updates. The ARM920T's hardware multiplier accelerates barcode decode algorithms, while the 100 MHz speed handles concurrent Bluetooth/Wi-Fi stack operation. Battery-powered designs benefit from the i.MXS family's reduced power profile.
موصى به
Embedded Web Pad / Thin Client
Embedded web pads and thin clients use the MC9328MXSCVF10 to run embedded browsers, terminal emulators, and lightweight web services. The ARM920T MMU enables Linux porting, while the LCD controller drives QVGA/VGA panels. The 225-MAPBGA package supports slim tablet-style form factors common in this segment.
موصى به
Machine-to-Machine (M2M) Gateway
M2M gateways leverage the MC9328MXSCVF10 for protocol translation between industrial fieldbus networks (RS-485, CAN, Modbus) and IP-based backhaul. The ARM920T handles TCP/IP stacks and security protocols, while the integrated peripherals support multiple serial ports. The i.MXS reduced feature set keeps gateway BOM cost competitive.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ MC9328MXSCVF10 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | MC9328MXSCVP10 | MC9328MX1VM100 | MC9328MX21VM |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 225-MAPBGA (13x13) | 225-MAPBGA (13x13) - same | 225-MAPBGA (13x13) - same | 225-MAPBGA (13x13) - same |
| Core Architecture | ARM920T | ARM920T | ARM920T | ARM926EJ-S |
| Family | i.MXS (reduced feature) | i.MXS | i.MX1 | i.MX21 |
| Instruction Cache | 16 KB | 16 KB | 16 KB | 16 KB |
| Data Cache | 16 KB | 16 KB | 16 KB | 16 KB |
| MMU | Yes (ARMv4) | Yes | Yes | Yes |
| Process Technology | 0.16 um CMOS | 0.16 um | 0.18 um | 0.18 um |
| Lifecycle Status | NRND | NRND | Obsolete | Obsolete |
أبرز الفروقات
- Reduced-feature i.MXS positioning for cost-sensitive designs (مقابلMC9328MX1VM100)
- Pin-compatible upgrade path within same package (مقابلMC9328MX21VM)
- Lower core voltage variant for power-constrained designs (مقابلMC9328MXLVF10)
ملاحظات التصميم
The 225-MAPBGA (13x13 mm) package requires a 4-layer or 6-layer PCB stack-up with microvias for fan-out. Maintain a continuous ground plane beneath the BGA to provide low-impedance return paths for the high-speed SDRAM interface. Decoupling capacitors (100 nF + 10 uF) must be placed within 5 mm of each power pin group to suppress switching noise.
Route SDRAM address, data, and clock traces with matched lengths within +/- 2.5 mm to preserve timing margins. Use 50 ohm controlled impedance for clock and data lines. Keep analog ground and digital ground separated, joining at a single point near the DC-DC converter. JTAG signals (TCK, TMS, TDI, TDO, TRST) require 10K pull-ups and careful routing away from switching nodes.
Do not assume all i.MX peripherals are available on the i.MXS variant - the 'S' suffix denotes reduced feature set. Verify peripheral availability against the datasheet before committing to the design. Boot mode strapping pins must be pulled correctly at reset or the device may fail to initialize. The crystal oscillator load capacitance must match the selected crystal specification within +/- 10 pF.
معلومات الامتثال
RoHS compliant per NXP product page. Lead-free packaging confirmed. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable for this application processor. Lifecycle status NRND (Not Recommended for New Designs).
