MCHC908JW16FC - 8-Bit 8MHz 16KB Flash MCU | NXP
MPN: MCHC908JW16FC ✗ انتهى عمره الإنتاجيMCHC908JW16FC نظرة عامة
A microcontroller is a compact embedded controller that integrates a processor core, program memory, data memory, peripherals, and I/O into one semiconductor package. The HC08 family belongs to the broader microcontroller and embedded-processing hierarchy. This MPN is positioned for compact embedded control, communications, LED drive, low-voltage detection, power-on reset, and PWM-oriented functions where an 8-bit architecture and integrated Flash memory are useful.
The verified specifications show a 16K x 8 Flash program-memory organization, 8 MHz clocking, 29 I/O pins, 48-QFN-EP packaging, and listed connectivity of SPI and USB. The datasheet search result also identifies LED, low-voltage detection, power-on reset, and PWM peripherals. These features make the part relevant to small control boards, sensor interfaces, communication modules, and compact consumer or industrial equipment requiring deterministic peripheral integration.
The MCHC908JW16FC uses the HC08 8-bit core and is specified as an 8 MHz device. Its 16 KB Flash memory is organized as 16K x 8, while the verified data lists 1K x 8 RAM. The 48-QFN-EP package is a surface-mount package with an exposed pad, making thermal and PCB-layout considerations important when the device operates at elevated ambient temperatures or higher switching rates.
Typical applications include USB-connected control peripherals, SPI-based sensor or display interfaces, LED-control systems, industrial control modules, and compact embedded products. The 29 I/O pins provide external connectivity, while USB and SPI support simplify connection to host systems and peripheral devices. Because the verified results identify the part as finished goods, purchasing decisions should include confirmation of condition, traceability, package condition, and application validation.
For new designs, engineers should verify the official HC08 datasheet, pinout, electrical limits, memory map, and peripheral behavior before layout release. The exposed-pad package requires a properly designed land pattern, adequate copper, and thermal-via strategy. This page consolidates verified source snippets and avoids inventing missing electrical or lifecycle details.
بدائل مباشرة لـ MCHC908JW16FC — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع MCHC908JW16FC (نفس عامل الشكل والبصمة) — يختلف في Core, Package.
لا تتوفر بدائل متوافقة تمامًا لهذا المنتج.
اطلب بدائلMCHC908JW16FC الحدود القصوى والخصائص الكهربائية
| Product Type | 8-bit microcontroller IC |
| Core | HC08 |
| Processor Architecture | 8-bit |
| أقصى تردد للساعة | 8 MHz |
| Program Memory | 16 KB Flash (16K x 8) |
| RAM | 1K x 8 |
| Number of I/O Pins | 29 |
| Connectivity | SPI, USB |
| Listed Peripherals | LED, LVD, POR, PWM |
| العلبة | 48-QFN-EP (7x7) |
| Package Type | Surface-mount QFN with exposed pad |
| Series | HC08 |
| Manufacturer | NXP Semiconductors |
| Core Size | 8-bit |
| Program Memory Type | Flash |
| Supply Status | Finished goods |
دليل تكوين أطراف MCHC908JW16FC surface-mount qfn with exposed pad
تكوين الأطراف لـ MCHC908JW16FC (حزمة surface-mount qfn with exposed pad). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ MCHC908JW16FC.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
MCHC908JW16FC مناسب لـ 6 التطبيقs: USB-Connected Embedded Control, SPI Sensor Interface Module, LED and PWM Control, Compact Consumer Peripheral, Low-Voltage and Power-System Monitoring, Industrial Embedded Module.
USB-Connected Embedded Control
The MCHC908JW16FC fits compact USB-connected control and status products because the verified data lists USB connectivity alongside an 8 MHz HC08 core, 16 KB Flash, and 1K x 8 RAM. It can organize firmware for configuration, status reporting, and peripheral control without requiring a large external memory device. The 29 I/O pins leave additional connections for indicators, sensors, and actuators, although USB electrical limits and protocol support must be confirmed from the official datasheet before final design.
موصى به
SPI Sensor Interface Module
MCHC908JW16FC is suitable for a small SPI-based sensor interface because SPI is explicitly identified in the verified connectivity data. Its 8-bit processing core can read sensors, apply control logic, and manage status outputs, while 16 KB Flash supports embedded application code and 1K x 8 RAM supports working data. The design should verify voltage levels, serial timing, pin multiplexing, and maximum bus loading from the official device documentation before connecting external hardware.
موصى به
LED and PWM Control
The MCHC908JW16FC is a practical candidate for LED indication, dimming, and simple PWM-controlled systems because the verified results list LED and PWM peripherals alongside 29 I/O pins. The MCU can use its embedded control functions to sequence indicators or drive PWM-capable external stages. Actual current drive, timer resolution, pin electrical limits, and PWM frequency are not provided in the supplied data, so external drivers may be required and must be sized from verified specifications.
موصى به
Compact Consumer Peripheral
MCHC908JW16FC can support compact consumer peripherals that need local control, USB or SPI connectivity, and modest embedded memory. Its 16 KB Flash is suitable for constrained firmware while 1K x 8 RAM supports runtime state and communication buffers. The small 7x7 mm QFN-EP package can assist board miniaturization, but exposed-pad thermal design, decoupling, and exact pin placement must follow the manufacturer package drawing. Finished-goods status should be considered before new-volume production.
موصى به
Low-Voltage and Power-System Monitoring
The verified feature list includes low-voltage detection and power-on reset, making MCHC908JW16FC relevant to compact power-system monitoring and sequencing products. These functions can support threshold detection, startup initialization, and coordination of external loads when paired with suitable sensing and power circuitry. The supplied data does not specify threshold voltages, reset timing, ADC resources, or supply limits; those values must be confirmed before implementing a safety- or reliability-critical power monitor.
موصى به
Industrial Embedded Module
MCHC908JW16FC may be used in small industrial or instrumentation modules where an 8-bit controller, local Flash memory, serial connectivity, and modest I/O capacity are sufficient. SPI can connect to sensors or converters, while USB can support configuration or host communication when the exact electrical interface is supported. The device’s operating voltage, temperature range, ESD rating, and lifecycle qualification are not included in the verified data, so industrial deployment requires formal component and system qualification.
موصى به
بيانات مرجعية هندسية لـ MCHC908JW16FC — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج |
|---|---|
| Package | 48-QFN-EP (7x7) |
| Brand | NXP Semiconductors |
| Core | HC08 8-bit |
| Maximum Frequency | 8 MHz |
| Program Memory | 16 KB Flash (16K x 8) |
| RAM | 1K x 8 |
| I/O Pins | 29 |
| Connectivity | SPI, USB |
| Listed Peripherals | LED, LVD, POR, PWM |
| Supply Status | Finished goods |
أبرز الفروقات
- Integrated connectivity for compact embedded designs (مقابلMCHC908JW32FHE)
- 16 KB Flash with an 8-bit HC08 core (مقابلMCHC908JW32FHE)
- Compact 7x7 mm exposed-pad package (مقابلMCHC908JW32FHE)
ملاحظات التصميم
Use the official MCHC908JW16FC package drawing to create the 48-QFN-EP 7x7 land pattern. The exposed pad should be connected according to the manufacturer’s thermal and electrical guidance, with a controlled via arrangement that does not compromise signal routing. Because the verified data does not include the complete pinout, do not assign signals to package positions from memory; verify every connection against the official datasheet before fabrication.
Place local decoupling close to the device power pins and follow the manufacturer’s recommended capacitance and ESR requirements. The supplied results do not provide operating voltage or decoupling values, so those values must come from the official datasheet. Confirm the power budget, startup behavior, and external regulator headroom before connecting USB or industrial circuitry. Estimated calculations are not possible without verified voltage and current data.
Do not treat a distributor listing as proof of pin compatibility or complete electrical equivalence. The cross-reference results returned tools and the target MPN itself, but no verified substitute with a matching package and pinout. For any proposed replacement, compare package drawings, pin functions, Flash and RAM capacity, clocking, voltage, temperature, USB/SPI behavior, and exposed-pad requirements before substituting it in production.
The 7x7 mm QFN-EP package requires an intentional thermal strategy because its small footprint limits heat-spreading area. Use the exposed pad, package-specific copper, and thermal vias as recommended by the manufacturer, while accounting for the ambient temperature and the device’s actual switching dissipation. The supplied data does not state thermal resistance or maximum power, so an estimated junction temperature should not be used as a release specification.
معلومات الامتثال
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Obtain current manufacturer or authorized-distributor documentation for the exact MPN and condition.
