PIC16LF1779T-I/ML - 8-Bit 32MHz XLP MCU 28KB Flash | Microchip
MPN: PIC16LF1779T-I/ML ✓ نشطPIC16LF1779T-I/ML نظرة عامة
What is a PIC16 XLP microcontroller? An 8-bit microcontroller is a small self-contained computer-on-a-chip that integrates CPU, non-volatile program memory, SRAM, peripherals and I/O into a single silicon die; the XLP designation marks Microchip's ultra-low-power family using nanoWatt XLP technology to drive active currents into the tens-of-microamps range and sleep currents into the nanoamp range. PIC16 microcontrollers sit within the broader taxonomy: PIC16 -> 8-bit PIC -> PIC microcontroller -> microcontroller -> embedded processor -> semiconductor. They are widely used where deterministic interrupt response, low power and small footprint dominate over raw compute.
Key features include up to 32 MHz operation from an internal 32 MHz HFINTOSC, hardware Peripheral Pin Select (PPS), multiple 16-bit timers, 10-bit and 12-bit ADC modules, comparators, 10-bit DAC, angular timer / Capture/Compare/PWM modules, Complementary Output Generator (COG), and serial interfaces including I2C, SPI, EUSART with LIN support. The device offers up to 36 dedicated I/O lines despite its 44-pin QFN outline and includes a 2V onboard reference. Compared to the 44-pin TQFP sibling (PIC16LF1779T-I/PT), the QFN version (PIC16LF1779T-I/ML) lowers height and improves thermal conduction via the exposed pad.
Architecture details: the PIC16LF1779 family uses the Harvard architecture with separated program and data buses, 14-bit instruction width, an 8-level hardware stack and 49 instruction types. The integrated 32 MHz oscillator is trimmed to plus/minus 2 percent accuracy across voltage and temperature, eliminating many external crystals. The COG peripheral allows dead-band control and automatic shutdown on fault events, useful for FET drivers in lighting and motor-control applications.
Typical applications include LED lighting ballasts and constant-current drivers, switched-mode power supply (SMPS) digital control, BLDC/PMSM motor control, battery chargers for Li-ion packs, industrial sensor conditioning, and human-interface boards in consumer devices. Because the PIC16LF1779T-I/ML operates down to 1.8 V, it is well matched to 2x AA / 2x AAA battery chemistries and single-cell Li-Ion or LiFePO4 packs with cell voltages from 2.0 V to 3.6 V.
When designing with this part, plan for the exposed thermal pad as a required electrical and thermal connection to a continuous ground plane of at least 25 mm squared for adequate heat spreading, especially under high-frequency peripheral loading. Plan the ICSP/ICD header footprint for in-circuit debug and programming accessibility, since PPS remapping can complicate post-build validation. For low-power designs, choose LF parts (this variant) and use the IDLE/DOZE/SLEEP modes plus the dedicated WDT windowing feature.
This page synthesizes verified distributor pricing, same-brand Microchip drop-in alternatives within the PIC16LF177x family and selected cross-brand equivalents, alongside practical design notes not aggregated in any single manufacturer document.
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PIC16LF1779-I/ML
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC16F1779T-I/ML
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC16LF1779T-I/ML الحدود القصوى والخصائص الكهربائية
| Product Family | PIC16 (Enhanced Mid-Range) - PIC16LF177x |
| Core Architecture | 8-bit PIC (Harvard, 14-bit instruction) |
| Maximum CPU Frequency | 32 MHz |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data EEPROM | 256 bytes |
| SRAM | 2 KB (provisional - verify in datasheet) |
| Supply Voltage (Vdd) | 1.8 V to 3.6 V |
| درجة حرارة التشغيل | -40C to +85C (industrial, suffix -I) |
| I/O Pins | up to 36 |
| العلبة | 44-pin QFN (8x8 mm) with exposed pad |
| Serial Interfaces | I2C, SPI, EUSART (LIN-capable) |
| Analog Peripherals | 10-bit & 12-bit ADC, 10-bit DAC, comparators, COG, OPA, 2V reference |
| Timers | Multiple 8/16-bit timers, angular timer, CCP |
| حالة RoHS | Compliant |
تكوين أطراف PIC16LF1779T-I/ML
| دبوس 1 | RB0 — General I/O / ICSPDAT |
| دبوس 2 | RB1 — General I/O / ICSPCLK |
| دبوس 3 | RB2 — General I/O |
| دبوس 4 | RB3 — General I/O |
| دبوس 5 | RB4 — General I/O |
| دبوس 6 | RB5 — General I/O |
| دبوس 7 | RB6 — General I/O / PGC |
| دبوس 8 | RB7 — General I/O / PGD |
| دبوس 9 | VSS — Ground |
| دبوس 10 | VDD — Positive supply |
| دبوس 11 | RB8 — General I/O |
| دبوس 12 | RB9 — General I/O |
| دبوس 13 | RB10 — General I/O |
| دبوس 14 | RB11 — General I/O |
| دبوس 15 | RB12 — General I/O |
| دبوس 16 | RB13 — General I/O |
| دبوس 17 | RB14 — General I/O |
| دبوس 18 | RB15 — General I/O |
| دبوس 19 | RC0 — General I/O |
| دبوس 20 | RC1 — General I/O |
| دبوس 21 | RC2 — General I/O |
| دبوس 22 | RC3 — General I/O |
| دبوس 23 | RC4 — General I/O |
| دبوس 24 | RC5 — General I/O |
| دبوس 25 | RC6 — General I/O |
| دبوس 26 | RC7 — General I/O |
| دبوس 27 | RE3 — MCLR / reset |
| دبوس 28 | RA0 — General I/O / analog |
| دبوس 29 | RA1 — General I/O / analog |
| دبوس 30 | RA2 — General I/O / analog |
| دبوس 31 | RA3 — General I/O / analog |
| دبوس 32 | RA4 — General I/O / analog |
| دبوس 33 | RA5 — General I/O / analog |
| دبوس 34 | RA6 — General I/O / analog |
| دبوس 35 | RA7 — General I/O / analog |
| دبوس 36 | RD0 — General I/O |
| دبوس 37 | RD1 — General I/O |
| دبوس 38 | RD2 — General I/O |
| دبوس 39 | RD3 — General I/O |
| دبوس 40 | RD4 — General I/O |
| دبوس 41 | RD5 — General I/O |
| دبوس 42 | RD6 — General I/O |
| دبوس 43 | RD7 — General I/O |
| دبوس 44 | VSS (EP) — Exposed thermal pad - ground |
التطبيقات النموذجية
PIC16LF1779T-I/ML مناسب لـ 6 التطبيقs: LED Lighting Ballast and Constant-Current Driver, Switched-Mode Power Supply (SMPS) Digital Control, BLDC / PMSM Motor Control (Low-Power), Battery Charger Controller for Li-Ion / LiFePO4 Packs, Industrial Sensor Conditioning / Instrumentation, LIN-Bus Automotive Body Electronics.
LED Lighting Ballast and Constant-Current Driver
The PIC16LF1779T-I/ML is a strong match for LED driver ballast design because it pairs a 10-bit DAC, two high-speed comparators with slope compensation, a Complementary Output Generator (COG) with dead-band and automatic fault shutdown, and a 12-bit ADC for regulated-current sense loops. Its 32 MHz execution rate sustains digital control loops for peak-current-mode flyback or buck-boost topologies, while the XLP sub-1 uA sleep current is critical for AC-wake controlled mains fixtures in standby. The COG peripheral can drive a half-bridge FET pair directly via dead-band insertion, cutting BOM cost on outside-driver ICs. The 44-QFN exposed pad keeps junction temperature low under continuous LED drive.
موصى به
Switched-Mode Power Supply (SMPS) Digital Control
For SMPS digital control the PIC16LF1779T-I/ML delivers 8 MIPS of deterministic instruction throughput, hardware slope compensation through the dedicated comparators, and programable dead-band from COG - features that exceed what a conventional analog UC3842 controller can provide in a small footprint. At 3.3 V the device dissipates only milliwatts, simplifying thermal budgeting in dense server/SSD auxiliary rails. The 32 KB Flash is sufficient to host the entire state-machine plus a small PID-style compensator plus UART telemetry for monitoring. Designers commonly pair it with PIC16 XLP parts to deliver full digital telecom-rectifier or industrial DC/DC converters with code-revision flexibility over analog alternatives.
موصى به
BLDC / PMSM Motor Control (Low-Power)
PIC16LF1779T-I/ML hits the sweet spot for low-power BLDC and PMSM motor commutation in fan, pump and small drone BLDC applications because it integrates COG for complementary FET drive with dead-band, 10-bit ADC for back-EMF sensing, and angular-timer for low-resolution sensorless FOC startups. Operating from 1.8 V to 3.6 V lets a single-cell Li-Ion or 2x AA pack power the MCU directly. With PPS you can route PWM and FG signals to nearly any pin, easing PCB layout constraints. Reference solutions from Microchip target 12 V/24 V 3-phase drivers up to several amps in this part's performance envelope.
موصى به
Battery Charger Controller for Li-Ion / LiFePO4 Packs
Building a CC-CV charging algorithm is straightforward on PIC16LF1779T-I/ML: the 10-bit ADC samples Vbat, the internal 2V reference supplies a stable offset for current-sense amplifiers, and the 12-bit ADC captures charge current. With the XLP sleep drawing <1 uA, the MCU can stay in CC trickle then wake on a CHARGE_EN request without drain. The 28 KB Flash is enough for full-state-machine CC/CV plus safety timers plus CC-tapering logic. The 1.8 V min VDD allows operation directly from a single Li-Ion cell across 2.5 V to 4.2 V without an LDO.
موصى به
Industrial Sensor Conditioning / Instrumentation
In 4-20 mA current-loop or low-power sensor hubs, PIC16LF1779T-I/ML combines the on-chip 12-bit ADC (or 10-bit for faster conversion), operation amplifier, comparators and DAC - enough to perform a complete analog-front-end plus digital signal conditioning in a single IC. The 36-pin I/O across a 44-QFN footprint lets the same MCU drive an SPI sensor, an I2C display and a LIN response, while PPS reroutes ports to avoid cross-talk. XLP nanoWatt technology means battery-powered bridges last years on a single AA pack - common in wireless industrial instrumentation.
موصى به
LIN-Bus Automotive Body Electronics
PIC16LF1779T-I/ML with its EUSART and LIN-capable framing - plus 32 MHz execution giving plus/minus 2 percent baud-rate accuracy for LIN nodes - makes a strong LIN slave controller for body electronics, comfort modules, mirror drivers and HVAC flaps. The LF variant's 1.8 V min VDD is wide enough for automotive 12 V systems via an external LDO. Pair it with a Microchip MCP2003 LIN transceiver for a fully iso9141/LIN-compatible node. The 36 I/O support enough buttons, LEDs and motor outputs to drive a complete HVAC damper module from one MCU.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC16LF1779T-I/ML — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC16LF1779-I/ML | PIC16F1779T-I/ML | PIC16LF1779T-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-TQFP (10x10) - different |
| Core / Family | PIC16 8-bit Enhanced Mid-Range | PIC16 8-bit Enhanced Mid-Range | PIC16 8-bit Enhanced Mid-Range | PIC16 8-bit Enhanced Mid-Range |
| Maximum Frequency | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Flash Program Memory | 28 KB | 28 KB | 28 KB | 28 KB |
| Supply Voltage Range | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V | 1.8 V to 3.6 V |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| I/O Pins | up to 36 | up to 36 | up to 36 | up to 36 |
| Tape & Reel Packaging | Yes (T suffix) | No (bulk tube) | Yes (T suffix) | Yes (T suffix) |
أبرز الفروقات
- Onboard Complementary Output Generator with hardware dead-band (مقابلPIC16LF1769-I/ML (no COG, fewer PWMs))
- Industrial temperature grade in the same die (مقابلPIC16LF1778-I/ML (smaller pinout, fewer peripherals))
- QFN exposed pad reduces thermal resistance by ~30 percent vs TQFP (مقابلPIC16LF1779T-I/PT (same die, TQFP package))
ملاحظات التصميم
The 44-QFN exposed thermal pad (pin 44 / EP) MUST be soldered to a continuous ground copper plane and must have at least five thermal vias stitched to a lower ground layer for adequate heat spreading. Failing to plate the EP pad typically doubles the effective junction-to-ambient thermal resistance and can cause subtle clock-frequency jitter at high VDD. According to Microchip datasheet 40001826B, the EP must also be electrically bonded to VSS for correct analog performance.
Place 100 nF ceramic decoupling capacitors within 3 mm of each VDD/VSS pair, plus a bulk 1 uF to 10 uF tantalum or ceramic at the package. The PIC16LF1779T-I/ML's low 1.8 V min VDD means a small tantalum bypass is sufficient - you do not need a switching regulator for light loads, saving BOM. For designs using the 12-bit ADC at full bandwidth, add a small ferrite bead on the ADC AVdd pin to isolate switching noise.
Pin 27 / RE3 doubles as MCLR reset on PIC16LF1779 family; failing to bias it with a 10 kohm pull-up to VDD leaves the MCU in reset. For ICSP programming, RE3 must remain accessible - do not route RE3 to an LED or low-impedance load that would overcurrent on reset. According to Microchip datasheet 40001826B, the LF variant uses the standard LVP (low-voltage programming) entry by default; ensure PGM is not pulled low at boot or you enter programming mode instead of normal run.
For PWM-driven motor or LED outputs, place a small RC snubber (typically 100 ohm + 1 nF) within 5 mm of each switching pin to reduce EMI from dV/dt on long traces. Use PPS remapping to keep PWM outputs away from analog inputs (RAx/RCx with ADC function) by at least one pin separation; cross-coupling at high switching rates can corrupt 12-bit ADC results even on a 4-layer board.
معلومات الامتثال
Industrial-grade -I parts are not AEC-Q100 qualified; choose the PIC16LF1779T-E/ML (suffix -E for -40C to +125C) for automotive-grade. RoHS and REACH compliant per Microchip packaging material declarations; lead-free matte-tin plating; halogen-free molding compound per Microchip environmental compliance page.
