PIC18F24K22-I/ML - 8-Bit 64MHz XLP MCU 16KB Flash QFN-28 | Microchip
MPN: PIC18F24K22-I/ML ✓ نشطPIC18F24K22-I/ML نظرة عامة
A microcontroller (MCU) is a single-chip computer containing a CPU core, non-volatile program memory, RAM, peripherals and I/O, designed for embedded control tasks. Within the Microchip portfolio, PIC18 sits between the baseline PIC10/12/16 and the high-performance PIC24/dsPIC33 families - richer peripherals and more memory than PIC16, lower cost and simpler toolchain than dsPIC33, all under one unified MPLAB X IDE. The PIC18FxxK22 family adds the nanoWatt XLP power-management layer, making it the preferred sub-family for low-power designs that still need USB, mTouch capacitive sensing, or 12-bit ADC performance.
Key features include a 12-bit ADC with up to 19 channels, two rail-to-rail analog comparators with programmable on-chip voltage reference, mTouch capacitive touch sensing support, two enhanced USART modules, two I2C and two SPI peripherals, two 8-bit timers plus three 16-bit timers, and a Programmable High/Low Voltage Detect (PLVD) module. The 28-QFN package's central exposed pad (EP) ties to ground and provides a low-thermal-resistance path; the package is footprint-compatible with most PIC18F2XK22 28-pin variants, simplifying PCB reuse across the family.
Typical applications include low-power IoT sensor nodes, consumer remote controls, home appliances with capacitive touch, battery-powered HVAC sensors, automotive body modules (AEC-Q100 grade 1 variant), and industrial control panels where the 64 MHz core and 16 MIPS headroom outpace PIC16 alternatives without paying the dsPIC33 price. When designing with this part, observe the 2.5-5.5V supply window and use the internal 16 MHz HFINTOSC to reduce external components; for sleep-sensitive designs, prefer the `nanoWatt XLP` deep-sleep modes (Sleep current under 100 nA typical) and enable the RTCC with a 32 kHz crystal for timekeeping.
بدائل مباشرة لـ PIC18F24K22-I/ML — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC18F24K22-I/ML (نفس عامل الشكل والبصمة) — يختلف في Package, Timers, ADC, Comparators, Core Architecture.
PIC18F24K22T-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F24K22-E/ML
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC18F25K22-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F23K22-I/ML
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC18F24K22-I/ML الحدود القصوى والخصائص الكهربائية
| Product Family | PIC18F2X/4XK22 (XLP) |
| Core Architecture | 8-bit PIC18 RISC |
| Maximum CPU Frequency | 64 MHz |
| Performance | 16 MIPS |
| Instruction Cycle Time | 200 ns |
| Program Memory (Flash) | 16 KB (8K x 16) |
| SRAM | 768 bytes |
| EEPROM | 256 bytes |
| Supply Voltage Range | 2.5 V to 5.5 V |
| I/O Pins | 24 |
| ADC | 12-bit, up to 19 channels |
| Comparators | 2 rail-to-rail with CVREF |
| Timers | 2 x 8-bit, 3 x 16-bit |
| Communication | 2 x EUSART, 2 x I2C/SPI |
| العلبة | 28-pin QFN (6x6 mm) with EP |
| نطاق درجة حرارة التشغيل | -40 C to +85 C (Industrial) |
| حالة RoHS | Compliant |
تكوين أطراف PIC18F24K22-I/ML
| دبوس 1 | RB7 — PORTB bit 7 / IOC / PWM |
| دبوس 2 | RB6 — PORTB bit 6 / IOC / PGC |
| دبوس 3 | RB5 — PORTB bit 5 / IOC / AN11 |
| دبوس 4 | RB4 — PORTB bit 4 / IOC / AN10 |
| دبوس 5 | RB3 — PORTB bit 3 / IOC / CCP2 |
| دبوس 6 | VSS — Ground reference |
| دبوس 7 | VDD — Positive supply (2.5V to 5.5V) |
| دبوس 8 | RB2 — PORTB bit 2 / IOC |
| دبوس 9 | RB1 — PORTB bit 1 / IOC / AN8 |
| دبوس 10 | RB0 — PORTB bit 0 / IOC / AN12 / INT0 |
| دبوس 11 | VSS — Ground reference (digital) |
| دبوس 12 | RC0 — PORTC bit 0 / SOSCO / AN4 |
| دبوس 13 | RC1 — PORTC bit 1 / SOSCI / AN5 |
| دبوس 14 | RC2 — PORTC bit 2 / AN6 / CCP1 |
| دبوس 15 | RC3 — PORTC bit 3 / AN7 / SCL |
| دبوس 16 | RC4 — PORTC bit 4 / SDA / AN14 |
| دبوس 17 | RC5 — PORTC bit 5 / AN15 / SDO |
| دبوس 18 | RC6 — PORTC bit 6 / AN16 / TX |
| دبوس 19 | RC7 — PORTC bit 7 / AN17 / RX |
| دبوس 20 | VSS — Ground reference |
| دبوس 21 | VDD — Positive supply (2.5V to 5.5V) |
| دبوس 22 | RA0 — PORTA bit 0 / AN0 / CVREF |
| دبوس 23 | RA1 — PORTA bit 1 / AN1 / C1IN- |
| دبوس 24 | RA2 — PORTA bit 2 / AN2 / VREF- |
| دبوس 25 | RA3 — PORTA bit 3 / AN3 / VREF+ |
| دبوس 26 | RA4 — PORTA bit 4 / T0CKI |
| دبوس 27 | RA5 — PORTA bit 5 / AN4 / SS |
| دبوس 28 | RA6 — PORTA bit 6 / OSC2 / CLKO |
| دبوس 29 | RA7 — PORTA bit 7 / OSC1 / CLKI |
| دبوس 30 | VSS — Ground reference (RE3) |
| دبوس 31 | MCLR — Master Clear (reset, active low) |
التطبيقات النموذجية
PIC18F24K22-I/ML مناسب لـ 6 التطبيقs: Battery-Powered IoT Sensor Node, Consumer Remote Control with mTouch, Automotive Body Electronics Module, Industrial Sensor and Control Panel, Home Appliance with Capacitive Touch UI, USB-Enabled Embedded Device.
Battery-Powered IoT Sensor Node
The PIC18F24K22-I/ML is ideal for battery-powered IoT sensor nodes where nanoWatt XLP deep-sleep current below 100 nA typical at 3V extends coin-cell lifetime to multi-year timeframes. Its 64 MHz core and 16 MIPS throughput let the MCU wake from sleep, sample a sensor via the 12-bit ADC at up to 19 channels, perform averaging or filtering, transmit via an EUSART-connected radio, and return to sleep - all within a few milliseconds per cycle. The 16 KB flash comfortably fits a wireless sensor stack (e.g., SHT3x driver + packet handling), while the 256-byte EEPROM stores calibration data that survives battery swaps.
موصى به
Consumer Remote Control with mTouch
The PIC18F24K22-I/ML is well suited for capacitive-touch remote controls thanks to on-chip mTouch hardware support that interprets up to 28 channels of button, slider, or proximity sensing without an external touch IC. Combined with the 64 MHz core, the part can scan touch sensors, debounce gestures, encode IR or RF commands via EUSART, and manage multi-button wakeup from deep sleep using the RTCC. The 2.5-5.5V supply range simplifies direct Li-ion or 2x AAA battery connection, while 100 nA sleep current allows months of standby on a single coin cell.
موصى به
Automotive Body Electronics Module
AEC-Q100-qualified variants of the PIC18F24K22 serve automotive body electronics - mirror controllers, seat-position modules, lighting drivers, and HVAC sensors - where 16 MIPS and integrated peripherals reduce BOM cost. The two EUSART blocks support LIN bus communication with auto-baud detection, while two MSSP blocks handle I2C sensor clusters (e.g., temperature, humidity, ambient light). With automotive-grade temperature rating up to +125 C and PPAP documentation, the part meets OEM supplier requirements. The 28-QFN package's 6x6 mm footprint fits tight mirror or door-handle housings.
موصى به
Industrial Sensor and Control Panel
The PIC18F24K22-I/ML fits industrial control panels where 12-bit ADC accuracy, rail-to-rail comparators for threshold detection, and PWM outputs for motor or valve control replace discrete analog circuitry. Its programmable CVREF simplifies setting comparator trip points, while 2 EUSARTs support RS-485 Modbus RTU or RS-232 communication with industrial equipment. The 64 MHz core runs PID loops for temperature, pressure, or flow control at millisecond cadence. The -40 C to +85 C industrial temperature range covers most factory-floor and outdoor cabinet installations.
موصى به
Home Appliance with Capacitive Touch UI
White goods such as induction cooktops, microwave ovens, washing machines, and coffee makers use the PIC18F24K22-I/ML for its mTouch capacitive sensing combined with sufficient CPU to drive 7-segment or TFT user interfaces. The 12-bit ADC samples up to 19 channels for temperature, humidity, and load sensing, while the integrated CVREF drives accurate comparator-based safety thresholds. The 256-byte EEPROM retains user settings and calibration data through power cycles. XLP low-power modes support clock and standby displays that draw minimal current when the appliance is idle.
موصى به
USB-Enabled Embedded Device
Although the 28-pin PIC18F24K22 lacks the on-board USB peripheral of the 14K50/45K50 family, it remains widely used as a companion MCU to a USB transceiver or a USB-serial bridge IC, handling command parsing, sensor aggregation, and host-side protocol translation at 16 MIPS. Its two EUSARTs can drive a CDC ACM class over USB-serial, while MSSP peripherals drive SPI flash for firmware update storage. The 16 KB flash fits a USB stack plus application logic, and nanoWatt XLP sleep modes support USB suspend current budgets.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC18F24K22-I/ML — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC18F24K22T-I/ML | PIC18F24K22-E/ML | PIC18F25K22-I/ML | PIC18F23K22-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) ML | 28-QFN (6x6) ML - same | 28-QFN (6x6) ML - same | 28-QFN (6x6) ML - same | 28-QFN (6x6) ML - same |
| Flash Memory | 16 KB | 16 KB - same | 16 KB - same | 32 KB - +100% | 8 KB - -50% |
| SRAM | 768 bytes | 768 bytes - same | 768 bytes - same | 1.5 KB - +95% | 512 bytes - -33% |
| Maximum Frequency | 64 MHz (16 MIPS) | 64 MHz - same | 64 MHz - same | 64 MHz - same | 64 MHz - same |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C - same | -40 C to +125 C - Extended | -40 C to +85 C - same | -40 C to +85 C - same |
| Supply Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same |
| XLP nanoWatt Sleep Current | <100 nA typical | <100 nA typical - same | <100 nA typical - same | <100 nA typical - same | <100 nA typical - same |
| Pricing (Qty 1, USD) | $4.93 | ~$4.93 - same | ~$5.10 - +3% | ~$5.40 - +9% | ~$4.30 - -13% |
أبرز الفروقات
- nanoWatt XLP deep-sleep current below 100 nA typical (مقابلPIC18F25K22-I/ML)
- Industrial -40 C to +85 C rating standard; AEC-Q100 variants available (مقابلPIC18F24K22-E/ML)
- Optimized 16 KB flash for typical USB/sensor stacks (مقابلPIC18F23K22-I/ML)
ملاحظات التصميم
The 28-QFN ML package has a central exposed thermal pad (EP) that MUST be soldered to a grounded copper pad on the PCB. Per the Microchip QFN PCB layout application note, the EP solder paste stencil should use a windowed pattern (typically 4 or 9 openings) covering 50-80% of the pad area to prevent solder balling and ensure reliable void-free soldering. Keep the EP copper pour at least 2 mm larger than the package on all sides for heat spreading.
Place a 100 nF decoupling capacitor as close as possible to each VDD pin (pins 7 and 21) and a bulk 4.7 uF to 10 uF capacitor at the package. The PIC18F24K22's nanoWatt XLP deep-sleep mode is sensitive to noisy supply rails - noisy VDD can wake the MCU inadvertently. For battery-powered designs, use a ferrite bead or 10 ohm resistor on VDD to isolate from switching power supply noise.
Do not leave the MCLR pin (pin 1) floating - either tie it to VDD through a 10 kohm pull-up or implement the recommended ICSP reset circuit with a diode and capacitor to support in-circuit programming. When migrating from PIC18F2XK20 to PIC18F2XK22, note that the ADC channel mapping differs for analog inputs on shared pins; verify ANx assignments using the PPS register configuration in the datasheet before redesigning the layout.
Estimated: At 64 MHz operation with full peripheral activity at 5V, the PIC18F24K22-I/ML dissipates approximately 30-40 mW in the 28-QFN package. With theta_JA of approximately 40 C/W on a 1 oz 4-layer PCB (JEDEC EIA/JESD51), the junction temperature rise is ~1.6 C above ambient. The internal thermal shutdown trips at +150 C. For automotive applications above +85 C ambient, derate clock frequency and disable unused peripherals via PMD registers to limit self-heating.
معلومات الامتثال
RoHS and REACH compliant per Microchip material declarations. Automotive AEC-Q100 grade is available on /MLVAO variants. Standard /ML grade is industrial -40 C to +85 C.
