PIC24EP512GP806-E/MR - 16-bit 512KB Flash MCU 64-VQFN | Microchip
MPN: PIC24EP512GP806-E/MR ✓ نشطPIC24EP512GP806-E/MR نظرة عامة
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (RAM), and configurable peripheral interfaces on one silicon die. Within the semiconductor taxonomy, an MCU sits below the System-on-Chip (SoC) level and is the central building block of embedded electronics. The PIC24EP series specifically targets high-performance 16-bit control with DSP-style instructions, making it well suited to motor control, digital power conversion, and real-time signal processing where 8-bit MCUs lack headroom but full 32-bit parts are overkill.
Key features of the PIC24EP512GP806-E/MR include 512 KB (170K x 24) self-programmable Flash, 53 KB SRAM, hardware multipliers with single-cycle MAC, dedicated DMA for ADC and USB, and 122 general-purpose I/O pins routed to the package. The device supports an industrial operating range of -40C to +125C (the -E temperature grade covers -40C to +125C) and operates from a single 3.0 V to 3.6 V supply. AEC-Q100 qualification is mentioned by some distributors for the variant, making it usable in automotive dashboard, body, and powertrain-adjacent designs.
Architecturally, the PIC24EP512GP806 family uses a modified Harvard core with a 24-bit instruction word, dual 40-bit accumulators, and a 17 x 17 hardware multiplier. Dual CAN, USB, and four UART/SPI/I2C options are multiplexed onto the 122 GPIO, giving engineers enough peripheral headroom to replace external bridge ICs in many designs. The integrated DMA further reduces CPU load for ADC and USB pipelines.
Typical applications include CAN-connected industrial sensor nodes, USB human-interface devices, motor-control front ends, and automotive body controllers. The dual-CAN and USB combination makes it especially attractive in gateway or bridge designs that aggregate vehicle-network traffic and expose a diagnostic or configuration port.
When designing with this part, pay close attention to the 64-VQFN (9x9) exposed-pad PCB footprint and ensure the thermal pad is soldered to a continuous ground plane for thermal and electrical performance. The -E temperature grade is rated for -40C to +125C; for automotive-grade lifetime reliability, verify the specific AEC-Q100 documentation from Microchip rather than relying solely on distributor listings.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on the manufacturer product page alone.
بدائل مباشرة لـ PIC24EP512GP806-E/MR — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC24EP512GP806-E/MR (نفس عامل الشكل والبصمة) — يختلف في ADC, Core Architecture, Packaging, RAM Size, Timers.
PIC24EP512GP806-I/MR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24EP512GP806T-I/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←DSPIC33EP512GP806-I/MR
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC24EP512MC206-I/MR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24EP256GP206-I/MR
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC24EP512GP806-E/MR الحدود القصوى والخصائص الكهربائية
| Core Architecture | PIC24E (16-bit modified Harvard) |
| Program Memory (Flash) | 512 KB (170K x 24) |
| RAM Size | 53 KB (24K x 16) |
| CPU Speed | 60 MIPS (max) |
| جهد التغذية | 3.0 V to 3.6 V |
| نطاق درجة حرارة التشغيل | -40C to +125C (E grade) |
| I/O Pins | 122 |
| العلبة | 64-VQFN (9x9 mm) with exposed pad |
| ADC | 12-bit, up to 1.1 Msps, multiple channels |
| CAN | Dual CAN 2.0B |
| USB | USB 2.0 Full-Speed On-The-Go |
| Timers | 27 general purpose (9 x 16-bit, others) |
| DMA Channels | Multiple (data movement engine for ADC/USB) |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
تكوين أطراف PIC24EP512GP806-E/MR
| دبوس 1 | RP0/PMD0 — Remappable I/O / Parallel Master Data 0 |
| دبوس 2 | RP1/PMD1 — Remappable I/O / Parallel Master Data 1 |
| دبوس 3 | RP2/PMD2 — Remappable I/O / Parallel Master Data 2 |
| دبوس 4 | RP3/PMD3 — Remappable I/O / Parallel Master Data 3 |
| دبوس 5 | RP4/PMD4 — Remappable I/O / Parallel Master Data 4 |
| دبوس 6 | RP5/PMD5 — Remappable I/O / Parallel Master Data 5 |
| دبوس 7 | RP6/PMD6 — Remappable I/O / Parallel Master Data 6 |
| دبوس 8 | RP7/PMD7 — Remappable I/O / Parallel Master Data 7 |
| دبوس 9 | VDD — Supply voltage (3.0 V to 3.6 V) |
| دبوس 10 | VSS — Ground reference |
| دبوس 11 | OSC1/CLKI — Crystal oscillator input or external clock |
| دبوس 12 | OSC2/CLKO — Crystal oscillator output |
| دبوس 13 | MCLR — Master clear (reset) input, active low |
| دبوس 14 | PGED2 — Programming/debug data line 2 |
| دبوس 15 | PGEC2 — Programming/debug clock line 2 |
| دبوس 16 | PGED1 — Programming/debug data line 1 |
| دبوس 17 | PGEC1 — Programming/debug clock line 1 |
| دبوس 18 | AVDD — Analog supply voltage |
| دبوس 19 | AVSS — Analog ground reference |
| دبوس 20 | AN0 — Analog input 0 / ADC reference |
| دبوس 21 | AN1 — Analog input 1 |
| دبوس 22 | AN2 — Analog input 2 |
| دبوس 23 | AN3 — Analog input 3 |
| دبوس 24 | AN4 — Analog input 4 |
| دبوس 25 | AN5 — Analog input 5 |
| دبوس 26 | AN6 — Analog input 6 |
| دبوس 27 | AN7 — Analog input 7 |
| دبوس 28 | AN8 — Analog input 8 |
| دبوس 29 | AN9 — Analog input 9 |
| دبوس 30 | AN10 — Analog input 10 |
| دبوس 31 | AN11 — Analog input 11 |
| دبوس 32 | AN12 — Analog input 12 |
| دبوس 33 | AN13 — Analog input 13 |
| دبوس 34 | AN14 — Analog input 14 |
| دبوس 35 | AN15 — Analog input 15 |
| دبوس 36 | VREF+ — ADC voltage reference positive |
| دبوس 37 | VREF- — ADC voltage reference negative |
| دبوس 38 | C1RX — CAN1 receive |
| دبوس 39 | C1TX — CAN1 transmit |
| دبوس 40 | C2RX — CAN2 receive |
| دبوس 41 | C2TX — CAN2 transmit |
| دبوس 42 | D+ — USB D+ data line |
| دبوس 43 | D- — USB D- data line |
| دبوس 44 | VBUS — USB VBUS sense |
| دبوس 45 | VUSB — USB internal regulator output (cap to VSS) |
| دبوس 46 | RP8 — Remappable I/O |
| دبوس 47 | RP9 — Remappable I/O |
| دبوس 48 | RP10 — Remappable I/O |
| دبوس 49 | RP11 — Remappable I/O |
| دبوس 50 | RP12 — Remappable I/O |
| دبوس 51 | RP13 — Remappable I/O |
| دبوس 52 | RP14 — Remappable I/O |
| دبوس 53 | RP15 — Remappable I/O |
| دبوس 54 | RP16 — Remappable I/O |
| دبوس 55 | RP17 — Remappable I/O |
| دبوس 56 | RP18 — Remappable I/O |
| دبوس 57 | RP19 — Remappable I/O |
| دبوس 58 | RP20 — Remappable I/O |
| دبوس 59 | RP21 — Remappable I/O |
| دبوس 60 | RP22 — Remappable I/O |
| دبوس 61 | RP23 — Remappable I/O |
| دبوس 62 | RP24 — Remappable I/O |
| دبوس 63 | RP25 — Remappable I/O |
| دبوس 64 | RP26 — Remappable I/O |
التطبيقات النموذجية
PIC24EP512GP806-E/MR مناسب لـ 7 التطبيقs: Industrial CAN Sensor Node, USB Human Interface Device, Automotive Body Controller, Digital Power Conversion Front End, Motor Control Drive Stage, IoT Gateway / Bridge Device, Medical Patient Monitoring Accessory.
Industrial CAN Sensor Node
The PIC24EP512GP806-E/MR is a strong fit for industrial CAN sensor nodes because it integrates dual CAN 2.0B controllers, 512 KB Flash for protocol stacks, and 53 KB RAM for buffering CAN-FD or higher-layer payloads. Its 60 MIPS core runs CANopen or DeviceNet stacks at comfortable headroom while leaving cycles for periodic sensing and PID loops. Power is held to a 3.3 V rail and the -40C to +125C E grade handles factory-floor temperature swings. Place the device on a 4-layer PCB with continuous ground under the exposed pad for EMC.
موصى به
USB Human Interface Device
The PIC24EP512GP806-E/MR's USB 2.0 full-speed On-The-Go transceiver with on-chip DMA makes it ideal for USB HID peripherals such as custom keypads, panel controllers, or diagnostic tools. The 60 MIPS core handles USB stack plus application logic with cycles to spare, and 512 KB Flash stores composite descriptors and bootloader code. The DMA offloads bulk endpoint transfers so the CPU can run the user interface without interrupt overhead. A 24 MHz crystal and USB-IF-compliant 27 ohm RC network are required on D+/D-.
موصى به
Automotive Body Controller
The PIC24EP512GP806-E/MR suits automotive body controllers (BCM, door modules, HVAC panels) thanks to dual CAN for chassis/body network segmentation, 122 GPIO for switch and relay scanning, and the -E temperature grade covering under-hood-adjacent modules. Its AEC-Q100 status (per some distributor listings) eases PPAP documentation in OEM programs. The 53 KB RAM comfortably hosts AutoSAR-style runtime plus diagnostics, and 512 KB Flash supports multi-application firmware images. Verify AEC-Q100 certificate with Microchip for safety-critical use.
موصى به
Digital Power Conversion Front End
For digital power conversion (digitally controlled SMPS, PFC stages, LLC), the PIC24EP512GP806-E/MR's 60 MIPS core, 17x17 hardware multiplier with single-cycle MAC, and 1.1 Msps 12-bit ADC give it the bandwidth to run voltage-mode or average-current-mode control loops at typical 100 kHz switching frequencies. The 53 KB RAM supports per-cycle sample buffers and duty-cycle history, and the on-chip DMA streams ADC samples without CPU intervention. Designers should use the exposed-pad ground pour to sink switching losses and isolate analog/digital grounds.
موصى به
Motor Control Drive Stage
The PIC24EP512GP806-E/MR can serve as a sensorless or sensored BLDC/PMSM motor controller for small industrial pumps, fans, and appliance drives. Its high-speed PWM module supports complementary outputs with programmable dead-time, and the 12-bit ADC with DMA samples phase currents at high rates. The 60 MIPS core handles field-oriented control (FOC) or trapezoidal commutation with adequate headroom. For higher performance, the dsPIC33EP variant with DSP engine is preferred; otherwise this PIC24E part is the cost-effective choice.
موصى به
IoT Gateway / Bridge Device
The PIC24EP512GP806-E/MR is well suited to IoT gateways bridging CAN, USB, and UART-based sensor buses. Its dual CAN, USB OTG, multiple UART/SPI/I2C, and 122 GPIO let one device aggregate several fieldbuses without external bridge ICs. The 512 KB Flash stores gateway logic and protocol translation, while 53 KB RAM buffers messages between buses. Add an external Wi-Fi or BLE module on a UART/SPI for uplink. The exposed-pad package suits compact gateway enclosures with adequate PCB copper.
موصى به
Medical Patient Monitoring Accessory
The PIC24EP512GP806-E/MR can drive medical accessories (bedside monitoring displays, infusion-pump HMI boards, handheld diagnostic tools) where its USB OTG enables tethered data transfer, the 12-bit ADC samples analog physiological signals, and 512 KB Flash stores firmware with safety checks. The -40C to +125C temperature range supports clinical environments and field use. Note: medical safety certification (IEC 60601, IEC 62304) is a system-level obligation beyond the MCU itself. Pair with appropriate isolation and power management.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC24EP512GP806-E/MR — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC24EP512GP806-I/MR | PIC24EP512GP806T-I/MR | PIC24EP512GP806-E/PT | dsPIC33EP512GP806-I/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-TQFP - different | 64-VQFN (9x9) - same |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB (-50%) |
| RAM Size | 53 KB | 53 KB | 53 KB | 53 KB | 32 KB (-40%) |
| CPU Speed | 60 MIPS | 60 MIPS | 70 MIPS (DSP enhanced) | 60 MIPS | 60 MIPS |
| CAN Controllers | Dual CAN 2.0B | Dual CAN 2.0B | Dual CAN 2.0B | Dual CAN 2.0B | Single CAN (-50%) |
| Temperature Grade | E: -40C to +125C | I: -40C to +85C | I: -40C to +85C | I: -40C to +85C | I: -40C to +85C |
| DSP Engine | No (PIC24E core) | Yes (dsPIC33E) | No | No | No |
أبرز الفروقات
- Dual CAN plus USB OTG in a single 16-bit MCU (مقابلPIC24EP256GP206-I/MR)
- Extended -E temperature grade for industrial/automotive (مقابلPIC24EP512GP806-I/MR)
- VQFN-64 footprint with 9x9 mm body for compact designs (مقابلPIC24EP512GP806-E/PT (TQFP-64))
ملاحظات التصميم
The 64-VQFN (9x9) package relies on the bottom exposed pad as the primary heat-dissipation path. The pad must be soldered to a continuous ground plane with a 5x5 thermal via array (0.3 mm drill, 0.5 mm pitch) to the inner ground layer. Without the via array, junction temperature can rise 20-30C above rated. For continuous 60 MIPS operation, expect roughly 0.3 W internal dissipation; size the copper pour accordingly.
Place a 10 uF X7R bulk capacitor plus 0.1 uF ceramic within 5 mm of every VDD/AVDD pin pair. Separate analog and digital ground returns should join at a single point under the MCU exposed pad. Keep the 24 MHz crystal traces within 5 mm of OSC1/OSC2 and guard them with a ground pour on both sides. The D+/D- USB traces should be 90 ohm differential and length-matched within 150 mil.
Do not apply 5 V signals to any GPIO when VDD is 3.3 V; PIC24E GPIO are 5 V tolerant only on select pins (consult datasheet pin tables). Always configure unused peripherals in their reset state to minimize current. The MCLR pin must have a 10 kohm pull-up to VDD; a floating MCLR can cause spurious resets. For CAN buses, add a 120 ohm termination resistor only at the physical ends of the bus - not at every node.
Route the analog ADC inputs as short, guarded traces away from switching nodes and PWM signals. If using the ADC for high-impedance sensors, add a 100 nF C_holder capacitor on the analog input pin to allocate sampling time and reduce crosstalk. The C1RX/C1TX and C2RX/C2TX lines should be routed together with a ground guard on both sides to minimize EMI susceptibility.
معلومات الامتثال
RoHS and lead-free per Microchip product page. AEC-Q100 qualification noted by some distributors; verify latest certificate from Microchip for automotive PPAP documentation.
