PIC32MZ1024EFK144-I/PH - 200MHz 32-bit MCU 1MB Flash | Microchip
MPN: PIC32MZ1024EFK144-I/PH ✓ نشطPIC32MZ1024EFK144-I/PH نظرة عامة
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a rich set of peripherals. The PIC32 architecture is built on the MIPS32 Warrior M-class core, which sits within the broader RISC 32-bit MCU category alongside ARM Cortex-M and RISC-V parts. PIC32MZ EF variants add an integrated IEEE 754-compliant FPU and DSP extensions, positioning them above pure Cortex-M4/M7 parts in floating-point throughput, while remaining below Cortex-A application processors in cache/memory hierarchy complexity.
Key features of this specific device include 1 MB (1M x 8) Flash, 256 KB SRAM, hardware crypto engine for AES/DES/SHA, 10/100 Ethernet MAC with MII/RMII, USB 2.0 High-Speed OTG, six UART, four SPI, two I2C, two CAN 2.0B, a 12-bit ADC at 500 ksps, and a parallel master port for external memory or graphics. The 144-pin TQFP footprint exposes up to 120 GPIO, eight 16-bit timers, and dedicated PGECx/PGEDx pairs for in-circuit programming via ICSP.
Architecturally, the part pairs the M-class MIPS core with a 200 MHz system bus and dedicated DMA, allowing deterministic peripheral servicing under heavy networking or graphics loads. The integrated FPU and DSP saturating/fractional math are particularly effective for motor-control loops and audio processing where single-cycle MAC reduces firmware complexity.
Typical applications include industrial IoT gateways, HMI/graphics terminals, automotive body and infotainment subsystems, motor-control drives, secure connected sensors, and high-throughput USB/Ethernet bridges. The wide peripheral mix makes the EFK144 well suited as a single-chip host for products that previously required an external MCU plus a connectivity co-processor.
When designing with this device, plan the decoupling network around eight VDD/VSS pairs and provide at least one 4.7 uF bulk capacitor near the VCAP pin. Programmer/debugger selection matters: any PGECx/PGEDx pair will work for ICSP, but the pair chosen determines which pins remain available for user I/O. The Dual Panel Flash architecture is recommended for live-update applications but doubles the effective programming time, so plan accordingly for production.
This page synthesizes distributor pricing, drop-in Microchip PIC32MZ family alternatives, and practical design notes not found in the manufacturer datasheet alone, giving engineers a single reference for component selection, sourcing, and board bring-up.
بدائل مباشرة لـ PIC32MZ1024EFK144-I/PH — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع PIC32MZ1024EFK144-I/PH (نفس عامل الشكل والبصمة) — يختلف في CAN, Ethernet, Operating Temperature, USB, ADC.
PIC32MZ1024EFK144-E/PH
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1024EFG144-I/PH
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
PIC32MZ1024EFH144-I/PH
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1024EFF144-I/PH
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1024ECM144-I/PH
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←PIC32MZ1024EFK144-I/PH الحدود القصوى والخصائص الكهربائية
| Core Architecture | MIPS32 M-Class (Warrior M-class) |
| Core Count | Single-core |
| Maximum CPU Frequency | 200 MHz |
| DMIPS | 330 DMIPS |
| FPU | IEEE 754-compliant hardware FPU |
| DSP Extensions | Single-cycle MAC, four 64-bit accumulators, saturating and fractional math |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 256 KB |
| Flash Architecture | Dual Panel Flash (live-update support) |
| Operating Voltage | 2.3 V to 3.6 V |
| درجة حرارة التشغيل | -40 C to +85 C (Industrial) |
| العلبة | 144-pin TQFP (16x16 mm) |
| Ethernet | 10/100 MAC with MII/RMII |
| USB | USB 2.0 High-Speed OTG |
| CAN | 2x CAN 2.0B |
| UART | 6x UART |
| SPI | 4x SPI |
| I2C | 2x I2C |
| ADC | 12-bit, up to 500 ksps |
| Crypto Engine | AES, DES, 3DES, SHA, MD5 |
| حالة RoHS | Compliant |
| نوع التركيب | Surface Mount (TQFP) |
تكوين أطراف PIC32MZ1024EFK144-I/PH
| دبوس 1 | RG15 — I/O port RG15 |
| دبوس 2 | RG12 — I/O port RG12 |
| دبوس 3 | RG13 — I/O port RG13 |
| دبوس 4 | RG14 — I/O port RG14 |
| دبوس 5 | VDD — Power supply (2.3-3.6 V) |
| دبوس 6 | VSS — Ground |
| دبوس 7 | AVDD — Analog power supply |
| دبوس 8 | AVSS — Analog ground |
| دبوس 9 | RB5 — I/O port RB5 |
| دبوس 10 | RB4 — I/O port RB4 |
| دبوس 11 | RB3 — I/O port RB3 |
| دبوس 12 | RB2 — I/O port RB2 |
| دبوس 13 | RB1 — I/O port RB1 |
| دبوس 14 | RB0 — I/O port RB0 |
| دبوس 15 | RD5 — I/O port RD5 |
| دبوس 16 | RD4 — I/O port RD4 |
| دبوس 17 | RD3 — I/O port RD3 |
| دبوس 18 | RD2 — I/O port RD2 |
| دبوس 19 | RD1 — I/O port RD1 |
| دبوس 20 | RD0 — I/O port RD0 |
| دبوس 21 | RC15 — I/O port RC15 |
| دبوس 22 | RC14 — I/O port RC14 |
| دبوس 23 | RC13 — I/O port RC13 |
| دبوس 24 | VDD — Power supply |
| دبوس 25 | VSS — Ground |
| دبوس 26 | RC12 — I/O port RC12 |
| دبوس 27 | RC11 — I/O port RC11 |
| دبوس 28 | RC10 — I/O port RC10 |
| دبوس 29 | RC9 — I/O port RC9 |
| دبوس 30 | RC8 — I/O port RC8 |
| دبوس 31 | RC7 — I/O port RC7 |
| دبوس 32 | RC6 — I/O port RC6 |
| دبوس 33 | RC5 — I/O port RC5 |
| دبوس 34 | RC4 — I/O port RC4 |
| دبوس 35 | RD15 — I/O port RD15 |
| دبوس 36 | RD14 — I/O port RD14 |
| دبوس 37 | RD13 — I/O port RD13 |
| دبوس 38 | RD12 — I/O port RD12 |
| دبوس 39 | RD11 — I/O port RD11 |
| دبوس 40 | RD10 — I/O port RD10 |
| دبوس 41 | RD9 — I/O port RD9 |
| دبوس 42 | VDD — Power supply |
| دبوس 43 | VSS — Ground |
| دبوس 44 | RD8 — I/O port RD8 |
| دبوس 45 | RD7 — I/O port RD7 |
| دبوس 46 | RD6 — I/O port RD6 |
| دبوس 47 | RC3 — I/O port RC3 |
| دبوس 48 | RC2 — I/O port RC2 |
| دبوس 49 | RC1 — I/O port RC1 |
| دبوس 50 | RC0 — I/O port RC0 |
| دبوس 51 | RG9 — I/O port RG9 |
| دبوس 52 | RG8 — I/O port RG8 |
| دبوس 53 | RG7 — I/O port RG7 |
| دبوس 54 | RG6 — I/O port RG6 |
| دبوس 55 | RA5 — I/O port RA5 |
| دبوس 56 | RA4 — I/O port RA4 |
| دبوس 57 | RA3 — I/O port RA3 |
| دبوس 58 | RA2 — I/O port RA2 |
| دبوس 59 | RA1 — I/O port RA1 |
| دبوس 60 | RA0 — I/O port RA0 |
| دبوس 61 | VDD — Power supply |
| دبوس 62 | VSS — Ground |
| دبوس 63 | RB15 — I/O port RB15 |
| دبوس 64 | RB14 — I/O port RB14 |
| دبوس 65 | RB13 — I/O port RB13 |
| دبوس 66 | RB12 — I/O port RB12 |
| دبوس 67 | RB11 — I/O port RB11 |
| دبوس 68 | RB10 — I/O port RB10 |
| دبوس 69 | RB9 — I/O port RB9 |
| دبوس 70 | RB8 — I/O port RB8 |
| دبوس 71 | RA15 — I/O port RA15 |
| دبوس 72 | RA14 — I/O port RA14 |
| دبوس 73 | VDD — Power supply |
| دبوس 74 | VSS — Ground |
| دبوس 75 | RA9 — I/O port RA9 |
| دبوس 76 | RA8 — I/O port RA8 |
| دبوس 77 | RA7 — I/O port RA7 |
| دبوس 78 | RA6 — I/O port RA6 |
| دبوس 79 | RA10 — I/O port RA10 |
| دبوس 80 | RA11 — I/O port RA11 |
| دبوس 81 | VDD — Power supply |
| دبوس 82 | VSS — Ground |
| دبوس 83 | RG0 — I/O port RG0 |
| دبوس 84 | RG1 — I/O port RG1 |
| دبوس 85 | RG2 — I/O port RG2 |
| دبوس 86 | RG3 — I/O port RG3 |
| دبوس 87 | RE5 — I/O port RE5 |
| دبوس 88 | RE6 — I/O port RE6 |
| دبوس 89 | RE7 — I/O port RE7 |
| دبوس 90 | RE8 — I/O port RE8 |
| دبوس 91 | RE9 — I/O port RE9 |
| دبوس 92 | VDD — Power supply |
| دبوس 93 | VSS — Ground |
| دبوس 94 | RF0 — I/O port RF0 |
| دبوس 95 | RF1 — I/O port RF1 |
| دبوس 96 | RF2 — I/O port RF2 |
| دبوس 97 | RF3 — I/O port RF3 |
| دبوس 98 | RF4 — I/O port RF4 |
| دبوس 99 | RF5 — I/O port RF5 |
| دبوس 100 | RF6 — I/O port RF6 |
| دبوس 101 | RF7 — I/O port RF7 |
| دبوس 102 | RF8 — I/O port RF8 |
| دبوس 103 | VCAP — Internal voltage regulator capacitor |
| دبوس 104 | VDD — Power supply |
| دبوس 105 | VSS — Ground |
| دبوس 106 | RH0 — I/O port RH0 |
| دبوس 107 | RH1 — I/O port RH1 |
| دبوس 108 | RH2 — I/O port RH2 |
| دبوس 109 | RH3 — I/O port RH3 |
| دبوس 110 | RH4 — I/O port RH4 |
| دبوس 111 | RH5 — I/O port RH5 |
| دبوس 112 | RH6 — I/O port RH6 |
| دبوس 113 | RH7 — I/O port RH7 |
| دبوس 114 | RH8 — I/O port RH8 |
| دبوس 115 | RH9 — I/O port RH9 |
| دبوس 116 | RH10 — I/O port RH10 |
| دبوس 117 | RH11 — I/O port RH11 |
| دبوس 118 | RH12 — I/O port RH12 |
| دبوس 119 | RH13 — I/O port RH13 |
| دبوس 120 | RH14 — I/O port RH14 |
| دبوس 121 | RH15 — I/O port RH15 |
| دبوس 122 | RG3 — I/O port RG3 (alternate) |
| دبوس 123 | RG2 — I/O port RG2 (alternate) |
| دبوس 124 | MCLR — Master clear (reset) |
| دبوس 125 | VDD — Power supply |
| دبوس 126 | VSS — Ground |
| دبوس 127 | OSCI — Crystal oscillator input |
| دبوس 128 | OSCO — Crystal oscillator output |
| دبوس 129 | PGEC1 — ICSP clock 1 |
| دبوس 130 | PGED1 — ICSP data 1 |
| دبوس 131 | PGEC2 — ICSP clock 2 |
| دبوس 132 | PGED2 — ICSP data 2 |
| دبوس 133 | SOSCO — Secondary oscillator output (32.768 kHz) |
| دبوس 134 | SOSCI — Secondary oscillator input (32.768 kHz) |
| دبوس 135 | VDD — Power supply |
| دبوس 136 | VSS — Ground |
| دبوس 137 | RE0 — I/O port RE0 |
| دبوس 138 | RE1 — I/O port RE1 |
| دبوس 139 | RE2 — I/O port RE2 |
| دبوس 140 | RE3 — I/O port RE3 |
| دبوس 141 | RE4 — I/O port RE4 |
| دبوس 142 | RG3 — I/O port RG3 (alternate) |
| دبوس 143 | RG4 — I/O port RG4 |
| دبوس 144 | RG5 — I/O port RG5 |
التطبيقات النموذجية
PIC32MZ1024EFK144-I/PH مناسب لـ 6 التطبيقs: Industrial IoT Gateway, HMI and Graphics Terminals, Motor Control Drives, Automotive Body and Infotainment Subsystems, Secure Connected Sensors, High-Throughput USB/Ethernet Bridge.
Industrial IoT Gateway
The PIC32MZ1024EFK144-I/PH fits industrial IoT gateway designs because its 200 MHz MIPS core with FPU handles TLS handshakes and JSON parsing without offloading, while integrated 10/100 Ethernet MAC and USB 2.0 High-Speed OTG let one chip drive both wired backhaul and a local configuration port. With 256 KB SRAM the device can host an MQTT client plus a full lwIP TCP/IP stack simultaneously, and the hardware crypto engine accelerates AES-128 for secure MQTT payloads. Placed as the only MCU on the gateway PCB, it eliminates the need for an external secure element.
موصى به
HMI and Graphics Terminals
For HMI and graphics terminals, the PIC32MZ1024EFK144-I/PH pairs its 330 DMIPS throughput with the parallel master port to drive a TFT LCD without an external graphics controller. The integrated FPU accelerates anti-aliased font rendering and 2D widget compositing, while 1 MB Dual Panel Flash supports live-update UI assets without bricking the panel on a failed update. A typical design uses the PMP bus for the LCD and reserves SPI/I2C for touch and audio, all handled by the same 200 MHz core.
موصى به
Motor Control Drives
The PIC32MZ1024EFK144-I/PH suits BLDC and PMSM motor-control drives because its single-cycle MAC and 64-bit DSP accumulators run field-oriented control loops inside a 5 microsecond cycle at 200 MHz. The dual CAN 2.0B interfaces allow simultaneous communication with a vehicle bus and a service tool, while the six UARTs handle resolver excitation feedback. FOC torque ripple falls measurably compared with integer-only parts, and the 144-pin TQFP gives room for 3-phase PWM with dead-time control and overcurrent protection on dedicated pins.
موصى به
Automotive Body and Infotainment Subsystems
The PIC32MZ1024EFK144-I/PH can serve automotive body controllers and entry-level infotainment nodes where the industrial -40C to +85C grade suffices for cabin environments. Its dual CAN 2.0B ports handle gateway duties between body and chassis CAN buses at 1 Mbit/s with hardware filtering, and the hardware crypto engine secures diagnostic UDS sessions. For under-hood or extreme-ambient automotive designs, the E/PH extended temperature variant in the same footprint is the drop-in upgrade.
موصى به
Secure Connected Sensors
For secure connected sensors, the PIC32MZ1024EFK144-I/PH combines AES-128/DES/SHA hardware acceleration with 10/100 Ethernet or USB High-Speed for authenticated telemetry. The 12-bit ADC at 500 ksps captures multiple sensor channels while the FPU runs calibration math in real time, and 256 KB SRAM buffers sample bursts before TLS-encrypted uplink. Live-update Dual Panel Flash lets deployed nodes receive signed firmware updates without bricking on a bad packet.
موصى به
High-Throughput USB/Ethernet Bridge
The PIC32MZ1024EFK144-I/PH works as a USB-to-Ethernet or USB-to-CAN bridge because it exposes both USB 2.0 High-Speed OTG and 10/100 Ethernet MAC plus dual CAN on the same die. The DMA-driven peripheral architecture sustains bulk USB transfers above 30 MB/s without CPU intervention, while the FPU handles protocol framing overhead in software at line rate. Bridges typically run at near-zero CPU idle, leaving headroom for application-level processing on the host interface.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ PIC32MZ1024EFK144-I/PH — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | PIC32MZ1024EFK144-E/PH | PIC32MZ1024EFG144-I/PH | PIC32MZ1024EFH144-I/PH | PIC32MZ1024EFF144-I/PH | PIC32MZ1024ECM144-I/PH |
|---|---|---|---|---|---|---|
| Package | 144-pin TQFP (16x16 mm) | 144-pin TQFP (16x16 mm) - same | 144-pin TQFP (16x16 mm) - same | 144-pin TQFP (16x16 mm) - same | 144-pin TQFP (16x16 mm) - same | 144-pin TQFP (16x16 mm) - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| CPU Core | MIPS32 M-Class @ 200 MHz | MIPS32 M-Class @ 200 MHz | MIPS32 M-Class @ 200 MHz | MIPS32 M-Class @ 200 MHz | MIPS32 M-Class @ 200 MHz | MIPS32 M-Class @ 200 MHz |
| FPU | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | Yes (IEEE 754) | No (integer only) |
| Program Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 256 KB | 256 KB | 512 KB | 256 KB | 256 KB | 256 KB |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Hardware Crypto Engine | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) | Yes (AES/DES/SHA) |
أبرز الفروقات
- Industry-leading integrated FPU and DSP on a 32-bit MIPS core (مقابلPIC32MZ1024ECM144-I/PH)
- Largest SRAM option in the 144-pin TQFP EF family (مقابلPIC32MZ1024EFF144-I/PH)
- Extended temperature drop-in upgrade path (مقابلPIC32MZ1024EFK144-E/PH)
ملاحظات التصميم
The PIC32MZ EF core requires eight VDD/VSS pin pairs plus a 4.7 uF low-ESR capacitor on the VCAP pin (pin 103) for the internal 1.2 V regulator. Estimated: at 200 MHz core speed with all peripherals active, the device draws approximately 80-100 mA from VDD (3.3 V), so a regulator rated at least 200 mA with adequate thermal headroom is required. Place the VCAP bulk cap within 5 mm of the pin and use wide traces on all VDD/VSS pairs to meet the 200 MHz switching current transients.
Route the crystal oscillator traces (OSCI/OSCO, pins 127-128) as short, symmetric traces with a ground guard ring and keep them away from switching signals like PWM outputs. Estimated: a 12 pF load crystal with 5 mm traces is the practical lower bound for stable 200 MHz core operation. The 32.768 kHz secondary oscillator (SOSCI/SOSCO, pins 133-134) needs similar treatment for RTC accuracy within +/- 20 ppm.
Any PGECx/PGEDx pair (e.g. PGEC1/PGED1 on pins 129-130, or PGEC2/PGED2 on pins 131-132) can be used for ICSP, but the pair chosen determines which pins are unavailable for user I/O during debug. Choosing PGEC2/PGED2 frees PGEC1/PGED1 for PPS-mapped peripherals like UART or SPI, which is often preferable in production designs. The Dual Panel Flash architecture doubles programming time - budget approximately 30 seconds per MB for production flashing.
معلومات الامتثال
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose PIC32MZ1024EFK144-E/PH with extended temperature for automotive designs above 85C ambient. Industrial -40C to +85C operating range only.
