S9KEAZN8ACFK - KEA 32-bit MCU 48MHz 8KB Flash QFN-24 | NXP
MPN: S9KEAZN8ACFK ✓ نشطS9KEAZN8ACFK نظرة عامة
What is a KEA microcontroller? The KEA (Kinetis E Automotive) family is a subset of NXP's Kinetis 32-bit MCU lineup targeting entry-level automotive and industrial applications. In the broader taxonomy, KEA devices are 32-bit microcontrollers within ARM Cortex-M0+ based microcontrollers, themselves a subset of microcontrollers (MCUs), and ultimately embedded computing semiconductors. The 'E' suffix denotes AEC-Q100 Grade 1 automotive qualification, distinguishing KEA parts from general-purpose Cortex-M0+ MCUs. KEA parts share a common SVD/header set and peripheral IP, allowing code portability across KEA sub-families (KEA8, KEA64, KEA128).
Key features of the S9KEAZN8ACFK include a Cortex-M0+ core at 48 MHz, 8 KB program Flash, 1 KB SRAM, an 8-channel 12-bit SAR ADC, FlexIO, and multiple communication peripherals (SCI/UART, SPI, I2C). The wide supply range of 2.7 V to 5.5 V supports both 3.3 V and 5 V automotive bus environments. An integrated low-power stop and wait mode with fast wakeup time supports battery-saving requirements. The AEC-Q100 Grade 1 qualification covers -40C to +125C operating temperature.
The KEA architecture uses a von Neumann bus matrix, single-cycle GPIO access, and a tightly-coupled peripheral bridge, which together yield deterministic interrupt latency. The on-chip 12-bit ADC with up to 8 channels and hardware trigger sources simplifies motor and sensor acquisition. Hardware CRC and a watchdog timer provide functional safety primitives typical of automotive body and chassis ECUs.
Typical applications include automotive body control modules, HVAC actuators, lighting controllers (LED drivers via PWM), simple motor control (window lift, seat adjustment), and LIN slave nodes. The wide supply range also makes the S9KEAZN8ACFK suitable for industrial sensor interfaces and white goods.
When designing with this device, allocate sufficient decoupling (100 nF plus 4.7 uF bulk) near the supply pins, follow NXP's QFN thermal pad soldering guidelines for the EP, and verify LIN transceiver compliance when used as a LIN slave node.
This page synthesizes distributor pricing, AEC-Q100 context, and drop-in KEA8 alternatives that are not collated on a typical distributor product listing.
بدائل مباشرة لـ S9KEAZN8ACFK — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع S9KEAZN8ACFK (نفس عامل الشكل والبصمة) — يختلف في Communication Peripherals, MSL Level, Watchdog.
S9KEAZN8ACFKR
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
S9KEAZN8ACFK
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←S9KEAZN8ACFK الحدود القصوى والخصائص الكهربائية
| Core | ARM Cortex-M0+ |
| CPU Bit Width | 32-bit |
| Maximum CPU Frequency | 48 MHz |
| Program Flash | 8 KB (8K x 8) |
| SRAM | 1 KB |
| Supply Voltage Range | 2.7 V to 5.5 V |
| درجة حرارة التشغيل | -40C to +125C |
| العلبة | 24-QFN (4x4 mm) |
| نوع التركيب | Surface Mount |
| AEC-Q100 Grade | Grade 1 |
| ADC | 12-bit SAR, up to 8 channels |
| Communication Peripherals | SCI (UART), SPI, I2C, FlexIO |
| Timers | FTM (PWM), PIT, LPTMR, RTC |
| Watchdog | Yes (WDOG) |
| Low-Power Modes | Stop, Wait, Run |
| مستوى MSL | 3 |
| حالة RoHS | Compliant |
تكوين أطراف S9KEAZN8ACFK
| دبوس 1 | VDD — Supply voltage |
| دبوس 2 | VSS — Ground |
| دبوس 3 | PTA0 — GPIO / peripheral |
| دبوس 4 | PTA1 — GPIO / peripheral |
| دبوس 5 | PTA2 — GPIO / peripheral |
| دبوس 6 | PTA3 — GPIO / peripheral |
| دبوس 7 | PTA4 — GPIO / peripheral |
| دبوس 8 | PTA5 — GPIO / peripheral |
| دبوس 9 | PTB0 — GPIO / peripheral |
| دبوس 10 | PTB1 — GPIO / peripheral |
| دبوس 11 | PTB2 — GPIO / peripheral |
| دبوس 12 | PTB3 — GPIO / peripheral |
| دبوس 13 | PTC0 — GPIO / peripheral |
| دبوس 14 | PTC1 — GPIO / peripheral |
| دبوس 15 | PTC2 — GPIO / peripheral |
| دبوس 16 | PTC3 — GPIO / peripheral |
| دبوس 17 | PTC4 — GPIO / peripheral |
| دبوس 18 | PTC5 — GPIO / peripheral |
| دبوس 19 | PTC6 — GPIO / peripheral |
| دبوس 20 | PTC7 — GPIO / peripheral |
| دبوس 21 | RESET_b — Reset input (active low) |
| دبوس 22 | VDDA — Analog supply |
| دبوس 23 | VSSA — Analog ground |
| دبوس 24 | NC — Not connected (per datasheet) |
التطبيقات النموذجية
S9KEAZN8ACFK مناسب لـ 6 التطبيقs: Automotive Body Control Module, LIN Slave Sensor Node, HVAC Blower / Fan Controller, LED Driver / Interior Lighting, Industrial Sensor / 4-20 mA Transmitter, White Goods Appliance Board.
Automotive Body Control Module
The S9KEAZN8ACFK drives BCM functions such as mirror fold, seat position, and interior lighting where AEC-Q100 Grade 1 (-40C to +125C), 8 KB flash, and 12-bit ADC are sufficient. Its 2.7-5.5 V supply supports direct connection to 5 V automotive rails with no external LDO. The on-chip FTM PWM generates LED dimming and motor drive signals, and the integrated watchdog simplifies ASIL-A functional safety paths.
موصى به
LIN Slave Sensor Node
The S9KEAZN8ACFK is purpose-built for LIN 2.x slave sensor nodes including rain-light, temperature, and seat-occupancy sensors. The 48 MHz Cortex-M0+ runs the full LIN state machine and sensor DSP within 8 KB flash and 1 KB SRAM. Pairing with TJA1027 LIN transceiver yields a sub-$2 BOM node that meets automotive EMC and ESD requirements.
موصى به
HVAC Blower / Fan Controller
The S9KEAZN8ACFK's FTM PWM and 12-bit ADC enable closed-loop HVAC blower speed control with tachometer input capture. AEC-Q100 Grade 1 qualification permits under-dash deployment near thermal stress zones. The 48 MHz core executes PI loops within 1 ms while leaving headroom for LIN diagnostics and NTC temperature compensation.
موصى به
LED Driver / Interior Lighting
The S9KEAZN8ACFK drives RGB interior lighting via FTM PWM channels, with 12-bit resolution for color-mixing dimming. AEC-Q100 Grade 1 ensures photometric stability over automotive temperature swings. A typical 4-channel RGBW node consumes roughly 3 KB of flash, leaving room for bootloader and CAN/LIN diagnostics.
موصى به
Industrial Sensor / 4-20 mA Transmitter
The S9KEAZN8ACFK powers 4-20 mA smart sensor transmitters with on-chip 12-bit ADC and SCI/UART for HART modem connection. Its 2.7-5.5 V supply supports loop-powered designs and the -40C to +125C range suits process and outdoor deployments. The Cortex-M0+ core handles linearization and HART burst mode in 6 KB flash.
موصى به
White Goods Appliance Board
The S9KEAZN8ACFK serves washing-machine and refrigerator control boards where 8 KB flash suffices for cycle logic and user-interface tasks. The FTM PWM controls motor and valve actuators; the 12-bit ADC reads temperature and water-level sensors. AEC-Q100 robustness gives appliance designers extended field-life margins.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ S9KEAZN8ACFK — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | S9KEAZN8ACFKR | MKE02Z64VLD2 |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 24-QFN (4x4 mm) | 24-QFN (4x4) - same | LQFP-64 - different |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ |
| CPU Frequency | 48 MHz | 48 MHz | 20 MHz |
| Program Flash | 8 KB | 8 KB | 64 KB |
| SRAM | 1 KB | 1 KB | 4 KB |
| Supply Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| AEC-Q100 Grade | Grade 1 | Grade 1 | Grade 0/1 |
أبرز الفروقات
- Automotive Grade 1 qualification in compact QFN-24 (مقابلMKE02Z64VLD2)
- Higher CPU frequency for protocol stacks (مقابلMKE02Z64VLD2)
- Drop-in reel-packaged twin for high-volume assembly (مقابلS9KEAZN8ACFKR)
ملاحظات التصميم
Place a 100 nF X7R ceramic decoupling capacitor within 2 mm of each VDD/VSS pair and a single 4.7 uF bulk capacitor on the main supply rail. The KEA internal voltage regulator requires minimum 1 uF load capacitance on the core rail - refer to datasheet section on regulator stability. Estimated: at 48 MHz with all peripherals active, IDD roughly 15 mA; in stop mode drops to ~5 uA.
The 24-QFN-EP package relies on the exposed pad for thermal and electrical ground. The PCB land pattern must allocate at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) under the EP and connect to an internal ground plane for heat spreading. Without proper EP soldering, junction temperature can exceed 125C at moderate loads.
Do not leave the RESET_b pin floating - tie it to VDD through a 10 kohm pull-up and provide a manual reset pushbutton or supervisor. The ADC channels shared with GPIO must be configured in the pin-mux before analog sampling, and the bandgap reference must be enabled before ADC calibration. Watchdog refresh must occur within the configured window to prevent unintended reset.
معلومات الامتثال
AEC-Q100 Grade 1 qualified per KEA product family. RoHS and REACH compliant per NXP product page.