SGTL5000XNAA3R2 - Stereo Audio Codec, 32-QFN-EP | NXP
MPN: SGTL5000XNAA3R2 ✓ نشطSGTL5000XNAA3R2 نظرة عامة
An audio codec (coder-decoder) is a mixed-signal IC that converts digital audio streams (typically I2S, left-justified, or right-justified) into analog signals for headphones or line outputs while simultaneously digitizing analog microphone or line inputs. The SGTL5000 belongs to the audio codec family, which sits in the broader mixed-signal semiconductor hierarchy of audio ICs, interface ICs, and finally the integrated circuit category. It enables compact portable designs by collapsing the DAC, ADC, headphone driver, and PLL onto one chip.
Key features of the SGTL5000XNAA3R2 include a capless headphone output topology that eliminates the need for large DC-blocking capacitors, programmable microphone bias with on-chip reference, and 1.62 V to 3.6 V digital supply operation with 0.9 V to 1.2 V analog core voltage (generated by an internal LDO). Total harmonic distortion plus noise is rated at -80 dB (DAC-to-headphone), and quiescent current consumption is engineered for handsets, tablets, and other battery-powered applications. The exposed thermal pad on the 32-QFN-EP package ensures low thermal resistance for continuous headphone drive.
The architecture uses a sigma-delta modulator for both ADC and DAC paths with on-chip digital decimation/interpolation. The integrated PLL accepts a reference clock and synthesizes all internal audio clocks, allowing system designers to feed a single system clock and avoid adding a dedicated audio crystal. Headphone amplification is ground-centered and capless, supporting 16 ohm and 32 ohm loads.
Typical applications include portable media players, tablets and e-readers, wearable fitness devices, USB audio dongles, and low-power voice-capture accessories. The codec is also found in industrial human-machine interfaces and consumer single-board computers where compact audio is required.
When designing with the SGTL5000XNAA3R2, place the analog decoupling capacitors as close to the AVDD and HPVDD pins as possible, and connect the exposed pad to a clean analog ground. Route I2S and I2C traces away from switching nodes and consider a ferrite bead between DVDD and the system digital supply to prevent digital switching noise from coupling into the analog path.
This page synthesizes distributor pricing, NXP and Freescale cross-references, drop-in alternatives, and practical design notes not aggregated in any single datasheet or distributor page, giving engineers a one-stop decision resource.
بدائل مباشرة لـ SGTL5000XNAA3R2 — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع SGTL5000XNAA3R2 (نفس عامل الشكل والبصمة) — يختلف في Control Interface, Integrated PLL, Package, DAC-to-Headphone Power Consumption, Headphone Output.
SGTL5000XNBA3R2
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SGTL5000XNAA3
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SGTL5000XNBA3
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SGTL5000XNAA3R2G
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SGTL5000XNBA3R2G
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
SGTL5000XNAA3R2 المواصفات
| الوظيفة | Stereo Audio Codec with Headphone Amplifier |
| Number of ADCs | 1 |
| Number of DACs | 1 |
| Number of Input Channels | 2 |
| Number of Output Channels | 2 |
| ADC/DAC Resolution | 24 bit |
| ADC SNR | 100 dB |
| DAC-to-Headphone SNR | 98 dB |
| DAC-to-Headphone THD+N | -80 dB |
| DAC-to-Headphone Power Consumption | 4 mW |
| معدل أخذ العينات | 8 kHz to 96 kHz |
| Digital Interface | I2S, Left/Right Justified |
| Control Interface | I2C, SPI, Serial |
| Supply Voltage (Digital) | 1.62 V to 3.6 V |
| Supply Voltage (Analog Core) | 0.9 V to 1.2 V (internal LDO) |
| Headphone Output | Capless, ground-centered |
| Integrated PLL | Yes |
| العلبة | 32-QFN-EP (5x5 mm) |
| درجة حرارة التشغيل | -40C to +85C |
| نوع التركيب | Surface Mount |
| حالة RoHS | Compliant |
تكوين أطراف SGTL5000XNAA3R2
| دبوس 1 | HP_L — Left channel headphone output |
| دبوس 2 | HP_R — Right channel headphone output |
| دبوس 3 | HPVDD — Headphone amplifier supply |
| دبوس 4 | HPGND — Headphone amplifier ground |
| دبوس 5 | AVDD — Analog supply |
| دبوس 6 | AVSS — Analog ground |
| دبوس 7 | VAG — Internal analog virtual ground |
| دبوس 8 | LINEOUT_L — Left line-level output |
| دبوس 9 | LINEOUT_R — Right line-level output |
| دبوس 10 | LINEIN_L — Left line-level input |
| دبوس 11 | LINEIN_R — Right line-level input |
| دبوس 12 | MIC — Microphone input |
| دبوس 13 | MIC_BIAS — Microphone bias voltage output |
| دبوس 14 | DVDD — Digital supply |
| دبوس 15 | DGND — Digital ground |
| دبوس 16 | IOVDD — I/O supply (1.62 V to 3.6 V) |
| دبوس 17 | I2C_SCL — I2C clock / SPI SCLK |
| دبوس 18 | I2C_SDA — I2C data / SPI MOSI |
| دبوس 19 | SPI_AD — SPI MISO / I2C address select |
| دبوس 20 | SPI_CS — SPI chip select (active low) |
| دبوس 21 | I2S_MCLK — Master clock input |
| دبوس 22 | I2S_BCLK — I2S bit clock |
| دبوس 23 | I2S_LRCLK — I2S left-right clock (word select) |
| دبوس 24 | I2S_DAT_IN — I2S data input to ADC |
| دبوس 25 | I2S_DAT_OUT — I2S data output from DAC |
| دبوس 26 | RESET — Hardware reset (active low) |
| دبوس 27 | GPIO — General-purpose input/output |
| دبوس 28 | XOUT — Crystal oscillator output (PLL reference) |
| دبوس 29 | XIN — Crystal oscillator input |
| دبوس 30 | VDD_PLL — PLL supply |
| دبوس 31 | TEST — Test mode (tie low in normal operation) |
| دبوس 32 | NC — Not connected (per datasheet) |
التطبيقات النموذجية
SGTL5000XNAA3R2 مناسب لـ 6 التطبيقs: Portable Media Player Audio Subsystem, Tablet and E-Reader Audio Playback, Wearable Fitness Band Audio Feedback, USB Audio Dongle and Headset Adapter, Industrial Human-Machine Interface (HMI) Audio, Single-Board Computer Audio Add-On.
Portable Media Player Audio Subsystem
The SGTL5000XNAA3R2's 4 mW DAC-to-headphone power and 98 dB SNR make it ideal for battery-powered portable media players where every milliwatt matters. Per the NXP SGTL5000 datasheet, the codec accepts 8-96 kHz I2S streams from a host application processor and directly drives 16-32 ohm headphones without external DC-blocking capacitors, which shrinks the BOM by eliminating two 100 uF electrolytics. The capless ground-centered headphone output also avoids the click/pop on jack insertion that plagues AC-coupled designs, an important UX detail for handheld players. In a typical PMP architecture, the SGTL5000 sits between the host CPU/MPU and the headphone jack, with I2C for control and a master clock from the integrated PLL, eliminating the need for a dedicated audio crystal and further reducing system cost and PCB area.
موصى به
Tablet and E-Reader Audio Playback
Tablets and e-readers require stereo line-out to external amplifiers plus headphone drive for personal listening, both of which the SGTL5000XNAA3R2 supports natively. According to the SGTL5000 datasheet, the IC provides a dedicated line-out path in parallel with the headphone driver, so designers can route the same DAC output to either jack without an analog mux. The 100 dB ADC SNR also enables high-quality microphone capture for voice notes and conferencing on the same device. The exposed thermal pad on the 32-QFN-EP 5x5 mm package keeps headphone impedance loads (down to 16 ohms) thermally safe even at 0 dBFS continuous sine output. The 1.62-3.6 V digital supply is directly compatible with 1.8 V or 3.3 V SoC I/O rails used in tablet designs.
موصى به
Wearable Fitness Band Audio Feedback
For wearable fitness bands and smartwatches that deliver voice prompts, notification beeps, or Bluetooth-bridged audio, the SGTL5000XNAA3R2's 4 mW playback path and small 5x5 mm QFN are decisive advantages. The NXP datasheet specifies 0.9-1.2 V analog core operation (internally regulated by an on-chip LDO from the digital rail), eliminating the need for a separate analog regulator in tight wearable PCB layouts. The microphone bias generator and 100 dB ADC SNR also support always-on voice wake or push-to-talk microphone capture on the same device. Power-down current is in the microamp range, critical for battery life on devices that spend most of their time in standby with only occasional audio events.
موصى به
USB Audio Dongle and Headset Adapter
Compact USB audio dongles that add headphone and microphone jacks to a single-board computer benefit from the SGTL5000XNAA3R2's integrated PLL, capless headphone driver, and small footprint. The integrated PLL accepts a 12-50 MHz reference clock from the USB bridge chip and generates all internal audio sample rates, removing the dedicated 24.576 MHz audio crystal typical of competing dongle designs. Per the NXP datasheet, the capless headphone output eliminates two large 220 uF capacitors that would otherwise dominate a dongle's PCB, making a true thumb-drive form factor feasible. The I2C control path can be bit-banged over USB HID or wired through an I2C-capable USB bridge.
موصى به
Industrial Human-Machine Interface (HMI) Audio
Industrial HMIs and panel PCs use the SGTL5000XNAA3R2 for alarm tones, voice prompts, and operator-headset intercom where reliable performance over -40C to +85C is required. The NXP datasheet specifies the operating temperature range as -40C to +85C, suitable for control cabinets and factory floors. The exposed thermal pad and small QFN-32 footprint also suit the dense, vibration-resistant PCB layouts typical of industrial enclosures. Stereo line-in supports connection to plant-wide paging systems, and the codec's proven Freescale/NXP silicon pedigree is a long-term supply assurance advantage for industrial designs with 10+ year field life.
موصى به
Single-Board Computer Audio Add-On
Hobbyist and prosumer single-board computers (Raspberry Pi class, BeagleBone, custom Linux boards) use the SGTL5000XNAA3R2 on audio daughter cards to provide line-out, headphone, and microphone functions without redesigning the main SoC. The codec's I2S slave mode allows it to be clocked directly from the SoC's PCM/I2S peripheral, and the I2C control path uses standard Linux kernel drivers (mainline since 2012). The exposed pad and QFN-32 footprint are well matched to hobbyist-level hand-soldering or low-cost SMT assembly. The 4 mW playback path keeps the add-on board's idle power budget well within USB-powered device limits, enabling bus-powered audio hats.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ SGTL5000XNAA3R2 — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | SGTL5000XNBA3R2 | SGTL5000XNAA3 | SGTL5000XNBA3 | SGTL5000XNAA3R2G | SGTL5000XNBA3R2G |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-QFN-EP (5x5 mm) | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same | 32-QFN-EP (5x5 mm) - same |
| Silicon Revision | Rev A | Rev B | Rev A | Rev B | Rev A | Rev B |
| Packaging Format | Tape & Reel (R2) | Tape & Reel (R2) | Tray | Tray | Tape & Reel (R2) green | Tape & Reel (R2) green |
| DAC SNR | 98 dB | 98 dB | 98 dB | 98 dB | 98 dB | 98 dB |
| ADC SNR | 100 dB | 100 dB | 100 dB | 100 dB | 100 dB | 100 dB |
| THD+N (DAC-to-HP) | -80 dB | -80 dB | -80 dB | -80 dB | -80 dB | -80 dB |
| DAC-to-HP Power | 4 mW | 4 mW | 4 mW | 4 mW | 4 mW | 4 mW |
| Sample Rate Range | 8 kHz to 96 kHz | 8 kHz to 96 kHz | 8 kHz to 96 kHz | 8 kHz to 96 kHz | 8 kHz to 96 kHz | 8 kHz to 96 kHz |
| Lifecycle / Status | Active (rev A, approaching EOL) | Active (rev B, preferred for new designs) | Active (rev A, tray-pack) | Active (rev B, tray-pack) | Active (rev A, green packaging) | Active (rev B, green packaging) |
أبرز الفروقات
- Integrated capless headphone driver eliminates two 100 uF DC-blocking capacitors (مقابلSGTL5000XNBA3R2 (silicon rev B))
- Silicon revision B fixes errata documented in rev A datasheet (مقابلSGTL5000XNAA3R2 (silicon rev A, this part))
- Ultra-low 4 mW DAC-to-headphone playback power extends battery life in portable designs (مقابلSGTL5000XNBA3R2 (silicon rev B))
ملاحظات التصميم
Per the NXP SGTL5000 datasheet, decouple AVDD, HPVDD, DVDD, and IOVDD with a 1 uF ceramic capacitor placed within 3 mm of each respective pin. Use a ferrite bead between the system 3.3 V rail and the codec's DVDD/IOVDD pins to block digital switching noise from coupling into the analog domain. Estimated: at IOVDDHPVDD, DVDDIOVDD, and current draw, the IC consumes roughly 4 mW in DAC-to-headphone playback; at 48 kHz / 24-bit input the total quiescent draw on IOVDD is typically 15-20 mA during active playback.
The exposed thermal pad (EP) on the 32-QFN-EP package must be soldered to a clean, unbroken analog ground plane for both thermal dissipation and low-impedance analog return. Per the datasheet, keep I2S and I2C traces short and routed away from the headphone output traces (HP_L, HP_R) and the crystal pins (XIN, XOUT). Place the 24.576 MHz audio crystal (or chosen PLL reference) within 5 mm of XIN/XOUT and guard those traces with a ground pour to prevent PLL jitter from coupling into the analog path.
Do not float the MIC_BIAS pin when the microphone input is unused - per the NXP community thread, leaving MIC_BIAS floating can inject noise into the line-in path through internal substrate coupling; either disable the mic bias in software via the CHIP_MIC_CTRL register or tie it to analog ground through a 100 kohm resistor. Also, ensure the RESET pin is held low for at least 1 ms after IOVDD reaches 1.62 V before releasing, otherwise the I2C control logic may latch in an undefined state.
The capless headphone outputs (HP_L, HP_R) are ground-centered and do not require DC-blocking capacitors, but they will source/sink up to ~30 mA into 16 ohm loads - route these traces as a differential pair with continuous ground return underneath to prevent coupling into adjacent analog traces. Per the datasheet, headphone output noise is approximately 5 uVrms A-weighted when driving 32 ohm loads; at 16 ohm loads this rises to ~7 uVrms, which is still adequate for portable audio but should be characterized on the final PCB.
معلومات الامتثال
RoHS compliant per NXP product page. Not AEC-Q100 qualified - the SGTL5000 family targets consumer/portable audio, not automotive. Lead-free and halogen-free per NXP material declaration.
