XC3S200-5FTG256C - Spartan-3 FPGA 200K Gates 256-LBGA | AMD
MPN: XC3S200-5FTG256C ✗ انتهى عمره الإنتاجيXC3S200-5FTG256C نظرة عامة
A Field Programmable Gate Array is a reconfigurable digital integrated circuit containing configurable logic blocks, programmable interconnect, and input/output blocks. FPGA terminology follows a hierarchy from programmable logic device to field-programmable gate array, providing designers with hardware parallelism that can implement control logic, data acquisition, signal processing, and communication functions without relying on a fixed-function ASIC.
The XC3S200-5FTG256C combines 200,000 system gates with 4,320 logic cells and supports a 725 MHz maximum operating frequency according to its device listing. The -5 speed designation identifies the device speed grade, while the FTG256C package code identifies the lead-free 256-ball surface-mount package and commercial temperature grade. The device operates from a 1.2 V core supply and is specified for 0 to 85 C operation.
The Spartan-3 architecture provides programmable logic, block RAM, dedicated multipliers, and general-purpose I/O in a single device. These resources support parallel datapath designs such as protocol bridges, industrial controllers, video timing systems, and embedded network equipment. Because the device is a mature 90 nm FPGA, design flows should follow the Spartan-3 toolchain and the configuration requirements documented for the platform.
Typical applications include industrial automation, motor and motion control, telecommunications line-card support, data acquisition, test equipment, and embedded control platforms. The 256-LBGA package offers a high pin count for parallel interfaces, but it requires careful PCB layout with short escape routes, solid power distribution, and decoupling close to every supply pin.
For new designs, verify the available configuration PROM and programming cable before committing the layout, because configuration memory availability can constrain production schedules. A complete migration should also be checked for I/O standard, timing, and configuration-pin compatibility rather than package similarity alone.
This page consolidates device specifications, package details, verified source links, practical application guidance, and drop-in alternatives that are not collected in a single manufacturer datasheet excerpt.
بدائل مباشرة لـ XC3S200-5FTG256C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC3S200-5FTG256C (نفس عامل الشكل والبصمة) — يختلف في Device Type, Operating Temperature, System Gates, Logic Cells, Lead-Free Status.
XC3S200-5FT256C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3S200A-5FTG256C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S200AN-5FTG256C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S200-5FTG256I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S200-4FTG256C
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3S200-5FTG256C الحدود القصوى والخصائص الكهربائية
| Device Type | FPGA |
| FPGA Family | Spartan-3 |
| System Gates | 200000 gates |
| Logic Cells / Logic Blocks | 4320 logic cells |
| Maximum Frequency | 725 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm |
| العلبة | 256-LBGA |
| Terminals | 256 balls |
| Package Type | Lead Free |
| درجة حرارة التشغيل | 0 to 85 C |
| نوع التركيب | Surface Mount |
| Device Category | Programmable Logic Devices, Field Programmable Gate Arrays |
| Speed Grade | -5 |
| Temperature Grade | Commercial |
دليل تكوين أطراف XC3S200-5FTG256C lead free
تكوين الأطراف لـ XC3S200-5FTG256C (حزمة lead free). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC3S200-5FTG256C.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC3S200-5FTG256C مناسب لـ 6 التطبيقs: Industrial Automation and PLC Control, Data Acquisition and Signal Conditioning, Motor Control and Signal Processing, Telecommunications Protocol Conversion, Test and Measurement Equipment, Embedded Control and Instrumentation.
Industrial Automation and PLC Control
The XC3S200-5FTG256C fits industrial sequencing, machine interlock, and PLC-style control because its 4,320 logic cells can support parallel state machines and protocol handling. The 256-ball package provides numerous I/O connections for sensors and actuators, while the listed 725 MHz maximum frequency gives designers substantial timing margin for synchronous control logic. The commercial 0 to 85 C rating is suitable for ordinary indoor industrial equipment, although extended-temperature or long-lifecycle programs should use a currently supported platform. Configuration PROM availability and the Spartan-3 design toolchain should be verified before new production commitment.
موصى به
Data Acquisition and Signal Conditioning
The Spartan-3 XC3S200-5FTG256C can implement parallel sampling control, digital filtering, trigger sequencing, and interface conversion when external analog-to-digital converters feed the FPGA. Its 4,320 logic cells are meaningful for multi-channel acquisition, and the 1.2 V core supply simplifies modern digital rail planning. Use the package's dense ball array to route acquisition buses, clock inputs, and control signals without excessive routing congestion. Because the device is from a mature process family, verify supported I/O standards, maximum clock rates, and configuration behavior against the target acquisition board before release.
موصى به
Motor Control and Signal Processing
The XC3S200-5FTG256C supports parallel motor-control, filtering, and fixed-point signal-processing implementations where multiple arithmetic operations must execute concurrently. Its listed 725 MHz device speed and dedicated FPGA logic resources make it suitable for control-law execution, pulse-width modulation generation, and feedback decoding. The 256-LBGA package provides the pin density required for position sensors, gate-driver interfaces, and high-speed control signals. Designers should evaluate internal multipliers, block RAM, and clocking resources against the algorithm because those counts are not present in the verified product listing and must be taken from the family documentation.
موصى به
Telecommunications Protocol Conversion
The XC3S200-5FTG256C is suited to low-rate protocol bridges, framing logic, and parallel-to-serial interface conversion because programmable logic can implement multiple channels concurrently. Its 4,320 logic cells provide capacity for framing state machines, buffering, and supervisory logic, while the high pin count simplifies parallel bus access on the board. The commercial-grade device can support indoor telecom and network-interface equipment, but operator requirements for long supply continuity and product change notices are important constraints for this legacy family. Confirm configuration memory support, I/O voltage domains, and system timing during hardware review.
موصى به
Test and Measurement Equipment
The XC3S200-5FTG256C can implement sequencers, pattern generators, capture logic, and timing-control functions in compact test equipment. Its parallel architecture supports deterministic multi-channel sequencing, and the 256-ball package gives designers access to parallel data buses, triggers, and clock inputs. The listed 725 MHz maximum frequency supports demanding timing-generation logic, although achievable performance depends on the selected clocking scheme and routing. Use the manufacturer package guidance to place decoupling capacitors and preserve clean clock distribution. For new instrument platforms, assess whether a supported FPGA family is more appropriate for lifecycle management and tool availability.
موصى به
Embedded Control and Instrumentation
The XC3S200-5FTG256C works as a companion programmable-logic device for embedded controllers, handling deterministic sampling, timing, peripheral interfacing, and fault monitoring in parallel with a microcontroller. Its 4,320 logic cells allow designers to offload time-critical tasks without stretching a microcontroller software schedule, and the 256-LBGA package supports a broad interface set. The 1.2 V core supply is compatible with modern board-level power planning, but external I/O supplies remain design-specific. Validate configuration startup timing, unused-ball treatment, and the exact device pinout from the Spartan-3 package documentation before layout release.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC3S200-5FTG256C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC3S200-5FT256C | XC3S200A-5FTG256C | XC3S200AN-5FTG256C |
|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD |
| Package | 256-LBGA | 256-LBGA | 256-LBGA | 256-LBGA |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3A | Spartan-3AN |
| Speed Grade | -5 | -5 | -5 | -5 |
أبرز الفروقات
- Direct same-family package match with a 200000-gate Spartan-3 device (مقابلXC3S200-5FT256C)
- Identical listed package and speed grade with an industrial temperature option (مقابلXC3S200-5FTG256I)
- Spartan-3 resource baseline with a listed 725 MHz maximum frequency (مقابلXC3S200-4FTG256C)
ملاحظات التصميم
Place the 1.2 V core bypass capacitors directly across the corresponding supply and ground balls, with short, low-inductance paths and the smallest usable capacitance closest to the device. The 256-LBGA package has a dense escape requirement, so reserve-space routing through fine-pitch vias and follow the manufacturer package guidelines for layer changes. Keep high-current return paths continuous rather than relying on fragmented plane transitions.
Budget the core rail for static FPGA consumption plus dynamic current driven by switching activity, I/O standards, and configuration behavior. The device is identified as a 1.2 V core part, but input and output voltage domains are design-specific and must be taken from the device pin tables. Sequence rails so the device is not driven by an I/O domain before its core supply is valid. Estimated rail headroom should be recalculated from the actual design utilization and measured activity factor.
Do not treat a shared LBGA package as proof of an interchangeable design. Before substituting XC3S200-5FT256C, XC3S200A-5FTG256C, or XC3S200AN-5FTG256C, compare configuration pins, unused balls, I/O standards, clock-capable pins, and timing constraints. The Spartan-3 family uses mature tools and configuration memories, so confirm that the required PROM or alternative configuration source is available before committing a production order.
Route clock inputs as short, continuous traces with a controlled return path and avoid stubs or unnecessary layer transitions. For high-speed I/O, follow the selected I/O-standard guidance and terminate external buses according to the system architecture. The listed 725 MHz maximum device frequency is not a guarantee for every I/O path; achievable timing depends on placement, routing, clocking, and the selected pin functions.
معلومات الامتثال
The device listing identifies the FTG256C package as lead free. No explicit RoHS, REACH, AEC-Q100, halogen-free, or conflict-minerals statement was identified in the verified product data.
