XC3S400-5FG456C - 400K Gate Spartan-3 FPGA | AMD
MPN: XC3S400-5FG456C ✗ انتهى عمره الإنتاجيXC3S400-5FG456C نظرة عامة
A field-programmable gate array, or FPGA, is a semiconductor whose digital functions are defined by a user-loaded bitstream rather than a fixed mask used for an application-specific integrated circuit. Within the product hierarchy, the XC3S400-5FG456C is an FPGA, a programmable-logic semiconductor, and a member of the AMD Spartan-3 family. This positioning makes it useful for prototypes, embedded control systems, industrial equipment, communications interfaces, and other designs that benefit from hardware flexibility, short development cycles, and field reconfiguration.
Principal features include 400,000 system gates, 8,064 logic cells, 264 I/O sites, a 456-ball FBGA package, and a 725 MHz performance rating. The 1.2 V operating supply corresponds to the device's low-voltage internal core. Spartan-3 devices support configurable logic, block RAM, dedicated multipliers, digital clock management, and programmable I/O resources. Designers use these resources for parallel datapaths, control state machines, data acquisition, packet processing, and interface bridging.
The XC3S400-5FG456C combines a 456-ball package with approximately 264 user I/O sites. This high pin count supports memory-intensive and interface-heavy systems, but it also requires careful escape routing, multilayer PCB construction, and controlled-impedance signal integrity. The -5 speed suffix identifies the device's performance grade, while the commercial-temperature designation supports general industrial and commercial implementations when the complete system thermal environment remains within the specified limits.
Typical applications include industrial automation controllers, data-acquisition and signal-processing systems, communications infrastructure, embedded video or imaging control, test equipment, and custom accelerator logic. In these systems, the FPGA can execute parallel algorithms, manage multiple external buses, and adapt its behavior through configuration updates without changing the printed circuit board.
A key design consideration is that software migration is not automatically compatible across speed grades, package markings, or Spartan-3 device families. A replacement should be checked against the package ball map, voltage requirements, I/O standards, configuration interface, and timing constraints. The manufacturer DS099 Spartan-3 family datasheet should be used to validate the selected device, pinout, electrical limits, and configuration requirements.
This product page combines the manufacturer family documentation with package, resource, interface, and replacement information intended to accelerate engineering evaluation. It also distinguishes speed-grade alternatives from industrial or package-marked variants, helping designers identify a candidate that matches the original PCB while recognizing any temperature, timing, or qualification differences that must still be reviewed before production release.
بدائل مباشرة لـ XC3S400-5FG456C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
XC3S400-4FG456C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3S400-5FGG456C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S400-4FGG456I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S400-5FG456I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S400A-4FGG456C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S400-5FG456C الحدود القصوى والخصائص الكهربائية
| Device Type | Spartan-3 Field Programmable Gate Array (FPGA) |
| System Gates | 400,000 gates |
| Logic Cells | 8,064 logic cells |
| Maximum Performance Rating | 725 MHz |
| I/O Count | 264 I/O |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm |
| Package Type | 456-ball FBGA |
| Total Package Balls | 456 balls |
| Temperature Grade | 0 °C to 85 °C (32 °F to 185 °F) |
| Lead-Free Status | Lead Free |
| Device Family | Spartan-3 |
| Programming Technology | SRAM-based field-programmable logic |
| Logic Resource Count | 294,912 logic-cell equivalents |
دليل تكوين أطراف XC3S400-5FG456C 456 balls
تكوين الأطراف لـ XC3S400-5FG456C (حزمة 456 balls). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC3S400-5FG456C.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC3S400-5FG456C مناسب لـ 6 التطبيقs: Industrial Automation Controller, Data-Acquisition and Signal Processing, Communications Interface Controller, Embedded Test and Measurement, Custom Hardware Accelerator, Programmable Imaging Controller.
Industrial Automation Controller
The XC3S400-5FG456C is appropriate for industrial automation controllers that coordinate sensors, motion-control stages, actuators, and operator interfaces. Its 8,064 logic cells and 264 I/O sites provide substantial parallel control capacity, while the 725 MHz performance rating supports timing-sensitive sequencing. The 1.2 V core suits modern digital logic, but the 456-ball FBGA demands controlled assembly. A practical implementation assigns deterministic logic to pipelines, isolates external interfaces, and places the FPGA near high-fanout control and memory connections.
موصى به
Data-Acquisition and Signal Processing
The XC3S400-5FG456C can implement parallel acquisition control, digital filtering, channel sequencing, and data formatting in a programmable instrument. Its 8,064 logic cells and dedicated Spartan-3 resources allow multiple data paths to be processed concurrently, while 264 I/O sites provide access to converters, memory, and control buses. The device's 725 MHz rating improves timing headroom for pipelined processing. Designers should use separate clock regions for acquisition and interface logic, constrain interfaces at their useful limits, and validate conversion latency end to end.
موصى به
Communications Interface Controller
The XC3S400-5FG456C fits communications equipment requiring parallel protocol conversion, buffering, framing, and FPGA-based data-path control. Its 264 I/O sites support connections among high-speed transceivers, memory, and backplane logic, while the programmable architecture permits protocol updates without a PCB change. The 725 MHz performance rating supports aggressive pipelining, but implementation quality depends on clocking, I/O standards, and board-level signal integrity. Use dedicated clock-capable routes and series termination where required by the selected interface specification.
موصى به
Embedded Test and Measurement
The XC3S400-5FG456C is suitable for programmable test systems that coordinate stimulus generation, response capture, timing sequences, and communication with host equipment. Parallel programmable logic replaces fixed sequencers and permits the same board to support multiple test patterns. Its 8,064 logic cells and 264 I/O sites are well matched to instrument routing, and the -5 performance grade provides additional timing margin. Engineers should reserve pins for configuration and debugging, apply clocking discipline across domains, and verify thermal performance with representative pattern activity.
موصى به
Custom Hardware Accelerator
The XC3S400-5FG456C can implement a custom accelerator for filtering, packet handling, checksum generation, or other repetitive parallel operations. Spartan-3 logic blocks and multipliers allow multiple pipeline stages to execute concurrently, while the 725 MHz rating supports short clock periods when timing constraints are properly planned. The design should map arithmetic blocks to the resource type they optimize, register pipeline boundaries, and avoid inferring architecture-specific resources without confirming the final device utilization. Post-route timing analysis is essential before production release.
موصى به
Programmable Imaging Controller
The XC3S400-5FG456C can serve as the timing and control controller for camera, imaging, or machine-vision subsystems. Parallel programmable logic can coordinate sensor exposure, frame markers, data capture, crop or format operations, and communication with a processor. The 264 I/O sites accommodate multiple data and control paths, while the 725 MHz rating supports pipelined data movement. Designers should isolate high-speed sensor interfaces from slower control traffic, constrain output timing, and verify connector, memory, and thermal constraints in the complete assembly.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC3S400-5FG456C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC3S400-4FG456C | XC3S400-5FGG456C | XC3S400-4FGG456I | XC3S400-5FG456I | XC3S400A-4FGG456C |
|---|---|---|---|---|---|---|
| Package | 456-ball FBGA | 456-ball FBGA - same package family | 456-ball FBGA - same package family | 456-ball FBGA - same package family | 456-ball FBGA - same package family | 456-ball FBGA - same package family |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3A |
| Speed Grade | -5 | -4, numeric grade 20% lower | -5, same numeric grade | -4, numeric grade 20% lower | -5, same numeric grade | -4, numeric grade 20% lower |
أبرز الفروقات
- Higher factory speed grade than the -4 alternatives (مقابلXC3S400-4FG456C)
- Commercial-temperature ordering code (مقابلXC3S400-4FGG456I)
- Direct same-family ordering option with the -5 speed designation (مقابلXC3S400-5FGG456C)
- Broader interface capacity than lower-density programmable devices (مقابلXC3S400-4FG456C)
ملاحظات التصميم
Treat the 456-ball FBGA as a multilayer-routing problem. Use the manufacturer package drawing to define pad, solder-mask, and paste-land geometry, then route escape signals directly to adjacent layers before vias become necessary. Separate high-speed memory and serial interfaces from clocks and lower-speed control signals. Preserve uninterrupted return paths beneath high-speed nets, and validate layer transitions with the PCB fabrication and assembly capabilities used for the finished assembly.
Decouple the 1.2 V core with the capacitor network and power-distribution arrangement specified in the DS099 device guidance and board-design recommendations. Place the smallest bypass capacitors at the associated supply and ground balls to minimize loop area, then add bulk capacitance near the regulator or supply entry point. Check both steady-state and transient current across all clock domains, and avoid routing auxiliary supply connections through long shared paths that could disturb configuration or I/O operation.
Create constraints for every external interface rather than relying only on internal FPGA timing. Apply I/O standards according to the selected bank configuration, maintain the required input and output timing margins, and account for board skew and connector or device jitter where applicable. For source-synchronous interfaces, route clock and data as a matched group on adjacent layers. Run post-route and post-layout simulation with realistic board assumptions before releasing the bitstream.
Estimate worst-case FPGA power from the final design rather than relying on a generic device value. Activity factor, configured resources, I/O loading, and core voltage can materially change dissipation. Use those operating inputs to estimate junction temperature, compare the result with the package and board thermal limits, and expand copper or improve airflow if required. Repeat the calculation after placement because nearby high-power components and the PCB stack-up affect heat spreading.
Do not treat every XC3S400 ordering code as an automatic substitute. The -4 and -5 speed grades affect timing, while C, I, G, and related suffixes can represent ordering, temperature, or package distinctions. For the XC3S400-4FG456C, retime the complete design and verify that the lower speed grade still closes timing. For Spartan-3A candidates, check device resources, electrical limits, and configuration compatibility separately, even when the package name appears identical.
معلومات الامتثال
The product listing identifies the device as lead free. RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals status require manufacturer lot or product documentation.
