XC3S4000-4FG900C - 4M Gate Spartan-3 FPGA | AMD
MPN: XC3S4000-4FG900C ✗ انتهى عمره الإنتاجيXC3S4000-4FG900C نظرة عامة
A field-programmable gate array, or FPGA, is a programmable digital integrated circuit whose logic, memory, and I/O resources can be configured after manufacture. Within the semiconductor hierarchy, an FPGA is a configurable logic device used for parallel processing, interface bridging, signal generation, data acquisition, and embedded control. The Spartan-3 family targets cost-sensitive designs requiring more logic density than small programmable logic devices while retaining a relatively simple implementation flow.
Key resources include 62,208 logic cells distributed across 6,912 CLBs or LABs, together with 1,769,472 RAM bits for buffers, lookup tables, or distributed data storage. The device provides 633 user I/O, supporting interfaces to external memory, transceivers, converters, processors, and network equipment. Its 1.2 V-class core operation reduces power relative to many older FPGA generations, while the -4 speed designation identifies its performance grade.
The 900-FBGA package concentrates a large amount of programmable logic and I/O into a compact surface-mount footprint. Fine-pitch ball-grid construction makes accurate PCB layout, via planning, assembly-profile inspection, and power distribution essential. Unlike a microcontroller, the FPGA executes hardware-defined parallel datapaths after configuration rather than relying primarily on sequential software execution.
Typical uses include industrial control, communications infrastructure, video and image processing, test equipment, storage controllers, networking, and embedded signal-processing systems. The large LUT and RAM inventory is particularly useful for parallel filters, protocol engines, bus bridges, and high-speed data paths where multiple operations must execute concurrently.
Before finalizing a board, verify the 900-ball land pattern against the manufacturer package drawing, provide clean core and I/O supplies, and confirm the selected Xilinx synthesis, implementation, and programming tools support the Spartan-3 device. Because this is a fine-pitch BGA package, assembly yield, solder-mask definition, X-ray inspection, and thermal design should be reviewed with the PCB fabricator.
This page combines the published device resources, package characteristics, operating limits, sourcing path, replacement options, and practical implementation considerations in one engineering-focused reference for FPGA design and procurement teams.
بدائل مباشرة لـ XC3S4000-4FG900C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC3S4000-4FG900C (نفس عامل الشكل والبصمة) — يختلف في Device Type, Mounting Type, Speed Grade, Temperature Grade, Package.
XC3S4000-4FG900I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3S4000-5FG900C
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3S4000-2FG900C
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S4000-1FG900C
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S5000-4FG900C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S4000-4FG900C الحدود القصوى والخصائص الكهربائية
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3 |
| System Gates | 4,000,000 gates |
| Logic Cells | 62,208 cells |
| Configurable Logic Blocks | 6,912 CLBs |
| Logic Array Blocks | 6,912 LABs |
| Total RAM Bits | 1,769,472 bits |
| User I/O | 633 I/O |
| Core Supply Voltage Range | 1.14 V to 1.26 V |
| Nominal Core Supply Voltage | 1.2 V |
| نطاق درجة حرارة التشغيل | 0 °C to 85 °C |
| Package Type | 900-FBGA |
| Package Ball Count | 900 balls |
| نوع التركيب | SMD |
| Speed Grade | -4 |
| Temperature Grade | Commercial |
| Lead-Free Status | Lead Free |
دليل تكوين أطراف XC3S4000-4FG900C 900 balls
تكوين الأطراف لـ XC3S4000-4FG900C (حزمة 900 balls). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC3S4000-4FG900C.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC3S4000-4FG900C مناسب لـ 6 التطبيقs: Industrial Control and Automation, Communications and Network Interfaces, Data Acquisition and Instrumentation, Video and Image Processing, Storage and Interface Controllers, Programmable Logic and Embedded Control.
Industrial Control and Automation
The XC3S4000-4FG900C fits high-density machine-control logic because its 62,208 logic cells and 6,912 CLBs can implement sequencing, motion coordination, safety interlocks, and multiple peripheral bridges in parallel. Its 633 user I/O provides substantial connectivity for encoders, sensors, actuators, and industrial communications. The commercial 0 °C to 85 °C range suits controlled indoor equipment. A practical design uses parallel state machines for real-time control while the FPGA handles protocol conversion and timing-critical I/O. The main constraint is fine-pitch 900-FBGA assembly, so the PCB fabricator should review pad definition, via-in-pad requirements, thermal design, and inspection coverage before production release.
موصى به
Communications and Network Interfaces
The XC3S4000-4FG900C is suitable for parallel packet processing, bus bridging, and protocol termination because its 62,208 logic cells provide substantial parallel datapath capacity and its 1,769,472 RAM bits support buffering. The 633 user I/O can accommodate multiple lanes and control interfaces, while the 1.14 V to 1.26 V core range supports low-voltage digital implementation. A practical architecture places header parsing, FIFO control, and CRC logic in the FPGA and uses a dedicated Ethernet controller for the physical network interface. Timing closure, clock-domain crossing, and I/O standards must be checked carefully because network interfaces often combine high-speed differential signaling with unrelated legacy interfaces.
موصى به
Data Acquisition and Instrumentation
The XC3S4000-4FG900C fits instrument and test-equipment designs requiring parallel sampling control, digital filtering, and flexible I/O. Its 6,912 CLBs and 1,769,472 RAM bits can implement acquisition pipelines, digital filters, correlation functions, and trigger logic in parallel, while 633 user I/O supports converters and instrumentation interfaces. A practical implementation can synchronize multiple converters into the FPGA and perform filtering before transferring results to a processor. The design should establish converter and FPGA clock domains carefully, define deterministic latency, and preserve timing margins for post-processing. The 0 °C to 85 °C commercial rating is appropriate for laboratory equipment maintained within that ambient range.
موصى به
Video and Image Processing
The XC3S4000-4FG900C can support parallel pixel pipelines, color processing, frame timing, and interface bridging because the 62,208 logic cells can execute multiple stages concurrently. Its 1,769,472 RAM bits provide distributed resources for line buffers and small frame-data stages, while 633 user I/O supports multiple parallel interfaces. In a practical implementation, the FPGA can receive decompressed or native video, perform thresholding, filtering, or color conversion, and forward results to a display or processor. Timing analysis should cover pixel clocks, frame boundaries, and asynchronous control signals. The 900-FBGA footprint demands careful escape routing and may require high-density PCB construction and assembly inspection.
موصى به
Storage and Interface Controllers
The XC3S4000-4FG900C is appropriate for storage controllers and high-speed interface bridges where parallel logic must run alongside sizable buffers. The FPGA can implement command sequencing, data masks, ECC control, arbitration, and bus translation, using its 1,769,472 RAM bits for FIFO and packet-buffer resources. A practical design separates deterministic controller logic from external memory and storage interfaces, then uses clock-domain-crossing structures to protect data integrity. Engineers should verify timing against the selected memory and transceiver specifications rather than relying on nominal FPGA performance. The 633 user I/O support is valuable for wide parallel buses, although every assigned interface must satisfy its voltage, slew, and timing requirements.
موصى به
Programmable Logic and Embedded Control
The XC3S4000-4FG900C can serve as a programmable logic platform that combines a soft processor, custom peripherals, and direct I/O control. Its 62,208 logic cells provide enough capacity for a processor-based subsystem plus deterministic hardware accelerators, while 1,769,472 RAM bits support instruction, data, and buffer memories. A practical architecture can place time-critical sensor acquisition, motor timing, or communication framing directly in hardware and delegate supervisory functions to a soft processor. Design effort should focus on memory bandwidth, interrupt latency, clock-domain boundaries, and deterministic I/O behavior. For final production, verify the complete design with the intended synthesis and implementation tools and confirm the configuration method matches the board’s startup requirements.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC3S4000-4FG900C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC3S4000-4FG900I | XC3S4000-5FG900C | XC3S4000-2FG900C | XC3S4000-1FG900C | XC3S5000-4FG900C |
|---|---|---|---|---|---|---|
| Package | 900-FBGA | 900-FBGA | 900-FBGA | 900-FBGA | 900-FBGA | 900-FBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 |
| System Gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates | 4,000,000 gates | 5,000,000 gates, 25% higher |
| Core Supply Voltage Range | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
| Speed Grade | -4 | -4 | -5 | -2 | -1 | -4 |
| Temperature Grade | Commercial, 0 °C to 85 °C | Industrial grade | Commercial, 0 °C to 85 °C | Commercial, 0 °C to 85 °C | Commercial, 0 °C to 85 °C | Commercial, 0 °C to 85 °C |
أبرز الفروقات
- Direct replacement choice with increased logic density (مقابلXC3S5000-4FG900C)
- Higher speed option in the same base package (مقابلXC3S4000-4FG900C)
- Industrial temperature alternative without changing the speed grade (مقابلXC3S4000-4FG900C)
ملاحظات التصميم
Treat the 900-FBGA land pattern as a high-density assembly constraint. Use the manufacturer FG900 package drawing to define the ball matrix, solder-mask apertures, paste stencil, via-in-pad rules, and assembly profile. Escape power, configuration, clock, and high-speed differential pairs before placing general-purpose I/O. Share the final stack-up and drill plan with the assembler because changes to buried or blind vias can affect escape routing and production yield.
Separate the 1.2 V-class core rail from the I/O supplies and follow the manufacturer’s recommended power-distribution topology. Place the smallest decoupling capacitors directly at the relevant supply and ground balls, then provide bulk capacitance near the device. Estimate each rail’s worst-case current from the final utilization report, including configuration and transient activity, and add design margin before selecting regulators and copper dimensions.
Assign clocks and configuration signals before general I/O and preserve continuous return paths beneath high-speed routes. Keep a clean boundary between the Spartan-3 core supply and noisy I/O supply regions, and validate every external interface against its voltage, slew, and timing requirements. The XC3S4000-4FG900C offers 633 user I/O, but availability in the selected bank may depend on package, supply, and configuration constraints documented for the device.
Do not assume that any same-package Spartan-3 device is automatically interchangeable. Speed-grade substitutions can change timing closure, while a larger-density device can alter utilization and power behavior. Compare the complete pin tables, configuration interface, I/O standards, and timing reports, then perform a clean synthesis, implementation, and post-route simulation before approving a substitution. The 900-ball package also requires inspection planning that accounts for hidden solder-joint defects.
معلومات الامتثال
The product listing identifies the XC3S4000-4FG900C package as lead free. No explicit RoHS, REACH, halogen-free, conflict-minerals, or AEC-Q100 statement was identified. AEC-Q100 is not applicable to this commercial-grade FPGA designation.
