XC3S50-5VQG100C - 50K Gate Spartan-3 FPGA | AMD
MPN: XC3S50-5VQG100C ✗ انتهى عمره الإنتاجيXC3S50-5VQG100C نظرة عامة
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic and I/O can be configured after fabrication. In the device hierarchy, an FPGA is a programmable logic device, followed by the broader categories of semiconductor, integrated circuit, and digital logic. Spartan-3 devices combine configurable logic blocks, distributed memory, dedicated input/output structures, and clocking resources in a single package.
The XC3S50-5VQG100C provides 73,728 bits of distributed RAM and 192 logic array blocks, making its internal resources suitable for modest control systems, interface conditioning, signal processing, and embedded logic. Its 63 configurable I/O pins provide external connectivity, while the -5 speed designation corresponds to the verified 725 MHz maximum frequency. The 100-pin VTQFP package supports compact surface-mount PCB layouts.
The Spartan-3 architecture uses a 90 nm process and a 1.2 V internal core voltage. Distributed RAM provides storage alongside configurable logic, allowing small lookup tables, buffers, and state machines to be implemented without relying entirely on external memory. Designers must also account for dedicated configuration pins, clock routing, power-supply sequencing, and the fixed resources assigned to configuration when planning the pinout.
Typical uses include industrial control logic, low-cost embedded control, data acquisition, communication-interface bridging, instrumentation, and consumer electronics. The component is appropriate when a relatively small amount of parallel logic, moderate I/O connectivity, and programmable functionality are needed without moving to a larger FPGA.
The primary design consideration is package and power planning. A 100-pin VTQFP layout is sensitive to thermal via placement and power-distribution integrity, while the 1.2 V core rail requires clean supply delivery. Configuration logic should also be preserved according to the manufacturer's guidance because its pins may not be freely available for ordinary user functions.
This page combines the verified distributor specifications, package details, lifecycle caveat, drop-in replacement analysis, and practical design guidance for engineers evaluating the AMD Spartan-3 XC3S50-5VQG100C.
بدائل مباشرة لـ XC3S50-5VQG100C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC3S50-5VQG100C (نفس عامل الشكل والبصمة) — يختلف في Logic Cells, Operating Temperature, Package, Process Technology, Speed Grade.
XC3S50-5VQ100C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S50-4VQG100C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S50-4VQG100I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC3S50-5VQG100I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S50-5VQG100E
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S50-5VQG100C الحدود القصوى والخصائص الكهربائية
| Product Type | Spartan-3 Field Programmable Gate Array (FPGA) |
| System Gates | 50,000 gates |
| Logic Cells | 1,728 cells |
| Logic Array Blocks | 192 blocks |
| Programmable I/O Pins | 63 pins |
| Distributed RAM | 73,728 bits |
| أقصى تردد للساعة | 725 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| العلبة | 100-pin VTQFP, 14 x 14 mm |
| نوع التركيب | Surface mount |
| Device Family | Spartan-3 |
| Speed Grade | -5 |
| درجة حرارة التشغيل | 0 °C to 85 °C |
| Terminal Count | 100 pins |
دليل تكوين أطراف XC3S50-5VQG100C 100-pin vtqfp, 14 x 14 mm
تكوين الأطراف لـ XC3S50-5VQG100C (حزمة 100-pin vtqfp, 14 x 14 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC3S50-5VQG100C.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC3S50-5VQG100C مناسب لـ 6 التطبيقs: Industrial Control Logic, Data Acquisition Interface, Communication Interface Bridging, Embedded Instrumentation, Motor and Motion Control, Consumer and Hobby Electronics.
Industrial Control Logic
The XC3S50-5VQG100C fits compact industrial control and machine-sequencing logic because it provides 1,728 configurable logic cells, 192 logic array blocks, and 63 programmable I/O pins. According to the verified product data, the device supports up to 725 MHz internally, although the external control path will normally operate at a much lower rate. Its 73,728 bits of distributed RAM can hold small state tables, counters, and diagnostic flags without external memory. The 100-pin VTQFP package also supports dense surface-mount assemblies, although the commercial 0 °C to 85 °C range must be checked against the enclosure temperature.
موصى به
Data Acquisition Interface
The XC3S50-5VQG100C is appropriate for parallel data-acquisition interfaces that require programmable capture, timing, or formatting logic. Its 63 I/O pins and 73,728 bits of distributed RAM provide resources for parallel buses, sample buffering, and control state machines, while the 725 MHz maximum clock allows modern FPGA clocking and timing techniques. The verified operating range of 0 °C to 85 °C suits controlled indoor equipment. Designers must assign pins around configuration functions and verify acquisition-device voltage levels, clock jitter, and timing against the selected external ADC.
موصى به
Communication Interface Bridging
The XC3S50-5VQG100C can bridge legacy parallel signals to a serial or network-oriented system using its 1,728 logic cells and 63 configurable I/O pins. The verified 725 MHz device rating provides timing margin for parallel-to-serial conversion, protocol framing, and clock-domain crossing logic. Its 100-pin surface-mount package keeps the implementation compact, while distributed RAM can support buffering and packetization. Real designs still need protocol-specific state machines, voltage-compatible I/O standards, termination, and timing constraints for any legacy interface.
موصى به
Embedded Instrumentation
The XC3S50-5VQG100C suits instrumentation products that need programmable measurement logic, calibration tables, and display or communications control around a main processor. Its 50,000-system-gate capacity, 73,728 bits of distributed RAM, and 63 I/O pins are enough for measurement conditioning, trigger logic, and auxiliary interface functions. The commercial 0 °C to 85 °C range is appropriate for typical indoor instruments, while the 100-pin VTQFP simplifies compact board construction. Precision analog conversion and low-noise sensing remain functions of the selected external components rather than the FPGA itself.
موصى به
Motor and Motion Control
The XC3S50-5VQG100C can implement motion-control sequencing, pulse generation, fault capture, and communication logic in a compact controller. Its 63 I/O pins support encoder inputs, control outputs, and status signals, while the verified 725 MHz maximum clock allows precise timing logic and event capture. Distributed RAM can store position, velocity, and diagnostic state. Because the FPGA does not directly provide motor-drive power stages, the design must include suitable gate drivers, protection, isolation, and analog feedback conditioning, and it must meet applicable industrial environmental requirements.
موصى به
Consumer and Hobby Electronics
The XC3S50-5VQG100C remains useful for cost-sensitive programmable logic, educational platforms, adapters, and compact consumer products. It offers 50,000 system gates, 63 I/O pins, and a 100-pin VTQFP package without requiring the resources of a larger FPGA. According to the verified records, the device operates from a 1.2 V core and is rated for 725 MHz maximum frequency, enabling flexible timing and control implementations. Projects should include a supported configuration source, valid power sequencing, and careful attention to connector grounding and exposed-pin accessibility during assembly.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC3S50-5VQG100C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC3S50-5VQ100C | XC3S50-4VQG100C | XC3S50-4VQG100I | XC3S50-5VQG100I | XC3S50-5VQG100E |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 100-pin VTQFP | 100-pin VTQFP | 100-pin VTQFP | 100-pin VTQFP | 100-pin VTQFP | 100-pin VTQFP |
| System Gates | 50,000 gates | 50,000 gates | 50,000 gates | 50,000 gates | 50,000 gates | 50,000 gates |
| Logic Cells | 1,728 cells | 1,728 cells | 1,728 cells | 1,728 cells | 1,728 cells | 1,728 cells |
| Programmable I/O | 63 pins | 63 pins | 63 pins | 63 pins | 63 pins | 63 pins |
| Maximum Clock Frequency | 725 MHz | 725 MHz | 630 MHz | 630 MHz | 725 MHz | 725 MHz |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Temperature Grade | Commercial, 0 °C to 85 °C | Commercial, 0 °C to 85 °C | Commercial | Industrial | Industrial | Extended |
| Distributed RAM | 73,728 bits | 73,728 bits | 73,728 bits | 73,728 bits | 73,728 bits | 73,728 bits |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
أبرز الفروقات
- Higher verified speed rating than the -4 alternatives (مقابلXC3S50-4VQG100C)
- Direct same-speed commercial replacement with matching resources (مقابلXC3S50-5VQ100C)
- Temperature-grade flexibility without changing logic resources (مقابلXC3S50-5VQG100I)
ملاحظات التصميم
Design the 1.2 V core rail and any required I/O auxiliary supplies as separate, well-filtered domains. Place the closest manufacturer-recommended bulk and bypass capacitors at the associated supply pins, then verify the complete power-up sequence against the Spartan-3 configuration requirements. Estimated core dissipation cannot be calculated from the supplied data because active utilization, I/O loading, and static power were not provided; use the manufacturer power estimator and the final constrained design instead of assuming a generic dissipation value.
Keep the 100-pin VTQFP power distribution continuous and connect the required thermal and ground vias according to the manufacturer land pattern. Route configuration, clock, and sensitive I/O paths away from switching nodes and high-current outputs. The verified package is 14 x 14 mm, so pad spacing is tight for fine-pitch assembly; inspect stencil, solder-paste volume, and reflow profiles to reduce bridging risk. Verify the PCB dimensions against the exact package drawing because different 100-lead ordering notations can require careful mechanical comparison.
Do not treat all 100 package pins as user I/O: the verified device has 63 programmable I/O pins, and some terminals are dedicated to configuration, clock, power, or ground. Freeze the pin assignment early and reserve the configuration interface even when the design initially appears to use only a small portion of the FPGA. Also avoid substituting a -4 speed device without rerunning static timing: its verified maximum frequency is approximately 630 MHz versus 725 MHz for the target, a 13% reduction that can affect a critical path.
Assign external clock and high-speed interface pins through the FPGA constraints and verify input threshold, drive strength, slew, and termination against the selected I/O standard. The 725 MHz figure is a device capability and does not guarantee that every board layout or I/O path closes timing at that rate. Use short clock routes, controlled reference planes, and source-synchronous or board-specific timing analysis. Where an external serializer or transceiver is used, verify its launch and receive characteristics rather than treating the FPGA's maximum frequency as an end-to-end guarantee.
معلومات الامتثال
The supplied distributor and product-summary data did not explicitly state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. These fields remain unknown rather than being inferred from the device's age or technology generation.
