XC3S50A-4FTG256C - 50K Spartan-3A FPGA | AMD
MPN: XC3S50A-4FTG256C ✗ انتهى عمره الإنتاجيXC3S50A-4FTG256C نظرة عامة
A field-programmable gate array is a semiconductor whose digital logic, interconnect, and I/O functions are configured after fabrication. An FPGA belongs to the programmable-logic device hierarchy, alongside CPLDs, and provides parallel hardware implementation of control, signal-processing, communications, and data-acquisition functions. The Spartan-3A family combines moderate logic density with a large I/O count in a cost-conscious architecture for embedded control and industrial equipment.
The XC3S50A-4FTG256C provides 144 user I/O, giving it substantial connectivity for parallel buses, control signals, and external interfaces. Its 1,584 slices divide the 55,296 logic cells into parallel programmable resources for combinational and sequential logic. The 50K-gate description provides a relative scale for system architects, while the 667 MHz figure establishes the device's timing-performance class for clocked designs.
The 256-ball FTBGA package supports compact PCB integration but requires careful escape routing, via-in-pad considerations, and thermal design. A 90 nm fabrication process and 1.2 V core supply place this device in an established low-power FPGA generation. Designers should use the AMD DS529 family data sheet for package dimensions, pin definitions, configuration requirements, bank voltage rules, and supported I/O standards.
Typical uses include industrial control systems, instrument interfaces, digital signal-processing front ends, communications equipment, and embedded test systems. Its combination of 144 I/O and 1,584 slices is useful when an application needs many parallel external connections or moderate logic parallelism rather than the density of a larger FPGA. Configuration storage, clocking, power sequencing, and JTAG programming remain essential board-level functions.
When replacing another device, verify the exact BGA ball map, power rails, configuration interface, I/O voltage standards, and speed grade rather than relying only on the logic-cell count. The C-grade suffix and -4 speed designation affect system timing and environmental requirements. Use the manufacturer's package pinout and configuration guidance to validate every board-level connection before production release.
This product record combines the verified Spartan-3A device characteristics with package-aware replacement guidance, commercial sourcing instructions, and practical design notes for 256-ball FTBGA implementation. It is intended to accelerate initial component screening while preserving the verification work required for production-quality FPGA designs.
بدائل مباشرة لـ XC3S50A-4FTG256C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC3S50A-4FTG256C (نفس عامل الشكل والبصمة) — يختلف في Package, Configuration Modes, Family, Logic Cells, Operating Temperature.
XC3S50A-4FTG256I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S50A-5FTG256C
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S50A-5FTG256I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XC3S50A-4FTG256C الحدود القصوى والخصائص الكهربائية
| Device Type | Spartan-3A field-programmable gate array |
| Logic Gates | 50K gates |
| Logic Cells | 55,296 cells |
| Configurable Slices | 1,584 slices |
| User I/O | 144 I/O |
| Maximum Performance | 667 MHz |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -4 |
| Temperature Grade | Commercial (C) |
| العلبة | 256-ball FTBGA |
| Total Terminals | 256 terminals |
| Package Type | BGA |
| Package Shape | Square |
| Logic Technology | Configurable digital logic and interconnect |
دليل تكوين أطراف XC3S50A-4FTG256C square
تكوين الأطراف لـ XC3S50A-4FTG256C (حزمة square). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC3S50A-4FTG256C.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC3S50A-4FTG256C مناسب لـ 6 التطبيقs: Industrial Control and PLC Interface, Data Acquisition and Instrumentation, Communications and Protocol Conversion, Digital Signal Processing Front End, Embedded Test and Measurement Equipment, Legacy Video and Display Processing.
Industrial Control and PLC Interface
The XC3S50A-4FTG256C fits legacy industrial control systems that require many discrete connections without the density of a large FPGA. Its 144 user I/O can accommodate digital inputs, outputs, encoders, and interlock signals, while 1,584 configurable slices support state machines, timing logic, and communication protocols. The 1.2 V core supply and 90 nm CMOS implementation are appropriate for established control-platform architectures. For new deployments, verify the commercial temperature range, configure unused I/O safely, and use the AMD DS529 bank rules to select compatible voltage standards.
موصى به
Data Acquisition and Instrumentation
The XC3S50A-4FTG256C is suitable for parallel data-acquisition front ends that must combine sampling control, buffering, filtering, and interface logic. The 144 I/O allow multiple parallel buses to coexist, and the 1,584 slices provide sufficient parallelism for channel multiplexing, counters, and control sequencing. Its 667 MHz performance class supports clocked pipeline logic, while the 256-ball FTBGA package keeps the device compact. Designers should allocate pins by I/O bank, maintain separate analog and digital grounding practices, and verify timing against the selected ADC or sensor interface.
موصى به
Communications and Protocol Conversion
The XC3S50A-4FTG256C can implement parallel-to-serial conversion, clock-domain crossing, packet framing, and legacy communications bridges in FPGA-based equipment. Its 55,296 logic cells and 1,584 slices are sufficient for multiple medium-speed state machines and framing functions, while 144 I/O support parallel host connections and control signals. The -4 speed grade offers a defined timing target for legacy systems. Keep each interface within its assigned voltage bank, constrain all clocking paths, and validate protocol timing using the same clock assumptions used in the original ISE project.
موصى به
Digital Signal Processing Front End
The XC3S50A-4FTG256C fits small DSP front ends requiring decimation filters, correlation, modulation, or waveform generation close to an ADC or DAC. Its 1,584 slices support parallel multiplier, adder, and pipeline structures, and the nominal 667 MHz performance class provides a useful basis for synchronous logic design. The 144 user I/O reduces the need for external logic when several channels are involved. Select suitable I/O standards for each bank, account for routing delay in timing closure, and use registered interfaces to avoid combinational glitches across device boundaries.
موصى به
Embedded Test and Measurement Equipment
The XC3S50A-4FTG256C can implement timing generation, pattern sequencing, instrument control, and data capture within compact legacy test equipment. The 50K-gate architecture is large enough for parallel test channels while the 144 I/O support dense fixture and backplane connectivity. At 1.2 V, the core requires a carefully planned power tree with adequate decoupling and sequencing. Validate signal integrity across the BGA escape region, use controlled clock sources for test-vector accuracy, and confirm that every external driver remains compatible with the selected I/O bank voltage.
موصى به
Legacy Video and Display Processing
The XC3S50A-4FTG256C remains applicable to legacy pixel timing, character generation, overlay, and control logic where a dedicated video processor is unnecessary. Its 144 I/O can support parallel pixel or control buses, and 1,584 slices are suitable for moderate raster and synchronization pipelines. The commercial C grade must satisfy the enclosure's actual ambient-temperature range. Keep high-speed display interfaces in compatible voltage banks, account for output timing uncertainty, and use registered pipeline stages so that logic and memory delays do not create visible raster artifacts.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC3S50A-4FTG256C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC3S50A-4FTG256I | XC3S50A-5FTG256C | XC3S50A-5FTG256I |
|---|---|---|---|---|
| Package | 256-ball FTBGA | 256-ball FTBGA - same | 256-ball FTBGA - same | 256-ball FTBGA - same |
| Brand | AMD | AMD | AMD | AMD |
| Family | Spartan-3A | Spartan-3A | Spartan-3A | Spartan-3A |
| Logic Gates | 50K gates | 50K gates | 50K gates | 50K gates |
| Logic Cells | 55,296 cells | 55,296 cells | 55,296 cells | 55,296 cells |
| Configurable Slices | 1,584 slices | 1,584 slices | 1,584 slices | 1,584 slices |
| User I/O | 144 I/O | 144 I/O | 144 I/O | 144 I/O |
| Speed Grade | -4 | -4 | -5 | -5 |
| Temperature Grade | Commercial (C) | Industrial (I) | Commercial (C) | Industrial (I) |
| Process Technology | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
أبرز الفروقات
- Retains the original -4 speed grade and 256-ball footprint while changing one temperature-grade suffix (مقابلXC3S50A-4FTG256I)
- Commercial-grade alternative with a one-step higher speed designation (مقابلXC3S50A-5FTG256C)
- Combines a higher speed designation with industrial temperature grade in the same footprint (مقابلXC3S50A-5FTG256I)
ملاحظات التصميم
Treat the 256-ball FTBGA as a high-density escape-routing problem. Follow the FTG256 package drawing and AMD pinout for ball coordinates, preserve continuous power and ground planes, and route high-speed nets first. Decoupling capacitors should be placed close to the corresponding power balls, while configuration, clock, and JTAG nets should be kept short and protected from noisy switching paths. Validate the completed layout with the AMD package-design rules and manufacturing capability.
Separate the 1.2 V core rail from any auxiliary I/O supplies in the power tree, then use the bank voltage rules from AMD document DS529 before selecting I/O standards. Check voltage compatibility for every external device and maintain the required startup sequence. Estimated dissipation depends on input and output switching activity, selected I/O standards, core utilization, and ambient conditions; calculate it from the device model and a representative workload rather than relying only on the nominal core voltage.
Give clock and configuration nets controlled impedance and continuous reference planes. Avoid routing sensitive interfaces beside clock or high-current switching nets, and use registered I/O stages when signals cross between clock domains or enter and leave the FPGA. Apply series termination only when supported by the device and interface specification, because incorrect source termination can increase edge rate and degrade signal integrity. Include board-level timing and return-path analysis in the sign-off simulation.
A matching ball-grid package does not by itself prove drop-in equivalence. Before replacing XC3S50A-4FTG256C with an I-grade or -5-grade device, verify temperature limits, timing constraints, power sequencing, configuration behavior, JTAG operation, and lifecycle status. If the original ISE project contains speed-grade-specific timing assumptions, rerun implementation and static timing analysis for the substitute. Also confirm that the PCB accommodates the manufacturer-approved BGA assembly and inspection process.
معلومات الامتثال
The exact material-compliance declarations and automotive qualification status for this legacy ordering code must be confirmed from the manufacturer product record.
