XC6SLX150-3FG484C - 147443-Cell FPGA | AMD | Industrial
MPN: XC6SLX150-3FG484C ✓ نشطXC6SLX150-3FG484C نظرة عامة
An FPGA is a programmable semiconductor used to implement digital logic, interface protocols, control systems, and parallel processing functions. Its configurable architecture contains programmable interconnect and logic resources that can be configured after manufacture. This places the FPGA within the broader hierarchy of programmable logic devices, digital semiconductors, and embedded control hardware, while distinguishing it from fixed-function logic ICs and application-specific processors.
The principal features of the XC6SLX150-3FG484C include 147,443 logic cells, 11,519 configurable logic blocks, 338 I/O, and a 667 MHz internal frequency. Its 45 nm CMOS construction and 1.2 V core supply support dense designs requiring substantial parallel logic. The commercial-temperature suffix C supports operation from 0°C to 85°C, while the lead-free 19 mm by 19 mm CSBGA package is intended for compact surface-mount assemblies.
The Spartan-6 LX architecture provides a balance of programmable logic, dedicated block RAM, digital signal processing resources, and general-purpose I/O. Designers can implement communication links, control logic, instrumentation front ends, image-processing pipelines, and embedded accelerators without relying on a fixed instruction set. A 484-ball package offers dense routing access, but it requires careful PCB escape routing, via-in-pad or fanout strategies, and controlled assembly conditions for reliable manufacturing.
Typical uses include industrial automation, communications infrastructure, test and measurement equipment, embedded video processing, and high-density control systems. The 338 available I/O are particularly useful for parallel interfaces, while the large logic capacity allows multiple independent processing pipelines or control domains to share one programmable device. The 667 MHz internal figure is a device timing characteristic rather than a guarantee that every implemented circuit will run at that frequency.
Designers should prioritize the AMD Spartan-6 package pinout files when assigning BGA balls and planning PCB escape routing. Power, ground, configuration, clock, and user-I/O connections must be mapped against the exact device and package files. Decoupling, clock jitter, signal integrity, thermal dissipation, and configuration-boot requirements should be reviewed before schematic and layout release.
This page combines exact device characteristics with practical package-planning guidance, configuration considerations, same-package alternatives, and an engineering-oriented comparison. It helps designers determine whether the XC6SLX150-3FG484C fits a design before committing to a 484-ball BGA layout and high-speed FPGA implementation.
بدائل مباشرة لـ XC6SLX150-3FG484C — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XC6SLX150-3FG484C (نفس عامل الشكل والبصمة) — يختلف في Device Type, Logic Cells, Core Supply Voltage, Lead-Free Status, Operating Temperature.
XC6SLX150-2FG484C
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX150-N3FG484C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC6SLX150-3FGG484C
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC6SLX150-3FG484I
✅ بديل مباشرتواصل لمعرفة السعر
عرض ورقة البيانات ←XC6SLX150-2FGG484I
✅ بديل مباشر📋 بديل مرجعي (غير موجود في الكتالوج)
XC6SLX150-3FG484C الحدود القصوى والخصائص الكهربائية
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 147,443 cells |
| Configurable Logic Blocks | 11,519 CLBs |
| Internal Frequency | 667 MHz |
| I/O Count | 338 I/O |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -3 |
| Package Type | 484-ball CSBGA |
| Package Dimensions | 19 mm x 19 mm |
| Package Pitch | 0.80 mm |
| عدد الأطراف | 484 balls |
| درجة حرارة التشغيل | 0°C to 85°C |
| نوع التركيب | Surface Mount |
| Lead-Free Status | Lead-free |
دليل تكوين أطراف XC6SLX150-3FG484C 0.80 mm
تكوين الأطراف لـ XC6SLX150-3FG484C (حزمة 0.80 mm). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XC6SLX150-3FG484C.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XC6SLX150-3FG484C مناسب لـ 6 التطبيقs: Industrial Automation and Control, Communications and Network Interface, Test and Measurement Instrumentation, Video and Image Processing Pipelines, Aerospace and Defense Control Systems, Embedded Data Acquisition.
Industrial Automation and Control
The XC6SLX150-3FG484C fits industrial automation controllers that combine sequencing, communications, data acquisition, and real-time control in one FPGA. Its 147,443 logic cells and 11,519 configurable logic blocks provide room for parallel motion-control pipelines, while 338 I/O support encoder inputs, actuator outputs, and industrial interfaces. The -3 speed grade helps timing-constrained control paths, and the commercial 0°C to 85°C range suits equipment within that enclosure limit. The design should still include power conditioning, grounding, EMC mitigation, and thermal analysis at the system level.
موصى به
Communications and Network Interface
The XC6SLX150-3FG484C is suitable for communication equipment requiring parallel datapaths, protocol conversion, packet processing, and dedicated I/O. The large 147,443-cell architecture can host multiple packet engines or test functions, while the 338 I/O provide substantial board-level connectivity. The 667 MHz internal device frequency supports demanding synchronous logic when timing closure permits it. Engineers must budget carefully for transceiver interfaces, clock jitter tolerance, controlled-impedance routing, and thermal paths because the BGA package itself does not determine signal-integrity performance.
موصى به
Test and Measurement Instrumentation
The XC6SLX150-3FG484C can implement parallel acquisition, timing, pattern generation, and analysis functions in a high-end instrument. Its 11,519 configurable logic blocks can be partitioned into multiple synchronized channels, and 338 I/O reduce the need for external multiplexing around the FPGA. The -3 grade supports demanding clocking and pipeline timing, while the 1.2 V core technology requires a carefully designed multi-rail supply. Calibration, reference-clock jitter, analog isolation, channel skew, and deterministic triggering are critical system-level concerns for precision measurement.
موصى به
Video and Image Processing Pipelines
The XC6SLX150-3FG484C is appropriate for parallel video pipelines that require frame timing, pixel transformation, and multi-stage filtering. Its large programmable-logic capacity permits high-throughput parallel datapaths rather than forcing complex pixel operations into sequential software. The 338 I/O provide direct connectivity to parallel sensors, capture devices, and display timing circuits, while the -3 speed grade benefits clock-critical stages. Video designs should account for memory bandwidth, row and column latency, color format, clock-domain crossings, and synchronized reset distribution across the complete processing pipeline.
موصى به
Aerospace and Defense Control Systems
The XC6SLX150-3FG484C can support programmable control, monitoring, and communications logic where a high logic-cell count and extensive I/O are valuable. The -3 speed grade is appropriate for tightly timed control and signal-processing functions, and the family architecture permits dedicated watchdog, communication, and datapath blocks. Selection for flight hardware requires review of radiation, qualification, temperature, procurement, and obsolescence requirements that are not established by the base commercial ordering code. Critical systems should verify the exact ordering variant and certification documentation before design freeze.
موصى به
Embedded Data Acquisition
The XC6SLX150-3FG484C fits multi-channel acquisition systems requiring digital filtering, protocol conversion, buffering, and real-time analysis. With 147,443 logic cells, it can run several parallel conversion pipelines and associated control functions while retaining enough I/O for converters, sensors, memory, and synchronization interfaces. The 667 MHz internal frequency supports high-speed synchronous stages, but actual converter sampling rates remain limited by I/O timing, board-level skew, memory bandwidth, and analog performance. Engineers should co-design the clock tree, serialization interface, and FPGA acquisition logic rather than treating them independently.
موصى به
ملخص المنتجات الموصى بها
بيانات مرجعية هندسية لـ XC6SLX150-3FG484C — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XC6SLX150-2FG484C | XC6SLX150-N3FG484C | XC6SLX150-3FGG484C | XC6SLX150-3FG484I | XC6SLX150-2FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-ball FBGA | 484-ball FBGA | 484-ball FBGA | 484-ball FBGA | 484-ball FBGA | 484-ball FBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells | 147,443 cells |
| Configurable Logic Blocks | 11,519 CLBs | 11,519 CLBs | 11,519 CLBs | 11,519 CLBs | 11,519 CLBs | 11,519 CLBs |
| I/O Count | 338 I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O | 338 I/O |
| Process Technology | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS | 45 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | -3 | -2 | -3N | -3 | -3 | -2 |
أبرز الفروقات
- Highest identified Spartan-6 LX performance grade (مقابلXC6SLX150-2FG484C)
- Commercial-temperature ordering option in the 484-ball package (مقابلXC6SLX150-3FG484I)
- Exact -3 architecture with a close same-package ordering variant (مقابلXC6SLX150-3FGG484C)
ملاحظات التصميم
Plan the board around the 484-ball, 0.80 mm-pitch BGA rather than treating it as a conventional fine-pitch component. Use the AMD Spartan-6 package pinout file for every ball assignment, preserve the package body dimensions of 19 mm by 19 mm, and maintain the recommended land pattern and assembly mask. A multilayer stack-up with short via transitions helps escape the dense ball field. Check each board layer against the selected speed grade, I/O standards, and routing-density requirements before releasing the fabrication data.
The Spartan-6 LX device uses a 1.2 V core supply and additional package-specific rails. Follow the manufacturer power-distribution and decoupling guidance rather than assuming that a single rail can serve every ball. Place high-frequency decoupling close to the relevant package balls, use multiple connections for supply and ground groups, and keep the return path continuous beneath switching and high-speed signals. Validate the assembled board for voltage droop, simultaneous switching noise, and startup behavior under the intended clocking and I/O load.
Treat clock, configuration, and high-speed user interfaces as a single physical design challenge. Use controlled-impedance routing, avoid unnecessary stubs and layer transitions, provide a continuous reference plane, and keep clocks away from noisy switching paths. Although the device lists a 667 MHz internal frequency, implemented interface performance is constrained by package and board timing, external jitter, I/O standards, and configuration timing. Validate edge rates and channel skew with realistic transceiver, memory, and power assumptions rather than using only the nominal device frequency.
A compact 19 mm by 19 mm BGA concentrates heat beneath the package, so thermal design must be addressed before high-utilization operation. Use the package thermal data to select copper area, thermal vias, through-hole structures, and airflow appropriate to the enclosure. Estimate worst-case junction temperature from actual switching activity, core and I/O power, ambient temperature, and board heat spreading. Do not rely on the commercial 0°C to 85°C operating range as proof that every board location will remain within limits.
Do not treat a similar XC6SLX150 suffix as an automatic drop-in choice. Confirm the speed grade, temperature grade, package dimensions, ball map, and configuration interface in the AMD ordering information for the exact part. For an FPGA migration, also verify that the replacement bitstream, tool version, design constraints, memory interfaces, and timing results remain valid. A zero-PCB-change claim is appropriate only after comparing the exact package files and confirming device configuration compatibility.
معلومات الامتثال
The package is identified as lead-free. RoHS, REACH, halogen-free, conflict-minerals, and automotive qualification statuses are not established by the available product data.
