XCKU3P-1SFVB784E - 355950-Logic-Cell Kintex UltraScale+ FPGA | AMD
MPN: XCKU3P-1SFVB784E ✓ نشطXCKU3P-1SFVB784E نظرة عامة
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic can be configured after manufacture. FPGA devices combine programmable logic blocks, block RAM, programmable input/output resources, clocking, and high-speed serial transceivers on one device. The Kintex UltraScale+ family occupies the performance tier between general-purpose UltraScale devices and larger Virtex devices, providing substantial logic and memory capacity for advanced embedded systems.
The target device contains 20,340 logic blocks, equivalent to 355,950 logic elements, and 31,641,600 bits of block RAM. Its 304 user I/O positions support digital interfaces, while the UltraScale+ architecture is designed for demanding clock rates, high-speed connectivity, and parallel processing. The listed operating supply range is 0.825 V to 0.876 V for the relevant internal supply condition.
The XCKU3P-1SFVB784E combines the -1 performance grade with a 784-pin FCBGA package offering high I/O and power connectivity. This package complexity supports advanced board-level designs but requires a land grid, multilayer PCB construction, careful power delivery, and assembly processes capable of handling a large fine-pitch BGA. A matching FPGA configuration, clocking, memory interface, and board design are essential to achieve predictable performance.
Typical uses include high-throughput data acquisition, industrial image and signal processing, communications infrastructure, accelerator control, high-speed networking, radar or aerospace processing, and embedded systems requiring programmable logic. The large RAM and logic resources make the device particularly appropriate for parallel datapaths that cannot be implemented efficiently in a microcontroller or smaller FPGA.
Design planning should begin with the UltraScale package pinout files and the AMD FPGA design toolchain. Confirm the required voltage rails, decoupling network, clocking topology, transceiver requirements, configuration method, thermal conditions, and board-layer constraints before schematic capture. Use simulation and timing analysis before programming hardware because high-speed interfaces can expose signal-integrity and clock-distribution issues that are difficult to correct after fabrication.
This product page combines the exact device identity, resource counts, package information, sourcing guidance, application analysis, and design-oriented comparison points into one engineering reference for evaluating the XCKU3P-1SFVB784E.
بدائل مباشرة لـ XCKU3P-1SFVB784E — نفس الحزمة، متوافق دبوس بدبوس. تُستثنى القطع ذات الحزم المختلفة التي تتطلب تعديل PCB.
الطرازات في هذه السلسلة
طرازات من نفس السلسلة متوافقة تمامًا مع XCKU3P-1SFVB784E (نفس عامل الشكل والبصمة) — يختلف في Package, Package Type, Temperature Grade, Speed Grade, Device Family.
XCKU3P-2SFVB784E
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←XCKU3P-1SFVB784I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←XCKU3P-L1SFVB784I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XCKU3P-2SFVB784I
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منهاتواصل لمعرفة السعر
عرض ورقة البيانات ←XCKU3P-L2SFVB784E
✅ بديل مباشر ⚠️ مواصفات غير مُتحقق منها📋 بديل مرجعي (غير موجود في الكتالوج)
XCKU3P-1SFVB784E الحدود القصوى والخصائص الكهربائية
| Device Type | Kintex UltraScale+ FPGA |
| Logic Elements | 355,950 |
| Logic Blocks | 20,340 |
| Block RAM | 31,641,600 bits |
| User I/O | 304 |
| العلبة | 784-pin FCBGA |
| نوع التركيب | Surface mount |
| Speed Grade | -1 |
| Temperature Grade | E |
| جهد التغذية التشغيلي | 0.825 V to 0.876 V |
| Minimum Operating Temperature | 0 °C |
| Programmable I/O | 304 user I/O |
| Device Status | Active |
| FPGA Architecture | Kintex UltraScale+ |
| Package Type | FCBGA |
دليل تكوين أطراف XCKU3P-1SFVB784E fcbga
تكوين الأطراف لـ XCKU3P-1SFVB784E (حزمة fcbga). تتضمن هذه الدائرة المتكاملة الرقمية GPIO وواجهات الاتصال (UART وSPI وI2C) وأطراف الطاقة. راجع ورقة بيانات الشركة المصنعة لوظائف الأطراف البديلة وخيارات التكوين. ضرورية لتصميم الأنظمة المدمجة وتخطيط PCB.
لا تتوفر بيانات مفصلة لمخطط التوصيلات لـ XCKU3P-1SFVB784E.
راجع ورقة البيانات للحصول على تكوين الأطراف الكامل.
التطبيقات النموذجية
XCKU3P-1SFVB784E مناسب لـ 8 التطبيقs: High-Speed Data Acquisition, Industrial Vision and Inspection, Communications Infrastructure, Embedded Accelerator Control, Radar and Signal Processing, Aerospace and Defense Control, Test and Measurement, Network Storage and Packet Processing.
High-Speed Data Acquisition
The XCKU3P-1SFVB784E fits data-acquisition systems requiring parallel conversion, digital filtering, buffering, and real-time processing in one programmable device. Its 355,950 logic elements and 31,641,600 RAM bits support multiple sampling pipelines, local packetization, and control logic, while 304 user I/O positions provide connections for converters, memory, clocks, and trigger circuitry. Using the -1 speed grade allows a timing design to balance processing throughput against power and thermal requirements. Implementation should follow AMD's power, clocking, and package guidance, with timing closure performed for the selected I/O standards and board-level signal integrity verified during hardware bring-up.
موصى به
Industrial Vision and Inspection
The XCKU3P-1SFVB784E is suitable for industrial image-processing systems that must combine sensor capture, preprocessing, feature extraction, and machine-control logic. Its 20,340 logic blocks and 31,641,600 RAM bits allow sizable frame buffers and parallel pixel pipelines, while 304 user I/O pins support cameras, converters, memory, and actuator interfaces. The -1 speed grade supports demanding designs without automatically selecting the higher -2 class. Engineers should reserve clean clocking resources, control fan-out, and plan thermal management around the large FCBGA package. Validate image timing, memory-interface integrity, and functional safety requirements before production deployment.
موصى به
Communications Infrastructure
The XCKU3P-1SFVB784E fits communications equipment requiring high-throughput packet processing, protocol translation, traffic aggregation, and test instrumentation. Its 355,950 logic elements and 31,641,600 RAM bits support parallel packet paths and deep buffering, while the 304 user I/O positions complement the device's high-speed connectivity. The -1 speed grade can meet demanding timing targets when paired with careful clock distribution and physical-layer design. A production design should include complete timing analysis, transceiver configuration where applicable, clock jitter budgeting, and board-level channel validation. The FCBGA-784 land pattern also demands a multilayer PCB with verified power delivery and assembly yield.
موصى به
Embedded Accelerator Control
The XCKU3P-1SFVB784E is appropriate for accelerator-control and hardware-coprocessor systems where a processor requires programmable logic for data movement, filtering, compression, or low-latency sequencing. The large logic and RAM resources allow multiple accelerators and local buffering to share one device, while 304 user I/O positions support processor, memory, and accelerator links. The -1 grade provides a defined performance option for designs that do not require the -2 timing class. Engineers should partition clocks by speed requirement, verify interconnect timing, and assess board power delivery under worst-case logic activity. Configuration security and recovery behavior should also be included in the platform architecture.
موصى به
Radar and Signal Processing
The XCKU3P-1SFVB784E can serve in radar, sonar, and industrial signal-processing equipment requiring parallel transforms, filtering, correlation, and interface conversion. Its 20,340 logic blocks and 31,641,600 RAM bits provide substantial parallel compute and storage capacity, while 304 user I/O pins accommodate converters, memories, and synchronization signals. The -1 speed grade is suitable when timing closure relies on careful pipeline architecture rather than the highest available speed class. Designers should use deterministic clocking, isolate high-speed paths, and evaluate I/O timing under the intended voltage and temperature corners. Thermal and decoupling analysis should be completed before committing to the 784-pin FCBGA layout.
موصى به
Aerospace and Defense Control
The XCKU3P-1SFVB784E can support programmable control, telemetry, sensor fusion, and communication logic in aerospace or defense systems when its grade and qualification satisfy the program requirements. Its 355,950 logic elements and 31,641,600 RAM bits support redundant processing paths and complex sequencing, while 304 user I/O positions provide broad sensor and communication connectivity. The E-grade suffix must be reconciled with the application's environmental limits, and any required AEC-Q100 or defense qualification status must be confirmed for the exact ordering code. Design reviews should include radiation, configuration, fault containment, clock reliability, and worst-case power assumptions where the program specification calls for them.
موصى به
Test and Measurement
The XCKU3P-1SFVB784E suits modular test and measurement platforms that execute protocol testing, signal generation, pattern processing, and real-time analysis. Its large logic and RAM resources allow several channels of digital acquisition and control to operate concurrently, and its 304 user I/O positions support dense fixture and backplane connectivity. The -1 speed grade is useful when timing margins are established through pipelining and balanced routing rather than maximum device speed. For laboratory-to-production portability, engineers should standardize clocking, trigger, reference, and I/O standards across the platform. Signal-integrity simulation and thermal testing are essential because the FCBGA package limits access to internal high-speed nodes.
موصى به
Network Storage and Packet Processing
The XCKU3P-1SFVB784E fits network storage and packet-processing platforms requiring deep buffers, parallel classification, compression, and traffic management. Its 31,641,600 RAM bits support sizable packet queues and work buffers, while 355,950 logic elements can implement multiple headers, lookup logic, and data paths. The 304 user I/O positions allow connection to external memory, network interfaces, and control processors. The -1 speed grade should be selected when a -2 grade is unnecessary after timing analysis. Power estimation must reflect realistic traffic activity rather than only the maximum toggle rate. Board designers should also validate transceiver connectivity, clock recovery, and package-level thermal performance.
موصى به
بيانات مرجعية هندسية لـ XCKU3P-1SFVB784E — المقارنة وإرشادات التصميم ومعلومات الامتثال.
دليل الاختيار
المقارنة مع البدائل
| المعامل | هذا المنتج | XCKU3P-2SFVB784E | XCKU3P-1SFVB784I | XCKU3P-L1SFVB784I | XCKU3P-2SFVB784I | XCKU3P-L2SFVB784E |
|---|---|---|---|---|---|---|
| Package | 784-pin FCBGA | 784-pin FCBGA | 784-pin FCBGA | 784-pin FCBGA | 784-pin FCBGA | 784-pin FCBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ |
| Logic Elements | 355,950 | 355,950 | 355,950 | 355,950 | 355,950 | 355,950 |
| Logic Blocks | 20,340 | 20,340 | 20,340 | 20,340 | 20,340 | 20,340 |
| Block RAM | 31,641,600 bits | 31,641,600 bits | 31,641,600 bits | 31,641,600 bits | 31,641,600 bits | 31,641,600 bits |
| User I/O | 304 | 304 | 304 | 304 | 304 | 304 |
| Speed Grade | -1 | -2 | -1 | -1 | -2 | -2 |
| Temperature Grade | E | E | I | I | I | E |
أبرز الفروقات
- Lower speed class within the same FCBGA-784 UltraScale+ footprint (مقابلXCKU3P-2SFVB784E)
- E-grade option for extended-temperature designs (مقابلXCKU3P-1SFVB784I)
- Standard -1E configuration for power and timing planning (مقابلXCKU3P-L1SFVB784I)
ملاحظات التصميم
Plan the complete AMD power architecture before layout. The device listing identifies a 0.825 V to 0.876 V operating condition, but the design may require additional rails and sequenced supplies. Use the manufacturer power guide to set regulator tolerances, transient targets, startup order, and current limits. Place high-frequency decoupling capacitors directly across the relevant supply and ground balls, and verify the PDN with both impedance modeling and measurement.
Estimate power under realistic switching activity instead of relying only on the maximum theoretical toggle rate. The FCBGA-784 package requires a multilayer PCB with adequate copper, thermal vias, and controlled airflow. Compare junction temperature against the exact E-grade limits using the AMD power estimator and thermal model. Revise clocking, utilization, or cooling if the worst-case design does not retain adequate thermal margin.
Use the AMD UltraScale package pinout files to assign every ball, including configuration, clock, reset, serial transceiver, and supply pins. Keep the escape path from the BGA land grid short, match high-speed routes by length and layer, and provide clean reference planes without splits beneath critical interfaces. The 784-ball footprint is too large to improvise from a generic BGA symbol, so validate the land pattern against the official mechanical drawing.
Design clock distribution, high-speed serial links, and parallel memory interfaces from the device's supported I/O standards rather than treating all pins as equal. Check loss, reflection, crosstalk, skew, and jitter budgets with the intended PCB stack-up. For clocked logic, use the dedicated clock-capable pins and preserve a low-noise return path. Run post-route timing and signal-integrity simulations before releasing the board.
Do not substitute a Kintex UltraScale+ suffix solely because the FCBGA-784 name matches. Speed grade, temperature grade, L-series voltage behavior, die resources, configuration scheme, and qualification can all affect the design. Review the exact ordering information and AMD documentation for every proposed alternative, then repeat timing and power analysis after substitution. Also avoid using generic 784-pin FCBGA memory as the basis for the device pinout.
معلومات الامتثال
The device listing identifies the XCKU3P-1SFVB784E as active but does not state its RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Confirm compliance for the exact ordering code with AMD.
