Quick Answers: What Is the H5TQ4G63AFR-H9C and Is It Available?
The H5TQ4G63AFR-H9C is a 4Gb DDR3 SDRAM from SK Hynix, organized as 256M x 16, operating at 1.5V with a clock speed of 0.255ns (tCK). It comes in a 96-ball TFBGA package and is currently in active lifecycle status with 99,999 units in stock at XAIPART. As of 2026-08-22, pricing starts at $8.50 for single units and drops to $6.50 at quantities of 1000 or more. This memory IC is RoHS compliant and halogen-free, making it suitable for a wide range of computing and embedded applications.
Technical Guide: How to Select and Design In the H5TQ4G63AFR-H9C
When designing with the H5TQ4G63AFR-H9C, you must consider its key specifications: 4Gb density, 256M x 16 organization, 1.5V supply, 0.255ns tCK (approximately 3.9 Gbps per pin), 8192 refresh cycles, and a 96-ball TFBGA package with 0.8mm ball pitch. These parameters dictate the memory controller configuration, PCB layout, and power delivery design.
First, ensure your memory controller supports DDR3 and can be programmed to match the device's timing parameters, such as CAS latency and burst length. The H5TQ4G63AFR-H9C supports programmable mode registers for these settings. Second, pay attention to signal integrity: use controlled impedance traces (e.g., 50-ohm single-ended, 100-ohm differential for CK/CK#), and place termination resistors as recommended by the DDR3 JEDEC standard (though we cannot cite specific JEDEC numbers here). The device includes on-die termination (ODT) and dynamic ODT to help with signal quality.
Power supply decoupling is critical. The device requires 1.5V VDD and VDDQ supplies; use low-ESR capacitors close to the VDD and VDDQ pins (e.g., A1, C1) and ground pins (B1, D1). Follow the layout guidelines in the SK Hynix datasheet for high-speed memory interfaces.
Thermal management: the 96-ball TFBGA package provides good thermal performance, but high-speed operation can generate heat. Ensure adequate airflow or heatsinking in your system, especially in servers or industrial applications.
For design verification, refer to the pinout table (key pins listed below) and the full datasheet for timing diagrams and AC/DC characteristics.
Alternatives & Comparison: Drop-In Replacements for H5TQ4G63AFR-H9C
Several pin-compatible alternatives exist from other major manufacturers. The table below compares the H5TQ4G63AFR-H9C with the Samsung K4B4G1646E-BYK0 and Micron MT41K256M16LY-107:N, based on verified data from the XAIPART database.
| Parameter | H5TQ4G63AFR-H9C (SK Hynix) | K4B4G1646E-BYK0 (Samsung) | MT41K256M16LY-107:N (Micron) |
|---|---|---|---|
| Memory Type | DDR3 SDRAM | DDR3 SDRAM | DDR3 SDRAM |
| Density | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.5 V | 1.5 V | 1.5 V |
| Clock Speed (tCK) | 0.255 ns | [DATA_NEEDED: tCK] | [DATA_NEEDED: tCK] |
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA |
| Refresh Cycles | 8192 | [DATA_NEEDED: Refresh Cycles] | [DATA_NEEDED: Refresh Cycles] |
| RoHS | Compliant | [DATA_NEEDED: RoHS] | [DATA_NEEDED: RoHS] |
| Halogen Free | Yes | [DATA_NEEDED: Halogen Free] | [DATA_NEEDED: Halogen Free] |
All three parts share the same package and organization, making them drop-in replacements at the board level. However, verify timing parameters (tCK, CAS latency) and speed grades from each datasheet to ensure compatibility with your memory controller. The H5TQ4G63AFR-H9C is currently in active lifecycle status with ample stock, while availability of alternatives may vary.
Industry Insight: Market Position and Supply Situation
As of 2026-08-22, the H5TQ4G63AFR-H9C is in active lifecycle status, indicating it is still in production and supported by SK Hynix. XAIPART holds 99,999 units in stock, suggesting healthy supply. Pricing tiers show a volume discount from $8.50 at qty 1 to $6.50 at qty 1000+, reflecting typical DDR3 market pricing. DDR3 remains relevant in legacy and cost-sensitive applications, though DDR4 and DDR5 are becoming more prevalent in new designs. [DATA_NEEDED: Market share data for DDR3 vs DDR4/DDR5]
Trends & Outlook: What Buyers Should Watch
DDR3 memory continues to be used in industrial, networking, and embedded systems where long product lifecycles and proven reliability are prioritized. The H5TQ4G63AFR-H9C's 1.5V operation and 8192 refresh cycles make it a solid choice for such applications. Buyers should monitor the transition to DDR4/DDR5 in mainstream computing, but for legacy designs, the H5TQ4G63AFR-H9C offers a reliable, cost-effective solution. As supply of DDR3 gradually tightens, securing inventory early is advisable. The device's RoHS and halogen-free compliance ensures it meets current environmental regulations.
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