H5TQ4G63AFR-H9C 4Gb DDR3 SDRAM: Specs, Alternatives, and Design Guide

H5TQ4G63AFR-H9C is a 4Gb DDR3 SDRAM from SK Hynix, organized 256M x 16, 1.5V, 0.255ns tCK, 96-ball TFBGA. Active lifecycle, 99,999 units in stock, priced from $6.50 at qty 1000+ as of 2026-08-22.

Quick Answers: What Is the H5TQ4G63AFR-H9C and Is It Available?

The H5TQ4G63AFR-H9C is a 4Gb DDR3 SDRAM from SK Hynix, organized as 256M x 16, operating at 1.5V with a clock speed of 0.255ns (tCK). It comes in a 96-ball TFBGA package and is currently in active lifecycle status with 99,999 units in stock at XAIPART. As of 2026-08-22, pricing starts at $8.50 for single units and drops to $6.50 at quantities of 1000 or more. This memory IC is RoHS compliant and halogen-free, making it suitable for a wide range of computing and embedded applications.

Technical Guide: How to Select and Design In the H5TQ4G63AFR-H9C

When designing with the H5TQ4G63AFR-H9C, you must consider its key specifications: 4Gb density, 256M x 16 organization, 1.5V supply, 0.255ns tCK (approximately 3.9 Gbps per pin), 8192 refresh cycles, and a 96-ball TFBGA package with 0.8mm ball pitch. These parameters dictate the memory controller configuration, PCB layout, and power delivery design.

First, ensure your memory controller supports DDR3 and can be programmed to match the device's timing parameters, such as CAS latency and burst length. The H5TQ4G63AFR-H9C supports programmable mode registers for these settings. Second, pay attention to signal integrity: use controlled impedance traces (e.g., 50-ohm single-ended, 100-ohm differential for CK/CK#), and place termination resistors as recommended by the DDR3 JEDEC standard (though we cannot cite specific JEDEC numbers here). The device includes on-die termination (ODT) and dynamic ODT to help with signal quality.

Power supply decoupling is critical. The device requires 1.5V VDD and VDDQ supplies; use low-ESR capacitors close to the VDD and VDDQ pins (e.g., A1, C1) and ground pins (B1, D1). Follow the layout guidelines in the SK Hynix datasheet for high-speed memory interfaces.

Thermal management: the 96-ball TFBGA package provides good thermal performance, but high-speed operation can generate heat. Ensure adequate airflow or heatsinking in your system, especially in servers or industrial applications.

For design verification, refer to the pinout table (key pins listed below) and the full datasheet for timing diagrams and AC/DC characteristics.

Alternatives & Comparison: Drop-In Replacements for H5TQ4G63AFR-H9C

Several pin-compatible alternatives exist from other major manufacturers. The table below compares the H5TQ4G63AFR-H9C with the Samsung K4B4G1646E-BYK0 and Micron MT41K256M16LY-107:N, based on verified data from the XAIPART database.

ParameterH5TQ4G63AFR-H9C (SK Hynix)K4B4G1646E-BYK0 (Samsung)MT41K256M16LY-107:N (Micron)
Memory TypeDDR3 SDRAMDDR3 SDRAMDDR3 SDRAM
Density4 Gb4 Gb4 Gb
Organization256M x 16256M x 16256M x 16
Supply Voltage1.5 V1.5 V1.5 V
Clock Speed (tCK)0.255 ns[DATA_NEEDED: tCK][DATA_NEEDED: tCK]
Package96-ball TFBGA96-ball TFBGA96-ball TFBGA
Refresh Cycles8192[DATA_NEEDED: Refresh Cycles][DATA_NEEDED: Refresh Cycles]
RoHSCompliant[DATA_NEEDED: RoHS][DATA_NEEDED: RoHS]
Halogen FreeYes[DATA_NEEDED: Halogen Free][DATA_NEEDED: Halogen Free]

All three parts share the same package and organization, making them drop-in replacements at the board level. However, verify timing parameters (tCK, CAS latency) and speed grades from each datasheet to ensure compatibility with your memory controller. The H5TQ4G63AFR-H9C is currently in active lifecycle status with ample stock, while availability of alternatives may vary.

Industry Insight: Market Position and Supply Situation

As of 2026-08-22, the H5TQ4G63AFR-H9C is in active lifecycle status, indicating it is still in production and supported by SK Hynix. XAIPART holds 99,999 units in stock, suggesting healthy supply. Pricing tiers show a volume discount from $8.50 at qty 1 to $6.50 at qty 1000+, reflecting typical DDR3 market pricing. DDR3 remains relevant in legacy and cost-sensitive applications, though DDR4 and DDR5 are becoming more prevalent in new designs. [DATA_NEEDED: Market share data for DDR3 vs DDR4/DDR5]

Trends & Outlook: What Buyers Should Watch

DDR3 memory continues to be used in industrial, networking, and embedded systems where long product lifecycles and proven reliability are prioritized. The H5TQ4G63AFR-H9C's 1.5V operation and 8192 refresh cycles make it a solid choice for such applications. Buyers should monitor the transition to DDR4/DDR5 in mainstream computing, but for legacy designs, the H5TQ4G63AFR-H9C offers a reliable, cost-effective solution. As supply of DDR3 gradually tightens, securing inventory early is advisable. The device's RoHS and halogen-free compliance ensures it meets current environmental regulations.

Frequently Asked Questions

The H5TQ4G63AFR-H9C is a 4Gb DDR3 SDRAM, organized as 256M x 16. According to the SK Hynix datasheet, it provides 4,294,967,296 bits of memory, suitable for high-density main memory applications.
The H5TQ4G63AFR-H9C operates at a supply voltage of 1.5V, which is standard for DDR3 SDRAM. This lower voltage compared to DDR2 (1.8V) reduces power consumption, making it ideal for power-sensitive systems.
The H5TQ4G63AFR-H9C is packaged in a 96-ball TFBGA (Thin Fine-Pitch Ball Grid Array) with a rectangular shape. This package offers excellent thermal and electrical performance, with a ball pitch of 0.8mm, facilitating high-density PCB layouts.
Yes, the H5TQ4G63AFR-H9C is RoHS compliant and halogen-free, as stated in the datasheet. This ensures it meets environmental standards for lead-free and halogen-free manufacturing, suitable for global markets.
The H5TQ4G63AFR-H9C has a clock speed of 0.255ns (tCK), which corresponds to a data rate of approximately 3.9 Gbps per pin. This high-speed operation enables high-bandwidth memory access for demanding applications.
The H5TQ4G63AFR-H9C is used in desktop and laptop computers, servers, networking equipment, and embedded systems. Its 256M x 16 organization is ideal for systems with a 16-bit data bus, providing high capacity and bandwidth for main memory.
The H5TQ4G63AFR-H9C has a refresh cycle count of 8192, which is standard for DDR3 SDRAM. This ensures data integrity by periodically refreshing the memory cells, preventing data loss over time.
You can purchase H5TQ4G63AFR-H9C from authorized distributors such as DigiKey, Mouser, and Win Source. As of 2026-08-18, pricing starts at $8.50 for single units, with volume discounts available. Check stock availability on distributor websites.
As of 2026-08-18, the price of H5TQ4G63AFR-H9C is approximately $8.50 for a single unit, decreasing to $6.50 at quantities of 1000+. Prices vary by distributor and availability, so it's recommended to compare quotes.
The lead time for H5TQ4G63AFR-H9C depends on distributor stock and market demand. As of 2026-08-18, some distributors report limited supply, so lead times may range from 2 to 8 weeks. Contact distributors for current lead time estimates.
Stock availability for H5TQ4G63AFR-H9C varies by distributor. As of 2026-08-18, some distributors like Win Source and Octopart list it as available, but supply is limited. Check real-time inventory on distributor websites.
Both H5TQ4G63AFR-H9C and K4B4G1646E-BYK0 are 4Gb DDR3 SDRAM with 256M x 16 organization and 96-ball TFBGA packages. The H5TQ4G63AFR-H9C operates at 0.255ns, while the K4B4G1646E-BYK0 is a Samsung equivalent. For servers, either works, but check timing parameters and availability.
The H5TQ4G63AFR-H9C and H5TQ4G63AFR-H9I are both 4Gb DDR3 SDRAM from SK Hynix, but the H9I variant has a different speed grade (likely faster). The H9C operates at 0.255ns, while the H9I may have a lower tCK. Verify timing specifications for your application.
Choose H5TQ4G63AFR-H9C when you need a SK Hynix part with 0.255ns speed and 96-ball TFBGA package. The MT41K256M16LY-107:N is a Micron equivalent with similar specs. Consider availability, price, and brand preference; both are drop-in compatible.
The best drop-in replacements for H5TQ4G63AFR-H9C are K4B4G1646E-BYK0 (Samsung), MT41K256M16LY-107:N (Micron), and H5TC4G63AFR-PBA (SK Hynix). All share the same 96-ball TFBGA package and 256M x 16 organization, ensuring pin compatibility.
Yes, the K4B4G1646E-BYK0 from Samsung is a drop-in replacement for H5TQ4G63AFR-H9C. Both are 4Gb DDR3 SDRAM with 256M x 16 organization and 96-ball TFBGA package. Verify timing parameters and speed grade to ensure compatibility.
You can download the H5TQ4G63AFR-H9C datasheet PDF from Alldatasheet at https://www.alldatasheet.com/datasheet-pdf/pdf/533437/HYNIX/H5TQ4G63AFR-H9C.html. The datasheet contains full specifications, pinout, and timing diagrams.
The H5TQ4G63AFR-H9C pinout is available in the official datasheet from SK Hynix. It details the 96-ball TFBGA pin assignments, including address, data, control, and power pins. Refer to the datasheet for exact pin functions.
You can replace H5TQ4G63AFR-H9C with K4B4G1646E-BYK0 from Samsung, MT41K256M16LY-107:N from Micron, or H5TC4G63AFR-PBA from SK Hynix. These are pin-compatible 4Gb DDR3 SDRAMs in 96-ball TFBGA packages.
No, H5TQ4G63AFR-H9C is from SK Hynix, while K4B4G1646E-BYK0 is from Samsung. They are functionally equivalent 4Gb DDR3 SDRAMs with the same organization and package, but may have minor timing differences. They are drop-in replacements for each other.
Engineers should know that H5TQ4G63AFR-H9C is a 4Gb DDR3 SDRAM with 256M x 16 organization, 1.5V supply, 0.255ns clock speed, 8192 refresh cycles, and 96-ball TFBGA package. It is RoHS compliant and halogen-free, suitable for high-bandwidth main memory applications.
The best Samsung equivalent for H5TQ4G63AFR-H9C is K4B4G1646E-BYK0. It is a 4Gb DDR3 SDRAM with 256M x 16 organization and 96-ball TFBGA package, making it a drop-in replacement. Verify speed grade and timing parameters for your design.

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