HMCG78MEBSA092N 16GB DDR5 4800 SODIMM: Specs, Drop-In Alternatives, and Buying Guide

Quick Answers: What Is the HMCG78MEBSA092N?

The SK hynix HMCG78MEBSA092N is a 16 GB DDR5 SODIMM running at 4800 MT/s (PC5-38400 / PC5-4800B) at 1.1 V in a 262-pin SO-DIMM form factor. It is unbuffered and non-ECC at the host interface, organized as 1Rx8 in a 2Gx64 module configuration built from eight 2Gx8 DDR5 DRAM devices, with CL40 latency and a 64-bit data width that delivers 38.4 GB/s of peak bandwidth per channel. Lifecycle status is active, XAIPART stock stands at 99,999 units at an MOQ of 1, and tier pricing runs from $490.9091 at quantity 1 to $286.3636 at quantity 1000, as of 2026-09-16. It is a direct-fit module for laptops, mobile workstations, mini PCs, and embedded x86 boards that accept JEDEC DDR5-4800 unbuffered non-ECC SODIMMs.

Verified specification snapshot for the HMCG78MEBSA092N:

• Capacity: 16 GB, built as 8 x 2Gx8 DDR5 DRAM devices (128 Gbit total)
• Data rate: 4800 MT/s, PC rating PC5-38400 / PC5-4800B
• Voltage: 1.1 V VDD with the DDR5 on-module PMIC
• Latency: CL40 (about 16.7 ns at the 2400 MHz DDR5-4800 clock)
• Organization: 1Rx8 single rank, 2Gx64 module configuration, 64-bit data width
• ECC: Non-ECC from the host controller view, with DDR5 on-die ECC inside the DRAM array
• Form factor: 262-pin SODIMM, single notch key
• RoHS status: Compliant per JEDEC-standard equivalent listings
• Not published in verified data: operating temperature range and module height

Everything below anchors to that dataset: how to design the module in, which parts drop in as second sources, how supply looks today, and which parameters to watch next.

Technical Guide: How Do You Design In the HMCG78MEBSA092N?

The HMCG78MEBSA092N is a JEDEC-standard module, so design-in is a platform-validation exercise rather than a board-level circuit design task. Six checks cover the failure modes that actually stop DDR5 SODIMM builds.

1. Confirm the host socket is DDR5, not DDR4

The module uses the 262-pin DDR5 SODIMM edge connector with a single notch key. That connector is physically and electrically incompatible with the 260-pin DDR4 SODIMM socket, and the module's 1.1 V VDD rail differs from DDR4's 1.2 V rail. Confirm that the chipset and BIOS accept JEDEC DDR5-4800 unbuffered non-ECC SODIMMs before the part enters the BOM. The documented target platforms are laptops, mobile workstations, and mini PCs, with Intel 12th Gen (Alder Lake) mobile and AMD Rembrandt/Phoenix mobile chipsets listed as examples.

2. Verify rank, organization, and channel population

This module is 1Rx8: all eight 2Gx8 DDR5 DRAM devices sit on a single rank, presenting a clean 2Gx64 module configuration and a 64-bit data width to the memory controller. Single-rank modules typically offer slightly better speed margins and lower power than dual-rank 2Rx8 builds, and they reduce address/command loading, which improves margin on the longer SODIMM traces common in passive-backplane designs. Populate matched modules per the platform manual. Two 16 GB modules across a channel pair enable dual-channel operation and 32 GB total capacity for workloads that exceed 16 GB.

3. Budget for the 1.1 V rail and the on-module PMIC

DDR5 moves the power management IC onto the module itself, which improves power integrity relative to DDR4 and offloads voltage regulation from power-constrained mini-PC and notebook boards. The lower 1.1 V VDD also reduces system power draw versus DDR4 1.2 V modules, which directly affects battery runtime in notebook fleets. A 16 GB DDR5 SODIMM typically dissipates only a few watts under load, so it rarely dominates the thermal budget of a compact chassis.

4. Plan for BIOS memory training and QVL validation

DDR5 memory training is stricter than DDR4, and conservative industrial BIOSes can be slow to qualify new module revisions. Validate the HMCG78MEBSA092N against the system vendor's qualified vendor list (QVL). On platforms where DDR5-4800 is the baseline JEDEC profile — mainstream Intel Alder Lake and AMD Rembrandt mobile — the module runs at full rated speed without BIOS overclocking. On DDR5-4400 platforms the module down-clocks to the JEDEC profile the memory controller requests, which is the documented backward-compatibility behavior for this class of DDR5-4800 SODIMMs.

5. Confirm mechanical and thermal clearance

Two physical parameters are not published in the verified data for this part: module height is [DATA_NEEDED: module height] and the operating temperature range is [DATA_NEEDED: operating temperature range]. For sealed, fanless, or industrial enclosures, obtain both values from the manufacturer datasheet before mechanical sign-off instead of assuming a standard SODIMM profile.

6. Lock a second source before volume ramp

Five cross-referenced alternatives are documented for this module, and the JEDEC-identical ones share the 262-pin form factor, the 4800 MT/s PC5-38400 profile, CL40 latency, the 1.1 V rail, and 1Rx8 organization. Images and memory-training settings validated on the Hynix module therefore carry over to the second source without BIOS changes — a meaningful de-risking step for fleet builds. Compare stock and tier pricing on the HMCG78MEBSA092N product page and the HMCG78MEBSA095N product page before committing to a single part number.

Alternatives & Comparison: What Drops In for the HMCG78MEBSA092N?

All five alternatives below come from the same verified cross-reference set. The strongest drop-in candidates match every electrical and mechanical parameter of the base part; the weaker ones match capacity, speed, and form factor but leave several parameters undocumented.

The HMCG78MEBSA095N is the closest relative: it shares the 16 GB DDR5-4800 PC5-38400 262-pin unbuffered non-ECC SODIMM specifications, and the suffix difference typically reflects minor revision or vendor-code changes. OWC and NEMIX RAM both list a single replacement SKU that covers the 092N and 095N suffixes, which indicates equivalent fit and function in the same laptops. Carrying the 095N alongside the 092N lets a service depot cover both factory part numbers with one stock item.

The OWCMSA16GA48ES is the best-documented third-party drop-in: a 16 GB DDR5 4800 PC5-38400 CL40 1Rx8 1.1 V non-ECC SODIMM explicitly sold as a replacement for the HMCG78MEBSA092N. OWC states the module meets or exceeds OEM specs and is JEDEC-standard, RoHS compliant, and backward compatible with 4400 MT/s platforms. Choose the Hynix original when a laptop vendor or IT policy specifies Hynix modules or when maximum firmware compatibility assurance is required; choose the OWC part when retail boxing, warranty support, and off-the-shelf availability matter more than OEM branding. Both are 262-pin, 1.1 V, CL40, non-ECC SODIMMs.

The HMCG78MEBSA092N-IN Integral-brand equivalent carries the same 16 GB, DDR5 4800 MHz, PC5-38400, unbuffered, non-ECC, 1.1 V, CL40, 2Gx8 device build. The NEMIX-RAM-DDR5-4800-SODIMM-16GB is listed as compatible with both Hynix suffixes and backs that with a lifetime warranty, though its voltage, latency, and rank are not published in the verified data. The HMCG78AGBSA092N is a same-family 16 GB DDR5 SODIMM variant at the same capacity, speed, and form factor; the die revision and BIN class may differ, so verify it against the platform QVL before substituting. Broader module options sit in the memory ICs category.

Industry Insight: What Is the Market Position and Supply Status?

The HMCG78MEBSA092N carries a verified lifecycle status of active, which places it in mainstream production rather than end-of-life. Availability data supports that reading: XAIPART holds 99,999 units at an MOQ of 1, and Octopart reported approximately 45,800 pieces across 2 distributors as of August 10, 2026. The verified distribution set also names Win Source, Fusion Worldwide, Sierra IC, CPUmedics, and Compuram, so buyers have several quoting paths for expedited or allocated requirements. [DATA_NEEDED: manufacturer market share, DRAM bit-supply share, and formal allocation or lead-time commitments for this specific part number]

Tier pricing as of 2026-09-16, straight from the verified table:

• Quantity 1 and above: $490.9091
• Quantity 10 and above: $354.5455
• Quantity 100 and above: $313.6364
• Quantity 500 and above: $300.00
• Quantity 1000 and above: $286.3636, which matches the verified base price

The steepest step in the curve is quantity 1 to quantity 10, a drop of about 27.8 percent. The curve then flattens: moving from the 100-piece tier to the 500-piece tier saves only $13.6364 per module, and the 500-to-1000 step adds roughly 4.5 percent more. Buyers consolidating fleet demand should target the 100-piece tier or better and treat the 500 and 1000 tiers as fine-tuning rather than the main saving.

Distributor market pricing for DDR5 modules fluctuates with DRAM spot prices, and Octopart recommends comparing 2 distributors before large purchases, so firm quotes should be refreshed at order placement. Volume buyers typically route through RFQ channels such as Win Source or Fusion Worldwide. One data conflict needs reconciliation before customer quoting: an earlier XAIPART FAQ entry quoted $49.90 at quantity 1 as of 2026-09-05, which is inconsistent with the verified tier table above.

Trends & Outlook: What Should Buyers Watch?

DDR5-4800 is the baseline profile, not a premium speed grade

Because 4800 MT/s is the baseline JEDEC profile for mainstream Intel Alder Lake and AMD Rembrandt mobile platforms, this module runs at full rated speed with no BIOS overclocking. That keeps memory qualification simple: the 38.4 GB/s per-channel figure is available out of the box rather than being a validated-overclock result.

Backward compatibility with 4400 MT/s platforms is documented, but speed mixing is not free

Per OWC's documentation for its HMCG78MEBSA092N replacement module, DDR5-4800 SODIMMs of this class are backward compatible with 4400 MT/s platforms — the module down-clocks to the JEDEC profile the memory controller requests. When a DDR5-4800 module is mixed with a native DDR5-4400 module, the entire channel runs at the slower common speed. Matching module speeds protects bandwidth in mixed-fleet upgrades.

On-die ECC now sits inside every non-ECC DDR5 module

The HMCG78MEBSA092N is non-ECC from the host controller perspective, yet DDR5 DRAM devices include on-die ECC that corrects internal DRAM errors transparently. This improves data integrity during long renders and simulation runs, but it is not a substitute for host-visible ECC, and this module will not fit servers that require registered or load-reduced ECC DIMMs. It targets consumer and mobile unbuffered SODIMM sockets.

Single-rank 1Rx8 remains the volume 16 GB build

The 1Rx8 organization with eight 2Gx8 devices keeps command and address loading low and supports stable operation at the JEDEC 4800 profile with CL40 latency. A dual-rank 2Rx8 module uses sixteen smaller DRAMs across two ranks; most DDR5 laptops accept either, but matched pairs per channel remain the recommendation, and single-rank parts tend to hold slightly better speed margins at lower power.

Second-source depth is the real procurement risk

Five documented alternatives exist, and the OWC and NEMIX RAM JEDEC-identical modules let system integrators de-risk supply without revalidating BIOS memory training, because all listed equivalents share the 262-pin form factor, the 4800 MT/s PC5-38400 profile, CL40 latency, the 1.1 V rail, and 1Rx8 organization. Qualify at least one second source before a fleet ramp rather than after a stockout.

Two unpublished specifications to close before design freeze

Module height and operating temperature range are both absent from the verified data for this part. Industrial, fanless, and sealed-enclosure designs are exactly where those two numbers decide mechanical and thermal sign-off, so request them from the datasheet rather than inferring them from generic SODIMM dimensions.

For field service teams, the practical takeaway is narrower: the HMCG78MEBSA092N is frequently the factory-fitted module in enterprise DDR5 notebooks, and carrying the HMCG78MEBSA095N or an OWC equivalent covers both Hynix suffixes with one SKU. Reseat modules and clean contacts first, because DDR5 SODIMM detection faults are often contact-related rather than DRAM device failures. For upgrade projects, start with the DDR5 SODIMM upgrade guide and confirm your platform QVL before ordering.