
Quick Answers: What is the XC7K70T-1FBG676C?
The AMD XC7K70T-1FBG676C is a Kintex-7 FPGA built on 28nm technology, featuring 65,600 logic cells, 300 user I/Os, and 4,976,640 bits of block RAM. It operates at a 1V core voltage and comes in a 676-ball lidless FCBGA package. As of 2026-08-23, it is in stock with 99,999 units available at a base price of $36.5909 per unit (MOQ 1). This device is ideal for software-defined radio, medical imaging, industrial automation, and aerospace/defense applications.
Technical Guide: How to Select, Design In, and Use the XC7K70T-1FBG676C
When selecting the XC7K70T-1FBG676C for your design, verify that your logic requirements fit within 65,600 logic cells and that your I/O count does not exceed 300. The device provides 4,976,640 bits of block RAM for data buffering. For clock management, the FPGA includes MMCM and PLL blocks, supporting flexible clock generation. Configuration can be performed via JTAG, SPI, or BPI interfaces.
Design-in considerations: Ensure adequate decoupling capacitors on all power pins (VCCINT at 1V, VCCAUX at 1.8V) and follow AMD's power-on sequencing guidelines. The lidless FCBGA package requires careful thermal management; use a heatsink or forced airflow for high-utilization designs. The operating temperature range is [DATA_NEEDED: operating temperature range]. Supported I/O standards are [DATA_NEEDED: supported I/O standards].
For layout, reference the pinout for critical pins: VCCINT (B1, F1), GND (B2, D2, F2), VCCAUX (D1), and user I/O pins such as A1, A2, C1, C2, E1, E2. These are essential for power distribution and high-speed signal routing.
Alternatives & Comparison: Drop-in Replacements for the XC7K70T-1FBG676C
For designs requiring a faster speed grade, the XC7K70T-2FBG676C is a drop-in replacement with the same package and pinout but a -2 speed grade. For industrial temperature ranges, the XC7K70T-1FBG676I offers the same package and pinout with industrial temperature rating. The XC7K70T-1FBG676C is also compared with the larger XC7K160T-1FBG676C, which has more logic cells but a different pinout.
| Parameter | XC7K70T-1FBG676C | XC7K70T-2FBG676C | XC7K70T-1FBG676I | XC7K160T-1FBG676C |
|---|---|---|---|---|
| Logic Cells | 65,600 | 65,600 | 65,600 | 160,000 |
| Block RAM (bits) | 4,976,640 | 4,976,640 | 4,976,640 | [DATA_NEEDED: Block RAM] |
| User I/Os | 300 | 300 | 300 | [DATA_NEEDED: User I/Os] |
| Speed Grade | -1 | -2 | -1 | -1 |
| Temperature Grade | Commercial | Commercial | Industrial | Commercial |
| Package | 676-BBGA, FCBGA (lidless) | 676-BBGA, FCBGA (lidless) | 676-BBGA, FCBGA (lidless) | 676-BBGA, FCBGA (lidless) |
| Pinout | Same | Same | Same | Different |
Summary: The XC7K70T-2FBG676C and XC7K70T-1FBG676I are pin-compatible drop-in replacements, offering speed or temperature benefits. The XC7K160T-1FBG676C provides more logic but requires a different PCB layout.
Industry Insight: Market Position, Lifecycle, and Supply Situation
The XC7K70T-1FBG676C has an active lifecycle status, indicating ongoing production and availability. As of 2026-08-23, XAIPART lists 99,999 units in stock, with a base price of $36.5909. The device is part of AMD's Kintex-7 family, which is widely used in mid-range applications. [DATA_NEEDED: Market share data] [DATA_NEEDED: Lead time information]
Trends & Outlook: What Buyers Should Watch
With the active lifecycle and substantial stock, the XC7K70T-1FBG676C remains a reliable choice for current designs. Buyers should monitor AMD's roadmap for potential successors, but the 28nm process and 1V core voltage ensure competitive performance-per-watt. The availability of pin-compatible speed and temperature variants provides design flexibility. [VERIFY_NEEDED: Future availability trends]
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