MPC8536EBVTAULA
MPC8536EBVTAULA - PowerQUICC III 1.333GHz SoC | NXP
The NXP Semiconductors MPC8536EBVTAULA is a PowerQUICC III integrated communications processor built on the Power Architecture e500 core, delivering up to 1.333 GHz (scaling to 1.5 GHz on the family) in a 783-pin FCBGA (29 x 29 mm) package. It integrates DDR2/DDR3 memory controllers, PCI Express, Serial ATA (SATA), Gigabit Ethernet, SDHC, USB, and a Security Engine (SEC) into a single system-on-chip targeted at IP networking, storage, and secure communications equipment. Operating supply rails are 1.5 V / 1.8 V / 2.5 V / 3.3 V with a 0 to 105 C commercial temperature grade.
A PowerQUICC III processor is a type of communications processor that combines a high-performance Power Architecture CPU core with integrated networking peripherals, security accelerators, and memory controllers on a single die. It belongs to the broader hierarchy of microprocessor -> embedded processor -> communications SoC -> PowerQUICC family, designed to replace multiple discrete components in networking appliances with a single integrated device.
Key features include a 32-bit e500 core with dual-issue superscalar execution, integrated DDR2/DDR3 memory controller with ECC, four Gigabit Ethernet MACs (SGMII/RGMII), two PCI Express interfaces, two SATA-II ports, two USB 2.0 controllers (host/device), enhanced local bus, DUART, I2C, SPI, SD/MMC/SDHC host controller, and the NXP Security Engine for IPsec, SSL/TLS, and bulk crypto. The 783-pin FCBGA package uses a 1 mm pitch and supports high-speed parallel interfaces required by line-rate packet processing.
Typical applications include enterprise and SMB routers, secure VPN gateways, network attached storage (NAS) controllers, industrial Ethernet switches, IP-PBX systems, and wireless LAN controllers. The integrated SEC engine offloads AES, DES/3-DES, SHA-1/2, and public-key accelerators from the host core, enabling sustained gigabit IPsec throughput.
When designing with this device, allocate a 4-layer PCB with continuous ground planes under the BGA and matched-length routing for DDR2/DDR3, PCIe, SATA, and SGMII differential pairs. Thermal management must account for the 783-pin FCBGA junction-to-ambient thermal resistance, and a heat spreader is recommended at full 1.333 GHz operation.
This page synthesizes distributor pricing, 783-pin FCBGA drop-in alternatives within the PowerQUICC III and QorIQ families, and practical design notes that complement the manufacturer datasheet for routing, security, and power-rail sequencing decisions.
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