BCM8724BIFBG - Dual-Channel 10-Gigabit Ethernet Transceiver | Broadcom
MPN: BCM8724BIFBG ✓ সক্রিয়BCM8724BIFBG সারাংশ
An Ethernet transceiver is an interface IC that converts data between a digital parallel or serial processing domain and a high-speed physical communication channel. Within the network hierarchy, BCM8724BIFBG belongs to the transceiver class, supporting the physical-layer connection between a network processor or switch ASIC and external copper or optical media. A dual-channel implementation can simplify board planning by supporting two 10-Gigabit links in one package while reducing the number of separate transceiver devices required by a two-port design.
The principal verified feature is dual-channel 10-Gigabit serial operation. The component is categorized as an Ethernet transceiver and as an interface driver, receiver, and transceiver IC. Its 324-terminal ball package provides a substantial connection interface for power, ground, control, reference, and multiple high-speed differential signals. Because exact data-rate variants, electrical specifications, protocol support, reach, and pin assignments are not printed in the available product records, those details should be confirmed against the manufacturer datasheet before schematic capture or PCB release.
BCM8724BIFBG is most relevant to 10-Gigabit Ethernet infrastructure where two channels per package can reduce component count and board area. Potential installations include switch line cards, server network interfaces, routers, optical transceiver modules, test equipment, and industrial communication equipment. The final channel implementation still depends on the exact media interface, equalization or DSP requirements, reference circuitry, and magnetics or optical front-end selected by the system designer.
A high-speed serial transceiver requires careful PCB planning. Controlled-impedance differential routing, short return paths, continuous reference planes, clean power distribution, and appropriate connector or package escape geometry are essential for reliable 10-Gigabit operation. The exposed ball-grid footprint should be placed on a multilayer PCB with uninterrupted high-speed return paths and decoupling placed close to the device's supply pins.
This product page consolidates the verified catalog identity, package characteristics, sourcing links, and technical selection guidance for BCM8724BIFBG. Before committing a design, use the Broadcom datasheet and package drawing to confirm the complete pin list, electrical limits, reference requirements, and application circuit.
এর জন্য ড্রপ-ইন বিকল্প BCM8724BIFBG — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।
BCM8726BIFBG
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
BCM8705LBIFBG
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
BCM8724BIFBG সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য
| Product Type | Dual-channel serial 10-Gigabit Ethernet transceiver |
| Manufacturer | Broadcom Limited |
| ক্যাটাগরি | Integrated Circuits (ICs), interface drivers, receivers, and transceivers |
| Device Function | Ethernet transceiver |
| Channel Count | 2 channels |
| Nominal Serial Data Rate | 10 Gigabit/s per channel |
| Terminal Count | 324 terminals |
| Package Type | Square ball-grid package |
| Terminal Form | Ball |
| Terminal Position | Bottom |
| Package Body Shape | Square |
| মাউন্টিং টাইপ | Surface mount |
| পিন সংখ্যা | 324 balls |
BCM8724BIFBG square পিন কনফিগারেশন গাইড
BCM8724BIFBG (square প্যাকেজ)-এর পিন কনফিগারেশন। এই অ্যানালগ কম্পোনেন্টে ইনপুট, আউটপুট ও পাওয়ার সাপ্লাই পিন রয়েছে। অফসেট নাল, কম্পেনসেশন ও এনেবল পিন কনফিগারেশনের জন্য প্রস্তুতকারকের ডেটাশিট দেখুন। সিগন্যাল কন্ডিশনিং ও অ্যামপ্লিফায়ার সার্কিটের জন্য আদর্শ।
এর জন্য বিস্তারিত পিনআউট ডেটা পাওয়া যায়নি BCM8724BIFBG.
দেখুন ডেটাশিট সম্পূর্ণ পিন কনফিগারেশনের জন্য।
সাধারণ ব্যবহার
BCM8724BIFBG এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: 10-Gigabit Ethernet Switch Line Card, Server Network-Interface Card, 10-Gigabit Optical Module Controller, High-Speed Network Aggregator, Industrial Communication Gateway, Network Test and Measurement Equipment.
10-Gigabit Ethernet Switch Line Card
The BCM8724BIFBG fits a 10-Gigabit Ethernet line card where two high-speed channels must be integrated close to a switching ASIC. Its dual-channel 10-Gigabit identity can reduce the physical transceiver count compared with two single-channel devices, while the 324-ball package provides connections for power, reference, control, and differential signaling. The principal design concern is PCB density: routing two 10-Gigabit interfaces requires short escape paths, continuous reference planes, and carefully controlled impedance. Confirm the supported media type, protocol profile, clock architecture, and reference design in the Broadcom datasheet before committing the line-card schematic.
সুপারিশকৃত
Server Network-Interface Card
The BCM8724BIFBG is relevant to server network-interface cards that need two 10-Gigabit Ethernet links in a compact area. Its two-channel configuration can simplify synchronization and repeated transceiver placement compared with separate single-channel devices. Placement near the connector or optical-module interface can shorten high-speed escape routes, but power delivery, reference stability, and thermal dissipation must be planned around the 324-ball footprint. Use the exact Broadcom application schematic and layout guidance to determine the required PCB stack-up, decoupling, channel-loss budget, and external magnetics or optical front end.
সুপারিশকৃত
10-Gigabit Optical Module Controller
The BCM8724BIFBG can be evaluated for a dual-channel optical-module controller or dual-port optical interface where each channel operates at a nominal 10-Gigabit serial rate. Consolidating two channels into one 324-ball device may reduce controller count and simplify chassis wiring, but the media architecture must match the device's supported reach and electrical specifications. Keep the transceiver's high-speed differential routing short and isolate it from digital and switching-power return currents. Confirm whether the target optical standard, lane count, clock-recovery method, and module electrical interface are directly supported before using this part.
সুপারিশকৃত
High-Speed Network Aggregator
The BCM8724BIFBG is suitable for architecture evaluation in network aggregation equipment requiring two independent 10-Gigabit serial paths. A dual-channel package can support redundant or multi-port aggregation functions while reducing component count at the board edge. The implementation should preserve each channel's controlled-impedance differential pairs and maintain uninterrupted ground references beneath the BGA area. Because the verified records do not specify recovery method, reach, or protocol support, engineers should compare those requirements directly with the manufacturer datasheet and reference circuit rather than infer compatibility from the nominal data rate.
সুপারিশকৃত
Industrial Communication Gateway
The BCM8724BIFBG can support a high-speed industrial communication gateway that bridges a processing platform to two 10-Gigabit Ethernet backhaul or aggregation links. The dual-channel configuration gives the gateway design options for redundant uplinks or parallel traffic paths without using two separate transceiver packages. Industrial enclosure temperature, vibration, power-transient, and isolation requirements must be evaluated separately from the IC's core Ethernet function. Place the device where the exposed ball-grid package can dissipate heat effectively, use robust decoupling, and follow the Broadcom reference layout for differential routing and grounding.
সুপারিশকৃত
Network Test and Measurement Equipment
The BCM8724BIFBG is applicable to test and measurement systems that generate or analyze two 10-Gigabit Ethernet channels. Parallel channels can simplify dual-port traffic generation, loopback testing, or simultaneous instrument synchronization. In such equipment, channel loss and jitter margins are critical, so the physical implementation must preserve controlled impedance and provide clean references. Use the manufacturer's evaluation guidance to determine whether the 324-ball device should be mounted directly on the instrument motherboard or paired with a supported test fixture. Verify thermal margins, power sequencing, and the exact supported electrical media before building production test equipment.
সুপারিশকৃত
সুপারিশকৃত পণ্যের সারসংক্ষেপ
এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা BCM8724BIFBG — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।
নির্বাচন গাইড
বিকল্পের সাথে তুলনা
| পারামিটার | এই পণ্য | BCM8726BIFBG | BCM8705LBIFBG |
|---|---|---|---|
| Product Type | Dual-channel serial 10-Gigabit Ethernet transceiver | Broadcom Ethernet transceiver | Broadcom Ethernet transceiver |
| Manufacturer | Broadcom Limited | Broadcom Limited | Broadcom Limited |
| Package | Square 324-terminal ball-grid package | Square 324-terminal ball-grid package | Square 324-terminal ball-grid package |
| Terminal Count | 324 terminals | 324 terminals | 324 terminals |
| Terminal Form | Ball | Ball | Ball |
| Mounting Type | Surface mount | Surface mount | Surface mount |
মূল পার্থক্যসমূহ
- Two 10-Gigabit Ethernet channels in one device (বনামBCM8705LBIFBG)
- Compact 324-ball integration for high-speed network boards (বনামBCM8726BIFBG)
- Directly categorized for Ethernet transceiver implementations (বনামBCM8705LBIFBG)
ডিজাইন নোট
Treat both 10-Gigabit channels as controlled-impedance differential interfaces. Route each differential pair over a continuous reference plane, minimize stubs and vias, and avoid crossing plane boundaries. Keep connector, magnetics, or optical-module escape paths short because the 324-ball package leaves little room for impedance-discontinuity correction. Use the Broadcom reference layout and stack-up guidance when defining width, spacing, and via geometry.
Confirm every supply rail, its tolerance, sequencing requirement, and decoupling value from the manufacturer application circuit. Place the smallest high-frequency bypass capacitors directly at the relevant BGA power balls, and use lower-frequency bulk capacitance only where reference guidance permits. Do not assume that adjacent supply balls may be combined without following the package power-and-ground map, because incorrect assignment can create return-path discontinuities and channel instability.
Evaluate heat transfer from the 324-ball device in the actual board stack-up and enclosure. The package provides no exposed mechanical heat sink unless the Broadcom drawing explicitly defines one, so copper area and through-plane thermal vias may be required beneath power balls. Use the manufacturer thermal model to estimate junction temperature at the worst-case ambient, networking activity, and supply voltage. Apply the resulting margin to the product's maximum operating temperature.
Verify channel-loss, insertion-loss, return-loss, jitter, and crosstalk budgets for the selected connector, PCB route, magnetics, or optical front end. The 10-Gigabit nominal rate does not define the usable copper reach by itself. Use manufacturer compliance patterns and SI simulation where board length, connector transitions, or media topology depart from the reference design. Keep test points and high-current switching paths away from sensitive differential and reference nodes.
Do not create a production symbol or footprint from the 324-terminal package count alone. Use the exact Broadcom ball map, land pattern, solder-mask and paste guidance, and assembly profile. Likewise, verify the alternative parts' pin assignments rather than assuming that a shared 324-ball package implies interchangeability. A functional replacement must match power, clocks, reference circuitry, control logic, differential I/O, protocol profile, and media support.
কমপ্লায়েন্স তথ্য
The verified catalog records identify the manufacturer, device category, nominal channel function, and package characteristics but do not state individual compliance certifications. Confirm RoHS, REACH, lead-free, halogen-free, conflict-minerals, and automotive qualification status in the Broadcom product documentation.
