EP3C120F780I7 - 119K LE Cyclone III FPGA 780-FBGA | Altera/Intel
MPN: EP3C120F780I7 ✓ সক্রিয়EP3C120F780I7 সারাংশ
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect matrix, surrounded by programmable I/O cells. FPGAs sit at the top of the programmable logic hierarchy (CPLD -> FPGA -> SoC FPGA) and are used to implement arbitrary digital circuits, from glue logic and bus bridges to high-throughput parallel DSP pipelines and soft-core microprocessors. Unlike a fixed ASIC, the function is defined by a user-supplied bitstream stored in external configuration memory.
Key features of the EP3C120F780I7 include up to 531 user I/O pins, 4 PLLs for clock management, dedicated 18x18 hardware multipliers for DSP, and support for external memory interfaces including DDR/DDR2/QDRII SRAM. The device family provides up to 288 embedded 9x9 multipliers and 4 Mbits of on-chip RAM, making it suitable for cost-sensitive mid-density designs. Configuration is supported via passive serial, fast passive parallel, active serial (EPCS), and JTAG modes.
Architecturally, the Cyclone III EP3C120 uses a logic-array-based fabric with row and column interconnect, 8-input adaptive logic modules (ALMs), and per-MLAB distributed memory. Process technology is TSMC 65 nm low-power CMOS with 1.2 V core supply, giving a favorable performance-per-watt ratio compared to earlier Cyclone II and Stratix generations. The 780-FBGA package uses a wire-bond die with a controlled-impedance substrate, supporting LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks.
Typical applications include industrial motor control and machine vision, video processing and display controllers, telecom line cards and baseband prototyping, low-cost software-defined radio, and PCI/PCI Express endpoint bridges. The wide operating temperature range also makes it attractive for military and aerospace subsystems where extended-temperature commercial-grade FPGAs are acceptable.
When designing with the EP3C120F780I7, plan configuration memory carefully: the uncompressed bitstream exceeds 25 Mbits, so a 64-Mbit EPCS or parallel flash is typically required. Use the Quartus II PowerPlay analyzer early to model thermal dissipation, and follow the Altera pin connection guidelines for unused I/O banks to avoid leakage. Decoupling should follow the Altera reference design with 100 nF plus 10 µF bulk capacitors per power pin pair.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Cyclone III family, and practical design notes not found in the manufacturer datasheet alone.
এর জন্য ড্রপ-ইন বিকল্প EP3C120F780I7 — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।
এই সিরিজের ভ্যারিয়েন্ট
একই সিরিজের মডেল যেগুলো drop-in compatible EP3C120F780I7 (একই form factor এবং footprint) — পার্থক্য রয়েছে Package, Process Technology, Operating Temperature, Configuration Modes, Speed Grade.
EP3C120F780C7N
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP3C120F780C8N
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP3C120F780C8NAE
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP3C120F780C7NAD
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP3C120F780C7AD
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP3C120F780I7 সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য
| Family | Cyclone III |
| Device Type | FPGA (Field Programmable Gate Array) |
| Logic Elements | 119,088 |
| Logic Array Blocks (LABs) | 7,443 |
| Total Memory Bits | 3,981,312 |
| Embedded Multipliers (18x18) | 288 |
| User I/O Pins | 531 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.2 V |
| Internal Frequency | 472 MHz (max) |
| অপারেটিং তাপমাত্রা | -40C to +100C (industrial, "I" grade) |
| প্যাকেজ | 780-ball FBGA (F780), 29x29 mm, 1.0 mm pitch |
| Speed Grade | 7 |
| RoHS স্ট্যাটাস | Compliant |
EP3C120F780I7 780-ball fbga (f780), 29x29 mm, 1.0 mm pitch পিন কনফিগারেশন গাইড
EP3C120F780I7 (780-ball fbga (f780), 29x29 mm, 1.0 mm pitch প্যাকেজ)-এর পিন কনফিগারেশন। এই ডিজিটাল IC-তে GPIO, কমিউনিকেশন ইন্টারফেস (UART, SPI, I2C) এবং পাওয়ার পিন রয়েছে। বিকল্প পিন ফাংশন ও কনফিগারেশন অপশনের জন্য প্রস্তুতকারকের ডেটাশিট দেখুন। এমবেডেড সিস্টেম ডিজাইন ও PCB লেআউটের জন্য অপরিহার্য।
এর জন্য বিস্তারিত পিনআউট ডেটা পাওয়া যায়নি EP3C120F780I7.
দেখুন ডেটাশিট সম্পূর্ণ পিন কনফিগারেশনের জন্য।
সাধারণ ব্যবহার
EP3C120F780I7 এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: Industrial Motor Control & Drive, Video Processing & Display Controllers, Telecom Line Card & Protocol Bridging, Software-Defined Radio Baseband, PCI/PCI Express Endpoint Bridge, Machine Vision & Image Acquisition.
Industrial Motor Control & Drive
The EP3C120F780I7 fits industrial motor control because its 119,088 logic elements and 288 18x18 multipliers can implement multi-axis field-oriented control (FOC) loops, encoder feedback decoding, and PWM generation simultaneously. The 4 on-chip PLLs generate the switching-frequency clock and the resolver-excitation reference from a single 50 MHz crystal, eliminating external clock buffers. With 531 user I/Os the device interfaces directly to multi-channel ADCs for current sensing, to gate drivers via differential LVDS, and to industrial Ethernet MACs. The -40C to +100C industrial temperature grade allows deployment in uncooled cabinet locations.
সুপারিশকৃত
Video Processing & Display Controllers
The EP3C120F780I7 is well matched to mid-density video processing: 3,981,312 bits of embedded memory provide enough line buffers for 1080p60 color-space conversion and deinterlacing, while 288 18x18 multipliers accelerate scaling and sharpening filters in real time. The 531 I/Os support parallel RGB/CMOS camera input, HDMI/DVI TMDS links via LVDS, and BT.656/1120 display output. The 65 nm process keeps dynamic power manageable at 148.5 MHz pixel clocks, and the 4 PLLs generate independent video, audio, and memory clocks. Altera's VIP suite can drop pre-verified video IPs directly into the fabric.
সুপারিশকৃত
Telecom Line Card & Protocol Bridging
Telecom line cards need dense glue logic, multi-protocol bridging, and timing recovery, all of which the EP3C120F780I7 provides. The 119K logic elements can host 8-16 channelized T1/E1 framers plus an HDLC controller and a Utopia/Serial RapidIO bridge on a single device, replacing multiple CPLDs and ASICs. The 4 PLLs derive per-channel clocks from a Stratum-3 reference, and the 531 I/Os mate with HFR/Framer ICs through HSTL/SSTL interfaces. The industrial -40C to +100C temperature grade covers outdoor DSLAM and base-station mezzanine cards.
সুপারিশকৃত
Software-Defined Radio Baseband
Low-cost software-defined radio baseband designs map naturally onto the EP3C120F780I7: the 288 18x18 hardware multipliers implement digital down/up-conversion, channelization, and pulse-shaping filters, while the embedded memory holds coefficient banks for adaptive demodulation. The 4 PLLs derive sampling and IF clocks from a single TCXO. The 531 I/Os connect to dual ADCs/DACs over LVDS, to a host CPU via parallel or serial interface, and to front-panel status LEDs. The 65 nm low-power process gives favorable W/MHz for portable SDR and tactical-radio form factors.
সুপারিশকৃত
PCI/PCI Express Endpoint Bridge
The EP3C120F780I7 implements a single-lane PCI Express endpoint or a 64-bit/66 MHz PCI bridge with its 119K logic elements comfortably, leaving 60-70% utilization for user application logic on the bus-master side. The 4 PLLs generate the 100 MHz PCIe reference and the 66 MHz PCI clock from a common source. The 531 I/Os handle the 64-bit PCI/PCI-X data bus, JTAG, and local-bus glue to DSPs and memories. The industrial temperature range covers blade-server mezzanine cards in unconditioned environments.
সুপারিশকৃত
Machine Vision & Image Acquisition
Machine vision pipelines combining image preprocessing, color-space conversion, and feature extraction benefit from the EP3C120F780I7's 288 multipliers and 3.98 Mbits of block RAM. The 531 I/Os accept multi-lane Camera Link, MIPI-CSI-2 (with soft PHY), and parallel RGB sensor inputs at full throughput. The 4 PLLs generate the camera pixel clock, the processing clock, and an Ethernet-side clock for GigE Vision output. The -40C to +100C industrial grade supports factory-floor and outdoor inspection cameras. Altera's VIP and OpenCL SDKs accelerate image-pipeline development.
সুপারিশকৃত
সুপারিশকৃত পণ্যের সারসংক্ষেপ
এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা EP3C120F780I7 — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।
নির্বাচন গাইড
বিকল্পের সাথে তুলনা
| পারামিটার | এই পণ্য | EP3C120F780C7N | EP3C120F780C8N | EP3C120F780C8NAE | EP3C120F780C7NAD | EP3C120F780C7AD |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-FBGA (F780) 29x29 mm | 780-FBGA (F780) 29x29 mm | 780-FBGA (F780) 29x29 mm | 780-FBGA (F780) 29x29 mm | 780-FBGA (F780) 29x29 mm | 780-FBGA (F780) 29x29 mm |
| Logic Elements | 119,088 | 119,088 | 119,088 | 119,088 | 119,088 | 119,088 |
| Speed Grade | 7 | 7 | 8 (slower) | 8 (slower) | 7 | 7 |
| Temperature Grade | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Extended -40C to +125C | Automotive -40C to +125C | Commercial automotive flow 0C to +85C |
| User I/O | 531 | 531 | 531 | 531 | 531 | 531 |
| Embedded Memory (bits) | 3,981,312 | 3,981,312 | 3,981,312 | 3,981,312 | 3,981,312 | 3,981,312 |
| 18x18 Multipliers | 288 | 288 | 288 | 288 | 288 | 288 |
মূল পার্থক্যসমূহ
- Industrial temperature grade -40C to +100C in 780-FBGA (বনামEP3C120F780C7N)
- Faster speed grade 7 timing closure (বনামEP3C120F780C8N)
- Highest-density Cyclone III member in 780-FBGA (বনামEP3C120F484I7)
ডিজাইন নোট
The EP3C120F780I7 requires multiple power rails: VCCINT 1.2 V for the core logic, VCCAUX 2.5 V for PLLs and configuration, VCCIO 1.2-3.3 V per I/O bank (8 banks), and VCCPD 3.3 V for the configuration I/O. Decoupling per the Altera Cyclone III reference design is 100 nF plus 10 µF bulk per power pin pair, with the placement within 50 mils of the BGA via. A bulk capacitor of 330 µF on VCCINT and 100 µF on VCCAUX is recommended to handle inrush during configuration.
The 780-ball FBGA uses 1.0 mm ball pitch on a 29x29 mm substrate, requiring a 6-layer PCB minimum with microvia-in-pad or via-in-pad technology for the inner-row escape. Signal fanout should use the dog-bone pattern from the BGA break-out layer to a 4-mil trace/space inner layer, with the top and bottom reserved for component placement and a solid ground/power plane. Differential pair length matching for LVDS must be within ±10 mil, and DDR/2 interface traces need ±25 mil matching with fly-by topology.
Configuration mode pins MSEL[3:0] must be set to the correct mode (e.g., 0000 for active serial, 0100 for passive parallel) before power-up; the wrong setting will prevent configuration. The nCONFIG pin must be held low during power-up to abort any spurious configuration attempts. Unused I/O banks should be tied to VCCIO through a 10 kΩ resistor and VREF pins left floating, per the Altera pin connection guidelines. JTAG TCK should be pulled to ground through 1 kΩ if unused to avoid noise-induced configuration attempts.
কমপ্লায়েন্স তথ্য
RoHS and lead-free per Altera/Intel product marking; the I7 industrial temperature grade is not AEC-Q100 qualified - for automotive use, choose the EP3C120F780C7NAD AEC-Q100 screened variant. Halogen-free status is not explicitly published for this part number.
