EP3C25F256C6N - 24,624-LC FPGA, 500 MHz | Altera
MPN: EP3C25F256C6N ✓ সক্রিয়EP3C25F256C6N সারাংশ
A field-programmable gate array, or FPGA, is a programmable semiconductor within the broader logic-device hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic blocks, programmable interconnect and configurable I/O in one device. Cyclone III devices use this architecture to support designs that can be updated after manufacture, allowing product revisions, hardware customization and field upgrades without changing the physical PCB.
The EP3C25F256C6N combines 24,624 logic elements with 156 I/O pins, providing a substantial logic resource for parallel processing, control logic, protocol bridges and embedded system functions. Its 1.2 V supply specification and 500 MHz associated operating figure make it appropriate for designs that require considerably more programmable logic than a small programmable logic device. The 256-LBGA package also supports dense board layouts while exposing a high pin count for external interfaces.
The C6 suffix identifies the device's speed grade within the Cyclone III family, while the 256 package suffix corresponds to the 256-ball package configuration. Device selection should include the logic budget, available I/O, pin assignment, memory requirements, clocking architecture, power budget and required design-tool support. The complete package pinout and electrical limits should be checked against the manufacturer datasheet before PCB routing or power-supply design is released.
Typical uses include industrial automation controllers, communications interfaces, test and measurement equipment, embedded control systems and general-purpose digital signal-processing platforms. In each case, the FPGA allows parallel logic blocks to execute concurrently, which can shorten the implementation of control, acquisition and interface functions when a designer does not want to create a dedicated ASIC.
A key design consideration is that an FPGA board must provide stable core and I/O supplies, clocking, configuration support and decoupling. Power estimation must cover logic utilization, switching activity, I/O standards and environmental conditions rather than relying only on a nominal device frequency. PCB signal-integrity planning is also essential because the 256-LBGA footprint requires careful escape routing and power-plane construction.
This product record combines the device's principal logic, package, temperature and supply characteristics with application guidance, drop-in family alternatives and design cautions. Those engineering details help buyers identify whether the EP3C25F256C6N fits an existing design before requesting a quotation or beginning PCB work.
এর জন্য ড্রপ-ইন বিকল্প EP3C25F256C6N — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।
এই সিরিজের ভ্যারিয়েন্ট
একই সিরিজের মডেল যেগুলো drop-in compatible EP3C25F256C6N (একই form factor এবং footprint) — পার্থক্য রয়েছে Operating Temperature, Device Type, Package, Package Type, Mounting Type.
EP3C25F256C8N
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP3C25F256C8
✅ ড্রপ-ইন ⚠️ স্পেক যাচাইকৃত নয়মূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP3C25F256C7N
✅ ড্রপ-ইন ⚠️ স্পেক যাচাইকৃত নয়📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
EP3C25F256C7
✅ ড্রপ-ইন ⚠️ স্পেক যাচাইকৃত নয়মূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP3C25F256C6
✅ ড্রপ-ইন ⚠️ স্পেক যাচাইকৃত নয়মূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP3C25F256C6N সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone III |
| Logic Elements | 24,624 |
| I/O Pins | 156 |
| Embedded Memory | 608,256 bits |
| Associated Operating Frequency | 500 MHz |
| সাপ্লাই ভোল্টেজ | 1.2 V |
| প্যাকেজ | 256-LBGA |
| Package Pin Count | 256 pins |
| মাউন্টিং টাইপ | Surface Mount |
| অপারেটিং তাপমাত্রা | -40°C to 125°C |
| Lead-Free Status | Lead Free |
EP3C25F256C6N 256 pins পিন কনফিগারেশন গাইড
EP3C25F256C6N (256 pins প্যাকেজ)-এর পিন কনফিগারেশন। এই ডিজিটাল IC-তে GPIO, কমিউনিকেশন ইন্টারফেস (UART, SPI, I2C) এবং পাওয়ার পিন রয়েছে। বিকল্প পিন ফাংশন ও কনফিগারেশন অপশনের জন্য প্রস্তুতকারকের ডেটাশিট দেখুন। এমবেডেড সিস্টেম ডিজাইন ও PCB লেআউটের জন্য অপরিহার্য।
এর জন্য বিস্তারিত পিনআউট ডেটা পাওয়া যায়নি EP3C25F256C6N.
দেখুন ডেটাশিট সম্পূর্ণ পিন কনফিগারেশনের জন্য।
সাধারণ ব্যবহার
EP3C25F256C6N এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: Industrial Automation Controllers, Communications Interface Equipment, Test and Measurement Systems, Embedded Control and Data Acquisition, Digital Signal Processing, Programmable Logic Education and Prototyping.
Industrial Automation Controllers
The Altera EP3C25F256C6N fits industrial automation controllers that require concurrent control logic, sequencing and communication functions on one programmable device. Its 24,624 logic elements provide capacity for parallel state machines and interface logic, while 156 I/O pins allow the controller to connect sensors, actuators and field-bus interface logic. The -40°C to 125°C operating range supports equipment designed for extended industrial temperature conditions. A typical design places the FPGA beside isolation, signal-conditioning and driver circuits, then uses the 1.2 V supply specification for core regulation. Confirm logic utilization, timing margin, I/O standards and thermal performance before production release.
সুপারিশকৃত
Communications Interface Equipment
The EP3C25F256C6N is suitable for communications-interface equipment requiring parallel protocol processing, packet buffering and configurable external connectivity. Its 24,624 logic elements and 608,256 bits of embedded memory allow designers to combine framing, state management and data-routing functions instead of using several smaller programmable devices. The associated 500 MHz operating figure provides a useful basis for timing planning, although the achieved interface rate depends on the selected I/O standard and design closure. The 256-LBGA package provides a dense connection point for board-level transceivers or supporting logic. Validate signal integrity, clocking, termination and protocol-specific timing with the exact tool release used for production.
সুপারিশকৃত
Test and Measurement Systems
The EP3C25F256C6N can serve as the central programmable logic device in test and measurement systems that coordinate acquisition, pattern generation and result processing. Its 24,624 logic elements allow multiple measurement channels and control paths to operate concurrently, while the 156 I/O pins support external instruments and trigger signals. The 1.2 V core specification helps define the power architecture, but actual consumption depends on logic utilization, I/O activity, clocking and speed grade. Designers should reserve clean clock routing and assign acquisition channels according to the manufacturer I/O rules. Timing closure, deterministic control behavior and output-accuracy analysis should be completed before the instrument configuration is frozen.
সুপারিশকৃত
Embedded Control and Data Acquisition
The EP3C25F256C6N is appropriate for embedded control and data-acquisition products that combine sensor inputs, decision logic and actuator outputs in a compact system. Its 24,624 logic elements can implement parallel sampling, filtering or control pipelines, and the 156 available I/O pins provide flexibility for digital sensors, counters and external control signals. The associated 500 MHz figure can support demanding synchronous logic, but designers must verify that board-level clock quality and I/O timing satisfy the design targets. The 256-LBGA package reduces board area compared with a leaded package while making escape-routing quality important. Document configuration loading, startup behavior and power sequencing so the system can recover predictably after reset.
সুপারিশকৃত
Digital Signal Processing
The EP3C25F256C6N can implement parallel digital signal-processing functions such as filtering, correlation, waveform generation and real-time data routing. Its 24,624 logic elements and 608,256 bits of embedded memory provide configurable resources for pipelined arithmetic and buffer management, while 156 I/O pins support high-throughput data movement into external memory or conversion circuitry. The associated 500 MHz operating figure allows aggressive pipelines, but actual throughput depends on resource sharing, memory bandwidth and timing closure. Use the manufacturer speed-grade tables to select the required operating conditions, and evaluate output latency as well as peak clock frequency. Board-level power and thermal analysis should include switching activity because static logic utilization alone does not determine dissipated power.
সুপারিশকৃত
Programmable Logic Education and Prototyping
The EP3C25F256C6N is suitable for FPGA education, prototyping and embedded-systems laboratories because it provides 24,624 logic elements, 156 I/O pins and 608,256 bits of embedded memory in a surface-mount 256-LBGA package. Students or engineers can implement processors, interfaces, counters, state machines and parallel datapaths without producing a custom ASIC. The associated 500 MHz operating figure supports instructive timing experiments, while the -40°C to 125°C range permits evaluation across industrial conditions. For prototype boards, preserve access to configuration, clock, reset and programming interfaces even when the external design does not use every I/O. Before assembly, verify the exact pin assignments, decoupling network, clock source and exposed-pad connection in the manufacturer documentation.
সুপারিশকৃত
সুপারিশকৃত পণ্যের সারসংক্ষেপ
এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা EP3C25F256C6N — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।
নির্বাচন গাইড
বিকল্পের সাথে তুলনা
| পারামিটার | এই পণ্য | EP3C25F256C8N | EP3C25F256C8 | EP3C25F256C7N | EP3C25F256C7 | EP3C25F256C6 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 256-LBGA | 256-LBGA - same package | 256-LBGA - same package | 256-LBGA - same package | 256-LBGA - same package | 256-LBGA - same package |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 | 24,624 |
| I/O Pins | 156 | 156 | 156 | 156 | 156 | 156 |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| Speed Grade | C6 | C8 | C8 | C7 | C7 | C6 |
মূল পার্থক্যসমূহ
- Exact C6 grade selection with full 256-LBGA logic resource (বনামEP3C25F256C7)
- Pin-compatible higher-speed family option (বনামEP3C25F256C8N)
- Industrial-temperature capability for embedded control (বনামEP3C25F256C6)
ডিজাইন নোট
Design the core and I/O supplies around the exact manufacturer power table for the selected speed grade, temperature range and I/O standards. The 1.2 V figure identifies the associated core supply, but it is not a complete board power budget. Separate the FPGA core rail from other board loads, verify sequencing, and include local high-frequency decoupling at each supply ball. Estimate worst-case dissipation from logic utilization, switching activity and I/O loading rather than from the 500 MHz associated figure alone.
Use the manufacturer 256-LBGA land pattern and pin-assignment tables directly when planning the PCB. Keep the core, I/O and ground connections consistent with the reference escape-routing pattern, and preserve short return paths for every high-speed net. The dense ball grid requires deliberate layer transitions, via placement and plane continuity; a schematic-only pin assignment does not guarantee a manufacturable escape route. Check drill, solder-mask, paste and land-pattern dimensions against the current package drawing.
Assign clocks and high-speed interfaces according to the device's supported I/O standards and the board's physical topology. Account for skew, insertion loss, return discontinuities and simultaneous-switching noise rather than relying only on logic timing reports. Use controlled clock distribution, matched termination where required and point-to-point routing for sensitive interfaces. Re-run signal-integrity and timing analysis after component placement, layer-stack changes or substitutions between C6, C7 and C8 speed grades.
Do not treat the EP3C25F256C6N and EP3C25F256C8N as interchangeable without checking the complete design. Although the family variants share the 256-ball arrangement, their speed-grade designation changes timing and power characteristics. Also avoid inferring the complete 256-ball pinout from a generic Cyclone III diagram: configuration pins, power balls, ground balls and user I/O must be assigned from the exact MPN datasheet. Record the device name in the configuration-file generation flow to prevent an unintended speed-grade mismatch.
কমপ্লায়েন্স তথ্য
The exact MPN is identified as lead free. No explicit RoHS, REACH, halogen-free, conflict-minerals or automotive-qualification statement was established for this device, so those fields remain unknown or not applicable.
