EP4CE15F17A7N - 15,408-Cell 1.2V FPGA | Intel
MPN: EP4CE15F17A7N ✓ সক্রিয়EP4CE15F17A7N সারাংশ
A field-programmable gate array is a programmable digital integrated circuit. Its configurable logic blocks, programmable interconnects and input/output resources allow a hardware design to be implemented and revised through configuration data rather than a fixed circuit layout. Within the semiconductor hierarchy, an FPGA is a programmable logic device, an integrated circuit and a reconfigurable digital-logic component. The Cyclone IV E family combines programmable logic resources with integrated configurable resources for control, signal processing and connectivity-oriented designs.
The EP4CE15F17A7N provides 15,408 logic cells, with a comparison reference identifying 963 configurable logic blocks. Its listed maximum frequency is 472.5 MHz, while its core operating voltage is 1.2 V. These figures make the device suitable for designs requiring moderate parallel-processing capacity, deterministic control logic and compact integration without changing the PCB footprint when design requirements evolve.
The F17 package designation identifies the physical package configuration used by this ordering part number. The EP4CE15F17A7N is offered in a 256-LBGA package measuring 17 mm by 17 mm, with 256 ball terminals. The component is identified as an automotive-grade Cyclone IV E FPGA and an AEC-Q100 listing, making the temperature qualification relevant for automotive and other demanding embedded applications.
Typical design roles include industrial automation controllers, vehicle electronics, communications infrastructure, test equipment and embedded signal-processing systems. Its programmable architecture supports parallel interfaces, control logic and data acquisition in a single device, while the 256-terminal package provides extensive external connectivity for high-pin-count mixed-signal and digital designs.
PCB implementation should follow the manufacturer's ball map, power-plane recommendations and decoupling guidance. Because a 256-LBGA device has a dense pitch and numerous supply and ground connections, inspection, assembly and thermal performance depend on careful escape-routing, layer-stack selection and via placement. Use the manufacturer pin and package information to assign every ball and confirm the exact power-domain requirements.
This product page consolidates the device's key electrical, logical-capacity, packaging and automotive-qualification facts with practical design guidance, sourcing questions and a same-package migration reference. It is intended to help engineers confirm fit, qualify the device for an application and evaluate a drop-in option without overlooking FPGA-specific package or lifecycle constraints.
এর জন্য ড্রপ-ইন বিকল্প EP4CE15F17A7N — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।
EP4CE15F17C7N
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →EP4CE15F17A7N সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য
| Device Type | Cyclone IV E field-programmable gate array |
| Logic Elements | 15,408 cells |
| Configurable Logic Blocks | 963 CLBs |
| Maximum Frequency | 472.5 MHz |
| Core Supply Voltage | 1.2 V |
| প্যাকেজ | 256-LBGA |
| Package Dimensions | 17 mm x 17 mm |
| Terminal Count | 256 balls |
| মাউন্টিং টাইপ | Surface mount |
| Package Family | BGA family |
| Temperature Grade | Automotive |
| Automotive Qualification | AEC-Q100 |
| Device Family | Cyclone IV E |
| Family Device | EP4CE15 |
| Package Variant | F17 |
| Programmable Logic Type | SRAM FPGA |
EP4CE15F17A7N f17 পিন কনফিগারেশন গাইড
EP4CE15F17A7N (f17 প্যাকেজ)-এর পিন কনফিগারেশন। এই ডিজিটাল IC-তে GPIO, কমিউনিকেশন ইন্টারফেস (UART, SPI, I2C) এবং পাওয়ার পিন রয়েছে। বিকল্প পিন ফাংশন ও কনফিগারেশন অপশনের জন্য প্রস্তুতকারকের ডেটাশিট দেখুন। এমবেডেড সিস্টেম ডিজাইন ও PCB লেআউটের জন্য অপরিহার্য।
এর জন্য বিস্তারিত পিনআউট ডেটা পাওয়া যায়নি EP4CE15F17A7N.
দেখুন ডেটাশিট সম্পূর্ণ পিন কনফিগারেশনের জন্য।
সাধারণ ব্যবহার
EP4CE15F17A7N এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: Automotive Electronics, Industrial Automation and Control, Communications Infrastructure, Test and Measurement Equipment, Embedded Signal Processing, Security and Surveillance Systems.
Automotive Electronics
The EP4CE15F17A7N fits automotive electronics designs that require a programmable FPGA with 15,408 logic elements, 963 configurable logic blocks and operation from a 1.2 V core. Its AEC-Q100 identification supports qualification work for vehicle electronic control units, body modules and communication gateways. The 256-LBGA package exposes a large number of connections for sensors, actuators and vehicle networks, but implementation must follow the manufacturer ball map, power domains and automotive qualification requirements. Validate temperature, transient behavior, supply sequencing and functional-safety obligations for the complete vehicle platform before production release.
Industrial Automation and Control
The EP4CE15F17A7N is appropriate for industrial automation controllers that combine sequencing, communications and parallel control logic in one programmable device. Its 15,408 logic elements and 472.5 MHz maximum performance provide capacity for multi-channel control, while the 256-LBGA package supports numerous external interfaces. Designers can implement protocols, motion sequences and machine-safety interlocks as configurable logic and update functionality through the device's configuration mechanism. Confirm industrial temperature requirements, I/O voltage domains, clocking strategy and long-term availability before integrating the FPGA into a controller intended for a long service life.
Communications Infrastructure
The EP4CE15F17A7N can support communications infrastructure designs requiring parallel data paths, packet processing and control functions. Its 15,408 logic elements are suitable for moderate-throughput channelization, interface adaptation and system control when the final design fits the available logic, memory and I/O resources. The 1.2 V core and high-pin-count 256-LBGA package enable integration with external transceivers and network processors, while a programmable architecture allows protocol updates without a PCB respin. Timing closure, transceiver interface standards, reference-clock quality and thermal performance must be evaluated with the target system's actual data rates and utilization.
Test and Measurement Equipment
The EP4CE15F17A7N is useful in compact test and measurement equipment where acquisition sequencing, pattern generation, timing control and data routing benefit from programmable logic. The device's 963 configurable logic blocks and 472.5 MHz maximum frequency can implement multiple coordinated digital channels, while the 256-LBGA package provides connections to converters, memories and interface transceivers. Use the FPGA's programmable I/O and clock resources to match the instrumentation architecture, but verify input thresholds, output drive, termination and supported voltage standards for every connected device. Signal-integrity simulation and timing analysis are essential before laboratory deployment.
Embedded Signal Processing
The EP4CE15F17A7N supports embedded signal-processing workloads that combine fixed control functions with configurable parallel pipelines. The 15,408 logic elements can accommodate filtering, correlation, data formatting and digital control when resource estimates fit the device, while the 472.5 MHz maximum frequency enables time-sensitive processing. Place the FPGA between external sensors or converters and downstream memory or communications logic, and define clock boundaries carefully to prevent timing violations. Confirm whether the selected Cyclone IV E resources include the required DSP, memory and hardened interface blocks, and complete post-route timing and power analysis before hardware release.
Security and Surveillance Systems
The EP4CE15F17A7N can serve as the programmable processing fabric in security and surveillance equipment requiring multiple image or sensor interface streams, motion detection logic and system control. Its configurable architecture permits sensor timing, data reduction and event handling to be developed in hardware, while the 256-LBGA package supports external memory and high-speed interface connections. The device is not marketed in the cited information as a dedicated security processor, so cryptographic functions and protected configuration requirements must be evaluated separately. Confirm compliance obligations, I/O compatibility, thermal loading and system-update strategy for each surveillance product.
এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা EP4CE15F17A7N — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।
নির্বাচন গাইড
বিকল্পের সাথে তুলনা
| পারামিটার | এই পণ্য | EP4CE15F17C7N |
|---|---|---|
| Device Family | Cyclone IV E | Cyclone IV E |
| Brand | Intel | Intel |
| Package | 256-LBGA | 256-LBGA |
| Logic Elements | 15,408 cells | 15,408 cells |
| Ordering Grade | A7 automotive ordering code | C7 ordering code |
মূল পার্থক্যসমূহ
- Automotive-grade ordering option (বনামEP4CE15F17C7N)
- Identical logic capacity within the migration family (বনামEP4CE15F17C7N)
- Same 256-LBGA migration footprint (বনামEP4CE15F17C7N)
ডিজাইন নোট
Follow the manufacturer's recommended core and I/O supply topology, decoupling and power-up sequencing. The 1.2 V core requirement does not imply that every bank can use 1.2 V I/O; each bank has its own voltage constraints. Place high-frequency decoupling capacitors at the appropriate supply and ground balls using the pin-specific layout guidance. Estimated: total device dissipation requires the design's selected I/O voltages, utilization, output loading and static power, so it must be obtained from post-fit Quartus power analysis rather than inferred from the 1.2 V core value.
Use the 256-LBGA land pattern and ball map associated specifically with EP4CE15F17A7N. Escape-route balls in accordance with the recommended PCB stack-up, paying attention to via-in-pad requirements, solder-mask design and differential-pair symmetry. Do not infer ball functions from the package dimensions or commercial listing. Review escape-routing and power-plane connectivity with the package design rules, and verify manufacturing capability for the 17 mm by 17 mm package before releasing artwork.
Assign clocks, high-speed I/O and sensitive interfaces using the manufacturer's supported standards and complete timing analysis with actual board constraints. The listed 472.5 MHz maximum frequency is a device capability point, not a guaranteed system operating frequency for every design. Constrain input and output timing, model board-level loss and skew, and verify the selected I/O voltage against external-device requirements. Poor clock distribution or mismatched edge rates can undermine timing closure even when logic utilization remains within device limits.
Do not approve a migration based only on the shared EP4CE15 F17 package name. The A7 and C7 ordering suffixes may affect speed, temperature or qualification criteria. For EP4CE15F17C7N, verify timing, operating-temperature limits, power characteristics, configuration compatibility and lifecycle status in the manufacturer documentation. Also confirm that the design's configuration flash interface and JTAG requirements remain compatible. A PCB-compatible footprint alone does not prove functional, timing or qualification equivalence.
কমপ্লায়েন্স তথ্য
The manufacturer-associated product listing identifies EP4CE15F17A7N as an automotive AEC-Q100 device. RoHS, REACH, lead-free, halogen-free and conflict-minerals status were not established from the cited information.
