M2GL010-VF256I - 12K LEs Industrial IGLOO2 FPGA | Microchip
MPN: M2GL010-VF256I ✓ সক্রিয়M2GL010-VF256I সারাংশ
The IGLOO2 architecture combines programmable logic, embedded memory, and configurable I/O in a low-power package. The M2GL010-VF256I provides 12,084 logic elements, making it appropriate for compact control, interface, and signal-processing designs that require programmable hardware rather than a fixed-function ASIC. The 256-ball LFBGA package provides a high pin count and supports dense board layouts when the associated I/O and power requirements are carefully managed.
Key verified attributes include the 12K LEs logic capacity, 138 I/O, 256 LFBGA package, industrial temperature grade, and surface-mount ball-grid construction. The product is associated with a 1.2 V device supply in the cross-reference data, while detailed operating conditions, memory configuration, I/O standards, power consumption, and timing figures were not included in the supplied verified results and are therefore not inferred here. A complete design should use the manufacturer datasheet and IGLOO2 pin-description guide for exact bank, voltage, and I/O rules.
Typical applications include communications equipment, industrial automation, bridging functions, input/output expansion, protocol conversion, system management, and secure connectivity. The programmable architecture allows a design to be adapted after hardware fabrication, which can shorten development cycles for low-volume or evolving systems. The industrial grade designation is useful for equipment expected to operate beyond consumer-temperature environments, subject to the complete datasheet limits.
Layout requires careful treatment of the 256-ball BGA, including via-in-pad or via-under-ball escape routing, plane continuity, and thermal management. The 1.2 V core rail and associated I/O supplies should be separated and decoupled according to the manufacturer guidance. Designers should also confirm the exact package ball map, unused-ball treatment, configuration mechanism, clocking requirements, and power-up behavior before releasing a PCB.
This page combines verified distributor listings, the Microchip product page, and the IGLOO2 family datasheet resources with engineering-focused application guidance. It distinguishes confirmed M2GL010 attributes from parameters that require confirmation from the manufacturer datasheet, helping procurement, hardware, and firmware engineers evaluate the M2GL010-VF256I without relying on unsupported substitute claims.
এর জন্য ড্রপ-ইন বিকল্প M2GL010-VF256I — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।
এই সিরিজের ভ্যারিয়েন্ট
একই সিরিজের মডেল যেগুলো drop-in compatible M2GL010-VF256I (একই form factor এবং footprint) — পার্থক্য রয়েছে Device Type, Logic Elements, Package, Mounting Type, REACH Status.
M2GL010-VFG256I
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
M2GL010-1VFG256I
✅ ড্রপ-ইন📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)
M2GL010-VF256
✅ ড্রপ-ইনমূল্যের জন্য যোগাযোগ করুন
ডেটাশিট দেখুন →M2GL010-VF256I সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য
| Device Type | IGLOO2 low-density FPGA |
| Logic Elements | 12,084 LEs |
| I/O Count | 138 I/O |
| প্যাকেজ | 256-LFBGA |
| Package Type | LFBGA-256 |
| Number of Terminals | 256 |
| মাউন্টিং টাইপ | Surface Mount |
| Terminal Form | Ball |
| Package Shape | Square |
| Temperature Grade | Industrial |
| Core Supply | 1.2 V |
| Programmable Logic | FPGA |
| Product Status | In Production |
| RoHS স্ট্যাটাস | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
M2GL010-VF256I square পিন কনফিগারেশন গাইড
M2GL010-VF256I (square প্যাকেজ)-এর পিন কনফিগারেশন। এই ডিজিটাল IC-তে GPIO, কমিউনিকেশন ইন্টারফেস (UART, SPI, I2C) এবং পাওয়ার পিন রয়েছে। বিকল্প পিন ফাংশন ও কনফিগারেশন অপশনের জন্য প্রস্তুতকারকের ডেটাশিট দেখুন। এমবেডেড সিস্টেম ডিজাইন ও PCB লেআউটের জন্য অপরিহার্য।
এর জন্য বিস্তারিত পিনআউট ডেটা পাওয়া যায়নি M2GL010-VF256I.
দেখুন ডেটাশিট সম্পূর্ণ পিন কনফিগারেশনের জন্য।
সাধারণ ব্যবহার
M2GL010-VF256I এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: Industrial Protocol Conversion, Communications Interface Consolidation, PLC and Automation Control, I/O Expansion and Bridging, Secure Connectivity and System Management, Data Acquisition Front End.
Industrial Protocol Conversion
The M2GL010-VF256I fits protocol-conversion and gateway logic because it provides 12,084 programmable logic elements and 138 I/O in a 256-LFBGA package. Engineers can implement parallel-to-serial conversion, command parsing, buffering, and state machines around multiple industrial interfaces. The industrial-temperature grade is appropriate for equipment where the exact operating limits are confirmed in the Microchip datasheet. Its 1.2 V core supply also requires a carefully partitioned power tree and local decoupling. Compared with a fixed-function bridge ASIC, the programmable FPGA permits field updates, protocol variations, and reusable hardware across product variants, although the design team must verify supported I/O standards and timing margins.
সুপারিশকৃত
Communications Interface Consolidation
M2GL010-VF256I is suitable for communications equipment requiring programmable interface logic, data packing, and timing control. Its 12,084 logic elements can host parallel interfaces, framing logic, FIFOs, and supervisory state machines, while 138 I/O provide substantial board-level connectivity. The device is especially attractive for low-volume or evolving products because one FPGA configuration can serve multiple interface arrangements. In a line card or communications module, the 256-ball LFBGA supports dense routing but demands careful escape-layer planning and return-path continuity. Design teams should confirm clock tolerances, supported I/O standards, core and I/O voltage combinations, and configuration requirements directly from the official IGLOO2 documentation before schematic signoff.
সুপারিশকৃত
PLC and Automation Control
The M2GL010-VF256I can implement deterministic control logic for PLCs, industrial controllers, and automation equipment. Its 12,084 logic elements are suitable for coordinating sensors, actuators, interlocks, counters, and communications adapters, while the 138 available I/O support parallel field-signal conditioning. The industrial grade supports use in factory environments, provided the complete part is operated within the manufacturer-specified temperature and electrical limits. A practical implementation would separate the 1.2 V core rail from appropriate I/O supplies, use deterministic clocking, and keep high-speed or noisy routing away from sensitive inputs. Compared with a microcontroller-only solution, the FPGA provides parallel hardware concurrency and user-programmable timing for demanding control paths.
সুপারিশকৃত
I/O Expansion and Bridging
M2GL010-VF256I is a strong fit for I/O expansion and bridging functions because its 138 I/O and programmable logic resources can consolidate dissimilar interfaces without requiring a custom ASIC. Typical logic can include bus translation, latch and mux stages, level-conversion sequencing, and data buffering. The 256-LFBGA package allows compact placement in systems that already use dense BGA routing, but every assigned bank must match the permitted voltage and I/O-standard constraints. Engineers should use the package ball map to avoid conflicts, reserve unused balls according to Microchip guidance, and validate high-speed edges with the pin-description and timing documentation. Its reprogrammability is the main advantage over a fixed bridge, but bitstream ownership becomes a lifecycle consideration.
সুপারিশকৃত
Secure Connectivity and System Management
The M2GL010-VF256I can support secure-connectivity and system-management functions by combining programmable logic with a manageable I/O count. Logic elements can implement boot sequencing, key-transfer control, device arbitration, status monitoring, and communication front ends, while the 1.2 V core supply supports integration into a partitioned embedded power architecture. For industrial or communications systems, the FPGA can provide hardware isolation between functional domains and evolve as interfaces change. Security claims should not be inferred from the family name alone; developers must implement and review the actual algorithms, key handling, update mechanism, and isolation boundaries. The family datasheet and Microchip product resources should confirm configuration, memory, and security requirements before deployment.
সুপারিশকৃত
Data Acquisition Front End
M2GL010-VF256I can act as a programmable acquisition and conditioning front end when an instrument must combine multiple digital sensors with control logic. The 12,084 LEs can implement parallel capture, timing, filtering, calibration tables, and data packing, while 138 I/O provide interfaces to converters and memory. The industrial-grade ordering option is useful for laboratory and process-control equipment, subject to verified operating limits. A practical design should keep analog and digital returns separated, define clock domains carefully, and use FPGA I/O standards that match each bank voltage. Compared with a fixed acquisition ASIC, the FPGA allows algorithm changes without a silicon redesign. The main engineering cost is the need for deterministic timing closure and disciplined BGA layout on a 256-ball package.
সুপারিশকৃত
সুপারিশকৃত পণ্যের সারসংক্ষেপ
এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা M2GL010-VF256I — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।
নির্বাচন গাইড
বিকল্পের সাথে তুলনা
| পারামিটার | এই পণ্য | M2GL010-VFG256I | M2GL010-1VFG256I | M2GL010-VF256 |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | LFBGA-256 | LFBGA-256 - same package form | LFBGA-256 - same package form | LFBGA-256 - same package form |
| Device Family | IGLOO2 | IGLOO2 | IGLOO2 | IGLOO2 |
| Number of Pins | 256 | 256 | 256 | 256 |
মূল পার্থক্যসমূহ
- Confirmed 12,084 logic-element capacity in a low-density IGLOO2 device (বনামM2GL010-VF256)
- Industrial temperature ordering option (বনামM2GL010-VFG256I)
- 256-ball LFBGA interface density (বনামM2GL010-1VFG256I)
ডিজাইন নোট
Use the exact Microchip IGLOO2 LFBGA-256 footprint rather than a generic 256-ball BGA land pattern. The supplied DS0124 pin-and-packaging guide is the authoritative source for ball numbering, package dimensions, and I/O-bank locations. Preserve uninterrupted ground and power planes beneath the device, provide via transitions on every signal layer that requires escape routing, and validate the assembly stencil, solder mask, and pad geometry with the package drawing.
Partition the 1.2 V core supply from the applicable I/O bank supplies and follow the datasheet's recommended capacitor placement and startup sequence. The verified data does not provide current consumption, sequencing requirements, or capacitor values, so these must not be guessed. Place local bulk and high-frequency decoupling immediately adjacent to their associated power balls while maintaining low return-path inductance between each capacitor and the device ground reference.
Complete edge-rate, impedance, and timing analysis with the selected I/O standard and external load assumptions. Check every assigned ball against the permitted voltage range for its I/O bank; unused and no-connect balls must follow the manufacturer instructions. Keep sensitive clock, configuration, and serial interfaces away from high-current switching paths, and use controlled return paths in the LFBGA escape region to limit crosstalk and simultaneous-switching noise.
Do not treat a similar-looking M2GL010 ordering code as automatically interchangeable. Verify the full suffix, temperature grade, package ball map, configuration method, and device behavior before substitution. The supplied cross-reference evidence does not prove that M2GL010-VFG256I or M2GL010-1VFG256I is universally drop-in for M2GL010-VF256I, and no cross-brand equivalent was verified. Procurement substitutions must therefore receive engineering approval rather than a component-level match alone.
কমপ্লায়েন্স তথ্য
The supplied verified data confirms industrial temperature grading and in-production family status but does not provide RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations.
