AMD

XC3S400-5FG320C - 400K Gate Spartan-3 FPGA | AMD

MPN: XC3S400-5FG320C ✗ জীবনকালের সমাপ্তি
1.2 V Vdss 320-ball FBGA Package 725 MHz Speed
সর্বনিম্ন অর্ডার পরিমাণ: 1 |

XC3S400-5FG320C সারাংশ

The AMD XC3S400-5FG320C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 configurable logic cells, 221 I/O sites, and operation up to 725 MHz, housed in a 320-ball fine-pitch BGA package. The device combines programmable logic, dedicated memory resources, and selectable I/O resources in a single CMOS device. Its 1.2 V core voltage and 90 nm fabrication process identify it as a cost-optimized FPGA for embedded systems where deterministic digital logic is more important than the very high performance of modern application processors.

An FPGA is a semiconductor whose digital behavior is defined after manufacture by loading a configuration bitstream into on-chip configuration memory. In the device hierarchy, the XC3S400-5FG320C is a Spartan-3 FPGA, a programmable-logic device within the broader FPGA and semiconductor categories. Unlike a fixed-function microcontroller or application-specific IC, an FPGA can implement parallel data paths, state machines, protocol controllers, and custom interfaces while retaining upgradeability through field reconfiguration.

The principal resource figures are 400,000 system gates, 8,064 logic cells, and 221 I/O sites. The manufacturer documentation index identifies a maximum performance figure of 725 MHz for this ordering code. The 320-ball FBGA package supports dense PCB routing and is intended for space-constrained embedded equipment rather than breadboard-based prototyping. Configuration storage, configuration pin functions, and complete ball assignments should be taken from the Spartan-3 pinout and configuration documentation before a PCB is released.

The -5 portion of the ordering code identifies the device speed grade, while the C suffix identifies the commercial temperature grade. The target therefore differs from lower-speed or industrial-temperature variants in timing qualification and operating-temperature class, although the logical architecture and 320-ball package remain compatible. Because Spartan-3 devices rely on configuration memory, the power-up behavior, configuration source, bitstream integrity, and startup timing must be included in the complete system design rather than treated as firmware-only concerns.

Typical uses include industrial control and automation, communication protocol conversion, data acquisition, embedded video, instrumentation, and general-purpose digital signal processing. Parallelizable tasks such as bus arbitration, packet filtering, sensor conditioning, or control-law execution can be implemented as parallel hardware logic. A microcontroller may still be preferable for complex operating-system software, while an FPGA is advantageous when deterministic response, custom I/O, or post-deployment logic updates justify programmable hardware.

For a new design, first verify that every available ball, supply rail, decoupling requirement, configuration interface, and supported I/O standard is compatible with the selected board revision. Preserve the manufacturer's recommended power sequencing, use a configuration scheme that produces a valid startup state, and validate timing with the actual board-level clock and external interfaces. Do not treat a faster speed-grade substitute as automatically equivalent without rerunning timing analysis for the installed design.

This product record combines the verified device identifiers, package and logic-resource details, speed-grade comparisons, sourcing guidance, and practical migration considerations. It is intended to help engineers distinguish electrically similar orderings from true PCB-compatible replacements while focusing attention on the timing, temperature, configuration, and qualification differences that determine whether a substitution is production-safe.

এর জন্য ড্রপ-ইন বিকল্প XC3S400-5FG320C — একই package, pin-to-pin compatible। ভিন্ন package-এর যেসব পার্টে PCB rework প্রয়োজন সেগুলো বাদ দেওয়া হয়েছে।

এই সিরিজের ভ্যারিয়েন্ট

একই সিরিজের মডেল যেগুলো drop-in compatible XC3S400-5FG320C (একই form factor এবং footprint) — পার্থক্য রয়েছে Mounting Type, AEC-Q100 Qualification, Package Type, Speed Grade, Temperature Grade.

AMD
AEC-Q100 Qualification: Not applicable
Package Type: 320-ball fine-pitch BGA
Speed Grade: -4
এর সাথে তুলনা করুন XC3S400-5FG320C →

XC3S400-4FG320C

✅ ড্রপ-ইন
AMD
📦 320-ball FBGA
Spartan-3 field-programmable gate array (FPGA) · 400,000 system gates · 294,912 logic elements · 8,064 CLBs · 221 I/O · 1.2 V · -4 · Commercial (C)

মূল্যের জন্য যোগাযোগ করুন

ডেটাশিট দেখুন →

XC3S400-4FG320I

✅ ড্রপ-ইন
Xilinx
📦 320-ball FBGA
Spartan-3 field-programmable gate array (FPGA) · 400,000 gates · 8,064 cells · 294,912 bits · 221 I/Os · 1.2 V · -4 speed grade

মূল্যের জন্য যোগাযোগ করুন

ডেটাশিট দেখুন →

XC3S400-5FG320I

✅ ড্রপ-ইন ⚠️ স্পেক যাচাইকৃত নয়
📦 320-ball FBGA
Maximum frequency differs by 0 MHz at 725 MHz; industrial temperature grade replaces commercial

📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)

XC3S400-3FG320C

✅ ড্রপ-ইন ⚠️ স্পেক যাচাইকৃত নয়
📦 320-ball FBGA
Lower -3 speed grade versus -5; speed rating is 100 MHz lower on the 725 MHz scale, a 14% reduction

📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)

XC3S400-3FG320I

✅ ড্রপ-ইন ⚠️ স্পেক যাচাইকৃত নয়
📦 320-ball FBGA
Lower -3 speed grade versus -5; speed rating is 100 MHz lower on the 725 MHz scale, a 14% reduction; industrial grade

📋 রেফারেন্স বিকল্প (ক্যাটালগে নেই)

XC3S400-5FG320C সর্বোচ্চ রেটিং ও বৈদ্যুতিক বৈশিষ্ট্য

FPGA Family Spartan-3
System Gates 400,000 gates
Configurable Logic Cells 8,064 cells
Maximum Performance Frequency 725 MHz
Core Supply Voltage 1.2 V
Process Technology 90 nm CMOS
I/O Count 221 I/O
Package Type 320-ball FBGA
Number of Terminals 320 balls
মাউন্টিং টাইপ Surface Mount
Speed Grade -5
Temperature Grade Commercial
Programmable Logic Type Field-Programmable Gate Array (FPGA)
RoHS স্ট্যাটাস unknown
REACH Status unknown
AEC-Q100 Qualification not_applicable

XC3S400-5FG320C 320-ball fbga পিন কনফিগারেশন গাইড

XC3S400-5FG320C (320-ball fbga প্যাকেজ)-এর পিন কনফিগারেশন। এই ডিজিটাল IC-তে GPIO, কমিউনিকেশন ইন্টারফেস (UART, SPI, I2C) এবং পাওয়ার পিন রয়েছে। বিকল্প পিন ফাংশন ও কনফিগারেশন অপশনের জন্য প্রস্তুতকারকের ডেটাশিট দেখুন। এমবেডেড সিস্টেম ডিজাইন ও PCB লেআউটের জন্য অপরিহার্য।

XC3S400-5FG320C-এর জন্য 320-ball fbga প্যাকেজ পিনআউট ডায়াগ্রাম

এর জন্য বিস্তারিত পিনআউট ডেটা পাওয়া যায়নি XC3S400-5FG320C.

দেখুন ডেটাশিট সম্পূর্ণ পিন কনফিগারেশনের জন্য।

সাধারণ ব্যবহার

XC3S400-5FG320C এর জন্য উপযুক্ত 6 অ্যাপ্লিকেশনs: Industrial Automation and Control, Data Acquisition and Signal Conditioning, Communication Protocol Conversion, Embedded Video Processing, Test and Measurement Instrumentation, Programmable Logic and Instrumentation.

🏭

Industrial Automation and Control

The AMD XC3S400-5FG320C fits deterministic machine-control functions that require parallel logic, numerous I/O sites, and reconfigurable hardware. Its 8,064 logic cells can host state machines, interlock logic, axis-control functions, and communication adapters, while 221 I/O sites provide substantial connectivity for sensors and actuators. The documented 725 MHz maximum performance supports demanding control pipelines, although the commercial C grade requires verification against the cabinet ambient temperature. In a production controller, keep the FPGA responsible for time-critical parallel operations and isolate safety functions according to the applicable machine-safety architecture.

📡

Data Acquisition and Signal Conditioning

The XC3S400-5FG320C can implement parallel data capture, digital filtering, trigger logic, and interface conversion around precision converters. Its 8,064 configurable logic cells allow sampling pipelines and control paths to execute concurrently, and its 221 I/O sites support multiple data buses and control signals. The 725 MHz maximum performance figure provides headroom for pipelined processing, but the implemented clock rate must satisfy the design's timing constraints. Use synchronous interfaces where possible and validate input timing against the actual converter and trace delay rather than relying only on the nominal FPGA performance figure.

🌐

Communication Protocol Conversion

The AMD XC3S400-5FG320C is appropriate for bridging dissimilar serial, parallel, and packet-oriented interfaces through parallel transmit and receive pipelines. Its 8,064 logic cells can support framing, checksums, buffering, and protocol state machines, while 221 I/O sites are useful for legacy bus connections. The 725 MHz maximum performance allows combinational logic and state-machine updates to run concurrently, reducing the risk of serial-interface bottlenecks. For clocked conversions, register all boundary crossings, constrain source-synchronous interfaces, and test behavior during configuration startup when the associated external devices may already be operating.

📺

Embedded Video Processing

The XC3S400-5FG320C can support pixel pipelines, color processing, timing generation, and simple image preprocessing in cost-sensitive embedded displays. Parallel datapaths exploit the device's 8,064 logic cells and documented 725 MHz maximum performance, while 221 I/O sites accommodate pixel-clock and control connections. The architecture is most appropriate for deterministic preprocessing rather than complex compression or high-resolution computer vision. Keep video timing generation in the FPGA, use line and frame buffers with appropriate CDC handling, and verify pin assignments against the selected memory and display interfaces before finalizing the 320-ball PCB layout.

🔧

Test and Measurement Instrumentation

The AMD XC3S400-5FG320C is useful in programmable test equipment, waveform generation, pattern processing, and timing-control systems. Its 8,064 logic cells and 221 I/O sites support parallel pattern engines and multiple instrument-control interfaces, while the 725 MHz maximum performance provides capacity for deeply pipelined acquisition paths. The commercial temperature grade may fit laboratory equipment, but it should be checked against the enclosure temperature and heat rise. Separate acquisition timing from slower control traffic, apply synchronous clocking to high-speed analog-to-digital converters, and include calibration paths that remain valid after the FPGA is reconfigured.

🖥️

Programmable Logic and Instrumentation

The XC3S400-5FG320C supports general-purpose programmable logic, educational platforms, custom accelerators, and legacy system consolidation. With 400,000 system gates and 8,064 logic cells, it can host multiple independent engines, while 221 I/O sites provide flexible connections to test points and legacy devices. The documented 725 MHz maximum frequency permits high-speed synchronous pipelines, but every design still requires explicit timing constraints and a verified configuration bitstream. Use the FPGA for deterministic parallel tasks and pair it with a microcontroller when networking, a rich operating system, or extensive firmware management is required.

সুপারিশকৃত পণ্যের সারসংক্ষেপ

XC3S400-4FT256I Xilinx ব্যবহৃত হয়: Industrial Automation and Control ATSM4S4BA-AN Microcontroller companion for supervisory control ব্যবহৃত হয়: Industrial Automation and Control ADS1254E Texas Instruments ব্যবহৃত হয়: Industrial Automation and Control, Data Acquisition and Signal Conditioning AD9023AZ Analog Devices ব্যবহৃত হয়: Data Acquisition and Signal Conditioning, Test and Measurement Instrumentation OP132UA Analog signal-conditioning front end ব্যবহৃত হয়: Data Acquisition and Signal Conditioning MAX3490EESA+ Analog Devices ব্যবহৃত হয়: Communication Protocol Conversion DP83867IRRGZT Texas Instruments ব্যবহৃত হয়: Communication Protocol Conversion SN65HVD37D Texas Instruments ব্যবহৃত হয়: Communication Protocol Conversion TAS5000PFB Texas Instruments ব্যবহৃত হয়: Embedded Video Processing PCM1725U Texas Instruments ব্যবহৃত হয়: Embedded Video Processing OPA132UA Texas Instruments ব্যবহৃত হয়: Embedded Video Processing, Test and Measurement Instrumentation AD779JN Analog Devices ব্যবহৃত হয়: Test and Measurement Instrumentation XC6SLX100-2FG484C AMD ব্যবহৃত হয়: Programmable Logic and Instrumentation EP3C25F324C7 Intel ব্যবহৃত হয়: Programmable Logic and Instrumentation STM32F103ZET6L Microcontroller companion for control-plane functions ব্যবহৃত হয়: Programmable Logic and Instrumentation
What are the key specifications of XC3S400-5FG320C that engineers should know?
The XC3S400-5FG320C is a Spartan-3 FPGA providing 400,000 system gates, 8,064 configurable logic cells, 221 I/O sites, and a maximum documented frequency of 725 MHz. It uses a 1.2 V core supply and a 90 nm CMOS process in a 320-ball FBGA package. According to the AMD/Xilinx device documentation, the -5 suffix denotes the speed grade and C identifies the commercial temperature grade.
What is the XC3S400-5FG320C used for?
The XC3S400-5FG320C is used for parallel digital logic, control systems, protocol conversion, data acquisition, and embedded signal-processing functions. Its 8,064 logic cells and 221 I/O sites allow multiple processing paths to operate concurrently, while the 320-ball FBGA package supports dense multilayer PCB layouts. The manufacturer documentation index identifies 725 MHz as the maximum performance figure for this ordering code.
Where can I download the XC3S400-5FG320C datasheet?
The XC3S400-5FG320C datasheet and device documentation can be located through the product datasheet index linked on this page. The indexed device information identifies the Spartan-3 family, 400,000 system gates, 8,064 configurable logic cells, 1.2 V supply, 90 nm process, and 320-pin FBGA construction. Use the AMD/Xilinx datasheet and pinout documents as the controlling references for ball assignments and electrical limits.
Where can I find the XC3S400-5FG320C pinout?
The XC3S400-5FG320C pinout is documented in the AMD/Xilinx Spartan-3 package pinout and data-sheet materials for the 320-ball FBGA package. Use those documents to assign every ball, including power, ground, configuration, clock, and user I/O functions. A complete 320-ball transcription is not reproduced on this page because the public device result does not expose the ball table, and the package diagram library has no 320-ball FBGA template.
Is XC3S400-5FG320C suitable for industrial control systems?
The XC3S400-5FG320C is electrically suitable for many digital control functions, but its C suffix identifies a commercial temperature grade rather than the industrial grade. For machinery exposed to extended ambient temperatures, select the corresponding industrial ordering or verify the complete system temperature envelope. The device provides 8,064 logic cells, 221 I/O sites, and 725 MHz maximum performance for implementing real-time control logic.
Where to buy XC3S400-5FG320C online?
Use the Request a Quote form on this page to request XC3S400-5FG320C availability, sourcing support, and a current quotation. The form allows engineers to specify quantity, target packaging, and delivery requirements without relying on a static price. Because this is a legacy Spartan-3 configuration, confirm the exact -5FG320C suffix, 320-ball package, commercial temperature grade, and required quantity before accepting a supply proposal.
What is the price of XC3S400-5FG320C?
The current XC3S400-5FG320C quotation is obtained through the Request a Quote form on this page. The form is the appropriate route for price, stock, and volume-break inquiries because legacy FPGA supply can vary by quantity and sourcing condition. Specify the exact XC3S400-5FG320C ordering code so that the quotation is not confused with another Spartan-3 speed grade, temperature grade, or package.
What is the lead time for XC3S400-5FG320C?
Request the current XC3S400-5FG320C lead time through the Request a Quote form on this page. The requested confirmation should cover the ordered quantity, reel or tray packaging, shipment destination, and whether any additional traceability is required. For production planning, obtain a schedule for the exact -5FG320C commercial-grade device rather than extrapolating from another Spartan-3 package or speed grade.
Is XC3S400-5FG320C in stock?
Stock status for the exact XC3S400-5FG320C should be confirmed through the Request a Quote form on this page. A legacy FPGA listing does not by itself establish current inventory, particularly when the requirement concerns a specific reel quantity or production traceability. Include the exact MPN, desired package quantity, delivery date, and any inspection requirements in the request.
What is the difference between XC3S400-5FG320C and XC3S400-4FG320C?
The XC3S400-5FG320C and XC3S400-4FG320C occupy the same Spartan-3 device and 320-ball FBGA class, but their speed grades differ. The -5 ordering is documented at up to 725 MHz, while the -4 ordering is listed at 630 MHz in the comparison material. The difference is approximately 95 MHz, so board timing must be revalidated before substituting the lower-speed device.
When should I choose XC3S400-5FG320C over XC3S400-4FG320I?
Choose the XC3S400-5FG320C when the design targets the commercial temperature grade and benefits from its documented 725 MHz maximum frequency. Choose an -4 industrial-grade ordering when ambient-temperature qualification matters more than maximum timing headroom. The commercial -5 device offers about 95 MHz more nominal performance than the listed 630 MHz -4 device, but the temperature and timing requirements must be evaluated together.
What is the best drop-in replacement for XC3S400-5FG320C?
The closest verified drop-in candidate is XC3S400-4FG320C because it retains the Spartan-3 architecture and 320-ball FBGA package while changing only the documented speed grade. It operates at up to 630 MHz rather than 725 MHz, a reduction of approximately 95 MHz or 13%. No complete set of five qualified drop-in alternatives was established, and every proposed substitution must pass timing, temperature, and configuration checks.
Can XC3S400-4FG320I replace XC3S400-5FG320C?
The XC3S400-4FG320I can serve as a pin-compatible migration candidate because it retains the 320-ball package and Spartan-3 device family, but it is not an unconditional functional equivalent. Its listed maximum frequency is 630 MHz versus 725 MHz for the -5 device, and its industrial temperature designation differs from the commercial target. Confirm critical-path timing, startup behavior, and environmental requirements before substitution.
What can replace XC3S400-5FG320C?
XC3S400-4FG320C is the clearest package-compatible replacement candidate in the verified cross-reference material because it preserves the 320-ball FBGA format and Spartan-3 architecture. Its documented maximum frequency is 630 MHz, compared with 725 MHz for the target, so the substitution can close timing margin. The XC3S400-4FG320I is another migration candidate when industrial temperature qualification is required.
Is XC3S400-5FG320C the same as XC3S400-4FG320I?
No. The XC3S400-5FG320C and XC3S400-4FG320I share the Spartan-3 family and 320-ball package, but they carry different speed and temperature-grade identifiers. The target is a -5 commercial-grade part documented at up to 725 MHz, while the alternative is a -4 industrial-grade part listed at 630 MHz. PCB compatibility must therefore be accompanied by timing and temperature validation.
What is the best AMD equivalent for XC3S400-5FG320C?
The best AMD-qualified migration candidate identified for the XC3S400-5FG320C is the XC3S400-4FG320C, which preserves the Spartan-3 logic architecture and 320-ball FBGA footprint. Its maximum documented frequency decreases from 725 MHz to 630 MHz, approximately 13%, so it is most appropriate when the original design has adequate timing margin or can be constrained. No cross-brand drop-in replacement was established with the required evidence.

এর জন্য ইঞ্জিনিয়ারিং রেফারেন্স ডেটা XC3S400-5FG320C — তুলনা, ডিজাইন গাইডেন্স এবং কমপ্লায়েন্স তথ্য।

নির্বাচন গাইড

Choose the XC3S400-5FG320C when the board already uses its 320-ball FBGA footprint and the design benefits from the -5 speed grade, with the target timing requirements stated against a documented maximum frequency of 725 MHz. Select XC3S400-4FG320C only when the commercial temperature class remains appropriate and approximately 95 MHz of nominal frequency can be surrendered after complete timing analysis. Use XC3S400-4FG320I when industrial temperature qualification is more important than maximum performance, recognizing its listed 630 MHz ceiling. XC3S400-5FG320I is the closest timing-equivalent choice for an industrial-temperature redesign because it retains the -5 grade, but its commercial and industrial identities are not interchangeable. No cross-brand drop-in replacement was established. In every case, validate configuration startup, I/O standards, PCB ball assignments, power sequencing, and timing before production release.

বিকল্পের সাথে তুলনা

পারামিটার এই পণ্য XC3S400-4FG320C XC3S400-4FG320I XC3S400-5FG320I XC3S400-3FG320C XC3S400-3FG320I
Package 320-ball FBGA 320-ball FBGA 320-ball FBGA 320-ball FBGA 320-ball FBGA 320-ball FBGA
Brand AMD AMD AMD AMD AMD AMD
FPGA Family Spartan-3 Spartan-3 Spartan-3 Spartan-3 Spartan-3 Spartan-3
System Gates 400,000 gates 400,000 gates 400,000 gates 400,000 gates 400,000 gates 400,000 gates
Configurable Logic Cells 8,064 cells 8,064 cells 8,064 cells 8,064 cells 8,064 cells 8,064 cells
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V
Process Technology 90 nm CMOS 90 nm CMOS 90 nm CMOS 90 nm CMOS 90 nm CMOS 90 nm CMOS
Temperature Grade Commercial Commercial Industrial Industrial Commercial Industrial
I/O Count 221 I/O 221 I/O 221 I/O 221 I/O 221 I/O 221 I/O

মূল পার্থক্যসমূহ

  • Higher nominal timing performance than the verified -4 package variants (বনামXC3S400-4FG320C)
  • Commercial-grade ordering matched to controlled-environment designs (বনামXC3S400-4FG320I)
  • Same -5 speed grade for designs requiring industrial temperature qualification (বনামXC3S400-5FG320I)

ডিজাইন নোট

Route the 320-ball FBGA on a multilayer PCB with short, referenced clock and configuration paths. Use the AMD/Xilinx Spartan-3 package and pinout documentation to assign power, ground, configuration, and user I/O balls; the package library available for this page does not include a 320-ball FBGA symbol. Place decoupling capacitors close to the applicable supply balls and preserve the manufacturer-defined power and ground distribution pattern. PCB signal-integrity simulation should include the selected stack-up, clock topology, and high-speed I/O rather than relying only on nominal schematic connectivity.

Do not treat speed-grade substitutions as automatic drop-in equivalents. The target is documented at up to 725 MHz, while the verified -4 alternatives are listed at 630 MHz, a reduction of approximately 95 MHz or 13%. Re-run static timing analysis for every clock domain, review derived clocks and I/O constraints, and test worst-case board conditions. Configuration startup, JTAG access, PROM compatibility, and the C-versus-I temperature-grade requirement also need explicit confirmation before releasing a substitute into production.

Design the 1.2 V core supply and associated I/O supplies from the device power-estimation and configuration documentation rather than from the nominal core voltage alone. Account for configuration activity, state-dependent utilization, clocking, and I/O loading when selecting regulators and copper thermal capacity. A valid implementation should include local bulk and high-frequency decoupling, defined sequencing behavior, and a controlled startup path for the FPGA and any external memory or configuration source.

Use dedicated clock-capable inputs where required, provide a clean clock reference, and constrain all synchronous interfaces. For memory or external converter paths, match trace lengths to the applicable device timing specification and add series termination only where the signal-integrity analysis supports it. Treat configuration pins as potentially asynchronous during startup, and avoid relying on FPGA user logic to control a configuration signal before the device has been configured and the associated external hardware has been placed in a safe state.

কমপ্লায়েন্স তথ্য

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
লিড ফ্রি
Unknown
হ্যালোজেন ফ্রি
Unknown
কনফ্লিক্ট মিনারেলস
Unknown

The device documentation index identifies a Spartan-3 FPGA but does not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. The commercial ordering is not presented as an automotive-qualified AEC-Q100 device.

ডেটা যাচাই করা হয়েছে: 2026-11-04 — ডেটা XAIPART-এর কম্পোনেন্ট ইঞ্জিনিয়ারিং টিম দ্বারা যাচাই ও কিউরেট করা হয়েছে

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AMD Xilinx XC3S400-5FG320C XC3S400-4FG320C XC3S400-4FG320I XC3S400-5FG320I XC3S400-3FG320C XC3S400-3FG320I Spartan-3 FPGA field-programmable gate array programmable logic device configurable logic cell system gate 320-ball FBGA BGA package surface-mount semiconductor 90 nm CMOS configuration bitstream configuration memory I/O site speed grade temperature grade JTAG industrial control data acquisition communication protocol conversion embedded video processing
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