FPGA & CPLD
Products (6357)
EP2SGX60CF780I4N - 60K LEs Stratix II GX FPGA, 780-FBGA | Altera
The Altera EP2SGX60CF780I4N is a high-density Stratix II GX field-programmable gate array (FPGA) featuring 60,440 logic elements, 60,440 equivalent logic blocks (CLBs), and up to 2,542 Kbits of embedded memory, housed in a 780-ball fine-line BGA (FC-FBGA) package measuring 23 x 23 mm with 1.0 mm pitch. It integrates up to 20 serial transceivers operating at 6.375 Gbps, supporting PCI Express, Serial RapidIO, XAUI, and CEI-6G protocols for high-bandwidth interconnect. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic, interconnect, and I/O behavior are configured by the end user via an HDL bitstream rather than at the factory. FPGAs occupy a middle ground between fixed-function ASICs (highest performance, lowest per-unit cost at volume) and microcontrollers (highest flexibility, lowest per-unit performance): they deliver ASIC-class data-path throughput while remaining reconfigurable in the field. Stratix II GX belongs to Altera's high-end transceiver-equipped family, targeting wireline communication, broadcast video, and high-speed serial bridging. Key features include 12 PLLs (4 fast PLLs + 8 enhanced PLLs), 12 dedicated clock transceivers supporting 622 Mbps to 6.375 Gbps operation, a 1.2 V core supply (range 1.15 V to 1.25 V), and an industrial temperature grade (-40 °C to +100 °C case). The 90 nm CMOS process provides high logic density with on-chip termination, dynamic phase alignment, and pre-emphasis equalization for backplane and chip-to-chip serial links. The architecture combines adaptive logic modules (ALMs) with embedded TriMatrix memory blocks (MRAM), allowing designers to build wide datapaths, protocol controllers, and DSP blocks at full chip frequency. Stratix II GX supports up to 16 global clock networks, 4 dedicated clocking PLLs for high-frequency synthesis, and 8 regional PLLs with dynamic reconfiguration capability for frequency margining and link-rate switching. Typical applications include 10 Gbps Ethernet MAC/PHY bridging, PCI Express Gen1/Gen2 endpoint and root-port designs, Serial RapidIO switch fabrics, broadcast video processing (HD-SDI, 3G-SDI), telecom backplane aggregation, and high-end test-and-measurement instrumentation where reconfigurable high-speed serial I/O is required. When designing with this device, ensure your PCB meets the FC-FBGA-780 land-pattern requirements (1.0 mm pitch microvia stack-ups), provide independent analog supply rails for the transceiver PLLs, and select the correct speed grade for your target transceiver line rate. Bitstream configuration requires a compatible Altera/Intel Quartus II programmer. This page synthesizes distributor pricing, Stratix II GX family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
EP2SGX60CF780I5N - Stratix II GX FPGA 60K LE FC-FBGA-780 | Altera
The Altera EP2SGX60CF780I5N is a high-density Field Programmable Gate Array (FPGA) from the Stratix II GX family, featuring 60,440 Logic Elements (LEs), 60,440 Adaptive Logic Modules (ALMs), and up to 622 MHz maximum operating frequency in a 780-pin FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) package. The device integrates up to 12 embedded transceivers operating at 6.375 Gbps, supporting high-speed serial protocols including PCI Express, Serial RapidIO, XAUI, and CEI-6G. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed I/O that can be re-programmed to implement custom digital logic. FPGAs sit at the top of the programmable logic hierarchy (PAL -> CPLD -> FPGA) and are used when processors or ASICs cannot meet performance, latency, or parallelism requirements. The Stratix II GX family targets high-speed serial connectivity and signal-processing applications, placing this specific variant as a high-end member suitable for telecom backplanes, broadcast video, and high-end test equipment. Key features of the EP2SGX60CF780I5N include 2,542 Kbits of embedded RAM distributed across TriMatrix memory blocks (M512, M4K, and M-RAM), 192 dedicated 18x18 multipliers for DSP operations, and a 1.2V core supply (1.15V to 1.25V operating range). It supports up to 12 full-duplex transceiver channels at data rates up to 3.125 Gbps, with some configurations reaching 6.375 Gbps depending on speed grade. The industrial temperature grade (-40C to +100C) and 90nm CMOS process technology make it suitable for demanding industrial and defense applications. The architecture is based on Altera's adaptive logic module (ALM) fabric, which provides finer-grained lookup-table (LUT) packing than previous Stratix generations, increasing effective logic density by ~25%. The transceiver blocks include dedicated Physical Coding Sublayer (PCS) and Physical Medium Attachment (PMA) hardware, supporting standards such as PCIe Gen1 (2.5 Gbps), XAUI (3.125 Gbps), and Serial RapidIO (1.25 to 3.125 Gbps). Programmable pre-emphasis and equalization compensate for channel loss on FR-4 backplanes up to 40 inches. Typical applications include high-speed serial interface bridging, telecom line card prototyping, military signal processing, broadcast video routers, and high-performance computing (HPC) acceleration. The 780-ball FC-FBGA package (29 x 29 mm, 1 mm pitch) is designed for high-density PCB designs with controlled-impedance routing for the transceiver lanes, requiring dedicated ground and power planes plus matched-length differential pairs. When designing with this device, allocate transceiver lanes first and route them on the top or bottom layers with continuous reference planes. Power supply decoupling requires at least 22 decoupling capacitors per power rail, plus bulk capacitors for the 1.2V core and PLL analog supplies. JTAG and configuration pins (MSEL[2:0], nCONFIG, nSTATUS, DONE) must be accessible for in-system programming. This page synthesizes distributor pricing, drop-in alternative Stratix II GX variants, and practical PCB design considerations not found in the manufacturer datasheet alone, giving procurement and engineering teams a single source for component evaluation.
EP2SGX60DF780C3 - Stratix II GX 60K LE FPGA, 780-BGA | Intel
The Intel (formerly Altera) EP2SGX60DF780C3 is a Stratix II GX family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 3,022 Logic Array Blocks (LABs), and 364 user I/Os in a 780-pin FineLine BGA (FC-FBGA) package. The device is fabricated on a 90 nm process node, operates from a 1.2 V core supply, and supports internal frequencies up to approximately 717 MHz. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as transceivers, DSP blocks, and memory. FPGAs sit at the top of the programmable-logic taxonomy: programmable logic device -> CPLD/FPGA -> high-density FPGA -> transceiver-equipped FPGA. The Stratix II GX family specifically integrates multi-gigabit transceivers, making it part of the high-speed transceiver-equipped FPGA category used in communications, video, and signal-processing systems. Key features of the EP2SGX60DF780C3 include up to 20 embedded transceivers supporting serial rates up to 6.375 Gbps, dedicated DSP blocks for high-throughput signal processing, distributed and M512K/M4K TriMatrix memory, and support for external memory interfaces including DDR/DDR2/QDRII SRAM. The "DF780" suffix denotes the 780-ball FC-FBGA FineLine BGA package; the "C3" speed grade is the fastest commercial grade offered in the Stratix II GX family, with -4 (medium) and -5 (slow) grades also available. The commercial operating range is 0 °C to +85 °C (TJ). Architecturally, Stratix II GX uses an ALM (Adaptive Logic Module) based core rather than the legacy 4-LUT architecture, providing improved logic utilization. The transceiver hard IP supports CPRI/OBSAI, Serial RapidIO, PCI Express (Gen1), and Gigabit Ethernet, offloading high-speed serialization from soft logic. MultiTrack interconnect routing and the Quartus II design suite complete the design ecosystem. Typical applications include high-speed serial backplane interfaces, telecom line cards, wireless baseband signal processing, video broadcast and editing systems, and ASIC prototyping. The 6.375 Gbps transceiver capability makes it especially suitable for chip-to-chip and backplane links. Design consideration: at 780-ball FC-FBGA with 1 mm pitch, PCB stack-up and via-in-pad design with proper thermal vias under the exposed die region are essential. The transceiver reference clock jitter budget must be analyzed using the Stratix II GX Transceiver User Guide. This page synthesizes distributor inventory, parametric context, and practical design guidance not consolidated on any single manufacturer or distributor page.
EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel
The Intel (formerly Altera) EP2SGX60DF780C3N is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 3,022 LABs, and 364 user I/Os in a 780-pin FC-FBGA package. Fabricated on a 90 nm process with a 1.2 V core supply, it pairs a rich programmable fabric with embedded transceivers suited for high-speed serial I/O. An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that engineers can re-program after manufacture. Stratix II GX sits within the FPGA hypernym hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The GX suffix denotes integrated multi-gigabit transceivers, making Stratix II GX devices a sub-family of the broader Stratix II family that targets wired communications, broadcast video, and high-performance computing backplanes. Key features include 60,440 logic elements, 2,544,192 bits of embedded memory, 364 user I/Os, 717 MHz internal operating frequency, and up to 816.9 MHz performance. The part supports 4 PLLs, dedicated high-speed serial transceiver channels, and JTAG-based in-system programming. The DF780 package is a 23 x 23 mm FC-FBGA with 1 mm pitch, designed for high-density PCB layouts where signal integrity and thermal performance are critical. From an architectural standpoint, the Stratix II GX fabric uses Adaptive Logic Modules (ALMs) rather than the older 4-LUT structure, delivering improved logic utilization and timing closure. The 90 nm process node strikes a balance between performance and power, while the integrated transceivers support protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet without external PHY devices. Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO, GBE), software-defined radio front-ends, broadcast video processing, and ASIC prototyping platforms. The combination of high logic density and embedded transceivers makes it a strong fit for telecom line cards and data-acquisition systems. When designing with this part, ensure the PCB provides a continuous ground plane under the BGA and matched-length routing for the high-speed serial channels. Power decoupling must follow Intel's Stratix II GX PowerPlay recommendations, with bulk capacitance scaled to transceiver utilization. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX60DF780C4 - 60K LEs Stratix II GX FPGA 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX60DF780C4 is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 364 user I/O, and high-speed transceivers in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm pitch. Built on a 90 nm CMOS process, the device supports an internal operating frequency up to 717 MHz and operates from a 1.2 V core supply. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic functionality is defined after manufacturing by the user via a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy (FPGA -> programmable logic -> logic IC -> integrated circuit) and are used to implement arbitrary combinational and sequential logic, soft processors, DSP pipelines, and high-speed serial interfaces. The Stratix II GX family in particular targets high-throughput serial I/O, embedding multi-gigabit transceivers alongside the programmable fabric. Key features of the EP2SGX60DF780C4 include 60,440 logic elements, 2,544,192 bits of embedded memory, up to 717 MHz fabric performance, dedicated DSP blocks, and high-speed serial transceiver channels supporting multi-gigabit-per-second rates. The 780-FBGA package with 1 mm ball pitch and exposed-die construction enables dense board placement while providing adequate thermal performance. The 'C4' speed grade balances timing margin against dynamic power for cost-sensitive designs. From an architectural standpoint, the Stratix II GX uses an ALM-based fabric (Adaptive Logic Modules) with each ALM capable of implementing up to 8 inputs of combinational logic, providing higher effective density than the previous 4-input LUT architecture. The 90 nm process supports embedded memory blocks of M512, M4K, and M-RAM types, and the transceiver blocks support standard serial protocols including PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. Typical applications include telecom line cards, high-speed serial interface bridging (PCIe, SRIO, XAUI), DSP co-processing for wireless baseband, test and measurement equipment, and broadcast video processing. The integration of transceivers with the programmable fabric eliminates the need for external PHY ICs, reducing BOM cost and board area. When designing with this part, engineers must allocate sufficient decoupling and follow Altera/Intel PCB layout guidelines for the FBGA package, including via-in-pad or microvia stack-ups to escape the 1 mm pitch ball grid, and provide thermal relief through the exposed die pad and adequate copper area on inner/outer PCB layers. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II GX and Stratix II families, and practical design notes not consolidated on any single distributor product page.
EP2SGX60DF780C4N - Stratix II GX FPGA, 60K LEs, 364 I/O, FBGA-780 | Intel
The Intel (formerly Altera) EP2SGX60DF780C4N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 60,440 equivalent logic elements, 364 user I/Os, and high-speed transceiver capability, housed in a 780-ball FineLine BGA (FBGA) package measuring 29 x 29 mm with 1 mm pitch. Built on a 1.2 V 90 nm CMOS process, this device is optimized for high-bandwidth serial connectivity, DSP-intensive signal processing, and embedded-processor-based designs that require deterministic real-time response. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device built around an array of configurable logic blocks (CLBs/LEs), programmable interconnect, and dedicated hard IP blocks such as transceivers, block RAM, multipliers, and PLLs. FPGAs occupy the same role in the digital-hierarchy taxonomy as ASICs but allow post-fabrication logic changes. Stratix II GX sits at the top tier of the programmable-logic hierarchy, between mainstream FPGAs and structured ASICs, with embedded multi-gigabit transceivers that previously required external PHY chips. Key features of the EP2SGX60DF780C4N include 60,440 logic elements organized into 3,022 Logic Array Blocks (LABs), 2,544,192 bits of on-chip RAM, dedicated DSP blocks for high-throughput filtering and FFT, and up to 20 embedded transceivers supporting serial rates up to 6.375 Gbps. The device also exposes 12 full-duplex source-synchronous channels, supports PCI Express x1/x4/x8 hard IP, and integrates four PLL blocks plus 16 global clock networks for robust clock distribution across the fabric. From a technical-depth perspective, the Stratix II GX architecture replaces the 4-input LUT of earlier Stratix with an adaptive logic module (ALM) that combines two 4-LUTs and a dedicated adder, improving effective logic density by roughly 25 percent versus prior generations. Combined with the 90 nm strained-silicon process and 1.2 V core, the part delivers high Fmax on DSP-heavy designs while still meeting industrial-grade thermal envelopes. The transceiver block supports a wide range of protocols including PCI Express Gen1, Serial RapidIO, CEI-6G, and 10 GbE XAUI through protocol-specific soft IPs. Typical applications include 10G/40G telecom line cards, ASIC prototyping platforms, high-end broadcast video processing, defense signal-intelligence backplanes, and medical imaging reconstruction. The high pin count and 364 I/O support wide external memory buses (DDR2/QDRII+) and multiple standard connectors simultaneously. Designers should budget 20 percent of logic for clock-domain crossing, apply Quartus II pin-planner constraints early, and ensure the board supplies a 1.2 V VCCH/LVDS-clean supply for the transceiver PHY. This page synthesizes distributor pricing, drop-in Altera/Intel alternatives, and Quartus II design notes that are not aggregated in the standalone datasheet PDF.
EP2SGX60DF780C5 - Stratix II GX FPGA, 60K LEs, 780-FBGA | Intel
The Intel (formerly Altera) EP2SGX60DF780C5 is a Stratix II GX family field-programmable gate array (FPGA) integrating 60,440 logic elements, 3,022 logic array blocks (LABs), and embedded transceivers in a 780-pin flip-chip BGA package. Built on a 90 nm process with a 1.2 V core supply, the device is specified for a commercial operating temperature range and a -5 speed grade, balancing logic capacity with high-speed serial capability for communications and signal-processing backplanes. An FPGA is a programmable logic device that combines configurable logic blocks, programmable interconnect, and dedicated silicon resources (block RAM, DSP blocks, PLLs, and high-speed transceivers) on a single die, allowing designers to implement custom digital hardware that can be reconfigured after manufacturing. The Stratix II GX family sits within Intel's high-performance FPGA hierarchy: FPGA > programmable logic > programmable logic device > semiconductor IC, and is widely used in protocols where hard SERDES, large on-chip memory, and high logic density are required concurrently. Key features include 364 user I/O pins, embedded 3.125 Gbps-class transceivers, embedded multiplier blocks for DSP, TriMatrix block RAM, and a structured ASIC-like clock network. According to distributor listings, the device supports an internal frequency near 717 MHz and uses a 23 x 23 mm FC-FBGA substrate with 1 mm ball pitch, providing robust signal and power integrity for high-channel-count designs. Architecturally, the Stratix II GX family introduced an adaptive logic module (ALM) that combines fracturable look-up-tables with dedicated arithmetic and carry logic, delivering higher effective logic utilization than the previous Stratix generation. The -C5 speed grade places it in the mid-band of Stratix II GX timing, well suited for production deployments rather than the fastest prototyping tier. Typical applications include telecom line cards, multi-gigabit serial backplanes, video broadcast equipment, military radar preprocessing, and high-performance ASIC prototyping. Designers also use the part in test and measurement chassis where flexible I/O plus high logic density shorten time-to-market. When designing with this device, plan power sequencing for the 1.2 V core, the auxiliary and PLL supplies, and the transceiver analog rails, and verify termination, length-matching, and stack-up against the package's 1 mm BGA pitch. Because the part is in the Stratix II GX EOL category at Altera/Intel, long-life customers should confirm last-time-buy status before committing to new designs.
EP2SGX60DF780C5N - Stratix II GX FPGA, 60K LE, 780-FBGA | Altera
The Altera (Intel) EP2SGX60DF780C5N is a Stratix II GX family Field Programmable Gate Array (FPGA) integrating 60,440 logic elements, 3,022 LABs, 364 user I/Os, and 2,544,192 bits of embedded memory in a 780-pin flip-chip BGA (FBGA) package. Built on a 90 nm process node, the device supports an internal clock frequency up to 609.76 MHz (per ADatasheet listing) with 1.2 V core supply operation. The EP2SGX60DF780C5N is one of the Stratix II GX variants, distinguished by its integrated multi-gigabit transceiver (MGT) blocks for high-speed serial I/O, making it well suited for serial connectivity, signal processing, and protocol bridging applications. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O can be configured by the end designer after manufacture. The Stratix II GX family belongs to the broader hierarchy of programmable logic devices (PLD) -> FPGA -> high-performance transceiver-equipped FPGA -> embedded system-on-chip prototyping silicon. Compared with earlier Stratix generations, Stratix II GX introduced adaptive logic modules (ALMs) and embedded DSP blocks for high-throughput arithmetic, while the GX suffix indicates the addition of multi-gigabit transceivers that operate up to 6.375 Gbps. Key features include 60,440 logic elements (LE), 3,022 LABs/CLBs, 2,544,192 bits of embedded RAM (≈2.5 Mb), embedded DSP blocks for high-speed multiply-accumulate operations, and 12 transceiver channels that operate at serial data rates up to 6.375 Gbps per the Stratix II GX device handbook. The 780-pin flip-chip BGA package supports high I/O count with signal integrity for high-speed parallel and serial interfaces. The device is fabricated on a 90 nm CMOS process and uses 1.2 V core supply with separate VCCIO banks for mixed-voltage I/O interfacing. Architecture-wise, the Stratix II GX uses an ALM-based fabric rather than the older 4-input LUT approach, doubling effective logic capacity per area. On-chip TriMatrix memory supports true dual-port, simple dual-port, and single-port RAM/ROM configurations. The transceiver blocks include clock data recovery (CDR), pre-emphasis, and equalization, supporting standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G. Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO), telecommunication line cards, multi-gigabit serial backplanes, video broadcast equipment, and DSP prototyping for radar and baseband processing. The 780-FBGA package also makes the device suitable for designs that require many LVDS or DDR memory interfaces on the parallel side. Design consideration: Stratix II GX designs require the Quartus II design software for synthesis, place-and-route, and timing closure. Power estimation must include both the logic fabric and the active MGT channels, since transceivers can dominate total power consumption when all 12 channels are active. This page synthesizes distributor stock levels, drop-in package and speed-grade alternatives from the Stratix II GX family, and practical design notes not duplicated on the manufacturer datasheet.
EP2SGX60DF780C7 - Stratix II GX 60K LE FPGA, 364 I/O, 780-BGA | Intel
The Intel (Altera) EP2SGX60DF780C7 is a member of the Stratix® II GX family of high-density, high-performance FPGAs with integrated transceivers, fabricated on a 90 nm process and housed in a 780-ball FineLine BGA (FBGA) package. The device integrates 60,440 logic elements (LEs), 3,022 logic array blocks (LABs), and 364 user I/O pins, providing the digital fabric needed for high-throughput parallel processing, custom interconnect, and protocol bridging. The C7 speed grade is the slowest commercial speed bin of the family, trading Fmax for low power and tight cost positioning, and is intended for designs where timing closure is not the dominant constraint. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O can be customized after manufacture. The Stratix II GX family belongs to the taxonomy: FPGA -> programmable logic -> digital ASIC alternative -> semiconductor. These devices sit between generic microcontrollers and fixed-function ASICs in the design hierarchy, providing ASIC-class data-path parallelism and logic density while remaining reprogrammable for design changes, field upgrades, and late-stage bug fixes. The GX suffix denotes integrated multi-gigabit transceivers, making the family especially relevant for serial-protocol-heavy designs such as PCIe, Serial RapidIO, XAUI, and custom high-speed serial links. Key features of the EP2SGX60DF780C7 include 2,544,192 bits of embedded RAM organized in M512/M4K/M-RAM blocks, embedded DSP blocks for fixed- and floating-point arithmetic, programmable I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X) on every user pin, and on-chip PLL and clock management. The 780-pin FBGA package supports very high I/O count, enabling wide parallel buses, multiple high-speed serial links, and abundant differential pairs. The 1.15V–1.25V core supply reflects the 90 nm process node, while separate I/O banks allow 1.5V, 1.8V, 2.5V, or 3.3V interfacing on a per-bank basis. Typical applications for this device include high-speed serial protocol bridging (PCIe endpoint / root complex, XAUI/10 GbE front-end, Serial RapidIO), DSP front-ends for telecom baseband and radar, custom packet processors in networking line cards, and prototype ASIC development. The 780-BGA package combined with 364 user I/Os also suits video broadcast, test and measurement instrumentation, and military/aerospace signal-processing cards where the C7 speed grade and high logic density are advantageous. When designing with the EP2SGX60DF780C7, note that the C7 speed grade implies a lower Fmax than C5 or C6; reserve C7 for designs where timing margins are not the limiting factor, otherwise upgrade to a faster bin. The 780-BGA requires controlled-impedance PCB design, decoupling capacitor placement within the BGA keep-out, and a thermal solution sized to the application's ambient and airflow. The Intel Quartus II design software (legacy) is the supported toolchain; current Intel Quartus Prime does not support Stratix II, so EOL planning is critical. This page synthesizes distributor pricing, drop-in speed-grade and variant alternatives, and practical design notes for the EP2SGX60DF780C7 that are not found in the manufacturer datasheet.
EP2SGX60DF780I3N - 60K LE Stratix II GX FPGA, 780-FBGA | Intel / Altera
The Intel (formerly Altera) EP2SGX60DF780I3N is a high-density Field-Programmable Gate Array (FPGA) from the Stratix II GX family, delivering 60,440 logic elements and 60,440 Configurable Logic Blocks (CLBs) in a 780-ball Flip-Chip Fine-pitch Ball Grid Array (FC-FBGA) package with a 1.00 mm terminal pitch. The device supports maximum internal clock frequencies up to 622.08 MHz (data sheet speed grade 816.9 MHz reference) and is fabricated on a 90 nm CMOS process with a 1.2 V nominal core supply voltage. What is a Stratix II GX FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. Stratix II GX is a transceiver-equipped variant in the broader Stratix II family, engineered for high-speed serial I/O applications such as serial RapidIO, PCI Express, XAUI, and custom protocols. Within the FPGA taxonomy (FPGA → programmable logic → logic IC → integrated circuit), Stratix II GX sits at the high-performance, transceiver-rich tier. Key differentiating features of the EP2SGX60DF780I3N include 60,440 logic elements, embedded multiplier blocks for DSP, dedicated high-speed serial transceivers supporting multi-gigabit data rates, and a rich on-chip memory hierarchy with TriMatrix memory blocks. The FC-FBGA-780 package supports industrial-grade thermal operation from -40 °C to +85 °C and is optimized for high signal-integrity designs with controlled-impedance escape routing. Architecturally, Stratix II GX uses Altera's adaptive logic module (ALM) instead of the legacy 4-input LUT, delivering finer-grain logic packing and improved performance per logic element. The built-in transceivers operate at line rates suitable for 1 Gbps to 3.125 Gbps serial protocols and can be aggregated into 4- or 8-channel groups for parallel high-speed links. Dedicated hard IP blocks for PHY functions reduce soft-logic resource consumption and lower latency for memory and connectivity interfaces. Typical applications include telecommunications line cards, baseband processing for wireless infrastructure, high-speed serial protocol bridging (PCIe, XAUI, Serial RapidIO), military and aerospace signal processing, broadcast video transport, and high-performance ASIC prototyping. The -I3 industrial speed grade and 1.2 V core operation make it suitable for thermally constrained embedded systems where reliability over the industrial temperature range is mandatory. When designing with this FPGA, pay close attention to transceiver reference clock jitter, PCB stack-up for high-speed serial channels, and decoupling strategy near each transceiver quad. The 1.00 mm ball pitch requires microvia or fine-line PCB fabrication; through-hole vias on BGA pads are not recommended. Quartus II software (version supporting Stratix II GX) is required for design entry, synthesis, place-and-route, and programming file generation. This page consolidates distributor stock and pricing (as of 2026-09-09), curated same-package drop-in alternatives, and design notes not aggregated on any single manufacturer or distributor page.
EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
The Intel EP2SGX60DF780I4 is a Stratix II GX family Field-Programmable Gate Array (FPGA) with 60,440 logic cells, 364 user I/Os, 2,544,192 bits of embedded memory, and integrated 6.375 Gbps transceivers, housed in a 780-ball FineLine BGA (29 x 29 mm, 1 mm pitch) package. It is fabricated on a 90 nm CMOS process and supports an internal maximum clock frequency of up to 732.1 MHz. The device is rated for industrial temperature operation (-40C to +100C ambient), and the suffix "I4" denotes the industrial speed grade. An FPGA is an integrated circuit containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardened IP such as transceivers, memory blocks, and DSP blocks. The Stratix II GX family is Intel's (formerly Altera's) high-end transceiver-rich FPGA family, positioned above the Cyclone and Arria lines and below the Stratix IV/V in the programmable-logic taxonomy: FPGA > Stratix > high-speed serial transceiver FPGA > Stratix II GX. This categorization matters for system architects evaluating performance per dollar and per watt. Key features of the EP2SGX60DF780I4 include 60,440 logic elements, 2,544,192 embedded RAM bits organized as M512/M4K/M-RAM blocks, embedded 6.375 Gbps multi-gigabit transceivers (MGTs), dedicated DSP blocks, and Phase-Locked Loops (PLLs). The high transceiver count and rich DSP resources make the device a workhorse for parallel signal-processing and high-speed serial I/O applications. Architecturally, Stratix II GX devices use an adaptive logic module (ALM)-based fabric, an 8-input fracturable LUT, and a column-based DSP/memory floorplan. Compared to Stratix II (non-GX) devices, the GX variant adds hardened PMA-capable transceivers directly bonded to the die, enabling 6.375 Gbps SERDES without consuming fabric logic. This architecture delivers a multi-GHz fabric with deterministic timing closure. Typical applications include high-speed serial backplane interfaces (XAUI, PCIe Gen1, Serial RapidIO, SDI/HD-SDI), DSP co-processing, software-defined radio (SDR) baseband, and 1G/10G Ethernet MAC bridging. The device's combination of 6.375 Gbps transceivers and embedded DSP is well matched to multi-lane serial protocol bridges and pre-silicon ASIC prototyping. When designing with the EP2SGX60DF780I4, designers should carefully manage multi-gigabit transceiver PCB routing (controlled-impedance differential pairs, length matching, and AC-coupling capacitors on each lane), provide ample decoupling on VCCINT/VCCA and VTT rails, and ensure thermal management accounts for industrial-temperature operation in enclosed chassis. Power estimation should be performed in the Quartus II Early Power Estimator before PCB layout to size rails correctly. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not aggregated in a single place on the manufacturer datasheet, giving engineers a one-stop reference for part selection, sourcing, and PCB-level integration.
EP2SGX60DF780I4N - Stratix II GX FPGA, 60K LE, FBGA-780 | Intel
The Intel (formerly Altera) EP2SGX60DF780I4N is a high-density Stratix II GX FPGA in the 780-pin FineLine BGA package, integrating 60,440 logic elements, 3,022 logic array blocks (LABs), and embedded transceivers for high-speed serial I/O. The device operates from a 1.2 V core supply on a 90 nm CMOS process and supports up to 364 user I/O pins, with built-in PCI Express, SATA, and multi-gigabit transceivers rated up to 6.375 Gbps per channel. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a programmable logic device that lets hardware engineers implement arbitrary digital circuits using configurable logic blocks (CLBs/LABs), routing fabric, and dedicated hard-IP such as transceivers, memory blocks, and PLLs. FPGAs sit above ASICs in the semiconductor taxonomy for flexibility and below microcontrollers for raw parallel performance, occupying a unique position in the broader IC hierarchy: programmable logic device -> FPGA -> high-performance FPGA -> transceiver-equipped FPGA -> power management and signal processing subsystem. Key features include 60,440 logic cells (60440-Cell), 3,022 LABs, embedded 18x18 multipliers for DSP, and high-speed serial transceivers ideal for serial RapidIO, XAUI, and PCIe designs. The 780-pin FBGA package offers fine-pitch 1.0 mm ball spacing in a 29 x 29 mm footprint and supports industrial temperature operation from -40C to +100C (per the I4 suffix). The Stratix II GX architecture uses adaptive logic modules (ALMs) that pack more logic per area than the original Stratix I family. The transceiver blocks support multiple high-speed serial protocols natively, enabling protocol bridging and backplane designs without external PHY chips. The part is lead-free and RoHS compliant per the datasheet. Typical applications include high-speed serial interface bridging (PCIe, SATA, XAUI), DSP coprocessors in telecom infrastructure, military and aerospace signal processing, and high-end ASIC prototyping. The integrated transceivers make this FPGA especially suitable for line-card designs in wired telecom. When designing with this FPGA, pay attention to power-rail sequencing and use the Stratix II GX HardCopy companion for production volumes. The 780-ball FBGA requires careful PCB layout with controlled-impedance traces and microvia stackups to achieve multi-gigabit signal integrity. This page synthesizes verified distributor pricing, drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX60E1152C - Stratix II GX FPGA 60K LE BGA-1152 | Intel
The Intel (formerly Altera) EP2SGX60E1152C is a Stratix II GX family Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA package, integrating approximately 60,000 logic elements (LEs) and embedded transceivers optimized for high-speed serial I/O. The device combines a rich logic fabric, on-chip memory, and 4.5 Mbps embedded multipliers (DSP blocks) with up to 20 multi-gigabit transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G. A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows engineers to configure arbitrary digital logic, interconnect, and I/O after silicon fabrication. Within the broader taxonomy, the EP2SGX60E1152C belongs to the hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> digital IC -> semiconductor. The Stratix II GX sub-family specifically targets high-bandwidth serial connectivity applications, integrating hardened PHY macros alongside the general-purpose fabric to simplify protocol implementation. Key features of the EP2SGX60E1152C include 60440 logic elements organized into ALMs, 2544192 bits of on-chip RAM, 534 user I/O pins, and transceiver support operating between 600 Mbps and 6.375 Gbps per channel. The device is fabricated in a 90 nm process node, with on-chip termination, dynamic phase alignment for transceivers, and embedded PCI Express hard IP blocks to reduce logic usage for common interconnect standards. From an architectural standpoint, the Stratix II GX uses an ALM-based adaptive logic module that yields roughly 40 percent higher logic density than 4-input LUT architectures. Combined with dedicated DSP blocks for signal processing and TriMatrix on-chip memory structures, the EP2SGX60E1152C achieves an attractive balance of logic, memory, and serial bandwidth per watt for high-throughput systems. Typical applications include high-end communications line cards with multi-gigabit serial links, ASIC prototyping for protocol verification, high-performance DSP pipelines for radar and image processing, ASIC-replacement designs in storage area networks, and broadcast video processing. The Stratix II GX is also widely used in industrial test equipment where dense logic and serial bandwidth converge in a single device. When designing with this FPGA, pay careful attention to power-rail sequencing requirements and decoupling strategy. The 1152-ball BGA package requires a multi-layer PCB with controlled-impedance routing for the high-speed serial lanes, and the Quartus II design software should be used for place-and-route to achieve timing closure on the transceiver channels. This page consolidates distributor availability, drop-in compatible alternatives from the same Stratix II GX family, and practical PCB layout notes that complement the manufacturer datasheet and Quartus II device handbook.
EP2SGX60EF1152C3 - Stratix II GX FPGA 60K LE 1152-FBGA | Intel
The Intel EP2SGX60EF1152C3 is a high-density Stratix II GX family FPGA built on a 90 nm process, integrating 60,440 logic elements (LEs) and 534 user I/Os in a 1152-ball FineLine BGA (FC-FBGA) package measuring 35 mm x 35 mm. It features 3,022 LABs/CLBs, 2,544,192 bits of embedded memory, 36 transceiver channels operating up to 6.375 Gbps, and an internal frequency rated at 717 MHz with 816.9 MHz maximum performance, all powered from a 1.2 V core supply. The device belongs to the Stratix II GX family which adds embedded transceivers for high-speed serial I/O. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits through a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and high-speed transceivers, all interconnected by a programmable routing fabric. In the system hierarchy, FPGAs sit above general-purpose microcontrollers and below ASICs in terms of design flexibility, offering hardware-level parallelism and reconfigurability for applications requiring custom high-speed data paths, signal processing, or protocol bridging. Stratix II GX specifically targets communications infrastructure where multi-gigabit serial transceivers eliminate the need for external PHY chips. Key differentiators of the EP2SGX60EF1152C3 include 36 embedded transceivers supporting PCI Express, Serial RapidIO, XAUI, CEI-6G, and Custom (GIGE) standards; 252 (18x18) multipliers for high-throughput DSP; an 8-input adaptive logic module (ALM) architecture that improves logic utilization by ~25% versus the prior Stratix generation; and dynamic phase alignment on transceivers to simplify PCB layout for high-speed serial channels. The 35x35 mm FC-FBGA-1152 footprint exposes a wide 534 I/O count plus 20 dedicated transceiver channels plus 16 additional high-speed differential pairs, ideal for systems requiring both high I/O density and multi-gigabit serial connectivity. Typical applications include high-end telecommunications line cards with multi-protocol backplane aggregation, broadcast video routers using SDI/HD-SDI/3G-SDI, military radar and signal processing, and PCI Express Gen1 endpoint designs. The 6.375 Gbps transceiver ceiling and 36-channel aggregation make this device well-suited for systems previously built with multiple FPGAs plus external transceivers. Designers can implement line-side SERDES, crossbar switching, and protocol bridging within a single chip, reducing board area and BOM cost. Design considerations for the EP2SGX60EF1152C3 include careful PCB stackup planning for the 1152-ball BGA, dedicated transceiver power filtering, Quartus II software support, and the need for configuration memory (EPCS) for non-volatile bitstream storage. The device requires multiple supply rails (1.2 V core, 2.5 V/3.3 V I/O, and dedicated transceiver analog supplies VCCA, VCCP, VCCR). Thermal management via heatsink or forced airflow is recommended because Stratix II GX can dissipate 15-25 W in typical operating conditions. This page synthesizes distributor pricing, package dimensions, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for the EP2SGX60EF1152C3.
EP2SGX60EF1152C3N - 60K LEs Stratix II GX FPGA | Intel | 1152-BBGA
The Intel (formerly Altera) EP2SGX60EF1152C3N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) with 60,440 logic elements, 2,544,192 bits of embedded memory, and integrated 3.125 Gbps transceivers, packaged in a 1152-ball flip-chip BGA. It is fabricated on a 90 nm process technology with a 1.2 V core supply and operates up to a maximum internal frequency of 717 MHz with a 0.40 ns propagation delay. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks and interconnect via a hardware description language (HDL). FPGAs occupy a tier in the semiconductor hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. They offer parallel processing, deterministic timing, and hardware-level reprogrammability that microcontrollers and DSPs cannot match for high-throughput, low-latency signal processing. The EP2SGX60EF1152C3N integrates 3022 logic array blocks (LABs) with 534 user I/Os, four phase-locked loops (PLLs), and embedded multiplier blocks (18x18) for DSP arithmetic. The device is offered in the C3 speed grade (commercial, -3 speed bin) and ships in a 35 mm x 35 mm 1152-pin FC-FBGA with 1.0 mm ball pitch, providing ample I/O for high-bandwidth memory interfaces and parallel data acquisition. The GX suffix denotes integrated multi-gigabit transceivers. Stratix II GX transceivers support serial protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI at up to 3.125 Gbps. The combination of high logic density, embedded memory, hard IP for DSP, and serial transceivers makes the EP2SGX60EF1152C3N a single-chip solution for protocol bridging, high-speed data aggregation, and signal processing. The 90 nm CMOS process delivers a balance of speed and power for telecom, military, and high-end industrial systems. Typical applications include 10G Ethernet line card aggregation, wireless baseband processing, radar and SIGINT front ends, high-speed test instrumentation, and military secure communications. Design flow uses the Quartus II design software, which provides synthesis, place-and-route, timing analysis, and bitstream generation for the device. When designing with the EP2SGX60EF1152C3N, ensure PCB layout follows Intel's 1152-BGA flip-chip escape rules with via-in-pad or microvia stack-ups for signal-integrity. Thermal management requires an adequate thermal pad connection to the PCB inner copper plane to keep junction temperature within the 100C commercial limit. The C3 speed grade is one step below the fastest C4 and C5 bins; verify timing closure against your target fMAX before committing to the bin. This page consolidates distributor pricing, same-brand Stratix II GX alternates, and practical Quartus II design notes not found in the device datasheet alone.
EP2SGX60EF1152C4 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP2SGX60EF1152C4 is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) housed in a 1152-ball FineLine BGA package, providing 60,440 equivalent logic elements, 2,544,192 bits of embedded RAM, and 534 user I/O pins. The device integrates up to 12 transceivers operating at 6.375 Gbps and is fabricated on a 90 nm process with a 1.15 V to 1.25 V core supply, according to the manufacturer datasheet family documentation. The "C4" speed grade targets commercial-temperature designs (0C to 85C ambient). A Field Programmable Gate Array is a programmable logic device containing configurable logic blocks, programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory blocks. Within the broader programmable-logic taxonomy, an FPGA sits between a CPLD (smaller, non-volatile, deterministic timing) and an ASIC (mask-programmed, highest density, lowest unit cost). The Stratix II GX family is engineered for high-speed serial I/O and DSP-intensive applications such as wireline communications, broadcast video, and military signal processing. Key features include 3022 LABs/CLBs, 24 (7+11) embedded 18-bit x 18-bit multipliers, embedded TriMatrix memory blocks distributed throughout the fabric, and 12 full-duplex multi-gigabit transceivers (MGTs) that natively support PCI Express, Serial RapidIO, XAUI, and CPRI protocols. The 1152-pin FC-FBGA package (35 mm x 35 mm body, 1.0 mm pitch) supports high I/O count and high transceiver ball-out. The part is lead-free (Pb-free) and RoHS compliant per the manufacturer product page. Typical applications include 10 Gbps wireline interfaces, software-defined radio baseband processing, ASIC prototyping, high-speed data acquisition, and PCI Express Gen1 endpoint cards. The combination of abundant logic, large on-chip memory, and multi-gigabit transceivers makes the device well suited for systems that require parallel DSP and serial connectivity on the same die. The "C4" speed grade is approximately 7%-10% slower than the fastest "C5" / "C6" grades but offers lower cost for designs that do not require the highest fmax. When designing with this device, plan power sequencing carefully: the 1.2 V core, 2.5 V/3.3 V auxiliary, and 1.2 V/1.5 V transceiver supplies must ramp in a defined order to avoid latch-up. Use at least eight PCB layers with continuous ground and power planes, and follow the Altera Stratix II GX Handbook decoupling recommendations for the 1152-FBGA package. This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix II GX family, and practical design notes that are not duplicated on the manufacturer datasheet.
EP2SGX60EF1152C4K - 60K LEs Stratix II GX FPGA, 1152-BGA | Altera
The Intel (formerly Altera) EP2SGX60EF1152C4K is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 60,440 logic elements, 534 user I/Os, 2,544,192 bits of embedded memory, and integrated 6.375 Gbps transceivers, all housed in a 1152-ball Flip-Chip BGA (FC-FBGA) package. The device is fabricated on a 90 nm process and operates from a 1.2 V core supply with up to 732.1 MHz internal performance. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, embedded memory, DSP blocks, and high-speed transceivers that can be rewired after manufacturing. FPGAs sit at the top of the digital IC hierarchy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family specifically extends this hierarchy with embedded transceivers, allowing single-chip implementation of multi-gigabit serial interfaces that previously required companion PHY chips. Key features of the EP2SGX60EF1152C4K include 3022 Logic Array Blocks (LABs), 3,024 Kbit (2,544,192 bits) of TriMatrix embedded memory, up to 252 embedded 18x18 multipliers, dedicated DDR2 memory interfaces, and up to 12 full-duplex multi-gigabit transceivers supporting CPRI, OBSAI, Serial RapidIO, PCI Express, XAUI, and CEI-6G protocols. The device is rated for commercial (0C to 85C) ambient operating conditions. The architecture uses Altera's adaptive logic module (ALM) combined with a hierarchical routing network, delivering up to 732.1 MHz fabric performance. The 1.2 V core supply and 90 nm CMOS process provide a balance of high logic density and low dynamic power, while the embedded transceiver blocks (6.375 Gbps) eliminate the need for external PHY silicon for high-speed serial links. The -C4 speed grade places this part in the mid-range performance tier of the family. Typical applications include high-end telecommunications line cards, military radar and signal-intelligence platforms, broadcast video processing, ASIC prototyping, and PCI Express Gen1/Gen2 endpoint or root-complex designs. Engineers commonly use the EP2SGX60EF1152C4K as a system-on-chip integration device where multiple protocol bridges, DSP pipelines, and a soft processor core coexist. When designing with the EP2SGX60EF1152C4K, plan power sequencing carefully - the core (VCC), analog (VCCA), and I/O banks (VCCIO) require specific ramp rates. Use the Quartus II design software (Altera) or Quartus Prime (Intel FPGA) for synthesis, place-and-route, and SignalTap II logic analysis. This page synthesizes distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX60EF1152C4N - Stratix II GX 60K FPGA, 1152-BGA | Altera
The Altera (Intel) EP2SGX60EF1152C4N is a Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 60,440 logic elements, 534 user I/O pins, and 2,544,192 bits of embedded memory in a 1152-ball FineLine BGA (FBGA-1152) package. The device is built on a 1.2V / 90nm CMOS process and includes up to 12 high-speed transceivers supporting multi-gigabit serial I/O for backplane and chip-to-chip links. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC whose logic function is defined after manufacture by a configuration bitstream loaded into on-chip SRAM. FPGAs sit hierarchically alongside ASICs and CPLDs as user-customizable digital logic devices, and high-density FPGAs like the Stratix II GX add embedded transceivers, DSP blocks, and large memory arrays to support system-on-chip (SoC) integration in communications, broadcast, and high-performance computing. Key features of the EP2SGX60EF1152C4N include 60,440 logic elements, 3,022 LABs (Logic Array Blocks), 254 I/O standards supported, and a maximum user I/O count of 534 pins. The integrated transceivers operate at up to 6.375 Gbps per channel and support PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI, and other serial protocols. The 1152-pin FBGA package uses a 35x35 mm substrate with 1.0 mm ball pitch and supports -40C to +85C commercial-grade operation (the 'C' suffix). The Stratix II GX architecture uses an adaptive logic module (ALM) that delivers up to 1.88x the logic capacity and 1.5x the memory bandwidth of the original Stratix family. The device's high-speed I/O bank structure supports single-ended standards (LVTTL, LVCMOS, PCI, PCI-X) and differential standards (LVDS, LVPECL, HyperTransport) via dedicated true-LVDS pins, with on-chip termination resistors for signal-integrity optimization. Typical applications include 10G/40G optical transport platforms, PCI Express Gen1/Gen2 endpoint and root-complex designs, Serial RapidIO switch fabrics, software-defined radio (SDR) baseband processing, and high-end ASIC prototyping. The combination of dense logic and integrated transceivers makes it particularly suitable for wireline and wireless infrastructure line cards. When designing with the EP2SGX60EF1152C4N, pay close attention to the FPGA's 25W typical power dissipation budget and provide a thermal solution sized for at least 15-20W steady-state load. Use the Altera Quartus II design suite (versions 7.2 through 13.0sp1) for synthesis and place-and-route, and consult the Stratix II GX pin connection guidelines for the 1152-BGA package before laying out the PCB. This page synthesizes verified distributor pricing, drop-in and parametric-equivalent alternatives, and practical Quartus II design considerations not consolidated in any single manufacturer document, giving engineering buyers a faster procurement and design-start workflow.
EP2SGX60EF1152C5 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP2SGX60EF1152C5 is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 3,022 LABs/CLBs, and 2,544,192 bits of embedded RAM in a 1,152-ball FineLine BGA package (35 x 35 mm). It integrates up to 534 user I/Os, 717 MHz internal operation, and high-speed transceivers optimized for serial connectivity, making it suitable for prototyping and production in communication, video-processing, and high-performance DSP systems. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that sits in the IC hierarchy between CPLDs and structured ASICs. It uses a matrix of configurable logic blocks (LABs/CLBs) embedded in a programmable interconnect fabric, augmented with hardened blocks such as transceivers, DSP slices, and block RAM. Stratix II GX family members are designed for high-speed serial I/O and embedded-transceiver-rich applications where general-purpose FPGAs lack the bandwidth. Key specifications include 60,440 logic elements, 3,022 LABs/CLBs, 2,544,192 bits of embedded RAM (approximately 311 kbyte), 484 pins in a 1152-ball BGA, and a core supply of 1.15 V to 1.25 V. The device also integrates up to 20 transceivers and supports high-performance parallel I/O standards including LVDS, LVPECL, HSTL, and SSTL for memory and backplane interfaces. Architecturally, the Stratix II GX uses an adaptive logic module (ALM) fabric paired with TriMatrix embedded memory that supports true dual-port, simple dual-port, and single-port modes with parity and ECC options. A network of dedicated high-speed serial transceivers handles multi-gigabit links, while the surrounding periphery offers programmable I/O banks supporting single-ended and differential signaling. This combination allows designers to consolidate what would otherwise be a discrete ASSP plus glue logic onto a single programmable device. Typical applications include high-speed serial backplane bridging, wireless baseband prototyping, video broadcast infrastructure, ASIC prototyping/emulation, and high-performance DSP co-processing. The combination of high logic density and transceiver-rich I/O is well suited to telecom line cards, test and measurement equipment front-ends, and defense signal-processing platforms. When designing with this device, plan the PCB for a high-layer-count stack-up to fan out the 1,152-ball BGA, and ensure that the 1.15 V to 1.25 V core rail is decoupled with low-impedance ceramic capacitors close to the package. This page synthesizes distributor pricing, drop-in Stratix II GX alternatives, and design notes not found in the manufacturer datasheet.
EP2SGX60EF1152C5N - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
The Intel EP2SGX60EF1152C5N is a high-density Stratix II GX Field Programmable Gate Array delivering 60,440 logic elements and 2,544,192 bits of embedded memory in a 1152-ball Flip-Chip FineLine BGA (FC-FBGA) package. It integrates 534 user I/Os and supports up to 609.76 MHz core operation on a 90 nm process with a 1.2 V core supply. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells are defined by a user-loaded configuration bitstream rather than hard-wired at the fab. Stratix II GX belongs to the FPGA -> programmable logic -> semiconductor hierarchy and was designed to combine high-density general-purpose logic with embedded transceivers for serial connectivity. Key features include 3022 Logic Array Blocks (LABs), embedded 18x18 multipliers (typically 144 DSP blocks for the device family), high-speed serial transceivers supporting multi-gigabit rates, and Phase-Locked Loops (PLLs) for clock management. The FC-FBGA-1152 package uses flip-chip land-grid array construction that maximizes I/O density while minimizing electrical parasitics. The 90 nm CMOS process with copper interconnect and 1.2 V core enables high toggle rates and aggressive integration, while the -5 speed grade denotes the mid-tier core performance bin. The Stratix II GX architecture pairs embedded transceivers with PCI Express hard IP blocks, supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI directly from the silicon. Typical applications include high-speed serial interface bridges, ASIC prototyping, telecom line-card glue logic, military/aerospace signal processing, and broadcast video infrastructure. The -5 commercial speed grade is appropriate for laboratory and production designs where lower power and predictable timing closure are priorities. Designers should plan for the 1152-ball FC-FBGA land pattern (35 mm or 40 mm body, depending on revision) and provide at least 6 PCB signal layers for break-out, plus dedicated ground/power planes for the 1.2 V core and 3.3 V/2.5 V/1.8 V I/O banks. Use the Quartus II design tool (or later Cyclone/Arria-compatible software where supported) for synthesis, place-and-route, and bitstream generation. This page synthesizes distributor pricing, drop-in speed-grade and package alternatives, and practical design notes that supplement the manufacturer datasheet.
EP2SGX60EF1152I3 - 60K LEs Stratix II GX FPGA, 1152-BGA, Industrial | Intel
The Intel (formerly Altera) EP2SGX60EF1152I3 is a high-performance Stratix II GX Field-Programmable Gate Array (FPGA) with 60,440 logic elements, integrated transceivers, and embedded memory, housed in a 1152-ball FineLine BGA package. It is part of the Stratix II GX family, which combines a logic-rich adaptive logic module (ALM) fabric with multi-gigabit transceivers targeting high-bandwidth serial I/O applications. The device operates at a maximum internal frequency of 717 MHz, with a propagation delay of approximately 2.99 ns per combinational logic block. A Stratix II GX FPGA belongs to the high-end FPGA family within the programmable logic device (PLD) hierarchy. Stratix II GX -> FPGA -> Programmable Logic Device -> Logic IC -> Integrated Circuit -> Semiconductor. The "GX" suffix denotes integrated multi-gigabit transceivers supporting protocols such as PCIe, Serial RapidIO, XAUI, CEI-6G, and SONET/SDH, eliminating the need for external PHY chips on many line cards. The "EF" infix indicates Enhanced Configuration (EPC) support, enabling fast parallel configuration via external memory devices for sub-100 ms boot. Key features include 60,440 equivalent logic elements, approximately 2.5 Mbit of embedded memory, dedicated DSP blocks for high-speed multiplication, up to 12 multi-gigabit transceivers (per Stratix II GX family), and PLL-based clock management. The -I3 speed grade and industrial temperature range (-40C to +100C) make this part suitable for harsh-environment deployment in telecom, military, and industrial systems. The architecture uses 90 nm CMOS process technology with adaptive logic modules (ALMs) that each contain a fracturable 8-input look-up table (LUT), two dedicated adders, and dedicated register chains, enabling higher effective logic density than 4-input LUT architectures. TriMatrix embedded memory blocks (M512, M4K, M-RAM) support single-port, dual-port, and FIFO configurations with byte-enable parity protection. Typical applications include 10G Ethernet line cards, PCIe Gen1/Gen2 endpoint and root-complex designs, SONET/SDH framer/mapper ASICs, Radar signal processing front-ends, and high-speed serial protocol bridging. The integrated transceivers save bill-of-materials cost and PCB area versus equivalent LUT-fabric-only FPGAs paired with external PHYs. When designing with this device, ensure proper power-sequencing of the analog transceiver supply (VCCH) versus the digital core supply (VCCINT) to avoid latch-up, and follow the Stratix II GX pin connection guidelines for unused transceiver pins. PCB layout requires impedance-controlled 100-ohm differential traces for the high-speed serial links, and a minimum 4-layer stackup with continuous ground planes is recommended. This page synthesizes distributor pricing, drop-in same-package alternatives from the Site MPN list, and practical design notes that complement the manufacturer datasheet.
EP2SGX60EF1152I3N - Stratix II GX FPGA, 60K LEs, 1152-FBGA | Intel
The Intel (formerly Altera) EP2SGX60EF1152I3N is a high-density Field-Programmable Gate Array from the Stratix II GX family, integrating 60,440 logic elements (LEs), 60,440 configurable logic blocks, and embedded transceivers in a 1152-ball FineLine BGA package. It is fabricated on a 90nm process technology, operates at a core voltage of 1.2V, and supports a maximum internal clock frequency of 717 MHz (with marketing frequency up to 816.9 MHz noted by some distributors). A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that engineers configure after manufacturing to implement custom digital circuits. Within the broader taxonomy, an FPGA sits under programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX family specifically adds multi-gigabit transceivers and is positioned for high-speed serial I/O, digital signal processing (DSP), and embedded processing applications. Key features of the EP2SGX60EF1152I3N include 2,544,192 bits of embedded memory (M4K/M512/RAM blocks), dedicated DSP blocks for high-throughput arithmetic, up to 12 embedded transceivers supporting multi-gigabit serial protocols, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and Phase-Locked Loops (PLLs) for clock management. It also offers configurable I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL) on the user I/O pins. Architecturally, Stratix II GX uses the ALM (Adaptive Logic Module) which combines the benefits of LUT-based and product-term logic, allowing more efficient packing of logic. The 90nm process delivers favorable performance-per-watt compared with earlier 130nm Stratix devices. The 1152-pin FC-FBGA package measures 35 x 35 mm with 1 mm ball pitch (some vendor listings also describe 23 x 23 mm or 484-ball variants of the same family depending on density/option). Typical applications include high-speed serial connectivity (backplane, XAUI, PCI Express, Serial RapidIO), high-performance DSP for wireless baseband or video processing, prototype ASIC development, military/aerospace signal processing, and high-end test and measurement equipment. The industrial temperature grade (I3N = -40C to +100C junction, with some sources citing -40C to +85C ambient) makes it suitable for harsher environments. When designing with this device, use the Quartus II development suite (compatible with Stratix II GX) for synthesis, place-and-route, and timing closure. Plan PCB layout carefully for the FC-FBGA - it requires microvia or via-in-pad technology and controlled-impedance routing for the high-speed transceiver channels. Power-rail sequencing is recommended because the device uses multiple supply voltages (1.2V core, 2.5V/3.3V I/O, PLL analog). This page synthesizes distributor pricing, drop-in same-family and same-package alternatives, and practical Stratix II GX design notes not found in the manufacturer datasheet alone.
EP2SGX60EF1152I4 - Stratix II GX FPGA 60K LEs, 1152-BGA | Intel
The Intel (Altera) EP2SGX60EF1152I4 is a Stratix II GX family Field-Programmable Gate Array (FPGA) delivering 60,440 logic elements, 2,544,192 bits of embedded memory, and 60440 logic cells in a 1152-ball flip-chip BGA package. Built on a 90nm process node, the part is rated for industrial temperature operation and targets high-speed serial I/O and DSP-heavy designs where transceiver-rich FPGA fabric is required. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic function is defined after manufacturing by the end user. Within the broader taxonomy of programmable logic, FPGAs sit alongside CPLDs as the dominant family; the Stratix II GX series in particular adds hardened multi-gigabit transceivers (MGTs) for serial protocols, bridging programmable logic and physical-layer (PHY) silicon. FPGAs occupy the same tier as ASSPs/ASICs in system design but offer faster time-to-market and field re-programmability. The EP2SGX60EF1152I4 integrates 3,022 Logic Array Blocks (LABs), 534 user I/O pins, and dedicated DSP blocks optimized for high-throughput arithmetic. Its on-chip transceivers operate in the multi-gigabit range, supporting protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet. Embedded memory totalling approximately 2.5 Mb is distributed across True-Dual-Port and Simple-Dual-Port RAM blocks, allowing wide data-path designs without external SRAM. Architecturally, Stratix II GX uses an adaptive logic module (ALM) based fabric that improves effective logic utilization versus traditional 4-LUT architectures. The device's 1.2V core supply, combined with 90nm CMOS technology, yields a favorable logic-performance-to-power ratio for its generation. Hardened PCIe and SERDES blocks reduce soft-IP overhead and free fabric for application logic. Typical applications include high-speed serial interface bridging, telecom backplane aggregation, software-defined radio (SDR) baseband processing, and test & measurement instrumentation. Its industrial temperature grade and high pin count make it well suited to line-card designs in wired communications. When designing in the EP2SGX60EF1152I4, plan power-rail sequencing carefully and use the manufacturer's reference PCB footprint for the FC-FBGA-1152 package; BGA escape routing benefits from buried vias and microvia stack-ups. Confirm transceiver reference-clock jitter compliance with the Stratix II GX Device Handbook before final layout. This page synthesizes distributor availability data, drop-in variants from the Stratix II GX family, and engineering design notes that go beyond the datasheet to support sourcing and second-source decisions for long-lifecycle programs.
EP2SGX60EF1152I4N - 60,440-LCell FPGA, 717 MHz | Intel
Intel EP2SGX60EF1152I4N is a high-density Stratix II GX field-programmable gate array with 60,440 logic cells, 2,544,192 bits of embedded memory, 534 I/O pins, and a 717 MHz internal frequency, supplied in a 1,152-ball FBGA package. The part belongs to the FPGA and CPLD category within programmable logic semiconductors and is designed for configurable digital processing, interface bridging, and high-speed system control. An FPGA, or field-programmable gate array, is an integrated circuit containing programmable logic elements, routing resources, and configurable I/O. Its architecture can be reprogrammed after manufacturing, unlike an application-specific integrated circuit. FPGAs occupy the programmable-logic branch of digital semiconductors and are commonly used for parallel processing, protocol implementation, signal processing, and adaptable interface hardware. The device is identified as a member of the Stratix II GX family. Verified data gives 60,440 logic cells, 2,544,192 bits of memory, 534 I/O, a 717 MHz internal frequency, a 1.2 V supply, and 1,152-ball FBGA packaging. These characteristics make the component suitable for systems requiring substantial programmable logic capacity and a large number of external connections. The GX family positioning also supports communications-oriented designs, although the supplied data does not enumerate individual transceiver parameters. The FPGA architecture combines programmable logic with embedded memory and configurable I/O. The exact logic-element architecture, process technology, transceiver count, phase-locked-loop count, maximum user I/O frequency, and supported memory interface speeds are not provided in the verified web data. Engineers should therefore consult the manufacturer datasheet and associated device handbook before selecting the part for timing closure, power estimation, configuration, or signal-integrity analysis. Typical applications include communications equipment, industrial automation, test and measurement systems, video and image processing, and custom interface controllers. The 534 I/O count is useful when many external devices, buses, sensors, or converters must be connected. The 60,440 logic cells provide capacity for parallel datapaths, protocol handling, and state-machine-rich control logic, while the 717 MHz internal-frequency figure provides a reference point for architecture planning. A critical design consideration is PCB implementation. A 1,152-ball FBGA requires controlled impedance routing, appropriate via construction, layer-stack planning, clean power distribution, and extensive signal-integrity verification. The supplied sources do not include a verified ball map, package drawing document, timing model, power data, or configuration details, so those items must be obtained from the manufacturer documentation before schematic release. This page consolidates distributor specifications, family identity, package information, sourcing context, and drop-in-selection constraints. Exact stock, quantity pricing, lifecycle classification, pinout, transceiver resources, and device-grade details remain subject to manufacturer documentation and current distributor confirmation.