FPGA & CPLD
Products (6357)
EP2SGX60EF1152I5 - Stratix II GX FPGA 60K LEs 1152-BGA | Intel
The Intel (formerly Altera) EP2SGX60EF1152I5 is a Stratix II GX Field-Programmable Gate Array (FPGA) integrating 60,440 logic elements, 2544192 bits of embedded memory, and high-speed serial transceivers in a 1152-ball flip-chip BGA package. Built on a 90 nm CMOS process and operating from a 1.15 V core supply, the device is rated for industrial temperature operation (-40 °C to +85 °C) and supports a maximum clock frequency of 622.08 MHz with on-chip PLLs and routing fabrics tuned for high-performance DSP and serial-link designs. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and embedded memory that engineers can re-program in the field to implement arbitrary digital logic, signal processing, or interface functions. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and PALs in density and capability, and below ASICs in per-unit cost but above ASICs in flexibility and time-to-market. The Stratix II family in particular added adaptive logic modules (ALMs), on-chip transceivers, and DSP blocks to address high-speed serial, video, and baseband applications. Key features of the EP2SGX60EF1152I5 include 60,440 logic elements organized into ALMs, up to 2,544,192 bits of embedded RAM, dedicated hardware multipliers and DSP blocks for high-throughput arithmetic, multi-gigabit transceivers for serial I/O, and a comprehensive clock management network. The device supports a wide variety of I/O standards through configurable LVDS/CMOS drivers and exposes the configuration logic through JTAG and passive/active serial modes. Architecturally, the Stratix II GX uses a row-based ALM layout with TriMatrix embedded memory blocks, MLAB (memory logic array blocks), and embedded transceivers that can be clocked independently of the core fabric. The 90 nm CMOS process enables a transistor budget that supports 60K logic elements plus hardened transceiver and DSP silicon on a single die, while the flip-chip BGA1152 package provides the necessary pin density for transceiver signals, DDR memory interfaces, and parallel I/O buses. Typical applications for this device include high-speed serial backplane aggregation, software-defined radio (SDR) baseband processing, telecom line cards, test and measurement instrumentation, video broadcast and image processing pipelines, and prototyping of ASIC-class datapaths. The combination of DSP blocks and multi-gigabit transceivers makes the part especially well suited to designs that need both bulk DSP throughput and chip-to-chip serial links. When designing with this FPGA, engineers should plan for the 1152-ball BGA power distribution network, decoupling strategy, and JTAG configuration chain early in the PCB layout. The industrial temperature grade and 1.15 V core supply place strict requirements on regulator accuracy and thermal dissipation, particularly when the transceiver and DSP blocks are operating at full utilization. This page synthesizes distributor pricing, drop-in alternatives from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet, with information current as of 2026-09-09.
EP2SGX60EF1152I5N - 60K Logic Cells FPGA | Intel | Industrial
Intel EP2SGX60EF1152I5N is a high-performance Stratix II GX field-programmable gate array with 60,440 logic cells, a 1.2 V core supply, and a 1 mm-pitch 1152-ball BGA package. Verified sources identify the device as an industrial-temperature FPGA built on 90 nm CMOS technology, with reported internal frequencies ranging from 609.76 MHz to 717 MHz. The package is described variously as 1152-pin FC-FBGA, 1152-ball PBGA, or a 23 x 23 mm FBGA-style package; engineers should confirm the exact ordering code drawing before fabrication. A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic blocks, routing resources, and input/output structures. Unlike an application-specific integrated circuit, an FPGA can be configured after manufacturing. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, alongside complex programmable logic devices, and is used when designers need hardware-level parallelism, rapid design changes, or high-speed digital signal processing. The principal verified feature of EP2SGX60EF1152I5N is its 60,440-cell Stratix II GX architecture. The device uses 90 nm CMOS technology and is specified for industrial temperature operation. The part is listed as a 1.2 V FPGA, while the verified package data indicates a 1 mm terminal pitch and 1152 ball terminals. These characteristics make it relevant to high-density digital systems where programmable logic and transceiver-oriented integration are required. The Stratix II GX family is intended for demanding logic, signal-processing, and communications-oriented designs. A 60,440-cell array can support substantial combinational and sequential logic, while the reported 609.76 MHz to 717 MHz internal frequency indicates the performance class expected from this family. The exact frequency value can vary with the source and design context, so timing closure should be performed using the manufacturer timing model and the selected configuration. Typical applications include industrial communications equipment, networking hardware, image-processing systems, and high-speed test or instrumentation equipment. Its BGA package supports dense board-level interconnect, while the industrial temperature grade is suitable for controlled industrial environments. The part may also be considered for legacy or existing designs that already use Stratix II GX silicon. Designers should verify the complete ball map, power rails, configuration interface, signal-integrity constraints, and thermal solution from the manufacturer documentation. The verified data does not provide sufficient detail for every electrical, timing, or mechanical parameter, so missing values must not be inferred from family-level assumptions. This page consolidates exact verified specifications, sourcing information, and clearly marked data gaps for engineering review.
EP2SGX60EF1162I4N - 60K LEs Stratix II GX FPGA, 1162-BGA | Altera
The Altera EP2SGX60EF1162I4N is a high-density Stratix II GX FPGA delivering 60,440 equivalent logic elements, 2,544,192 RAM bits, and 534 user I/Os in a 1162-ball FineLine BGA package. Built on a 90 nm process with embedded transceivers, it integrates up to 20 high-speed serial transceivers supporting data rates from 600 Mbps to 6.375 Gbps, making it a member of Altera's transceiver-based FPGA family for serial connectivity and DSP-intensive designs. What is a Stratix II GX FPGA? The Stratix II GX family is an enhanced version of the Stratix II architecture that adds multi-gigabit transceivers (MGTs) directly on-die. An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that implements arbitrary digital logic via programmable logic elements, embedded multipliers, block RAM, and a programmable interconnect. Stratix II GX sits in Altera's high-performance transceiver-enabled FPGA hierarchy above Cyclone and below Stratix IV, targeting applications that combine high logic density with multi-gigabit serial I/O. Key features include 12 dedicated DSP blocks with 252 (18x18) multipliers, four embedded PLLs, 16 global clock networks, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The device supports both enhanced and fast passive (FPP) configuration schemes and is offered in industrial temperature grade (-40C to +100C junction), denoted by the I4 speed-grade suffix. The EP2SGX60EF1162I4N uses a 1.2 V core supply with separate VCCIO banks supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V I/O standards including LVDS, LVPECL, and HSTL. The 1162-ball FineLine BGA package has dimensions of 35 mm x 35 mm with 1.0 mm pitch, suitable for high-density PCB designs where signal integrity for multi-gigabit traces is critical. Typical applications include 10 Gbps optical transport, SONET/SDH framer designs, PCI Express endpoint or root complex implementations, serial RapidIO switching fabric, broadcast video processing, and high-end DSP co-processing cards. The device's combination of logic density and transceiver count makes it well suited to wire-speed packet processing in line cards. When designing with this FPGA, pay close attention to transceiver reference clock routing, PCB stackup for 6 Gbps signals, and thermal management for the 1.0 mm pitch BGA. Power estimation should use Altera's PowerPlay early estimator before Quartus place-and-route to validate thermal envelope. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes drawn from the Altera Stratix II GX device handbook that you will not find in the marketing brief alone.
EP2SGX60EFI1152 - Stratix II GX FPGA | Intel
Intel EP2SGX60EFI1152 is a mature Enhanced Configuration (EPC) Stratix II GX field-programmable gate array associated with 2,544,192 configuration-related memory bits, 60,440 logic elements, 534 user I/O, and a 1,152-ball FineLine BGA package. The verified search results identify the part as an Altera/Intel FPGA and describe EP2SGX60 as part of the Stratix II GX family. The target ordering code is the 1,152-ball package variant, but exact speed grade, temperature grade, package dimensions, and absolute device characteristics are not established by the supplied excerpts. An FPGA, or field-programmable gate array, is a semiconductor device containing programmable logic, routing, memory, and I/O resources whose configuration can be changed after manufacture. Within the broader hierarchy, the EP2SGX60EFI1152 is an FPGA, a programmable logic device, a digital integrated circuit, and ultimately a semiconductor component. Its programmable architecture allows one hardware platform to implement interfaces, protocol bridges, signal processing, control logic, and other digital systems while supporting design changes through configuration rather than a new mask set. The highlighted device resources are 60,440 logic elements, 534 user I/O, and a 1,152-ball package. These values indicate a high-density device intended for designs requiring substantial parallel processing and wide external connectivity. The Enhanced Configuration designation in the supplied search results also indicates configuration-device relevance, although the exact supported configuration modes and electrical interfaces require confirmation from the full manufacturer datasheet. The Stratix II GX family combines programmable logic with application-oriented connectivity for communications, industrial, test, and embedded systems. The 534 I/O resources can support multiple buses, memory interfaces, control paths, and communications links when implemented with suitable board-level signal integrity and power distribution. The large package provides a dense interconnection interface, but also makes escape routing, decoupling placement, thermal analysis, and solder-joint inspection important engineering tasks. Typical applications include communications equipment, industrial automation, test and measurement hardware, video or imaging processing, embedded computing, and high-speed interface aggregation. The 60,440 logic elements make the device appropriate for logic-intensive designs, while 534 user I/O can support extensive external control and data paths. Designers should verify transceiver capability, clocking resources, configuration requirements, supported I/O standards, and package ball assignments against the authoritative datasheet before layout or production release. A key trade-off is that the 1,152-ball package is a high-density BGA implementation rather than a small surface-mount package. Engineers should use the manufacturer’s recommended power planes, high-frequency decoupling, controlled-impedance routing, and thermal strategy. Because the supplied web excerpts do not establish all operating limits, missing values must be confirmed rather than inferred. This page provides exact verified identification, resource and I/O values, source URLs, commercial context, application guidance, and clearly marked data gaps. It is intended to help engineers locate the datasheet and avoid treating an unverified package claim as a substitute for pinout or electrical validation.
EP2SGX60F1508 - Stratix II GX FPGA, 60K LEs, 6.375Gbps XCVR | Altera
The Altera (now Intel) EP2SGX60F1508 is a Stratix II GX family field-programmable gate array (FPGA) with embedded 6.375 Gbps transceivers, housed in a 1508-pin FineLine BGA (FBGA) package. It integrates 60,440 logic elements (LEs), 2.5 Mbits of embedded memory organized in TriMatrix blocks, and a 36x36 DSP block array delivering up to 384 GMACs of DSP performance, plus embedded high-speed transceivers organized in groups. What is an FPGA with embedded transceivers? An FPGA (Field-Programmable Gate Array) is a reprogrammable digital logic device built around an array of configurable logic blocks, embedded memory, and routing resources that the user programs via HDL (VHDL/Verilog) and synthesis. Stratix II GX is the transceiver-augmented variant of the Stratix II family, adding multi-gigabit transceivers (MGTs) for serial protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G. Within the broader taxonomy, EP2SGX60F1508 sits in the hierarchy: FPGA -> programmable logic device -> logic IC -> semiconductor. These FPGAs replace fixed-function ASICs in low-to-medium volume designs by offering hardware-level parallelism plus serial-link capability on a single die. Key features include 12 transceivers capable of 6.375 Gbps data rate, support for PCI Express x1/x4/x8 hard IP, an adaptive equalization receiver (CTLE + DFE), and 4 phase-locked loops (PLLs) plus 8 transmit PLLs dedicated to clocking the serial channels. The device also exposes 8 global clock networks, 4 regional clock networks per quadrant, and 16 dedicated clock pins. Hard IP blocks include embedded PCI Express, Serial RapidIO, and the GXB transceiver interface logic. The architecture is built on a 90nm CMOS process with 1.2V core operation, leveraging Altera's adaptive logic module (ALM) structure that contains eight 4-input look-up tables (4-LUTs) per ALM, giving improved logic packing efficiency over the prior Stratix generation. The transceiver blocks support multiple serial protocols through a programmable PCS layer. Typical applications include high-speed serial interface prototyping, PCIe Gen1/Gen2 endpoint or root-port designs, telecom backplane aggregation, video broadcast routing, and ASIC prototyping for protocols requiring 6.375 Gbps links. The wide transceiver count is the dominant value proposition versus general-purpose FPGAs of equivalent logic density. When designing with EP2SGX60F1508, ensure the PCB has matched 100-ohm differential routing for all transceiver pairs with skew under 1 ps to preserve eye margin. The 1508-pin FBGA requires a multilayer PCB with microvia stack-ups because the 1.0mm pitch cannot be reliably fan-routed with through-hole vias on standard 4-layer boards. This page synthesizes distributor stock, same-family Stratix II GX drop-in alternatives, and design notes (transceiver layout, power-rail sequencing) that the manufacturer datasheet alone does not consolidate for engineers evaluating this mature part.
EP2SGX60F780 - Stratix II GX FPGA 60K LE | Altera
The Altera (now Intel) EP2SGX60F780 is a Stratix II GX Field Programmable Gate Array (FPGA) from the 780-pin FBGA package family, integrating 60,440 logic elements and 2,544,192 bits of embedded memory on a 90 nm process node. The device features high-speed serial transceivers supporting multi-gigabit serial interfaces, hardened PHY IP for protocols such as PCI Express and serial RapidIO, and dedicated DSP blocks for high-throughput signal processing. An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and I/O cells that can be customized by the designer after manufacturing. FPGAs belong to the broader family of programmable logic devices (PLDs), alongside CPLDs and structured ASICs, and serve as the highest-density, highest-performance option in this category. Stratix II GX is a derivative of the Stratix II family that adds multi-gigabit transceivers for serial connectivity, making it a hybrid programmable-logic-plus-serdes platform used in communications, video, and high-performance computing subsystems. Key features of the EP2SGX60F780 include embedded transceiver channels that handle rates from 600 Mbps to 6.375 Gbps, adaptive equalization and pre-emphasis on the physical media, on-chip termination, and a hard PCI Express x1/x4 IP core. The device supports up to 12 transceiver channels per device in the high-density variants and integrates 384 18x18 multipliers in the DSP block array. Configuration is supported through JTAG, passive serial, fast passive parallel, and active serial modes, with built-in encryption using AES for secure bitstream loading. Architecturally, Stratix II GX employs the ALM (Adaptive Logic Module) as its basic logic element, replacing the older 4-input LUT of Stratix with an 8-input fractured LUT structure that delivers up to 25% higher performance and 2x the density per area. The transceiver physical media attachment (PMA) layer is hardened silicon, while the physical coding sublayer (PCS) is implemented in soft logic, enabling flexible protocol customization. The 780-pin FBGA package delivers high pin density for memory-rich and transceiver-rich designs while maintaining signal integrity at multi-gigabit rates. Typical applications for the EP2SGX60F780 include 10G Ethernet switching and bridging, PCI Express endpoint and root-complex designs, baseband processing in wireless infrastructure, HD-SDI video broadcast equipment, and storage area networking using serial RapidIO. The combination of logic capacity, transceiver bandwidth, and DSP throughput makes it well-suited for line-card designs, protocol bridges, and high-speed image processing pipelines. When designing with this device, plan thermal management carefully: Stratix II GX FPGAs can dissipate 10-25 W in the 780-BGA depending on transceiver utilization and clock rates. A multilayer PCB with adequate copper area and thermal vias under the exposed die pad is required. Quartus II software is used for synthesis, place-and-route, and timing closure, with transceiver toolkit support for PMA/PCS bring-up. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design guidance that the manufacturer datasheet alone does not provide, giving procurement and engineering teams a single decision-ready reference.
EP2SGX60FF1152 - Stratix II GX FPGA 60K LE 1152-BGA | Altera
The Altera (now Intel) EP2SGX60FF1152 is a high-density, high-performance Stratix II GX Field-Programmable Gate Array (FPGA) with embedded transceivers, integrating 60,440 equivalent logic elements and 2,544,192 bits of embedded memory in a 1152-ball FineLine BGA package. The device combines a 90 nm CMOS logic fabric with up to 3.125 Gbps embedded transceivers, making it well suited for high-speed serial I/O, digital signal processing, and communications infrastructure designs. The FF1152 package uses a 1.0 mm ball pitch and includes 364 user I/O pins for system connectivity. What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic and routing interconnects are configured by the end user after manufacturing. FPGAs occupy a tier of programmable logic that includes CPLDs (smaller, non-volatile) at the low end, FPGAs (volatile SRAM-based, high density) in the middle, and Structured ASICs / HardCopy at the high end. Stratix II GX devices specifically target high-bandwidth serial connectivity by integrating multi-gigabit transceivers directly on die, eliminating the need for external PHY chips. Key features of the EP2SGX60FF1152 include 12 embedded transceivers operating up to 3.125 Gbps, 16 DSP blocks totaling 192 18x18 multipliers for high-throughput signal processing, and dedicated hardware for source-synchronous interfaces including DDR/DDR2/QDR memory controllers. The device supports up to 4 PLLs and supports JTAG-based configuration via the IEEE 1149.1 standard. The architecture is built on a 90 nm SRAM-based fabric with 8-input adaptive logic modules (ALMs) — twice the density of the previous Stratix generation. Each ALM contains two combinational adaptive LUTs and two registers, providing flexible logic mapping. The memory subsystem consists of TriMatrix embedded SRAM blocks (M512, M4K, M-RAM) configurable as true dual-port, simple dual-port, or single-port RAM, ROM, or FIFO. The chip integrates 16 full-duplex transceiver channels grouped into four banks, each with dedicated clock data recovery and serializer/deserializer logic. Typical applications include 10 Gb Ethernet network interface cards, SONET/SDH framer/mapper devices, wireless baseband processing, high-definition video broadcast equipment, and PCI Express endpoint cards. The FF1152 package's large pin count also suits high-density prototyping of ASIC and Structured ASIC designs. A critical design consideration is power supply sequencing — Stratix II GX devices require multiple voltage rails (VCCINT, VCCIO, VCCA, VCCR, VCCT, VCC_PLL) brought up in a specific order to avoid device damage. Designers should also budget for the device's high transient current during configuration, typically requiring high-frequency decoupling within 50 mils of every power pin. This page synthesizes distributor pricing, drop-in package alternatives, parametric comparison, and PCB design notes for engineers sourcing or qualifying the EP2SGX60FF1152, supplementing the manufacturer's datasheet with practical cross-reference data.
EP2SGX90EF1152C3 - Stratix II GX FPGA 90K LE 1152-FBGA | Intel
The Intel EP2SGX90EF1152C3 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) with 90,960 equivalent logic elements (LEs), 4,520,448 RAM bits (4.5 Mbit), 558 user I/Os, and 4,548 LABs/CLBs, packaged in a 1152-ball FineLine BGA (FBGA). Built on a 90 nm process, the EP2SGX90 integrates up to 12 transceivers operating at 6.375 Gbps, dedicated DSP blocks, and TriMatrix memory blocks for high-performance signal processing. An FPGA is a semiconductor integrated circuit that can be programmed and reprogrammed after manufacturing to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) along with CPLDs; modern high-end FPGAs like the Stratix II GX family also embed hard IP such as multi-gigabit transceivers, PLLs, and DSP multipliers, making them functionally closer to a System-on-Chip than a simple gate array. The Stratix II GX architecture introduced ALM (Adaptive Logic Module) blocks, an improvement over the classic 4-input LUT architecture used in earlier Stratix devices, enabling tighter logic packing and faster timing closure. Key features of the EP2SGX90EF1152C3 include 4 PLLs, 12 multi-gigabit transceivers (3.125-6.375 Gbps), embedded DSP blocks (approximately 384 18x18 multipliers), and 4.5 Mbit of on-chip RAM. The 1152-FBGA package supports 558 user I/Os, enabling high-bandwidth parallel interfaces alongside serial links. The device operates from a 1.2 V core supply with separate VCCPD, VCCA, and VCCP supplies for I/O and analog blocks. Typical applications include high-speed serial backplane aggregation, telecom line cards, video broadcast infrastructure, military signal processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and abundant DSP blocks makes this device well-suited to applications that would otherwise require a discrete SERDES plus a large FPGA. Designers should provide clean, decoupled supply rails for VCCINT (1.2 V), VCCPD, VCCA, and VCCP, follow Altera/Intel reference design layout guidelines for the FBGA-1152 package, and validate transceiver channel performance against the IBIS-AMI models in the Quartus II design suite. The C3 speed grade offers typical commercial operating performance.
EP2SGX90EF1152C3ES - Stratix II GX FPGA 90nm 558 I/O 1152-BBGA | Intel
The Intel EP2SGX90EF1152C3ES is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) fabricated on a 90 nm process, delivering 90,960 logic elements backed by 4,520,448 bits of embedded memory and 558 user I/O pins in a 1152-ball FineLine BGA (FBGA) package. It integrates up to 12 transceivers (per family spec) capable of multi-gigabit serial I/O for backplane and chip-to-chip links, making it a workhorse for wired communication, broadcast video, and high-speed instrumentation. The 'C3' speed grade combined with the commercial-extended temperature suffix ('ES') targets -40 C to +100 C operation, while the 'E' denotes enhanced 1.5 V core VCC. An FPGA is a semiconductor integrated circuit whose digital logic function is defined after manufacturing by a configuration bitstream loaded into on-chip SRAM, in contrast to ASICs whose function is fixed at tape-out. Stratix II GX sits in the hierarchy: programmable logic device -> FPGA -> high-speed-transceiver-equipped FPGA -> Altera Stratix II GX family, designed for prototyping, low-volume production, and designs that benefit from hardware-level parallelism combined with 6.375 Gbps class serial links. Key features include 4,520,448 bits of embedded RAM (approximately 4.5 Mbit, distributed + block), dedicated DSP blocks for fixed/floating-point arithmetic, 12 high-speed transceivers with embedded CDR, support for PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet hard IP, and a robust clock management network with PLLs covering the device edge and core. The 1152-BBGA package exposes 558 user I/O across 24 user-I/O banks, providing flexible single-ended and differential signaling for LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards. Typical applications include 10 Gbps-class data aggregation switches, broadcast video format converters, radar and software-defined radio digital front-ends, ASIC prototyping for communications SoCs, and PCIe Gen1 endpoint cards. The transceiver-rich architecture also suits test-and-measurement chassis that aggregate many Gbps lanes into a single FPGA for real-time DSP.
EP2SGX90EF1152C3N - Stratix II GX FPGA 90K LE | Intel | 1152-BGA
The Intel EP2SGX90EF1152C3N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,548 LABs/CLBs, 4,520,448 bits of embedded memory, and 558 user I/Os, housed in a 1152-ball FC-FBGA package. Built on a 90nm process technology, the device operates at a core voltage of 1.2V and supports transceiver performance up to 816.9 MHz, making it suitable for high-speed serial connectivity and DSP-intensive workloads. The "EF" speed grade designation indicates the device's place in Stratix II GX timing closure, while the C3 commercial temperature grade and the "N" lead-free suffix confirm RoHS-compliant operation from 0C to +85C. An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard-IP such as transceivers, block RAM, and DSP blocks. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs - offering ASIC-class parallelism and throughput while preserving full post-production reprogrammability. Stratix II GX is Intel's (formerly Altera's) high-end transceiver-equipped family, positioned for serial connectivity, video processing, and communications infrastructure where parallel DSP and high I/O count are required. Key features of the EP2SGX90EF1152C3N include up to 12 transceivers supporting SERDES rates commonly used in the Stratix II GX family, dedicated embedded multiplier blocks for DSP, distributed and block RAM, and on-chip PLLs. The 1152-ball flip-chip BGA package provides the high-pin-count escape routing required to bring 558 user I/Os off-die while supporting the high-power transceivers. A rich configuration options set (Fast Passive Parallel, Active Serial, JTAG) makes the part deployable in production and in-field update scenarios. Typical applications include 10G/1G Ethernet line cards, wireless baseband processing, broadcast video routers, high-speed serial protocol bridging (PCI Express, Serial RapidIO, XAUI), and military/aerospace signal processing. The high logic density combined with embedded transceivers allows single-chip implementation of multi-channel data-path designs that previously required an FPGA plus an external PHY. When designing with this device, pay close attention to transceiver reference-clock jitter, PCB stack-up for BGA escape, and power-rail sequencing on the 1.2V core. Thermal management is critical because the FC-FBGA package concentrates heat from the transceiver channels. Use the Quartus II design software (or its supported successors) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package variants, and design considerations that go beyond the manufacturer datasheet - giving procurement and engineering teams a single authoritative reference for the EP2SGX90EF1152C3N.
EP2SGX90EF1152C4 - 90,960-Cell Stratix II GX FPGA
Altera EP2SGX90EF1152C4 is a high-density Stratix II GX field-programmable gate array with 90,960 logic cells, 558 user I/O, and a 1.2 V core supply specification, housed in a 1152-ball FC-FBGA package. The device is implemented using 90 nm CMOS technology and is intended for high-speed, logic-intensive embedded and communications systems. The verified search data identifies 4,548 LABs, a maximum frequency value of 732.1 MHz, and a 1152-pin package designated FC-FBGA, FBGA-1152, or 1152-BBGA in distributor listings. A field-programmable gate array, or FPGA, is a programmable semiconductor containing configurable logic, interconnect, memory, and I/O resources. Within the semiconductor hierarchy, an FPGA belongs to programmable logic devices, which are used to implement digital processing, interface bridging, control, and protocol functions. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing. The Stratix II GX family adds high-speed transceiver-oriented functionality to the programmable-logic architecture, while the exact transceiver count and electrical characteristics must be confirmed from the complete manufacturer documentation. The principal verified features are 90,960 cells, 558 I/O, 1.2 V technology supply, 90 nm process technology, and 1152-ball surface-mount packaging. The reported maximum frequency is 732.1 MHz in one source and 717 MHz in another source; therefore, the discrepancy is retained rather than reconciled by assumption. The device also appears in verified distributor data as a field-programmable gate array with 4,548 LABs. Its large logic capacity makes it suitable for parallel datapaths, multi-channel interface aggregation, and systems requiring configurable control and processing blocks. The architecture combines programmable logic fabric with package-level I/O resources and is designed for high-density digital implementation. The 90 nm process supports a substantial logic-cell count while the 1.2 V supply designation provides a defined electrical boundary for system power planning. The available search results confirm the device family, cell count, process technology, frequency figures, and package type, but do not provide complete transceiver specifications, configuration-memory details, operating-temperature grades, or absolute maximum ratings. Typical applications include communications infrastructure, industrial automation, high-speed test equipment, and embedded systems that require configurable digital processing. The 558 I/O resources support multiple parallel interfaces, while the 90,960-cell capacity can accommodate large state machines, protocol-processing logic, and data-path functions. The FC-FBGA package requires careful ball mapping, controlled-impedance routing, and thorough signal-integrity review during PCB design. Designers should obtain the complete manufacturer datasheet and verify the target speed grade, I/O bank restrictions, transceiver configuration, power sequencing, thermal limits, and package ball assignments before release. Because the supplied data contains conflicting frequency values and omits several device specifications, those parameters are not inferred. Pricing and stock should be confirmed with the distributor at the time of purchase, as availability may change rapidly. This page synthesizes verified distributor and manufacturer-oriented search results, preserves conflicting frequency figures, identifies the confirmed Stratix II GX architecture and 1152-ball package, and provides application and sourcing context beyond a single catalog listing. It does not replace the manufacturer datasheet or a formal PCB-level qualification.
EP2SGX90EF1152C4ES - Stratix II GX 90K LE FPGA, 558 I/O, 1152-FBGA
The Intel (formerly Altera) EP2SGX90EF1152C4ES is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,520,448 bits of embedded RAM, and up to 558 user I/O pins, fabricated on a 90 nm process and supplied from a 1.2 V core rail. The device is housed in a 1152-ball flip-chip FineLine BGA (FC-FBGA) package and is rated for the commercial-extended temperature range. It also integrates dedicated multi-gigabit transceivers and embedded multipliers targeting high-throughput signal-processing pipelines. An FPGA (Field Programmable Gate Array) is a type of programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, and DSP pipelines on a silicon fabric that is configured after manufacture. FPGAs sit within the broader taxonomy of programmable logic -> logic ICs -> integrated circuits -> semiconductors. Unlike fixed-function ASICs, FPGAs trade raw per-gate efficiency for design flexibility and rapid time-to-market, and they are commonly used for prototyping, low-volume production, and applications where standards or algorithms evolve frequently. Key features of the EP2SGX90EF1152C4ES include 4,520,448 RAM bits distributed across TriMatrix memory blocks, embedded DSP blocks for high-speed multiply-accumulate operations, dedicated serializer/deserializer (SERDES) channels supporting multi-gigabit serial protocols, and 558 user I/O pins compliant with multiple single-ended and differential I/O standards. The device supports configuration via passive serial, fast passive parallel, and JTAG modes, and includes on-chip PLLs for clock management. The Stratix II GX architecture combines an adaptive logic module (ALM) fabric with embedded transceivers capable of multi-gigabit serial interfaces such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The 90 nm process node and dedicated hard IP blocks deliver deterministic latency for serial connectivity, while the TriMatrix memory subsystem allows wide, high-throughput on-chip data buffers for packet processing and DSP. Typical applications for this part include high-speed serial interface bridging, telecommunications backplane aggregation, military and aerospace signal processing, industrial imaging pipelines, ASIC prototyping, and test and measurement instrumentation. The wide I/O count and embedded multi-gigabit transceivers make it particularly well-suited to designs that require both rich parallel connectivity and high-speed serial links on a single device. When designing with this FPGA, ensure that the 1152-ball FC-FBGA land pattern and ball-attach process match the manufacturer's recommended reflow profile, and that the PCB stack-up provides sufficient microvia and via-in-pad capacity for the BGA escape routing. Power-rail sequencing and decoupling must follow the Stratix II GX pin connection guidelines, and the device requires a configuration device or JTAG programmer for first-time bitstream load. This page synthesizes distributor stock levels, drop-in alternatives from the same Stratix II GX family, and practical design notes that complement the manufacturer datasheet for the EP2SGX90EF1152C4ES.
EP2SGX90EF1152C4N - Stratix II GX FPGA, 90960 LE, 1152-FBGA | Intel
The Intel (formerly Altera) EP2SGX90EF1152C4N is a high-density Stratix II GX family field-programmable gate array (FPGA) with 90,960 logic elements (LE), 4,520,448 bits of embedded memory, and integrated 6.375 Gbps transceivers, housed in a 1152-ball fine-pitch BGA (FC-FBGA / FBGA-1152) package. It operates across a 1.2 V core supply with multiple I/O bank voltages and supports up to 558 user I/O pins, with 4,548 LABs arranged to deliver high logic density for DSP- and memory-intensive designs. An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit that lets engineers implement arbitrary digital logic through a configurable array of logic elements, embedded memory blocks, DSP blocks, and routing interconnects. In the wider hierarchy, FPGAs sit above microcontrollers and ASICs in reconfigurability, and below ASICs in performance-per-watt. The Stratix II GX family is positioned as a transceiver-rich, DSP-capable platform used in telecom, video processing, and high-speed serial-link designs. Key features of the EP2SGX90EF1152C4N include 90,960 logic elements, 4.5 Mbit embedded memory, embedded DSP blocks for high-throughput signal processing, and up to 20 full-duplex CDR-based transceivers reaching 6.375 Gbps per channel. The 1152-ball FC-FBGA package supports high pin counts for parallel and serial I/O simultaneously, and the C4 speed grade balances Fmax and timing closure across industrial temperature ranges. The device is built on a 90 nm process node with a 1.2 V core. The Stratix II GX architecture uses adaptive logic modules (ALMs) rather than older 4-input LUTs, with each ALM capable of implementing any 7-input function or multiple smaller functions for finer logic packing. Embedded transceivers support CPRI, OBSAI, Serial RapidIO, PCIe, and custom serial protocols up to 6.375 Gbps, while the dedicated DSP blocks deliver up to 18x18-bit signed multiplication per cycle. TriMatrix memory blocks (MLABs, M512, M4K, M-RAM) are interleaved across the fabric to optimize both small and large memory buffering. Typical applications include high-end telecom baseband and packet processing, broadcast video bridge and router designs, high-speed serial protocol test equipment, defense and aerospace signal processing, and PCI Express endpoint/root port cards. Designers also use this device for ASIC prototyping due to its high LE count and abundant I/O bandwidth. Engineering trade-offs to consider include the 90 nm power profile (higher static leakage versus newer 40/28/20 nm Stratix IV/V/A10 families), the large 1152-ball BGA which demands 8+ layer PCB with controlled-impedance routing, and the C4 speed grade's timing margin relative to C5 or I-grade variants.
EP2SGX90EF1152C5 - Stratix II GX FPGA 90K LEs 1152-FBGA | Intel
The Intel (Altera) EP2SGX90EF1152C5 is a high-density, high-performance Stratix II GX Field Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 bits of embedded RAM, and 558 embedded 18x18 multipliers into a 1152-ball FineLine BGA (FCBGA) package measuring 35 mm x 35 mm. The device combines a 90 nm logic fabric with up to 20 transceivers capable of multi-gigabit serial I/O, making it a long-standing reference design for high-bandwidth wireline and embedded compute systems. A Field Programmable Gate Array (FPGA) is a programmable logic device built from configurable logic blocks, programmable interconnects, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit in the wider taxonomy of programmable logic devices, alongside CPLDs, and are widely used as application-specific accelerators in place of fixed-function ASICs. The Stratix II GX family, specifically, adds embedded transceivers that distinguish it from general-purpose Stratix II devices for serial connectivity. Key differentiating specifications include 4,520,448 total RAM bits, 558 dedicated 18x18 multipliers for DSP workloads, integrated multi-gigabit transceivers, and a core voltage range of 1.15 V to 1.25 V. The 1152-ball FCBGA package supports the high I/O count required by parallel memory buses and multi-channel serial links simultaneously. Combined with 90 nm process technology, the device balances logic density with low-jitter transceiver performance. Architecturally, the Stratix II GX uses an ALM-based logic fabric with adaptive look-up tables, dedicated on-chip memory blocks, and embedded transceivers capable of rates commonly used in 2005-2010 generation telecom and storage backplanes. The 558 embedded multipliers enable high-throughput DSP pipelines without consuming general logic, while 4.5 Mbits of RAM are distributed across TriMatrix memory blocks for flexible buffering. Typical applications include high-speed serial backplane aggregation, telecom line cards, broadcast video processing, military secure communications, and ASIC prototyping. The combination of logic density and integrated transceivers also makes it suitable for software-defined radio front-ends and test equipment requiring parallel DSP. When designing with this FPGA, allocate sufficient decoupling across VCCINT, VCCA, and transceiver supply rails, and follow Intel/Altera's pinout guidelines for the 1152-ball FCBGA. Designers should also confirm Quartus II support versions match the device before board bring-up. This page synthesizes distributor stock, drop-in Stratix II GX alternatives, and design guidance that the manufacturer datasheet alone does not provide in a single view.
EP2SGX90EF1152C5ES - Stratix II GX FPGA, 90K LEs, 1152-FBGA | Intel
The Intel (Altera) EP2SGX90EF1152C5ES is a high-density Stratix II GX Field Programmable Gate Array (FPGA) delivering 90,960 logic elements, 4,520,448 bits of embedded memory, and 558 user I/Os in a 1152-ball FineLine BGA (FBGA) package. Built on a 90 nm process, the Stratix II GX family integrates up to 20 transceiver channels operating at 6.375 Gbps, making this device a drop-in solution for high-speed serial I/O, embedded processing, and DSP-intensive designs. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that allows engineers to implement arbitrary digital logic using configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP blocks. FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs): unlike microcontrollers they execute logic in hardware rather than software, and unlike ASICs they can be re-programmed in the field. Stratix II GX belongs to Altera's high-end FPGA taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor) and was the industry's first 90 nm FPGA with embedded transceivers. Key features of the EP2SGX90EF1152C5ES include 12 embedded transceiver blocks supporting CPRI, OBSAI, Serial RapidIO, PCI Express, and Gigabit Ethernet protocols, 384 (18x18) multipliers for DSP workloads, an on-chip 36-block RAM architecture totalling approximately 4.5 Mbits, and a hard PCI Express x1/x4 endpoint block. The 1152-FBGA package exposes 558 user I/Os and supports hot-socketing for in-system reprogramming without board power-down. Architecturally the device pairs an adaptive logic module (ALM) based core fabric with a row-and-column interconnect, enabling high utilisation at clock rates up to 450 MHz internally. The Stratix II GX transceiver macros embed clock-data recovery (CDR), serializer/deserializer (SERDES), and pre-emphasis/equalisation blocks that replace external PHY silicon. The 'C5' speed grade reflects a commercial temperature range (0C to +85C) with the timing closure typical of mid-tier speed bins. Typical applications include 4G base-station baseband processing, radar and electronic-warfare front-ends, high-resolution medical imaging pipelines, high-end broadcast video routing, and ASIC prototyping for networking line cards. The combination of embedded multi-gigabit transceivers and DSP blocks makes the EP2SGX90EF1152C5ES particularly well suited to designs where parallel DSP plus serial backplane connectivity must coexist on a single device. When designing with this FPGA, plan the power-decoupling network carefully: Stratix II GX devices can draw transient currents exceeding 20 A during configuration. Use a multi-rail power-supply architecture (typically 1.2 V core, 2.5 V/3.3 V I/O, 1.2 V PLL, and 1.2 V transceiver analog) and follow Altera's recommended power-up/-down sequencing. Quartus II software with Service Pack 2 or later is required to compile designs targeting this device. This page synthesizes distributor pricing (as of 2026-09-09), drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not collected in any single manufacturer document.
EP2SGX90EF1152C5N - Stratix II GX FPGA 90,960 LE, 558 I/O | Intel
The Intel (formerly Altera) EP2SGX90EF1152C5N is a high-density Stratix II GX field-programmable gate array (FPGA) featuring 90,960 logic elements, 4,548 logic array blocks, and 4,520,448 bits of embedded RAM, housed in a 1152-ball FC-FBGA package. The device integrates up to 12 transceivers supporting data rates up to 6.375 Gbps, making it well suited for high-speed serial I/O applications such as backplanes, chip-to-chip links, and proprietary serial protocols. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and belong to the integrated circuits (IC) family, with variants including SRAM-based, flash-based, and antifuse-based architectures. Modern high-end FPGAs such as the Stratix II GX family integrate hard IP cores (transceivers, DSP blocks, memory interfaces) alongside general-purpose fabric, allowing one device to replace multiple discrete components on a board. Key features of the EP2SGX90EF1152C5N include 558 user I/Os, support for DDR/DDR2/QDRII memory interfaces, dedicated DSP blocks for high-throughput arithmetic, and a 1.2 V core supply with 90 nm process technology. The part operates over the commercial temperature range (0C to +85C) and is offered in a -5 speed grade. The 1152-ball flip-chip BGA package enables high pin density while supporting the high-speed signal integrity required by multi-gigabit transceivers. The Stratix II GX architecture employs an adaptive logic module (ALM) structure that improves logic efficiency versus prior 4-input LUT architectures, delivering higher effective logic capacity per die area. The integrated transceivers incorporate built-in clock data recovery (CDR), pre-emphasis, and equalization, supporting standards such as PCI Express, Serial RapidIO, XAUI, and CEI-6G without external PHY devices. Typical applications include high-speed serial backplane interfaces, telecom line cards, high-end test and measurement equipment, video broadcast infrastructure, and protocol bridging ASIC prototyping. The combination of logic density and integrated multi-gigabit transceivers lets designers consolidate what would otherwise be a discrete ASSP plus FPGA solution onto a single device. When designing with this part, pay close attention to power supply sequencing, PCB BGA fanout, and signal-integrity constraints on the transceiver channels. Reference designs and the Stratix II GX Device Handbook should be consulted for transceiver channel routing, decoupling strategies, and JTAG configuration circuit requirements. Designers should also note that the EP2SGX90 family is in its mature product lifecycle and may require sourcing through distribution channels. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single, comprehensive reference for sourcing and designing with the EP2SGX90EF1152C5N.
EP2SGX90EF1152I2N - 90,960 LEs Stratix II GX FPGA | Intel
The Intel/Altera EP2SGX90EF1152I2N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 bits of embedded RAM, and 558 user I/Os in a 1152-ball flip-chip BGA package. Built on a 90 nm process, the device combines a rich logic fabric with up to 12 transceiver channels (per Stratix II GX family specification) for high-speed serial I/O, making it suitable for serial connectivity, custom compute, and DSP pipelines. The EP2SGX90EF1152I2N is the I2 grade variant, specified for the industrial temperature range. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks (memory, transceivers, PLLs, multipliers). It sits in the broader taxonomy of programmable logic devices -> logic ICs -> integrated circuits. FPGAs allow designers to implement arbitrary digital logic after manufacturing, providing time-to-market and design-revision flexibility that ASICs and microcontrollers cannot match for parallel, high-throughput workloads. Key features of the EP2SGX90EF1152I2N include 4,548 Logic Array Blocks (LABs), embedded multiplier blocks for DSP, embedded memory (M512/M4K/M-RAM blocks totaling 4,520,448 bits), and dedicated high-speed transceivers. The device is built on a 1.2 V core with PLL-based clock management for multi-domain designs. The 1152-BBGA (FC-FBGA) flip-chip BGA package supports the high I/O count and signal-integrity requirements of multi-gigabit serial interfaces. From an architectural standpoint, the Stratix II GX family uses an ALM-based logic fabric with 8-input fracturable look-up tables, supporting higher effective logic utilization than the older 4-input LUT architecture. Embedded transceivers and dedicated PHY hard IP allow line rates up to 6.375 Gbps depending on protocol, simplifying high-speed serial designs. Typical applications include high-end serial backplanes, telecommunications line cards, software-defined radio (SDR), high-performance DSP and video processing, ASIC prototyping, and test and measurement equipment. The GX transceiver block is especially attractive for protocols such as PCI Express, Gigabit Ethernet, Serial RapidIO, and custom serial links. Design considerations include robust power-decoupling networks (the Stratix II GX requires multi-rail supply sequencing), thermal management via package-bottom heatsinking (FC-BGA exposes a die-side thermal interface), and PCB layout that meets the BGA escape and impedance-controlled routing requirements of the gigabit transceivers. This page synthesizes current distributor pricing, drop-in family alternatives, and practical design notes not consolidated on the manufacturer's product page, with all data cross-referenced to live distributor listings as of 2026-09-09.
EP2SGX90EF1152I3 - 90,960 LEs, Stratix II GX FPGA | Intel
The Intel EP2SGX90EF1152I3 is a high-performance Field Programmable Gate Array from the Stratix II GX family, featuring 90,960 equivalent logic elements organized as 558 Adaptive Logic Modules (ALMs) across 4,520,448 bits of on-chip memory. It supports a maximum core clock frequency of 622.08 MHz and is built on a 90 nm CMOS process with a nominal 1.2 V core supply (1.15 V to 1.25 V range). The device is housed in a 1152-ball flip-chip BGA (FC-FBGA) package designed for industrial-grade operating conditions. A Field Programmable Gate Array (FPGA) is a class of programmable logic device that allows engineers to implement custom digital circuits through configurable logic blocks, programmable interconnect, and dedicated hardened IP blocks. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism, in-field re-programmability, and time-to-market advantages. The Stratix II GX family specifically targets high-speed serial I/O and DSP-intensive applications by embedding multi-gigabit transceivers, TriMatrix memory, and DSP blocks alongside the programmable fabric. Key features include 4,520,448 RAM bits distributed across TriMatrix memory blocks, embedded multipliers for DSP pipelines, up to 8 multi-gigabit transceivers (depending on variant), and support for external memory interfaces including DDR2/QDRII/RLDRAM. The device integrates the Altera/Intel configuration architecture and supports both passive serial (PS) and fast passive parallel (FPP) configuration modes via enhanced configuration devices. Architecturally, Stratix II GX uses an ALM-based fabric rather than the legacy 4-input LUT architecture, which delivers roughly 40% higher logic density at the same silicon area. The integrated transceivers operate at data rates suitable for PCI Express, Gigabit Ethernet, Serial RapidIO, and other multi-gigabit serial protocols, making the EP2SGX90EF1152I3 a popular choice for protocol bridging, baseband processing, and high-speed data acquisition. Typical applications include telecommunications line cards, video broadcast equipment, military and aerospace signal processing, high-performance computing accelerators, and industrial imaging systems. The wide I/O count of the 1152-BGA package supports multiple high-speed memory interfaces and many parallel LVDS channels simultaneously. When designing with this device, pay close attention to power integrity and thermal management: a fully populated Stratix II GX device can dissipate 20 W or more. Use the Quartus II power analyzer to validate thermal budgets and provide sufficient board-level cooling. Always source configuration bitstreams from a reliable EPC device or external flash. This page synthesizes distributor pricing, same-family drop-in alternatives, and practical FPGA design notes not found in the manufacturer datasheet alone, helping engineers evaluate the EP2SGX90EF1152I3 against modern alternatives.
EP2SGX90EF1152I3N - 90,960 Cell Stratix II GX FPGA 1.2V FC-FBGA-1152 | Altera
The Altera (now Intel) EP2SGX90EF1152I3N is a high-density FPGA from the Stratix II GX family, integrating 90,960 logic elements and 90,960 equivalent LEs/CLBs in a 1152-ball Fine-pitch Chip-Scale BGA (FC-FBGA) package. Built on a 90 nm process technology and powered from a 1.2 V core supply, this device supports clock-tree frequencies up to 816.9 MHz and is rated for the industrial temperature grade. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. Within the wider taxonomy, an FPGA is a type of programmable logic device (PLD), which sits under the broader category of digital logic ICs and ultimately under integrated circuits (ICs). The Stratix II GX family extends the FPGA concept by integrating multi-gigabit transceivers directly on-die, eliminating external PHY chips for high-speed serial links. Key features of the EP2SGX90EF1152I3N include up to 4.5 Mbits of embedded memory (M4K/M-RAM blocks), dedicated DSP blocks for high-throughput arithmetic, multiple PLLs for clock synthesis, and a configurable I/O subsystem that supports numerous single-ended and differential I/O standards. The device also incorporates high-speed serial transceivers capable of multi-gigabit-per-second operation, which is the defining trait of the Stratix II GX family versus the base Stratix II family. Architecturally, the Stratix II GX uses an adaptive logic module (ALM) fabric that packs up to eight inputs per logic element, allowing higher effective logic density than the 4-input LUT approach used in the original Stratix family. Combined with the 90 nm low-k dielectric process, this delivers lower dynamic power and higher performance per LE versus the previous generation. Typical applications for the EP2SGX90EF1152I3N include high-speed serial interface bridging (PCI Express, Serial RapidIO, XAUI, SATA), telecom line cards, software-defined radio (SDR) baseband processing, video broadcast equipment, and ASIC prototyping. Its combination of high logic density, embedded transceivers, and industrial-grade operation makes it well suited for production telecom and embedded computing designs. When designing with this FPGA, carefully plan the power distribution network - Stratix II GX devices require multiple supply rails (VCCINT, VCCIO, VCCA, VCCP, transceiver supplies) with strict sequencing. Use the Altera Quartus II design suite for synthesis, place-and-route, and timing closure; the -I3 speed grade and industrial temperature range support up to 816.9 MHz internal operation. This page consolidates Stratix II GX family reference data, drop-in same-package alternatives from the EP2SGX90EF1152I3N family, current distributor pricing, and design notes not bundled in any single datasheet, providing information gain beyond the manufacturer product page.
EP2SGX90EF1152I4 - Stratix II GX FPGA, 90K LE, 1152-BGA | Intel / Altera
The Intel (formerly Altera) EP2SGX90EF1152I4 is a high-density Stratix II GX family FPGA combining 90,960 logic elements, 4,520,448 bits of embedded memory, and integrated transceivers in a 1152-ball FC-FBGA package. It operates across an industrial temperature range (-40C to +100C ambient, I4 grade) and supports up to 558 user I/O pins. Built on a 90 nm process with a 1.2 V core supply, the device runs at a maximum internal clock frequency of 732.1 MHz, targeting high-throughput serial and parallel DSP workloads. An FPGA (Field-Programmable Gate Array) is a programmable logic device that consists of an array of configurable logic blocks (LABs/CLBs), embedded memory blocks, DSP blocks, routing interconnects, and I/O cells - all of which can be reconfigured by the customer after manufacture. FPGAs sit between general-purpose microcontrollers and ASICs in the design flexibility-vs-performance trade-off, with Stratix II GX specifically positioned for high-speed serial connectivity (multi-gigabit transceivers) and DSP-intensive designs. Key features of the EP2SGX90EF1152I4 include 4,548 LABs/CLBs, 452 user I/O pins, dedicated multiplier blocks and DSP hardware, 12 embedded transceivers supporting multi-gigabit serial protocols (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), and dedicated PLL clock management blocks. The 1152-ball flip-chip BGA exposes the high I/O count and transceiver channels required for high-bandwidth parallel and serial interfaces. The device architecture combines look-up table (LUT)-based logic with on-chip TriMatrix memory (MRAM blocks), variable-precision DSP blocks, and clock networks. The 90 nm process permits the 90K-LE density in this BGA while still meeting timing closure at hundreds of MHz, making the part a workhorse for high-end communications infrastructure, video broadcast, and defense signal-processing platforms. Typical applications include high-speed serial protocol bridging (PCIe Gen1/Gen2 endpoints, Serial RapidIO switches, XAUI/10G Ethernet MACs), software-defined radio baseband, ASIC prototyping, ASIC and ASSP emulation, video and image processing pipelines, and high-performance DSP coprocessors. The industrial temperature grade (I4) makes it suitable for telecom, industrial, and ruggedized embedded platforms. Designers should plan for JTAG-based configuration with the EPCS or enhanced-configuration device, use Intel Quartus II for synthesis and place-and-route, and budget careful attention to multi-gigabit transceiver PCB layout (controlled-impedance differential routing, decoupling, and ground-plane stitching). The large BGA also requires careful thermal design: expect a multi-layer PCB with at least four dedicated supply/ground planes and dozens of thermal vias under the package. This page synthesizes distributor pricing, drop-in same-family variants, and practical design notes that complement the manufacturer datasheet. Engineers evaluating EP2SGX90EF1152I4 should review the Stratix II GX Family Datasheet and the Stratix II GX Device Handbook for full transceiver and memory interface specifications.
EP2SGX90EF1152I4N - 90k LEs Stratix II GX FPGA, 1152-BGA | Intel
The Intel EP2SGX90EF1152I4N is a high-density Stratix II GX family Field Programmable Gate Array (FPGA) fabricated on a 90 nm CMOS process, delivering 90,960 logic elements (LEs) and 4,520,448 bits of embedded memory in a 1152-ball FineLine BGA package. Per the manufacturer datasheet, the device integrates up to 12 transceivers, dedicated DSP blocks, and TriMatrix memory, targeting high-bandwidth serial I/O, baseband processing, and protocol-bridging designs that demand both logic density and hardened transceiver capability. A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit whose logic fabric, routing, and I/O can be configured after manufacture to implement arbitrary digital functions. FPGAs occupy the middle ground between fixed-function ASICs and software-defined processors: ASICs offer higher volume efficiency but no post-silicon flexibility, while FPGAs trade cost-per-unit for rapid prototyping, field upgradability, and parallel hardware acceleration. Within the taxonomy of programmable logic, the EP2SGX90EF1152I4N sits in the high-end transceiver-equipped tier, alongside other Stratix II GX and contemporary Virtex-5 LXT/SXT FPGAs, used wherever multi-gigabit serial links, high logic density, and deterministic latency must coexist. Key device features include a 717-732 MHz internal operating frequency, embedded multiplier/DSP blocks, a flexible PLLEU clock network, and high-speed LVDS and memory interfaces. The GX variant adds multi-gigabit transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CPRI. The 1152-ball FBGA package provides sufficient I/O and power/ground integrity for transceiver and DDR2/QDR II memory applications, with industrial-grade operating temperature support and lead-free compliance per the verified manufacturer data. The architecture combines logic elements, embedded RAM (TriMatrix), DSP blocks, and transceivers on a single die, with a hierarchical interconnect optimized for high fan-out. Hard intellectual property (IP) blocks for memory controllers and PLLs reduce soft-logic overhead and free fabric for application logic, while the 90 nm process delivers a favorable performance-per-watt ratio for its generation. Typical applications include high-speed serial backplane bridging, wireless baseband processing, video and imaging pipelines, test and measurement equipment, and defense/aerospace signal processing. The integrated transceivers make it well suited for line-card designs requiring multi-gigabit links, while the large logic and memory capacity supports deep packet buffers and wide datapaths. When designing with this part, allocate transceiver channels first (pin/bank assignments are fixed by package), then DDR2/QDR II memory interfaces (which consume dedicated DQS pins), and place the configuration scheme (EPC16 or JTAG) on dedicated pins. The 1152-ball FBGA requires a multi-layer PCB with controlled-impedance routing for transceivers and matched-length traces for DDR2 interfaces. This page synthesizes distributor pricing, package dimensions, drop-in alternatives from the Stratix II GX and adjacent families, and practical design notes not consolidated in the manufacturer datasheet.
EP2SGX90EF1152I5 - Stratix II GX FPGA, 90K LEs, 1152-BGA | Intel
The Intel (formerly Altera) EP2SGX90EF1152I5 is a high-density Stratix II GX family FPGA featuring 90,960 logic elements, up to 4.5 Mbits of embedded memory, and integrated 6.375 Gbps multi-gigabit transceivers, housed in a 1152-ball FineLine BGA package with industrial temperature grade. The device is fabricated on a 90 nm CMOS process with a 1.2 V core supply and supports a combinatorial delay of approximately 4.006 ns and an internal clock frequency of 622.08 MHz, making it suitable for high-throughput serial I/O, DSP, and embedded processing designs. A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and increasingly hard intellectual-property (IP) cores such as transceivers and processors. In the broader system hierarchy, an FPGA sits between programmable logic devices (CPLDs) and application-specific integrated circuits (ASICs): more flexible than ASICs, faster and more capable than CPLDs, and positioned as the workhorse for prototyping, low-volume production, and hardware acceleration. Key features of the EP2SGX90EF1152I5 include integrated 6.375 Gbps transceivers for backplane and chip-to-chip serial links, dedicated DSP blocks for high-speed multiply-accumulate operations, embedded TriMatrix memory with parity and ECC options, and support for external memory interfaces such as DDR2 and QDRII+. The industrial temperature grade (-40C to +100C ambient, with junction up to +125C) makes it suitable for harsh-environment applications including industrial automation, military/aerospace, and outdoor telecommunications equipment. The Stratix II GX architecture introduces an adaptive logic module (ALM) that breaks the classical 4-LUT model into a more flexible 8-input fracturable LUT, improving logic packing efficiency. The transceiver blocks support multiple protocols including PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet through hard PCS layers, offloading PHY-state-machine work from the programmable fabric. Typical applications include high-speed serial interface bridging, software-defined radio baseband processing, ASIC prototyping, radar signal processing, and high-performance DSP data paths. Designers commonly pair this device with external DDR2/QDR memory and clock generators such as the CDCE62005 or with companion PHY devices for PCIe or SRIO. When designing with this device, plan thermal management carefully: BGA-1152 with all transceivers active can dissipate 10-15 W, requiring a multilayer PCB with thermal vias under the package and, in many cases, a heatsink or forced-air cooling. JTAG configuration via the enhanced configuration device (EPC) family is the most common production programming method. This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not consolidated in the manufacturer datasheet, making it easier for hardware engineers to evaluate the EP2SGX90EF1152I5 against modern alternatives.
EP2SGX90EF1152I5N - 90k LEs Stratix II GX FPGA 1.2V FC-FBGA-1152 | Intel
The Intel (formerly Altera) EP2SGX90EF1152I5N is a high-density Stratix II GX FPGA from the EP2SGX90 family, integrating 90,960 logic elements (LEs) and 90,960 equivalent CLBs in a 1152-ball flip-chip BGA package. The device operates on a 1.2 V core supply, is fabricated on a 90 nm CMOS process, and supports a maximum internal clock frequency of 609.76 MHz (combinatorial delay as low as 4.006 ns). It is graded for the INDUSTRIAL temperature range. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture, allowing the same silicon to implement arbitrary digital functions, glue logic, signal-processing pipelines, or complete system-on-chip designs. FPGAs sit at the top of the programmable logic hierarchy alongside CPLDs, occupying the same broad category as ASICs and ASSPs in custom digital design. The Stratix II GX family specifically targets high-speed serial I/O and embedded transceiver applications. Key features include up to 4.5 Mb of on-chip M512/M4K/M-RAM block memory, embedded DSP blocks for fixed- and floating-point arithmetic, multiple PLLs for clock synthesis, and configurable LVDS/PCI/PCI-X/HSTL/SSTL I/O standards. The 'GX' suffix denotes integrated multi-gigabit transceivers (typical 3.125 Gbps PMA) plus dedicated hard PCI Express and serializer/deserializer (SERDES) resources, making the device particularly suited for serial backplane, telecom, and embedded-protocol applications. The 1152-ball FC-FBGA package uses fine-pitch solder balls on a plastic substrate, providing high I/O density for signal-intensive designs. With 8-input adaptive logic modules (ALMs), the 90 nm architecture achieves a balance between logic density and timing closure that established the Stratix II GX family as a benchmark for high-performance FPGA in 2006-2010 generation designs. Typical applications include high-speed serial protocol bridging, telecom line cards, broadcast video processing, ASIC prototyping, and embedded computing where the integrated transceivers reduce board area compared to FPGA-plus-external-PHY solutions. Engineers also use the part in industrial imaging and test-and-measurement platforms that require reconfigurable DSP pipelines. When designing with the EP2SGX90EF1152I5N, plan power-rail sequencing carefully: VCCINT (1.2 V core), VCCIO (per-bank I/O), VCCA (PLL analog), and the transceiver supply VCCRT/VCCCH must ramp in the sequence specified by Intel. Quartus II is the supported design toolchain, and IBIS models for signal-integrity simulation are available from Intel's FPGA support resources. This page synthesizes distributor pricing, package details, drop-in alternatives from the Stratix II GX family, and practical design notes not found in the standalone manufacturer datasheet.
EP2SGX90EF1508 - Stratix II GX FPGA 90K LE 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX90EF1508 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 RAM bits, and 12 transceiver channels, housed in a 1508-ball FC-FBGA package. The device is fabricated on a 90 nm process and supports core voltages of 1.2 V, with I/O voltages selectable per bank to interface with DDR/DDR2/QDR memory and LVDS/TTL/PCI/PECIL signaling standards. The suffix code 'EF1508' denotes the enhanced-configuration 1508-ball variant, while 'C5' speed grade variants (EP2SGX90EF1508C5) are catalog-distributed through Rochester Electronics as the part is mature. FPGAs (Field-Programmable Gate Arrays) are reconfigurable logic devices that allow engineers to implement arbitrary digital logic via a programmable fabric of look-up tables, flip-flops, and routing. Stratix II GX FPGAs specifically target high-speed serial connectivity applications, integrating multi-gigabit transceivers alongside the logic fabric. Within the broader taxonomy, an FPGA sits within programmable logic -> digital logic -> integrated circuit -> semiconductor. The Stratix II GX family occupies the high-end of Altera's 90 nm portfolio, designed for protocol bridging, custom computing, and signal processing where neither ASICs nor microcontrollers provide sufficient parallelism or I/O bandwidth. Key specifications include 90,960 logic elements, 4,520,448 embedded memory bits, 12 high-speed transceivers supporting rates up to 6.375 Gbps, up to 538 user I/O pins distributed across 8 I/O banks, and a typical core supply of 1.2 V. The 1508-ball FC-FBGA package provides a 1.0 mm ball pitch and exposes 4 PLLs for clock synthesis. The device supports configuration via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), and JTAG modes. Typical applications include multi-gigabit serial protocol bridges (PCI Express, XAUI, Serial RapidIO, Gigabit Ethernet), high-performance digital signal processing (DSP) datapaths for wireless basestations, software-defined radio (SDR) front-ends, and high-speed data acquisition systems. The integrated transceivers eliminate the need for external PHY chips, reducing BOM cost and simplifying PCB layout for line-card and backplane designs. When designing with this device, allocate sufficient decoupling (typically 0.1 µF and 10 µF per power rail), keep high-speed serial traces length-matched within the transceiver skew budget, and ensure thermal relief through adequate copper area on the FC-FBGA land pads. The 1508-ball FC-FBGA requires X-ray or endoscopic inspection after assembly. This page synthesizes distributor pricing, mature-lifecycle inventory, and pin-compatible Stratix II GX family alternatives not consolidated in the manufacturer datasheet or standard distributor listings.