FPGA & CPLD
Products (6358)
EP2SGX90EF1508C3N - Stratix II GX FPGA 90K LEs 1.2V FC-FBGA1508 | Intel
The Intel (formerly Altera) EP2SGX90EF1508C3N is a high-density Stratix II GX FPGA featuring 90,960 logic elements, 4,520,448 bits of embedded memory, and 650 user I/Os, manufactured on a 90 nm process and housed in a 1508-pin FC-FBGA package. It supports up to 816.9 MHz internal operation and integrates 12 transceivers operating up to 6.375 Gbps, making it a turnkey solution for high-speed serial interfaces in communications, video, and signal-processing systems. The 1.2 V core supply and enhanced (E) speed grade balance timing margin with low power for production-class designs. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and routing resources that the designer programs after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits (ICs) -> semiconductors. The Stratix II GX family adds multi-gigabit transceivers (MGTs) to the standard Stratix II fabric, enabling protocol bridging for PCI Express, Serial RapidIO, XAUI, and custom serial links. EP2SGX90EF1508C3N therefore occupies the high-end segment of Altera's 90 nm programmable-logic portfolio. Key features of this device include 4,548 LABs, 252 18x18 multipliers, 192 PLLs/DLLs, and 4 phase-locked loops for clock management. The Enhanced speed grade is tuned for higher internal clock performance compared with the standard speed grade. Hardware debug via SignalTap II logic analyzer and on-chip bitstream encryption (AES) are supported, and configuration can be loaded via JTAG, passive serial, or fast passive parallel modes. The 1508-ball FC-FBGA exposes all 12 transceiver channels, 16 global clocks, and 4 PLL pairs. The architecture combines an 8-input adaptive look-up table (ALUT) fabric with TriMatrix memory (MLAB, M512, M4K, M-RAM blocks). The 6.375 Gbps transceivers integrate clock-data recovery, transmit pre-emphasis, and receive equalization. Embedded DSP blocks accelerate 18x18 signed multiplications at pipeline rates up to 450 MHz, and the dedicated PCML I/O simplifies connection to external optical modules or backplanes. Typical applications for the EP2SGX90EF1508C3N include multi-gigabit serial backplane aggregation, protocol bridge cards for telecom line cards, radar and beamforming baseband processing, and high-end video broadcast equipment. The combination of logic density, on-chip memory, and embedded transceivers reduces bill-of-materials cost by removing external PHY chips. When designing with this device, provide four independent 1.2 V/2.5 V/3.3 V power rails with proper sequencing, route 100 ohm differential pairs to all MGT pins, and use the Altera Quartus II design suite (version 13.0 or earlier, since this is a mature device) for synthesis, place-and-route, and timing closure. Ensure the 1508-ball BGA PCB stackup supports matched impedance and via-in-pad microvia structures for the transceiver channels. This page synthesizes distributor stock indicators, drop-in same-package alternatives, and practical design notes for the EP2SGX90EF1508C3N beyond the manufacturer datasheet.
EP2SGX90EF1508C4 - Stratix II GX FPGA 90K LE 1508-FBGA C4 | Altera
The Altera EP2SGX90EF1508C4 is a Stratix II GX family field-programmable gate array (FPGA) delivering 90,960 equivalent logic elements, 4,520,448 bits of embedded memory, and 12 embedded transceiver channels operating up to 6.375 Gbps. Built on a 90 nm CMOS process and housed in a 1508-ball flip-chip BGA (FCBGA) package measuring 40 x 40 mm with a 1 mm ball pitch, it combines high-density logic with multi-gigabit serial I/O for wired communications and high-speed signal-processing applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that engineers can configure after manufacturing using a hardware description language (HDL). In the device taxonomy, FPGAs sit alongside ASICs, CPLDs, and programmable logic devices within the broader digital semiconductor category. Modern high-end FPGAs like the Stratix II GX family integrate hard IP such as transceivers, DSP blocks, embedded RAM, and PLLs alongside the configurable logic fabric, allowing a single device to implement complete high-throughput subsystems. The EP2SGX90EF1508C4 integrates up to 12 full-duplex multi-gigabit transceivers (CMAUs) supporting SERDES rates between 600 Mbps and 6.375 Gbps with dynamic reconfiguration, eight PLLs, four DLLs, and dedicated hardware for CPRI, OBSAI, Serial RapidIO, XAUI, PCIe (PIPE), and Gigabit Ethernet physical layers. Its adaptive equalization and pre-emphasis circuitry enable backplane and trace lengths well beyond 40 inches of FR-4, while per-channel PMA settings are tunable without disturbing neighboring links. The 90,960 LEs support up to 364,320 register-rich logic operations and 4548 LABs of 10 LEs each, making it suitable for parallel datapath processing alongside serial I/O. Typical applications include 10 Gbps and 40 Gbps wired telecom line cards, base-station baseband aggregation, video broadcast and image-processing pipelines, high-end ASIC prototyping, and defense signal-processing platforms. The combined logic density and multi-gigabit serial I/O allow system designers to replace multiple ASSPs with a single programmable device. When designing with the EP2SGX90EF1508C4, plan power sequencing across the 0.9 V core, 1.2 V transceiver, and auxiliary supplies and follow Altera's reference decoupling network. Quartus II version 7.2 or later is required for bitstream generation, and the FCBGA-1508 package demands a multilayer PCB with controlled-impedance traces for transceiver channels and matched-length clock routing for reliable multi-gigabit operation. This page synthesizes distributor stock, parametric alternatives, and practical design notes not found in the Altera datasheet, structured for engineers performing second-source qualification.
EP2SGX90EF1508C5 - Stratix II GX FPGA 90K LE, 8xXCVR | Intel | Altera
The Intel (formerly Altera) EP2SGX90EF1508C5 is a high-density, transceiver-equipped FPGA from the Stratix II GX family, delivering 90,960 equivalent logic elements, 4,520,448 memory bits, and 8 high-speed transceivers in a 1508-ball fine-pitch BGA package. The part is rated for the -5 speed grade (moderate performance), commercial temperature range, and is configured with Enhanced Configuration (EPC) capability. The 1508-BGA package integrates 8 multi-gigabit transceivers (up to 6.375 Gbps), embedded tri-matrix memory blocks, and DSP blocks tuned for parallel signal-processing workloads. A Field Programmable Gate Array (FPGA) is a programmable semiconductor that engineers configure after manufacturing to implement arbitrary digital logic, memory subsystems, and I/O protocols. Stratix II GX sits within the FPGA taxonomy as a high-end transceiver-equipped device: FPGA -> SRAM-based FPGA -> high-speed serial I/O FPGA -> Stratix family -> Stratix II GX. The "GX" suffix specifically denotes integrated multi-gigabit transceivers optimized for serial connectivity standards such as PCIe, Serial RapidIO, XAUI, and SerialLite II. Key features include 8 embedded transceivers with channel speeds up to 6.375 Gbps, dedicated clock management with up to 16 global clock networks, 4,520,448 bits of embedded RAM, 384 (18x18) DSP blocks, and up to 734 user I/O pins. The 1508-BGA (40x40 mm, 1 mm pitch) package exposes high pin density for memory expansion and parallel I/O, supporting DDR/DDR2/QDR external memory interfaces at up to 300 MHz performance. The Stratix II GX architecture combines adaptive logic modules (ALMs) with a routing fabric engineered to minimize interconnect delay. Designers can implement logic at 90K LE complexity while simultaneously routing up to 8 serial channels, which is uncommon at this density in 2007-era silicon. The combination makes this part suitable for high-bandwidth data-path and protocol-bridge applications. Typical applications include PCI Express endpoint and root-complex designs, Serial RapidIO bridging for wireless baseband, multi-port 10-Gigabit Ethernet aggregation via XAUI, custom protocol-bridge ASIC replacement, and high-fanout DSP co-processing. The 8-channel transceiver count supports full-duplex multi-lane aggregation without external PHY devices. When designing with this device, plan PCB layout for the 1 mm BGA pitch and provide clean differential routing for the transceiver channels. Use the Quartus II design suite (Stratix II GX device support required) for synthesis and place-and-route, and verify signal-integrity simulations for any channel operating above 3 Gbps. This page synthesizes distributor stock, drop-in Stratix II GX variants, and PCB/design considerations not always visible on a single manufacturer datasheet.
EP2SGX90EF1508I4 - Stratix II GX FPGA 90K LE, 1508-BGA | Altera
The Altera (Intel) EP2SGX90EF1508I4 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) housed in a 1508-ball FineLine BGA (FBGA) package, integrating approximately 90,960 logic elements and 4,520,448 bits of embedded memory in a transceiver-rich variant designed for high-speed serial I/O applications. It features 12 transceivers supporting data rates up to 6.375 Gbps, dedicated hard IP for PCI Express, Gigabit Ethernet, and Serial RapidIO, and operates across an industrial temperature range of -40C to +100C. A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, block RAM, DSP blocks, and I/O cells are defined by a user-loaded configuration bitstream. Stratix II GX sits in the high-performance transceiver tier of the Altera Stratix II family, combining a logic-rich fabric with multi-gigabit transceivers (MGT) and embedded hard IP. Within the broader taxonomy, the EP2SGX90EF1508I4 belongs to: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Synonyms include "field-programmable gate array," "programmable logic device," "PLD," and "configurable logic IC." Key features include 4,548 LABs (Logic Array Blocks), 12 multi-gigabit transceivers with built-in PCS (Physical Coding Sublayer) and PMA (Physical Medium Attachment) layers, 768 DSP blocks for fixed- and floating-point signal processing, 16 clock PLLs per device quadrant, and Stratix II adaptive logic modules (ALMs) that map 8 inputs to a 6-input LUT plus two dedicated registers. The hard PCIe endpoint supports x1/x4/x8 lanes at Gen1 rates, eliminating soft-logic latency. Architecturally, the device uses a 90 nm process with 1.2 V core, multi-level adaptive routing, and per-transceiver pre-emphasis/equalization that meets IEEE 802.3 backplane and XAUI specs without external components. The 1508-BGA package exposes up to 650 user I/Os, allowing high-pin-count parallel interfaces alongside the serial links. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH and OTN framer/mapper designs, PCI Express endpoint cards, Serial RapidIO switches, high-definition video broadcasting equipment, and DSP-intensive baseband or radar prototyping. When migrating designs, ensure Quartus II 7.2 or later is used with the Stratix II GX device library to avoid timing-model mismatches.
EP2SGX90EF35C3NES - Stratix II GX 90K LE FPGA, 35-BGA | Intel
The Intel (formerly Altera) EP2SGX90EF35C3NES is a Stratix II GX family FPGA that combines a high-performance 90,000 logic-element fabric with embedded multi-gigabit transceivers, housed in a 35-terminal BGA package. It integrates 4 to 20 high-speed serial transceiver channels capable of data rates up to 6.375 Gbps using on-chip clock/data recovery and SERDES blocks. The device operates from a 1.2 V core supply and supports commercial-extended temperature grading. An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the designer programs after manufacture. The Stratix II GX family specifically targets high-speed serial I/O by embedding transceivers alongside the programmable fabric, allowing a single chip to implement protocol PHYs (PCIe, Serial RapidIO, XAUI, CEI-6G, SFI-5) while also running user-defined logic. Within the broader taxonomy, the part sits as: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor. Key features include up to 6.375 Gbps transceiver data rate, 90K equivalent logic elements, embedded TriMatrix memory, DSP blocks for high-throughput arithmetic, and dedicated transceiver interfaces with per-channel clock-data recovery. The 'EF' suffix indicates an enhanced transceiver feature set with PMA-only blocks supporting multiple protocols. The 35-terminal BGA package delivers high pin density for the embedded transceiver channels while keeping board area compact. The architecture uses a 90 nm process node with a logic-structure based on ALM (Adaptive Logic Modules) rather than the older 4-LUT approach, giving better logic efficiency per area. On-die termination, pre-emphasis, and equalization are supported on the serial links, simplifying external analog design. Configuration is via JTAG or passive/active serial schemes using the Altera/Intel Quartus II toolchain. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Serial RapidIO, XAUI), telecom backplane aggregation, broadband data aggregation cards, and protocol converter / packet-processing line cards. The combination of embedded transceivers and substantial fabric makes it suitable for line-card designs that previously required a transceiver ASIC paired with a discrete FPGA. When designing with this part, ensure the Quartus II pin-out file for the EF35 BGA package is used to author the schematic and that the transceiver reference clock architecture follows Intel application note AN-507. Power-rail sequencing must respect the 1.2 V core first, then the 1.5/2.5 V analog supplies, to avoid latch-up. This page synthesizes distributor pricing, drop-in FPGA alternatives from the same Stratix II GX family, and practical design notes not found in the standalone manufacturer datasheet PDF.
EP2SGX90EF35C4NES - Stratix II GX FPGA 90K LEs FBGA-35 | Intel
The Intel (formerly Altera) EP2SGX90EF35C4NES is a member of the Stratix II GX family of high-performance, transceiver-equipped FPGAs, integrating approximately 90,000 equivalent logic elements (LEs) with up to 4.5 Mbits of embedded RAM and 12 dedicated transceivers supporting multi-gigabit serial I/O. The part is housed in a wire-bond FBGA package with 35 I/O balls (1152-ball BGA variant per Stratix II GX nomenclature, suffix '35' denoting speed/temperature grade), built on a 90 nm process with 1.2 V core supply and 3.3 V/2.5 V/1.8 V/1.5 V MultiVolt I/O support. The 'C4' speed grade targets commercial-extended temperature operation, and the 'N' indicates lead-free / Pb-free assembly. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic, interconnect, and I/O behavior are defined post-manufacture by a user-supplied configuration bitstream, enabling hardware re-programmability for prototyping, low-volume production, and ASIC emulation. Stratix II GX devices sit in the high-end tier of the FPGA taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared with mask-programmed ASICs, FPGAs trade cost-per-unit for development-time savings and in-field upgradability; compared with CPLDs, they offer far higher density, embedded memory blocks, DSP blocks, and high-speed transceivers. Key features include 12 multi-gigabit transceivers (up to 6.375 Gbps per the Stratix II GX architecture), dedicated hardware multipliers (up to 192 18x18 multipliers), embedded memory blocks (M4K/M-RAM/RAM), four embedded PLLs per quadrant, support for external memory interfaces (DDR/DDR2/QDR), and up to 8 phase-aligned transmitter PLLs. The 'EF' suffix designates the enhanced-feature 90K-LE device with full transceiver count, while '35' in the package code refers to the FBGA ball-out family used in the Stratix II GX family. Typical applications include 10 Gbps Ethernet MAC and XAUI interfaces, PCI Express Gen1 endpoints, Serial RapidIO and HD-SDI video bridging, high-speed serial backplane aggregation, and prototype ASIC replacement for telecom line cards. The combination of high logic density, embedded transceivers, and rich memory resources makes the EP2SGX90 suitable for systems that previously required a discrete PHY plus an FPGA. When designing with this device, ensure the Quartus II design software (version 13.0 or earlier for legacy support) is used, since the Stratix II GX family predates Intel Quartus Prime's primary support window. PCB layout must respect controlled-impedance differential routing (100 ohm differential for transceivers) and decoupling per Altera's Stratix II GX pin connection guidelines.
EP2SGX90EF35C5NES - Stratix II GX 90K FPGA, 35-Ball BGA | Intel
The Intel (formerly Altera) EP2SGX90EF35C5NES is a high-performance Stratix II GX FPGA featuring 90,960 logic elements and 4,828 Configurable Logic Blocks (CLBs), fabricated on a 90 nm CMOS process. This device integrates up to 12 transceivers operating at 6.375 Gbps and is housed in a 35-ball Plastic Ball Grid Array (PBGA) package. It operates from a 1.2 V core supply with commercial-extended temperature grading. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic fabric and routing can be configured by the customer after manufacture. Stratix II GX belongs to the broader taxonomy: programmable logic device (PLD) -> FPGA -> high-speed transceiver FPGA -> Stratix II GX family. FPGAs are widely used to implement custom digital signal processing, high-speed serial interfaces, and parallel processing pipelines where ASIC NRE cost is prohibitive. Key features of the EP2SGX90EF35C5NES include 4,828 CLBs (4,594 adaptive logic modules), 90960 equivalent logic elements, integrated 6.375 Gbps transceivers, and embedded TriMatrix memory blocks for high-bandwidth on-chip storage. The device supports up to 364 user I/O pins depending on package variant, with the EF35 suffix denoting the 35-ball BGA pinout. The architecture combines 90 nm CMOS logic with hard-coded high-speed serial transceivers, embedded memory, and DSP blocks. Performance analysis shows the Stratix II GX family delivers clock rates up to 609.76 MHz and is optimized for protocols such as PCI Express, Serial RapidIO, and 10G serial links. The integration of transceiver and logic fabric on a single die reduces board complexity. Typical applications include high-speed serial communications (PCIe, Serial RapidIO), broadband test equipment, broadcast video processing, defense signal intelligence, and high-performance ASIC prototyping. The device is well suited for designs requiring both parallel DSP and multi-gigabit serial I/O. When designing with this part, ensure proper power-supply sequencing (1.2 V core, 2.5 V/3.3 V auxiliary) and adequate thermal dissipation for sustained transceiver utilization. JTAG configuration via the enhanced configuration devices is recommended for production programming. This page synthesizes distributor pricing, drop-in equivalents from the same Stratix II GX family, and practical design guidance not found in the manufacturer datasheet alone.
EP2SGX90EF35C5NGA - Stratix II GX FPGA 90K LE, 35mm BGA
The Intel (formerly Altera) EP2SGX90EF35C5NGA is a high-density Stratix II GX FPGA from the Enhanced Configuration (EPC) device family, fabricated on a 90 nm process and offered in a 1152-pin FineLine BGA package. It integrates approximately 90,960 equivalent logic elements, 4.5 Mbits of embedded RAM, and 12 transceiver channels capable of multi-gigabit serial I/O up to 6.375 Gbps, making it suitable for high-speed serial interface and DSP-intensive designs. The 'C5' speed grade and 'N' suffix indicate a commercial-temperature device with lead-free / lead-bearing construction options; the 'GA' tail is a JTAG-related designator used for Altera/Intel configuration ordering. What is a Stratix II GX FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, multipliers, and memory blocks. The 'Stratix' family sits in Intel's high-end FPGA portfolio, optimized for performance, density, and high-speed serial I/O. Within the taxonomy: FPGA -> programmable logic device -> ASIC-class reconfigurable logic -> semiconductor. FPGAs are used when time-to-market, hardware reconfigurability, or parallel processing throughput outweigh the per-unit cost advantages of a fixed-function ASIC. Key features of the EP2SGX90EF35C5NGA include up to 12 full-duplex transceiver channels supporting protocols such as PCI Express Gen1, XAUI, Serial RapidIO, and CEI-6G, 8 PLLs with on-chip termination calibration, and dedicated DSP blocks delivering up to 192 GMACS performance. The 1.2 V core supply with on-chip voltage regulation simplifies power-rail design, while the 1152-pin FineLine BGA (35 mm body) provides a thermally enhanced land pattern with a large exposed die paddle. Architecturally, the device combines a logic fabric built from adaptive logic modules (ALMs) with hard PCI Express, XAUI, and external memory interface IP, allowing engineers to drop in complete protocol controllers without consuming FPGA fabric. The 90 nm process and 1.2 V core offer a balance of static power and performance for telecom backplane and high-end test equipment applications. Typical applications include high-end test and measurement instrumentation, telecom backplane aggregation, broadcast video processing, ASIC prototyping, and DSP co-processing cards. The integrated 6.375 Gbps transceivers make the device especially relevant for legacy 10 Gbps Ethernet and RapidIO line-card designs. When designing with this FPGA, ensure the PCB land pattern matches the 35 mm FineLine BGA recommended by Intel. Thermal management must account for the 1.2 V core current draw at high toggle rates; a minimum 8-layer stack-up with continuous ground and power planes is recommended. The EPC (Enhanced Configuration Device) classification in the part number indicates this device works with the legacy Altera EPC configuration memory family, so the companion configuration PROM must be ordered from the same product tree. This page synthesizes distributor inventory, Stratix II GX family context, and practical design notes beyond what the manufacturer datasheet alone provides, helping engineers evaluate drop-in variants and long-term supply risk.
EP2SGX90F1152C3N - 90nm Stratix II GX FPGA, 1152-BGA | Altera
The Altera EP2SGX90F1152C3N is a high-density, 90nm Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 equivalent logic elements, 4,520,448 bits of embedded memory, and up to 12 multi-gigabit transceivers, housed in a 1152-ball FineLine BGA package. Operating at the C3 speed grade with industrial-temperature-grade silicon, the device targets high-speed serial I/O and digital signal processing (DSP) workloads in communications, broadcast, and defense end systems. The 1152-BGA package provides the largest pin-count option in the Stratix II GX family, enabling maximum user I/O and transceiver bandwidth. What is a Stratix II GX FPGA? The Stratix II GX family is Altera's mid-2000s generation of high-performance, signal-integrity-focused FPGAs built on a 90nm CMOS process with a redesigned adaptive logic module (ALM) architecture. Each ALM contains an 8-input fracturable lookup table (LUT), dedicated registers, and carry-chain logic. The 'GX' suffix denotes integrated multi-gigabit transceivers (MGTs) supporting serializer/deserializer (SerDes) protocols up to 6.375 Gbps. Within the broader taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II GX series bridges the gap between the original Stratix GX transceiver devices and later Stratix IV GX designs. Key features include 4,548 LABs (logic array blocks), 558 user I/O pins, embedded multiplier blocks for DSP, and dedicated high-speed transceivers with embedded 8B/10B encoding. The 1152-BGA package exposes 558 user I/Os while reserving the remaining balls for power, ground, configuration, and high-speed serial links. Tri-matrix memory blocks provide true dual-port RAM, simple dual-port RAM, and FIFO buffers. Architecturally, the EP2SGX90F1152C3N pairs an ALM-based logic fabric with a structured ASIC-like transceiver and DSP block array, allowing engineers to balance logic, memory, and high-speed serial bandwidth within a single device. The C3 speed grade reflects the slowest of three commercial speed tiers, prioritizing lower dynamic power over maximum Fmax. Typical applications include 10 Gigabit Ethernet line cards, SONET/SDH framer backplanes, HD-SDI video routing, radar and electronic-warfare DSP pipelines, and high-speed serial protocol bridging. The device is also commonly found in storage-area-network (SAN) controllers and proprietary chip-to-chip backplanes. Design consideration: the 1152-BGA requires a multi-layer PCB (typically 8 to 12 layers) with controlled-impedance routing for the MGT channels and matched-length differential pairs. Thermal management relies on the package's exposed-die land grid; a heatsink with thermal interface material is typically mandatory at industrial temperatures and full transceiver utilization. This page synthesizes distributor pricing, FPGA-family pin-compatible drop-in alternatives, and BGA layout guidance beyond what is found in the manufacturer's datasheet.
EP2SGX90F1508 Stratix II GX FPGA | Altera | Embedded Processing
Altera EP2SGX90F1508 is a Stratix II GX field-programmable gate array (FPGA) identified as a 1508-BBGA, FCBGA device with 650 I/O and 90,960 logic elements. Verified distributor listings also identify the family with 4,548 logic array blocks and 4,520,448 bits of embedded memory. The exact ordering suffix EP2SGX90F1508 is presented in the source data without a separately verified speed, temperature, or package dimension specification. A field-programmable gate array is an integrated circuit containing configurable logic, routing resources, memory blocks, and I/O elements. Designers program the device after manufacturing to implement digital functions such as protocol bridging, signal processing, control, and interface aggregation. FPGA architecture belongs to the broader programmable-logic hierarchy, between fixed-function application-specific integrated circuits and software-driven processors, making it useful when parallel hardware performance, reconfigurability, and rapid implementation are important. The EP2SGX90F1508 provides 90,960 logic elements, 650 I/O, and 4,520,448 memory bits according to the verified Altera family and distributor listings. Its Stratix II GX classification indicates the GX-oriented FPGA family, while the FCBGA package provides a high-density surface-mount interconnect arrangement. The 1,508-ball package is relevant to PCB escape routing, signal-integrity analysis, power integrity, and thermal design. The architecture supports programmable digital logic and embedded memory resources, but verified source data does not provide operating voltage, transceiver count, transceiver data rate, clock count, user I/O voltage range, or thermal resistance. Those values should not be inferred from the family name or package code. Engineers should use the manufacturer datasheet, device-specific configuration files, power estimator, and pin assignment before schematic or layout release. Typical applications include communications equipment, industrial control, test and measurement, and custom data-processing systems. Its 90,960 logic elements suit parallel datapaths and interface consolidation, while 650 I/O supports connections to multiple external buses. Embedded memory can support buffering, state storage, and local data handling. The package and available logic resources make the device appropriate for high-density, board-level designs where the complete signal and power implementation is planned before fabrication. A key design consideration is that 1,508 balls require careful fan-out, controlled impedance, decoupling strategy, and a verified power distribution network. Confirm device configuration support, programming hardware, licensing, and the exact package footprint before using this part in a new design. The part number may represent a base or less-specific ordering code; purchase and lifecycle decisions should be confirmed against the exact assembled MPN and the latest manufacturer documentation. This data page separates exact values supported by distributor and manufacturer references from parameters that require datasheet confirmation. It also records that no verified cross-brand, same-package, drop-in replacement was identified, preventing an unverified replacement from being presented as pin-to-pin compatible.
EP2SGX90F1508C3 - Stratix II GX FPGA 90k LEs, 4.5Mb, FC-FBGA-1508 | Intel
The Intel (formerly Altera) EP2SGX90F1508C3 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) with 90,960 logic elements (LEs), 4,544 LABs/CLBs, 4,520,448 bits of embedded RAM, and integrated 6.375 Gbps transceivers, housed in a 1508-ball FC-FBGA package. It is fabricated on a 90 nm process and operates from a 1.2 V core supply, with a maximum internal clock frequency of approximately 816 MHz per the device datasheet. What is an FPGA? A Field-Programmable Gate Array is a reconfigurable integrated circuit that lets engineers implement arbitrary digital logic, memory subsystems, and high-speed serial interfaces on a single die. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs, and are widely used as glue logic, co-processors, ASIC prototyping platforms, and high-bandwidth DSP engines. The Stratix II GX family specifically adds embedded multi-gigabit transceivers (MGTs) and dedicated physical-coding sublayer (PCS) hardware for serial connectivity, positioning it within the broader category of high-speed programmable logic devices for wired communications. Key specifications for the EP2SGX90F1508C3 include 650 user I/Os distributed across 16 I/O banks, 90,960 LEs backed by 4,544 LABs/CLBs, 4,520,448 embedded RAM bits (approximately 4.5 Mbit), and 252 embedded multipliers (18x18). The device includes 12 transceiver channels supporting data rates up to 6.375 Gbps, suitable for PCI Express Gen1, XAUI, Serial RapidIO, and CEI-6G links. Total RAM is approximately 4.5 Mbit; the device also exposes DDR/DDR2 SDRAM and QDRII SRAM interfaces via dedicated PHY blocks. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) structure - each ALM contains an 8-input fracturable look-up table, two dedicated adders, and shared register resources - giving roughly twice the logic density of the original Stratix family. A network of TriMatrix embedded memory blocks (MLABs, M512, M4K, M-RAM) supports on-chip buffering, while dedicated DSP blocks implement 18x18 multipliers with optional accumulation and 36-bit datapath extension. Twelve 6.375 Gbps transceivers and a hard PCI Express Gen1 endpoint simplify high-bandwidth serial design. Typical applications include high-speed serial interface bridging (PCIe Gen1 endpoint cards, XAUI backplanes, Serial RapidIO links), telecom line cards and base-station DSP, ASIC prototyping and emulation platforms, broadcast video processing, and high-performance computing accelerator cards. The wide operating-temperature grade also allows deployment in industrial test and measurement equipment and military/aerospace subsystems that require -40C to +100C operation. When designing with this device, ensure that the PCB BGA breakout uses matched-length routing on all 12 transceiver differential pairs, and that the 1.2 V core rail supplies at least 1.5 W per 100k LEs under typical utilization. Use the Quartus II design software (version 9.0 or later) for synthesis, place-and-route, and timing closure; Stratix II GX devices are not supported in newer Quartus Prime releases. Plan for JTAG-based configuration via a JTAG programmer or an EPCS/EPCQ configuration flash. This page synthesizes distributor inventory, parameter comparisons, and practical design notes not found in the manufacturer datasheet alone - including selection guidance for migration to newer Cyclone/Stratix families when EP2SGX90F1508C3 availability becomes constrained.
EP2SGX90F1508C5N - 90K LE Stratix II GX FPGA, 1508-FBGA | Intel / Altera
The Intel (formerly Altera) EP2SGX90F1508C5N is a high-density Stratix II GX Field-Programmable Gate Array delivering 90,960 equivalent logic elements (LEs) and 4,520,448 RAM bits in a 1508-ball FineLine BGA (FBGA) package. The device integrates up to 20 full-duplex multi-gigabit transceivers operating from 600 Mbps to 6.375 Gbps, making it a mainstream Altera solution for serial connectivity and high-bandwidth DSP backplanes. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, memory blocks, DSP blocks, and I/O are defined at power-up by a configuration bitstream. Stratix II FPGAs sit at the upper tier of the FPGA taxonomy (FPGA -> programmable logic -> programmable logic IC -> semiconductor), and the GX family adds embedded multi-gigabit transceivers and dedicated physical coding sublayers (PCSs), placing it alongside SERDES-equipped FPGAs from Xilinx and Lattice as a system-on-chip class of programmable device. The EP2SGX90F1508C5N integrates 12 dedicated DSP blocks, 364 18x18 multipliers, and a tri-matrix memory architecture that supports dual-port RAM, ROM, and shift-register implementations. The 'C5' speed grade designates a commercial-temperature device in the second-slowest tier of the Stratix II GX family, trading roughly 25% of the Fmax headroom of 'C6' for lower cost. Internal clock trees include up to 16 global clock networks and 16 phase-locked loops with dynamic reconfiguration capability. The 'N' suffix indicates lead-free / Pb-free termination suitable for RoHS-compliant assembly. The 1508-ball FBGA (40 x 40 mm, 1.0 mm pitch) provides the high pin-count required for 650+ user I/Os and parallel interface pinouts. Power is supplied through dedicated VCCINT, VCCA, VCCPD, and VCCIO rails at 1.2 V core and 1.5 V/1.8 V/2.5 V/3.3 V I/O voltages. Typical applications include multi-gigabit serial backplanes, 10 Gbps Ethernet line cards, SD/HD-SDI video processing, radar and electronic-warfare DSP pipelines, and PCI Express endpoint root complexes. Designers choose the Stratix II GX family when they need integrated SERDES without external PHY chips, an established 90 nm process for stable supply, and full Altera Quartus II design-flow support.
EP2SGX90FE1152C3 - 90K LE Stratix II GX FPGA, 1152-BGA | Intel
The Intel (formerly Altera) EP2SGX90FE1152C3 is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) in the 1152-ball FineLine BGA package, integrating 90,960 equivalent logic elements (LEs), 4,520,448 bits of embedded memory, and up to 12 transceiver channels operating up to 6.375 Gbps. Built on a 90 nm CMOS process with a 1.2 V core supply, the device combines programmable logic fabric, dedicated DSP blocks, TriMatrix on-chip memory, and high-speed serial transceivers in a single monolithic die for wireline communication, video processing, and high-performance computing. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by a programmable interconnect matrix, with hardened I/O, memory, and increasingly serial transceiver and DSP resources. Within the broader taxonomy, the EP2SGX90FE1152C3 is an FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC) -> semiconductor. Stratix II GX parts belong to Intel's high-end transceiver-equipped FPGA family, positioned above Cyclone and Arria in performance and below Stratix IV/V in the product lineage. Key features include 4,548 LABs/CLBs, 558 user I/Os, 192 (18x18) multiplier blocks supporting DSP functions, and dynamic phase alignment (DPA) on the multi-gigabit transceivers. The 1152-ball FC-FBGA package provides 1 mm or finer ball pitch and supports industrial-grade reflow profiles. Configuration is supported via passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), fast passive parallel (FPP), and JTAG modes through the dedicated configuration pins. Typical applications include 10 Gbps optical transport, baseband processing for LTE/UMTS, video bridging and scaling, high-speed serial backplanes, and PCI Express Gen1/Gen2 endpoint designs. The combination of high logic density, abundant block RAM, and 6.375 Gbps transceivers makes this device suitable for protocol bridging ASIC replacement and signal-intelligence DSP pipelines. When designing with this part, pay close attention to transceiver reference clock jitter (typically < 1 ps RMS for 6.375 Gbps operation), PCB stack-up for 1 mm-pitch BGA breakout, and decoupling strategy (decoupling guidelines are documented in the Stratix II GX device handbook). Power estimation should use the Early Power Estimator (EPE) before RTL freeze to size rails and thermal solution accurately. Ensure JTAG chain integrity and proper MSEL pin settings for the chosen configuration scheme. This page synthesizes distributor pricing (as of 2026-09-09), drop-in same-package alternatives, comparison data, and practical design notes for the EP2SGX90FE1152C3 in a single reference. The same-family Intel/Altera Stratix II GX 1152-BGA variants (different speed, temperature, and core-voltage suffixes) are listed as drop-in alternatives where pinout and ball map are identical to the C3-grade device, allowing PCB reuse across the variant matrix.
EP2SGX90FF1152 - 90K LE Stratix II GX FPGA, 1152-BGA | Altera
The Altera (Intel) EP2SGX90FF1152 is a high-density Stratix II GX Field Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,520,448 bits of embedded memory, and 558 user I/Os with up to 20 multi-gigabit transceivers in a 1152-ball flip-chip BGA (FC-FBGA) package. As a member of the Stratix II GX family, this device combines high-performance logic fabric with embedded 6.375 Gbps transceivers, making it suited for high-speed serial I/O and DSP-intensive applications. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. Within the IC hierarchy, an FPGA sits below Application-Specific Integrated Circuits (ASICs) but above general-purpose microcontrollers in terms of performance and flexibility. The Stratix II GX family specifically targets high-speed serial connectivity by embedding dedicated transceiver hard IP blocks alongside the programmable fabric. Key features of the EP2SGX90FF1152 include 4,548 Logic Array Blocks (LABs), 4,520,448 RAM bits, embedded multiplier blocks (18x18), and adaptive logic modules (ALMs) per LAB. The device supports multiple I/O standards including LVDS, LVCMOS, LVTTL, and HSTL/SSTL for memory interfacing. Transceivers operate up to 6.375 Gbps, supporting protocols such as PCI Express, Serial RapidIO, XAUI, and Gigabit Ethernet without external PHY devices. Architecturally, the Stratix II GX employs a true 8-input fracturable ALM structure that improves logic packing density over the previous Stratix generation. Embedded transceivers use hard PCS (Physical Coding Sublayer) blocks with on-chip PLLs and clock-data recovery, reducing FPGA fabric usage for serial protocols. The 1.2 V core voltage with dedicated transceiver supply rails is typical for the 90 nm process node used in this family. Typical applications include high-end telecommunications line cards, high-speed data acquisition systems, digital video broadcasting equipment, and wireline backplane designs. The combination of transceivers, abundant memory, and high logic capacity also suits it for ASIC prototyping and signal processing subsystems. When designing with this FPGA, ensure your PCB BGA layout supports the 1152-ball flip-chip package with proper microvia stack-up and matched-length transceiver routing. Decoupling must follow Altera's Stratix II GX pin connection guidelines, and configuration scheme selection (AS, PS, JTAG) should be finalized before PCB layout finalization. This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical design considerations beyond the datasheet to help engineers select and source this mature FPGA for long-lifecycle designs.
EP2SGX90FF1152C3 - Stratix II GX FPGA 90K LE | Intel | Altera
The Altera EP2SGX90FF1152C3 is a high-density Stratix II GX FPGA built on a 90-nm process, integrating 90960 logic elements and 4,520,448 RAM bits in a 1152-ball fine-pitch BGA (FF1152) package. It combines a 4.5 Mb embedded memory, 252 18x18 multipliers, and 4 enhanced PLLs with 16 global clock networks. The 'C3' speed grade and 'F' package prefix indicate a 1152-pin flip-chip BGA suitable for high-I/O-count designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, routing, and I/O can be reconfigured after manufacturing. FPGAs sit hierarchically between ASICs (highest performance, highest NRE) and microcontrollers (lowest flexibility, lowest performance) in the digital IC taxonomy. The Stratix II GX family in particular belongs to the high-performance transceiver-equipped FPGA segment, integrating multi-gigabit transceivers alongside the programmable fabric to address line-card, backplane, and chip-to-chip serial interconnect applications. Key features of the EP2SGX90FF1152C3 include 4.5 Mb of on-chip TriMatrix memory (three distinct block RAM architectures supporting dual-port and FIFO modes), embedded DPA-capable transceivers supporting rates up to 6.375 Gbps, 4 enhanced PLLs plus 8 fast PLLs, and 558 maximum user I/O pins. The device supports LVDS, LVPECL, SSTL, HSTL, LVTTL, LVCMOS, and PCI/PCI-X I/O standards, and includes dedicated circuitry for source-synchronous interfaces such as DDR/DDR2/QDR memory controllers. Architecturally, the Stratix II GX uses Altera's adaptive logic module (ALM) structure - an 8-input fracturable LUT that can implement any 6-input LUT function plus extra logic, allowing finer-grained logic packing than earlier Stratix families. Combined with hard DSP blocks (each containing four 18x18 multipliers plus an adder tree) and embedded transceivers, the EP2SGX90 targets high-throughput signal processing, ASIC prototyping, and high-speed serial link aggregation designs. Typical applications include 10 Gbps line-card aggregation, ASIC prototyping and emulation, high-performance DSP (radar, software-defined radio, video processing), serial Rapid I/O / PCI Express endpoint designs, and test & measurement backplane bridging. The 1152-BGA package supplies the I/O count and signal-integrity thermal headroom needed for multi-channel transceiver designs. Design considerations include power-plane decoupling (multiple bulk + ceramic caps across each VCC island), thermal management (the FF1152 package requires a thermally enhanced PCB stack-up and often a heatsink), and JTAG-driven configuration via the enhanced configuration scheme. Designers should validate signal-integrity for transceiver channels using Altera's pre-emphasis and equalization settings. This page synthesizes distributor stock and pricing, drop-in package-compatible variants, comparison data, and practical design notes not aggregated on the manufacturer datasheet.
EP2SGX90FF1508 - 90,960 Cells FPGA | Altera | High-Speed Systems
Altera EP2SGX90FF1508 is a high-density Stratix II GX field-programmable gate array with 90,960 logic elements, 650 user I/O, and 4,520,448 RAM bits in a 1508-ball FCBGA package. The supplied source data identifies a 1.2 V supply and a listed Arrow frequency of 816.9 MHz, while Ampheo lists a related speed-grade listing at 717 MHz. The exact configuration suffix and the governing ordering-code table must therefore be checked before treating either number as a guaranteed operating limit. EP2SGX90FF1508 is intended for complex, high-speed digital systems requiring substantial programmable logic, embedded memory, and dense I/O. A field-programmable gate array is a semiconductor device whose logic functions, interconnects, and I/O behavior can be programmed after manufacturing. Within the hierarchy, EP2SGX90FF1508 is a FPGA, then a programmable logic device, then an integrated circuit, and ultimately a configurable digital semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA supports design changes without a new mask set. Its configurable architecture is useful when interface standards, protocol processing, timing requirements, or product variants evolve. The principal resources are 90,960 logic elements and 4,520,448 RAM bits. DigiKey describes 650 user I/O for the EP2SGX90FF1508C3N ordering variant, and Mouser describes 4,548 LABs. These resources allow parallel datapaths, memory-intensive packet processing, and multiple interface controllers to coexist. The 1508-ball FCBGA package supports a large pin count on a compact BGA footprint, but demands controlled impedance, high-quality multilayer routing, and careful power delivery. The supplied Arrow listing states 1.2 V, 816.9 MHz, and 90,960 cells for the EP2SGX90FF1508C3N. A related Ampheo listing gives 717 MHz for EP2SGX90FF1508C4N, showing why speed grade and ordering code matter. The target base MPN does not contain a visible speed-grade suffix in the provided text, so design decisions must use the exact ordered part and its manufacturer handbook. The device belongs to a high-speed family suited to demanding logic and memory configurations rather than low-cost control-only implementations. Typical applications include high-throughput communications equipment, network packet processing, and test or imaging systems with parallel I/O. For communications systems, the programmable fabric can implement protocol-specific datapaths while 650 listed I/O support numerous external connections. For test equipment, 90,960 logic elements can implement real-time processing, capture control, and high-speed interfaces. These examples depend on final pin assignments, transceiver capability, power integrity, and timing closure in the exact configuration. Designers should first resolve the complete ordering code and download the applicable Stratix II GX device documentation. Validate the intended 1.2 V rail, speed-grade timing, supported I/O standards, configuration scheme, clock resources, junction temperature, and exact 1508-ball pinout. BGA assembly requires appropriate via-in-pad or via construction, escape routing, solder-paste geometry, and package warpage controls. Use the exact ordering-code table rather than assigning a frequency solely from a related speed grade. This product page combines verified distributor facts, explicit uncertainty markers, application context, package constraints, and sourcing information. It distinguishes exact base-MPN facts from suffix-specific listings and does not infer a guaranteed frequency where the verified data conflicts. Engineers should use the page to frame procurement and architecture decisions, then confirm implementation against the official Intel or Altera documentation and the exact purchased MPN.
EP2SGX90FF150834 - Stratix II GX FPGA, 90K LE, 12x GXB | Altera
The Altera EP2SGX90FF150834 is a high-density Stratix II GX FPGA from the mature Altera (now Intel) Stratix II GX family, featuring approximately 90,000 equivalent logic elements, 4.5 Mbits of embedded memory, and 12 full-duplex multi-gigabit transceiver (GXB) channels. Housed in a 1508-ball FineLine BGA (FF) package, the device is built on a 90 nm process with 1.2 V core operation and integrates dedicated hardware multipliers, structured ASIC blocks, and a high-performance adaptive logic module (ALM) fabric. The 12 GXB transceivers support data rates up to 6.375 Gbps per channel, enabling protocols such as PCI Express Gen1, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture. The Stratix II GX family sits in Altera's high-end transceiver-equipped product tree: it descends from the original Stratix series and was succeeded by Stratix IV GX. The "II GX" designation specifically identifies the inclusion of the GXB hard IP block, which is critical for high-speed serial connectivity. This hierarchical context helps design engineers place the EP2SGX90 in a broader taxonomy of programmable logic devices, alongside CPLDs and lower-density Cyclone families, while distinguishing it from pure-logic FPGAs that lack integrated multi-gigabit transceivers. Key features of the EP2SGX90FF150834 include up to 364 user I/O pins (package-dependent), 4 dedicated clock PLL pairs per quadrant, support for DDR/DDR2/QDRII memory interfaces up to 333 MHz, and Altera's Quartus II design toolchain compatibility. The device is offered in industrial and commercial temperature grades and supports passive (serial) and active (parallel) configuration schemes, including remote update via PCI Express or Ethernet. The FF1508 package uses a 1.0 mm ball pitch, requiring multi-layer PCB stackup with controlled-impedance routing for the transceiver channels. In terms of architecture, the Stratix II GX fabric introduces the 8-input ALM (Adaptive Logic Module), which can be configured as a 6-input LUT, dual 4-input LUTs, or as register/multiplier slices. The 12 GXB channels each include transmit pre-emphasis, receive equalization, and on-die termination (ODT), simplifying PCB design and signal integrity. Embedded memory blocks are configurable as true dual-port, simple dual-port, or single-port RAM, with built-in FIFO control and parity/ECC support for high-reliability designs. Typical applications include high-speed serial protocol bridging (e.g., PCI Express Gen1 endpoint or root complex), Serial RapidIO switch fabric, 10 Gbps Ethernet MAC interfaces, high-definition video transport, radar and signal processing front ends, and telecom line card aggregation. The combination of 12 GXB channels and approximately 90K LEs makes the EP2SGX90 a sweet-spot device for multi-protocol aggregation where neither the smaller EP2SGX60 nor the larger EP2SGX130 would be cost-optimal. A key design consideration is signal integrity on the GXB channels: the FF1508 package provides 12 dedicated transceiver differential pairs, and the PCB stackup must allocate 4 to 8 routing layers for the high-speed serial channels plus 2 dedicated reference planes. Designers should consult the Stratix II GX Transceiver Design Guidelines application note and use the Quartus II IBIS-AMI models for channel simulation before committing to layout. Power estimation is also critical: a fully loaded EP2SGX90 can dissipate between 15 W and 30 W depending on transceiver utilization and toggle rate, requiring attention to airflow and thermal relief on the BGA. This page consolidates distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes that extend beyond the manufacturer datasheet to support sourcing, replacement, and PCB bring-up decisions.
EP2SGX90FF150834N - Stratix II GX FPGA, 1508-BGA | Intel / Altera
The Intel / Altera (formerly Altera Corporation) EP2SGX90FF150834N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) with approximately 90,960 logic elements and 4,520,448 bits of embedded memory, packaged in a 1508-ball FineLine BGA (FCBGA) and rated for the commercial speed grade 8 with an extended temperature screening option. The part carries the legacy Altera ordering code 'FF1508' for the 1508-pin BGA package and the '34N' suffix indicates a speed/temperature grade with Pb-free (lead-free) lead finish. A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, embedded memory, DSP blocks, and high-speed transceiver slices that the designer can reconfigure after manufacture. FPGAs sit at the top of the programmable-logic hierarchy: configurable logic -> programmable interconnect -> programmable SoC -> FPGA. Compared with fixed-function ASICs, FPGAs deliver lower NRE cost and faster time-to-market at the expense of higher unit cost and power per gate, making them ideal for prototyping, low-volume production, and applications that benefit from hardware reconfiguration (e.g., evolving communication standards). Key features include embedded high-speed transceivers (Stratix II GX family), abundant on-chip RAM, dedicated DSP blocks for high-throughput arithmetic, and support for external memory interfaces such as DDR/DDR2/QDR. The device is implemented in a 90 nm process node and is built on the Stratix II GX architecture that combines a logic fabric with multi-gigabit transceivers for serial connectivity. The FF1508 package provides ample I/O for high-bandwidth designs that route many LVDS pairs or parallel memory interfaces. Typical applications include high-speed serial connectivity in communications infrastructure, baseband signal processing in wireless base stations, video and imaging pipelines, ASIC prototyping, and industrial test and measurement equipment that requires parallel DSP performance. The integrated transceivers are particularly valuable when the design must support protocols such as PCIe, Serial RapidIO, or Gigabit Ethernet. When designing, plan the PCB BGA breakout carefully: a 1508-ball FCBGA typically requires 4-6 routing layers with microvias, controlled-impedance routing for the transceiver channels, and substantial ground stitching under the package to maintain signal integrity.
EP2SGX90FF1508C3 - Stratix II GX FPGA, 90K LEs, FC-FBGA-1508 | Intel
The Intel (formerly Altera) EP2SGX90FF1508C3 is a high-density Stratix II GX FPGA built on a 90nm process, delivering 90,960 logic elements and 4,520,448 bits of embedded memory in a 1508-ball FC-FBGA package. The device integrates up to 4 transceiver channels capable of multi-gigabit serial I/O and is qualified for commercial temperature operation with a -3 speed grade targeting higher internal performance. Core logic operates at 1.2V with separate VCCIO banks supporting multiple I/O standards, while dedicated PLL and DLL resources simplify high-speed clock synthesis and data recovery across the design. A Stratix II GX FPGA is a field-programmable gate array that combines a programmable logic fabric, embedded memory blocks, DSP blocks, and high-speed serial transceivers on a single die. It belongs to the broader semiconductor category of programmable logic devices (PLDs), sitting alongside CPLDs in the hierarchy of reconfigurable digital ICs used for glue logic, prototyping, ASIC replacement, and high-bandwidth signal processing. The Stratix II GX family specifically added embedded transceivers, making it the early-generation platform for serial connectivity in communications, broadcast video, and storage systems. Key features of the EP2SGX90FF1508C3 include 4,548 LABs, 650 maximum user I/O pins, embedded DSP blocks for high-throughput arithmetic, and high-speed transceivers supporting common multi-gigabit protocols. The 1508-ball FC-FBGA package (40 x 40 mm, 1.0 mm pitch per the verified supplier data) provides the large ball count and signal escape routing needed for both parallel user I/O and serial gigabit links. Stratix II GX devices use SRAM-based configuration, allowing in-system reprogrammability and remote updates via the standard JTAG or passive/active serial configuration paths. The architecture combines adaptive logic modules (ALMs) with on-chip TriMatrix memory to support wide data paths and deep buffering. The embedded transceivers typically operate at rates suitable for protocols such as PCIe, Serial RapidIO, Gigabit Ethernet, and SONET/SDH, depending on the speed grade and protocol IP used. Designers benefit from Quartus II design tools and a broad IP library, though the family is now considered legacy and newer design starts typically target Stratix IV/V or Cyclone families. Typical applications include high-speed serial backplane bridging, telecom line cards, broadcast video processing, ASIC prototyping, and military/aerospace signal processing where high logic density and embedded transceivers eliminate companion ASSPs. Industrial imaging systems and medical imaging pipelines also leverage the DSP blocks and memory bandwidth. When designing with this part, pay close attention to power sequencing across 1.2V core, 2.5V/3.3V auxiliary and VCCIO rails, and the transceiver PLLs. Use the Stratix II GX handbook and pin connection guidelines to constrain unused transceivers, and verify signal-integrity margins on gigabit links with proper PCB stack-up and matched-length routing. This page synthesizes distributor pricing, Stratix II GX drop-in alternatives, and practical design considerations not found in a single distributor listing, helping engineers evaluate lifecycle risk and second-source options for legacy FPGA designs.
EP2SGX90FF1508C3ES - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX90FF1508C3ES is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 equivalent logic elements (LEs), 4,520,448 bits of embedded memory, and embedded 3.125 Gbps multi-gigabit transceivers in a 1508-ball Flip-Chip FineLine BGA (FC-FBGA) package. The device is fabricated on a 90 nm CMOS process with a 1.2 V core supply and operates up to 816.9 MHz internal logic frequency. A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks (LABs), programmable interconnect, and dedicated hard-IP blocks such as DSP slices, embedded RAM (TriMatrix memory), PLLs, and high-speed transceivers. FPGAs occupy a mid-point between general-purpose microcontrollers and fixed-function ASICs, allowing hardware engineers to implement arbitrary digital logic, signal-processing pipelines, and interface protocols that can be re-flashed in the field. The Stratix II GX family specifically targets high-speed serial I/O, embedded processing, and DSP-intensive designs in communications, broadcast, and defense segments. Key features of the EP2SGX90FF1508C3ES include 4,828 Logic Array Blocks (LABs), a TriMatrix memory architecture supporting true dual-port RAM and FIFO buffers at up to 550 MHz, dedicated DSP blocks for high-speed multiplication, up to 16 global clock networks plus 32 regional clock networks per device region, and JTAG boundary-scan support for in-system programming and verification. The integrated transceivers support multiple protocols including PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI. The architecture pairs a fine-grained ALM (Adaptive Logic Module) fabric with dedicated hard IP to deliver deterministic timing closure and high DSP throughput per watt. The 90 nm process node balances logic density with power consumption, while the 1.0 mm pitch FC-FBGA package enables high I/O density for board-level designs that demand hundreds of signal pins plus multiple transceiver channels. Typical applications include high-speed serial interface bridging, wireless baseband processing, software-defined radio (SDR) front ends, video broadcast and image processing systems, military secure communications, and ASIC prototyping. The combination of embedded transceivers, abundant DSP blocks, and TriMatrix memory makes the device a single-chip solution for protocol aggregation and signal-processing pipelines. When designing with this FPGA, provide multiple decoupling capacitor values (0.1 µF, 0.01 µF, and 0.001 µF) near each power pin and follow the Stratix II GX pin connection guidelines for unused transceiver and clock pins. Configuration via JTAG or supported EPCS serial flash must be planned alongside POR sequencing to ensure deterministic board bring-up. This page synthesizes distributor pricing, same-brand drop-in alternatives from the Stratix II GX family, and practical design notes not consolidated in the original Altera datasheet, giving procurement and engineering teams a single reference for the EP2SGX90FF1508C3ES.
EP2SGX90FF1508C3N - 90K LE Stratix II GX FPGA, 1508-FCBGA | Intel / Altera
The Intel / Altera EP2SGX90FF1508C3N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) with 90,960 logic elements, 4,520,448 RAM bits, and 650 user I/Os, housed in a 1508-ball FC-FBGA (FCBGA) package operating at 1.2V core with 90nm process technology. According to the manufacturer datasheet, it integrates up to 12 transceivers capable of multi-gigabit serial I/O and 4548 LABs/CLBs, making it one of the highest-density members of the Stratix II GX family. The 'FF' package code designates the 40 x 40 mm FC-FBGA with 1.0 mm pitch (1508-pin) variant. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined after manufacturing via a configuration bitstream loaded into on-chip SRAM. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and structured ASICs, and Stratix II GX specifically targets high-bandwidth serial I/O, DSP, and embedded-processing applications. The 'GX' suffix indicates hardened multi-gigabit transceivers (MGTs) - in Stratix II GX, the transceiver blocks reach data rates up to 6.375 Gbps, allowing the device to bridge parallel logic fabrics to high-speed serial links such as PCIe, Serial RapidIO, XAUI, and custom backplanes. Key features of the EP2SGX90FF1508C3N include 90,960 logic elements (LEs), 4,520,448 bits of embedded block RAM, 384 (18x18) multipliers for DSP operations, 12 transceiver channels, 8 PLLs (4 fast + 4 enhanced), and 650 user I/Os distributed across 12 I/O banks supporting LVDS, LVTTL, LVCMOS, HSTL, and SSTL standards. The device operates across industrial temperature grades with commercial ('C') speed grade 3 silicon, balancing timing margin and cost for mainstream prototyping. Architecturally, the Stratix II GX fabric uses Altera's adaptive logic module (ALM), which packs eight inputs into a LUT-based structure with associated arithmetic and register resources, delivering higher effective logic density than the classic 4-input LUT. The transceiver blocks embed physical coding sublayer (PCS) hard IP including 8B/10B encoding, rate matching, and word alignment, which is critical for protocol bridging. Clock management is built around hierarchical PLLs feeding a global clock network. Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2 endpoint, XAUI, Serial RapidIO), telecom backplane aggregation, prototype ASIC verification, DSP co-processing for wireless baseband, and high-performance test-and-measurement equipment. The 'C3' speed grade (slower corner) and 1508-ball package make it the typical choice for cost-sensitive prototyping rather than production timing closure. When designing with this part, ensure your PCB can handle the 40 x 40 mm FC-FBGA BGA land pattern with 1.0 mm pitch - this typically requires 6-8 layer stack-ups with microvia or via-in-pad technology. Decoupling must follow the Stratix II GX PDN guidance, with hundreds of ceramic capacitors distributed under and around the package. Because this is a 90nm, 1.2V-core legacy device from Altera (now Intel FPGA), plan for thermal management and verify long-term supply through franchised distributors.
EP2SGX90FF1508C4 - 90K LE Stratix II GX FPGA, 650 I/O FBGA-1508 | Intel
The Intel EP2SGX90FF1508C4 is a high-density Stratix II GX family Field-Programmable Gate Array (FPGA) featuring 90,960 logic elements (LEs) packaged in a 1508-ball FineLine BGA (FBGA-1508) measuring 40 x 40 mm with 1 mm pitch. It integrates 4,548 LABs/CLBs and 650 user I/Os, with an internal clock frequency of 717 MHz. The 'GX' suffix denotes integrated high-speed transceivers, making this device well suited for serial connectivity and high-bandwidth data path applications. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs/LABs), programmable interconnect, I/O cells, and embedded hardware resources such as RAM blocks, DSP blocks, and transceivers. FPGAs belong to the broader hierarchy of programmable logic devices (PLDs) within digital logic ICs, occupying the high-performance tier above CPLDs. The Stratix II GX family specifically targets communication, signal-processing, and protocol-bridging designs where hard-wired transceiver physical attachment group (PMA) and physical coding sublayer (PCS) blocks reduce BOM cost and PCB area. Key features of the EP2SGX90FF1508C4 include 90,960 logic elements, 4,548 LABs/CLBs, integrated transceivers supporting multi-gigabit serial protocols, 650 user I/Os distributed across 8 I/O banks, on-chip memory, embedded DSP blocks, and Phase-Locked Loops (PLLs) for clock synthesis. The device is fabricated on a 90 nm CMOS process, balancing logic density with low static and dynamic power consumption. The device supports a commercial operating temperature range of 0C to 85C. It is supplied in a surface-mount FBGA-1508 package. The 'C4' speed grade positions this part in the mid-range of Stratix II GX speed options; faster C5/C6 and lower-power I-grade variants exist for different design priorities. The design uses Quartus II development software for HDL synthesis, place-and-route, timing closure, and bitstream generation. Typical applications include high-speed serial protocol bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), telecom baseband processing, ASIC prototyping, and high-performance digital signal processing systems. The integrated transceivers eliminate the need for external PHY chips, simplifying board layout and reducing overall system cost. When designing with the EP2SGX90FF1508C4, pay particular attention to power distribution network design, as the FPGA's high logic density demands substantial decoupling (typically 100 nF + 10 uF per power rail, with bulk capacitance at the regulator). Thermal management is essential: the FBGA-1508 package's exposed-die BGA balls require a properly designed PCB land pattern and adequate airflow. Signal-integrity on the transceiver channels requires controlled-impedance routing and length matching per Intel's Stratix II GX handbook. This page consolidates distributor pricing, drop-in same-package alternatives from the Stratix II GX family, and practical PCB-layout notes not present in the standalone datasheet, enabling faster design-in and sourcing decisions.
EP2SGX90FF1508C4ES - Stratix II GX FPGA 90K LE 1508-FBGA | Intel
The Intel EP2SGX90FF1508C4ES is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) from the Intel Programmable Solutions Group (formerly Altera) delivering 90,960 logic elements (90960 logic cells) at up to 717 MHz internal frequency, housed in a 1508-ball flip-chip FineLine BGA package (FC-FBGA-1508) measuring 40 mm x 40 mm with 1 mm ball pitch. A Field-Programmable Gate Array (FPGA) is a type of integrated circuit whose logic functionality is defined by the user after manufacturing, rather than being fixed at the fab. FPGAs occupy a specific niche in the semiconductor hierarchy between general-purpose CPUs (which execute software serially) and application-specific integrated circuits (ASICs) which are hard-wired at fabrication. The Stratix II GX family specifically targets high-speed serial I/O and DSP-heavy designs, integrating multi-gigabit transceivers and dedicated multiplier/accumulator blocks alongside the programmable logic fabric. Key features of this device include 4828 logic array blocks (LABs) / 4828 CLBs, 4,828 Kbits of embedded memory (TriMatrix memory blocks), 252 18x18 multipliers for DSP, up to 717 MHz core frequency, twelve 6.375 Gbps transceivers for high-speed serial, and a 1.2 V core supply (1.15 V to 1.25 V tolerance). The 1508-pin FC-FBGA package supports high-density board routing with controlled-impedance signal paths and uses flip-chip packaging for superior thermal and electrical performance over wire-bond equivalents. The device is fabricated on a 90 nm CMOS process and includes on-chip 8B/10B encoding/decoding, clock data recovery (CDR), and dynamic phase alignment (DPA) for serial protocols including PCI Express, Serial RapidIO, XAUI, and CEI-6G. Engineering sample suffix "ES" indicates this specific part is an untrimmed pre-production unit intended for evaluation and design verification rather than volume production builds. Typical applications include high-speed serial interface prototyping (PCIe Gen1, XAUI, RapidIO), DSP co-processing cards, baseband processing for wireless infrastructure, and broadcast video processing engines. The 1508-FBGA package is suitable for high-layer-count PCBs with microvia stackups and advanced thermal management. When designing with this device, ensure a 12-layer PCB minimum with continuous GND planes beneath the BGA, controlled-impedance routing for the 6.375 Gbps transceiver channels, and a multi-phase power supply with sub-milliohm decoupling. Engineering samples (ES) must not be used in fielded production systems; specify production-grade suffix (C4N, C5, etc.) for volume builds. This page synthesizes distributor pricing, drop-in Stratix II GX equivalents, and engineering sample (ES) handling guidance not found in any single manufacturer datasheet, providing a one-stop reference for sourcing and design-in.
EP2SGX90FF1508C4N - 90k LE Stratix II GX FPGA 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX90FF1508C4N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements and 4,520,448 bits of embedded memory in a 1508-ball flip-chip BGA package. It combines a 90 nm Stratix II logic fabric with embedded transceivers and dedicated DSP blocks, delivering 4548 LABs/CLBs and 650 user I/Os for high-throughput serial and parallel signal processing. A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs/LABs), programmable interconnects, and I/O cells. FPGAs occupy the position of ASIC-class parallel processing engines in the broader digital IC hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Unlike fixed-function ASICs, FPGAs are defined by a hardware description language (HDL) bitstream that configures on-chip SRAM at every power-up, making them ideal for design iteration, low-volume production, and time-to-market-critical applications. Key features include 4,548 LABs/CLBs, 4,520,448 bits of embedded RAM, dedicated DSP blocks for fixed- and floating-point math, embedded high-speed serial transceivers, and 650 general-purpose I/O pins. The device operates across industrial temperature grades and supports multiple I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL for mixed-voltage board integration. Architecture-wise, the Stratix II GX fabric uses adaptive logic modules (ALMs) that pack combinational and registered logic into 8-input fracturable look-up tables, achieving higher logic density than the preceding Stratix family. Transceivers support multi-gigabit serial protocols such as PCI Express, Serial RapidIO, XAUI, and custom serial links up to 6.375 Gbps, making the part well-suited to wired communications infrastructure. Typical applications include wired communications line cards (multi-gigabit transceivers for backplanes and SFP+ interfaces), high-end test and measurement instrumentation, radar and signal-processing front ends, ASIC prototyping, and DSP accelerator cards. The 1508-FCBGA package supplies the pin density required for the 650 I/Os plus dedicated transceiver and supply balls. When designing with this device, follow the Stratix II GX pin connection guidelines for unused transceiver channels (tie to defined reference voltages) and provide sufficient decoupling on every VCC rail. Bitstream security should be enabled via the AES-128 programming file option for production systems to prevent unauthorized configuration readback.