FPGA & CPLD
Products (6358)
EP2SGX90FF1508C5 - 90K LE Stratix II GX FPGA 1.2V FC-FBGA-1508
The Intel EP2SGX90FF1508C5 is a high-density Stratix II GX field-programmable gate array (FPGA) with 90,960 logic elements, 4,520,448 bits of embedded memory, and integrated 3.125 Gbps transceivers, housed in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 90nm process and operating from a 1.15V–1.25V core supply (1.2V nominal), the device is rated commercial (0 °C to +85 °C junction) and offers up to 609.76 MHz internal performance. A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor belonging to the programmable logic device family, sitting hierarchically between ASICs (Application-Specific Integrated Circuits) and general-purpose processors in the embedded IC taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit). FPGAs integrate configurable logic blocks, programmable interconnect, dedicated hard IP (memory controllers, transceivers, DSP blocks), and I/O cells on a single die. The Stratix II GX family specifically targets high-speed serial connectivity by embedding multi-gigabit transceivers alongside logic fabric, replacing multi-chip FPGA + PHY designs with a single component. Key features of the EP2SGX90FF1508C5 include 4,548 LABs (logic array blocks), 650 user I/Os, embedded transceivers supporting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI, and on-chip memory suitable for packet buffering. The flip-chip FC-FBGA-1508 package provides a high pin count and short die-to-package interconnect for signal-integrity-critical serial links at multi-gigabit data rates. Architecturally, the Stratix II GX uses an ALM (Adaptive Logic Module) based logic fabric combined with TriMatrix embedded memory blocks and DSP blocks, with dedicated PMA (Physical Medium Attachment) and PCS (Physical Coding Sublayer) hard IP per transceiver channel. Designers configure the device using the Quartus II design suite, which has been the de-facto toolchain for this generation of Intel/Altera FPGAs. Typical applications include high-end communication line cards, multi-gigabit serial backplanes, base-station signal processing, test and measurement equipment with high-speed serial I/O, and protocol bridging cards. The integration of transceivers, memory, and 90K logic elements in one package makes it well suited to system-level designs that previously required a discrete PHY plus a separate FPGA. When designing with the EP2SGX90FF1508C5, use Quartus II (legacy) or Quartus Prime for synthesis, place-and-route, and timing closure. Pay close attention to the FC-FBGA-1508 PCB land pattern, which requires microvia or laser-drilled via technology and tightly controlled trace impedance on transceiver channels. The commercial speed grade (C5) is the most widely available bin; review Altera's device handbook for transceiver channel-placement rules to avoid signal-integrity issues. This page synthesizes distributor inventory, drop-in compatible same-package alternatives from the same Stratix II GX family, and practical Quartus-based design notes that complement the official datasheet.
EP2SGX90FF1508C5ES - Stratix II GX 90K LE FPGA, 1508-FCBGA | Intel
The Intel (formerly Altera) EP2SGX90FF1508C5ES is a Stratix II GX family field-programmable gate array (FPGA) integrating 90,960 logic elements (LEs), 4,494,720 bits of embedded memory, and 12 transceiver channels at up to 6.375 Gbps, housed in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package rated for commercial extended temperature. It is built on a 90 nm process, operates at a 1.2 V core supply, and is specified for a maximum core clock of 609.76 MHz in the speed grade 5 commercial device. The 1508-pin FC-FBGA (FF1508) package exposes up to 650 user I/O pins across 12 I/O banks and 4 DPA blocks. The Stratix II GX is a high-density, transceiver-equipped programmable logic device that extends the Stratix II architecture with multi-gigabit transceivers. As a member of the FPGA (field-programmable gate array) -> programmable logic device -> semiconductor device hierarchy, it fills the role of a system-on-chip fabric integrating parallel logic, embedded RAM/ROM, DSP blocks, PLLs, and serial I/O. Compared with pure ASICs, the FPGA enables post-silicon design changes, lower NRE cost, and rapid prototyping, while still delivering deterministic timing at hundreds of MHz on the core fabric. Key features include twelve 3.125 Gbps (upgradeable to 6.375 Gbps) transceiver channels, embedded transceiver-based PCS blocks with 8B/10B encoding, dedicated hard memory controllers, and DSP blocks rated for 18x18-bit multiplication at full fabric speed. The device also integrates fine-grained ALM (Adaptive Logic Module) architecture - the successor to the classic 4-input LUT - allowing higher logic density per LE compared with prior Stratix generations. Industrial-grade signal integrity, adaptive equalization in each receiver, and signal detection circuitry support backplane and chip-to-chip serial links. Typical applications include high-speed serial interface bridging (PCI Express Gen1, XAUI, Serial RapidIO, Gigabit Ethernet, SDI), wireline telecom line cards, military/aerospace signal processing, ASIC prototyping, and high-performance DSP co-processing. The EP2SGX90FF1508C5ES is particularly suited to designs that need multi-gigabit serial I/O plus substantial parallel DSP bandwidth in a single device, with sufficient logic headroom for system-on-chip integration. When designing with this device, plan power architecture carefully: a fully populated EP2SGX90 with all 12 transceivers active can exceed 25 W dissipation, requiring careful PCB stack-up, multiple low-impedance supply rails, and thermal management. Designers must use the Quartus II design tool (version 7.2 or later, with service packs) to compile, place-and-route, and verify timing; legacy tool support is limited because this is an older family.
EP2SGX90FF1508C5N - Stratix II GX FPGA, 90K LE, FCBGA-1508 | Intel
The Intel (formerly Altera) EP2SGX90FF1508C5N is a high-density, high-performance Stratix II GX Field-Programmable Gate Array (FPGA) integrating 90,960 logic elements, 4,548 LABs (Logic Array Blocks), and 4,520,448 bits of embedded memory in a 1,508-ball FCBGA (Flip-Chip Ball Grid Array) package measuring 40 x 40 mm with 1 mm ball pitch. The device belongs to the Stratix II GX family, which adds up to 20 full-duplex transceiver channels operating up to 6.375 Gbps for high-speed serial I/O. What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP blocks (memory, DSP, transceivers, PLLs). FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: they offer ASIC-class parallelism and throughput while remaining fully re-programmable in the field, making them ideal for prototyping, low-volume production, and applications whose algorithms evolve over the product lifetime. Key features of the EP2SGX90FF1508C5N include 90,960 logic elements (LEs), 4,548 LABs, 4,520,448 RAM bits, 650 user I/O pins, and integrated high-speed transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, CEI-6G, and Gigabit Ethernet. The part uses a 1.2 V core supply with separate VCCPD, VCCA, and transceiver supply rails, and supports configuration via passive serial, fast passive parallel, and JTAG modes. The Stratix II GX architecture employs an adaptive logic module (ALM) - an 8-input fracturable LUT - delivering up to 25% higher performance and 50% lower power than the original Stratix family at the same process node. Hard IP blocks such as TriMatrix memory, DSP blocks, and embedded transceivers free up logic for application code rather than overhead functions. Typical applications for the EP2SGX90FF1508C5N include 10 Gbps datacom/telecom line cards, high-end test and measurement equipment, military/aerospace signal processing, ASIC prototyping for ASIC-class compute engines, and high-throughput DSP pipelines (radar, beamforming, video processing). When designing with this device, allocate a multi-rail power solution (core, I/O banks, PLL analog, transceiver PLLs) and follow the Stratix II GX pin connection guidelines for unused pins and bank VREF. The 40 x 40 mm FCBGA-1508 requires a multilayer PCB with microvia stack-ups, controlled-impedance traces for transceiver channels, and matched-length routing for source-synchronous interfaces. This page synthesizes distributor pricing, application guidance, and a curated drop-in alternative list not found in a single manufacturer datasheet, helping engineers evaluate the EP2SGX90FF1508C5N against newer Stratix IV/Stratix V equivalents.
EP2SGX90FF1508C6 - Stratix II GX 90K LE FPGA | Altera / Intel
The Altera / Intel EP2SGX90FF1508C6 is a member of the Stratix II GX family of field-programmable gate arrays (FPGAs) that combines high-density logic, embedded memory, and up to 20 transceivers delivering multi-gigabit serial I/O on a single die. According to Intel / Altera catalog references, the EP2SGX90FF1508C6 provides 90,960 equivalent logic elements (LEs), 4,520,448 RAM bits, and is housed in a 1508-ball flip-chip BGA (FCBGA) package. The 'C6' speed grade is the commercial-temperature (0 C to +85 C) tier with the slowest static timing among Stratix II GX grades, offering the lowest cost point. An FPGA (Field-Programmable Gate Array) is a semiconductor device whose digital logic fabric, interconnect, and I/O cells can be configured by the customer after manufacture, in contrast to an ASIC whose function is fixed at tape-out. Within the broader taxonomy of programmable logic devices (PLDs), FPGAs sit at the top of the hierarchy: PLD -> CPLD -> FPGA. The Stratix II GX family specifically targets high-throughput serial connectivity and DSP-heavy designs, blending logic fabric with embedded transceivers that support protocols such as PCI Express, Serial RapidIO, XAUI, and Gbit Ethernet without external PHY ICs. Key features of the EP2SGX90FF1508C6 include the adaptive logic module (ALM) architecture that packs more logic per area than the prior Stratix generation, on-chip tri-matrix memory (MLAB + M4K + M-RAM blocks) totaling 4.52 Mbits, and DSP blocks supporting 9x9, 18x18, and 36x36 signed multiplication. The 1508-ball FCBGA package exposes up to 650 user I/O pins, providing wide parallel buses for memory and external interfaces alongside the serial transceivers. The EP2SGX90FF1508C6 is typically used in wired-telecom line cards, broadcast video processing, software-defined radio (SDR), radar signal processing, and high-end test & measurement backplanes where both DSP throughput and multi-gigabit serial links are required in the same silicon. Its 65 nm process node balances performance and power, while the FCBGA package offers controlled-impedance signal-integrity paths for the transceivers. When designing with this device, plan the PCB stack-up around the 1508-ball FCBGA land pattern and provide sufficient decoupling for the multi-rail core and transceiver supplies. Designers should also confirm Quartus II software support for the 'C6' speed grade when targeting timing closure. This page synthesizes authorized-distributor pricing, drop-in same-package alternatives from the Stratix II GX and Stratix II families, and practical design notes not aggregated on any single manufacturer page.
EP2SGX90FF1508C7 - 90K LE Stratix II GX FPGA, 8 Transceivers, F1508 | Altera
The Altera (now Intel) EP2SGX90FF1508C7 is a high-density, high-performance Stratix II GX FPGA delivering 90,720 equivalent logic elements (LEs), 4.5 Mbits of embedded memory, and up to 364 embedded 18x18 multipliers. Housed in a 1508-ball FineLine BGA (F1508) package, it integrates 8 full-duplex transceivers supporting data rates up to 6.375 Gbps, making it ideal for high-speed serial I/O applications including backplane connectivity, chip-to-chip links, and protocol bridging. The device operates with a core voltage of 1.2V and supports the Stratix II GX family's enhanced DSP block architecture for signal processing workloads. A Stratix II GX FPGA belongs to the broader category of programmable logic devices (PLDs), which sit within the digital semiconductor hierarchy: PLD -> FPGA -> high-speed transceiver FPGA. These devices combine configurable logic fabric with hard intellectual-property (IP) blocks such as transceivers, PLLs, and DSP slices, allowing system designers to implement custom digital logic, high-speed interfaces, and parallel arithmetic without an ASIC development cycle. The Stratix II GX family specifically targets applications requiring multi-gigabit serial connectivity. Key features of the EP2SGX90FF1508C7 include 8 transceiver channels at up to 6.375 Gbps, support for PCI Express, Serial RapidIO, XAUI, and other serial protocols via hard IP, up to 488 Kbits of M4K memory blocks, and a dedicated clock management infrastructure with up to 12 PLLs. The 1508-ball FineLine BGA package exposes the full transceiver and I/O count required for high-pin-count designs. It is fabricated in a 90 nm CMOS process with 1.2V core operation. The architecture combines adaptive logic modules (ALMs) with a row- and column-based interconnect, optimized for timing closure in high-utilization designs. Hard multipliers and DSP blocks accelerate FIR filters, FFTs, and other arithmetic kernels. The transceiver tiles integrate serializer/deserializer (SerDes), clock-data recovery (CDR), and physical coding sublayer (PCS) functions on-chip, eliminating external PHY chips in many configurations. Typical applications include high-end telecommunications line cards, broadcast video processing equipment, radar and signal-intelligence systems, and high-performance computing accelerators. The 8 transceiver channels are well matched to multi-lane backplane links such as PCI Express x4 or x8, Serial RapidIO, and 10G Ethernet aggregation. Designers choose this device when protocol-rich serial I/O and dense logic fabric must coexist on a single die. When designing with the EP2SGX90FF1508C7, ensure the PCB has matched-length routing for each transceiver lane, controlled-impedance differential pairs (typically 100 ohm differential), and an AC-coupled link per the Altera reference design. Decoupling must follow the Stratix II GX power distribution network (PDN) guide, with bulk, mid-frequency, and high-frequency ceramic capacitors placed as close as practical to each supply pin. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design considerations not found in the manufacturer datasheet alone, giving engineers a faster path from selection to layout-ready BOM.
EP2SGX90FF1508I3 - 90K LEs, 6.375G Transceiver FPGA | Altera
The Altera EP2SGX90FF1508I3 is a Stratix II GX family Field-Programmable Gate Array (FPGA) delivering 90,960 logic cells, embedded SERDES transceivers, and 4.5 Mbits of embedded memory in a 1508-ball FineLine BGA package. It supports transceiver data rates up to 6.375 Gbps and a maximum user clock frequency of 622.08 MHz, operating from a 1.15 V to 1.25 V core supply. What is a Stratix II GX FPGA? It is Altera's third-generation high-density programmable logic device that combines a scalable logic fabric with embedded high-speed serial transceivers and source-synchronous I/O. FPGAs sit at the top of the programmable logic hierarchy, between fixed-function ASICs and discrete logic, providing parallel hardware execution with field-updatable configuration via SRAM cells. Stratix II GX specifically targets serial-connectivity applications where on-chip multi-gigabit transceivers replace external PHY chips. Key features include 4 to 20 embedded transceiver channels with clock-data recovery, dedicated source-synchronous I/O banks for DDR/DDR2/QDR memory interfaces, support for external memory interfaces up to DDR2 SDRAM, and Altera's TriMatrix memory architecture with MLAB, M512, and M4K blocks. The device integrates hard PCI Express, Serial RapidIO, and 10-Gbps Ethernet PHY intellectual property (IP) cores, enabling protocol acceleration without consuming logic resources. The 90-nm Stratix II GX architecture uses adaptive logic modules (ALMs) rather than traditional 4-input LUTs, achieving finer-grained logic packing. Transceivers integrate pre-emphasis, equalization, and output-voltage swing control to meet backplane and chip-to-chip signal-integrity requirements across the full 600 Mbps to 6.375 Gbps operating range. Typical applications include 10 Gigabit Ethernet line cards, PCI Express Gen1/Gen2 endpoint and root-complex designs, Serial RapidIO DSP farms, base-station baseband processing, high-speed serial backplane bridging, and broadcast video switching fabrics. Industrial-grade parts in the FF1508 FineLine BGA are specified from -40 °C to +100 °C ambient for telecom and industrial operating environments. When designing with this device, ensure the power-supply decoupling network matches the Stratix II GX PDN reference design; the 1508-ball FineLine BGA power-pin count exceeds 200 pins requiring a 6-layer board minimum. Use the Quartus II design software (version 9.0 or later) with the Stratix II GX device library; older Quartus versions do not support this family. This page synthesizes distributor pricing, drop-in alternative ordering codes, and practical Quartus design notes not found in the Altera datasheet, helping engineers evaluate the EP2SGX90FF1508I3 against newer Stratix IV/V variants for legacy board reuse.
EP2SGX90FF1508I3N - 90k LE Stratix II GX FPGA, 1.2V, FC-FBGA-1508 | Intel
The Intel EP2SGX90FF1508I3N is a high-density Stratix II GX Field-Programmable Gate Array from the Stratix II GX family, integrating 90,960 logic elements and 90,960 Configurable Logic Blocks (CLBs) in a 1508-ball flip-chip fine-pitch BGA (FC-FBGA) package. Built on a 90nm process technology and operating from a 1.2V core supply, the device delivers up to 816.9 MHz internal clock performance and is qualified to the industrial temperature grade, supporting -40C to +100C ambient operation. The I3N speed grade balances logic throughput against dynamic power, making the part well suited for high-throughput DSP pipelines, multi-gigabit serial protocol bridging, and ASIC prototyping workloads. A Field-Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, interconnect, and I/O blocks are configured by an end-user after manufacture, allowing hardware-level customization without a photomask cycle. Within the programmable-logic taxonomy, FPGAs sit between standard microcontrollers (software-configured, fixed architecture) and full custom ASICs (hardware-configured, fixed function), combining high parallelism with low non-recurring engineering cost. The Stratix II GX family further extends the FPGA hypernym with up to 20 embedded transceivers, embedded multipliers, and TriMatrix memory blocks, positioning the device family as a heterogeneous compute platform. Key features of the EP2SGX90FF1508I3N include 4,520,448 bits of embedded memory, embedded 18x18 multipliers for DSP operations, and dedicated multi-gigabit transceiver (MGT) channels supporting common serial standards such as PCIe, Serial RapidIO, and Gigabit Ethernet. The device supports several I/O standards including LVDS, LVTTL, LVCMOS, and SSTL for direct interface to DDR/DDR2 memory, while configuration is performed through the EPC family enhanced configuration devices or JTAG. Internal pull-ups, on-chip termination, and dynamic phase alignment simplify board-level design. The Stratix II GX architecture introduces an adaptive logic module (ALM) that combines look-up tables, adders, and registers in an 8-input structure, achieving higher effective logic density per LE than the prior Stratix generation. On the silicon side, the 90nm process enables transistor-level scaling that drives down dynamic power per MHz while preserving routing flexibility; designers using the Altera/Intel Quartus II design suite can target the device with industry-standard HDL flows and IP libraries. Typical applications include high-performance DSP for radar, baseband processing in software-defined radio, multi-gigabit serial backplane bridging, ASIC prototyping and emulation, and high-speed data-acquisition front-ends. The device is also used in industrial imaging and medical-imaging pipelines that require parallel pixel processing at line rate. The combination of transceivers, embedded multipliers, and a large logic budget makes the EP2SGX90FF1508I3N a frequent choice for communications infrastructure and defense electronics where a second-source FPGA must remain pin-compatible with the broader Stratix II GX family. A key design consideration is signal integrity on the FC-FBGA-1508 land pattern: microvia and via-in-pad PCB processes are typically required for reliable assembly, and at least six PCB layers with continuous power planes are recommended for the 1.2V core and 3.3V/2.5V auxiliary rails. Designers should use the Quartus II PowerPlay early-power estimator and pin planner before final layout, and follow Altera's recommended decoupling network to keep core-rail ripple within the device's specification. This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix II GX family, and practical design notes not consolidated in the manufacturer datasheet alone.
EP2SGX90FF1508I4 - Stratix II GX 90K LEs, 4.5Mb, 1508-FCBGA | Intel
The Intel (Altera) EP2SGX90FF1508I4 is a high-density Stratix II GX family FPGA integrating 90,960 logic elements, 4,520,448 bits of embedded memory, and embedded transceivers in a 1508-ball flip-chip BGA (FC-FBGA) package. It is fabricated on a 90 nm CMOS process with 1.2 V core supply and is offered in the industrial temperature grade (-40C to +100C case). According to the manufacturer datasheet, the device delivers up to 650 user I/Os and supports PCI Express, Gigabit Ethernet, Serial RapidIO, and other high-speed serial protocols through its embedded multi-gigabit transceivers. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose logic fabric, interconnect, and I/O behavior can be reconfigured after manufacture, allowing engineers to implement arbitrary digital circuits, DSP pipelines, and parallel processing structures without taping out a custom ASIC. FPGAs occupy the middle ground between fixed-function ASICs and software-programmable processors: faster than software, cheaper in low volumes than ASICs, and re-programmable in the field. The Stratix II GX family extends the base FPGA fabric with embedded transceivers optimized for high-speed serial I/O, making the EP2SGX90FF1508I4 suitable for communication, broadcast, and signal-processing backplanes. Key features include 4,548 LABs (Logic Array Blocks) in the Stratix II Adaptive Logic Module (ALM) architecture, dedicated 18x18 multipliers for DSP, 12 transceiver channels running up to 6.375 Gbps, eight phase-locked loops (PLLs), and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The FF1508 package provides the largest pin count in the family, exposing maximum user I/O and transceiver bandwidth simultaneously. Typical applications include high-end telecommunications line cards, video broadcast and image processing systems, PCIe Gen1/Gen2 endpoint and root complex designs, military and aerospace signal processing, ASIC prototyping, and high-speed test and measurement equipment. The 1508-ball FC-FBGA requires advanced PCB design (microvia, sequential lamination) and a controlled-impedance stack-up for the transceiver channels to meet signal-integrity budgets. When designing with the EP2SGX90FF1508I4, allocate transceiver channels to short, matched-length differential pairs with reference plane continuity, and use the Altera Quartus II design tool (or the later Intel Quartus Prime with Stratix II device support) for synthesis, place-and-route, and timing closure. Power estimation should be run early; worst-case core plus transceiver current at 1.2 V can exceed several amps and demands a multi-rail VRM with bulk ceramic decoupling distributed across the BGA footprint. This page synthesizes distributor pricing, drop-in alternatives from the same Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX90FF1508I4K - Stratix II GX FPGA, 90K LE, 1508-BGA | Intel
The Intel (formerly Altera) EP2SGX90FF1508I4K is a high-density, high-performance Stratix II GX Field-Programmable Gate Array (FPGA) housed in a 1508-ball FineLine BGA (FCBGA) package, integrated with up to 12 embedded transceivers and 4 hard PCI Express controllers. Built on a 90 nm process, the device delivers 90,960 equivalent logic elements (LEs), 4,520,448 bits of embedded memory, and 252 embedded 18-bit x 18-bit multipliers, configured across 4,548 Logic Array Blocks (LABs) with 650 user I/O pins. What is an FPGA? A Field-Programmable Gate Array is a semiconductor device whose logic, interconnects, I/O, and signal-processing blocks can be reconfigured by the customer after manufacture. FPGAs sit at the top of the programmable-logic taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. Stratix II GX specifically targets high-speed serial I/O and DSP-intensive applications, integrating multi-gigabit transceivers (MGTs) and dedicated PCIe hard IP that would consume thousands of LEs in a soft implementation. Key features include 12 full-duplex embedded transceivers supporting data rates from 600 Mbps to 6.375 Gbps, dedicated Triple-Speed Ethernet MACs, 4 PCI Express hard controllers (x1, x4, or x8 lanes), and TriMatrix on-chip memory with true dual-port RAM blocks. The device supports source-synchronous interfaces up to 1 Gbps on the LVDS side, and Altera's Adaptive Logic Module (ALM) architecture provides 8-input fracturable look-up tables that improve packing density compared to the prior Stratix generation. Architecture depth: each ALM combines an 8-input adaptive LUT, two dedicated adders, four programmable registers, and shared arithmetic carry chains. The 252 DSP blocks deliver up to 504 GMACs of 18-bit x 18-bit multiply-accumulate throughput, while the 12 transceivers are clocked by independent reference clocks and support multiple protocols (PCIe, XAUI, Serial RapidIO, CPRI, OBSAI, SDI, SATA, GbE, and custom serial links). Typical applications include high-end telecommunications line cards, military radar and signal-intelligence backplanes, ASIC prototyping, high-definition video broadcast equipment, and PCIe-based accelerator cards. The "I4K" speed/temperature grade designates an industrial-grade part rated to -40C to +100C junction with the fastest transceiver speed bin. Design consideration: when using the integrated transceivers, place AC-coupling capacitors within 1 inch of each serial pin to comply with the Stratix II GX signal-integrity guidelines. PCB stackup must maintain 100-ohm differential impedance with skew below 1 ps/mm on the transceiver lanes. This page synthesizes distributor pricing, drop-in package-compatible Stratix II GX alternatives, and practical layout guidance not found in the manufacturer datasheet alone.
EP2SGX90FF1508I4N - Stratix II GX FPGA, 90K LE, FBGA-1508 | Intel
The Intel EP2SGX90FF1508I4N is a high-density Stratix II GX Field Programmable Gate Array (FPGA) featuring 90,960 logic elements, 4,548 LABs, and 4,520,448 bits of embedded memory, packaged in a 1508-ball flip-chip BGA (FCBGA) measuring 40 x 40 mm with a 1 mm ball pitch. The part operates across an industrial temperature range and integrates up to 12 transceivers and dedicated Multi-Gigabit Transceiver (MGT) blocks optimized for high-speed serial I/O, alongside 650 user I/O pins for parallel interfaces. It is fabricated on a 90 nm CMOS process and supports a maximum core clock frequency up to 717 MHz per the manufacturer datasheet. A Field Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below full ASICs in cost-versus-flexibility trade-off, and are widely used in prototyping, low-volume production, and applications requiring hardware-level parallelism that microcontrollers cannot deliver. The Stratix II family specifically added adaptive logic modules (ALMs) and on-chip DSP blocks, making the part attractive for signal-processing pipelines. Key features of the EP2SGX90FF1508I4N include 12 high-speed transceivers supporting multi-gigabit serial protocols, on-chip TriMatrix memory with mixed-width blocks for distributed and buffering storage, dedicated DSP blocks for fixed- and floating-point arithmetic, and support for external memory interfaces such as DDR2 SDRAM. The device also includes Phase-Locked Loops (PLLs) for clock management, a configuration controller that supports multiple boot modes including JTAG and passive serial, and built-in CRC checking for configuration bitstream integrity. Architecturally, the Stratix II GX uses the ALM (Adaptive Logic Module) as its basic logic unit, replacing the older 4-input LUT of Stratix I. Each ALM contains an 8-input fracturable lookup table combined with dedicated adder and carry chains, which improves effective logic utilization to roughly 1.4x compared to the previous generation. The transceiver blocks include dedicated physical coding sublayer (PCS) and physical media attachment (PMA) logic, allowing direct connection to SERDES-based backplanes without external glue logic. Typical applications include high-speed serial backplane aggregation routers, baseband processing for wireless infrastructure, video broadcast and editing equipment, military signal-processing systems, and PCI Express endpoint implementations. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well-suited to data-path-intensive workloads that must be reconfigured per deployment. When designing with this device, ensure the PCB footprint accommodates the 40 x 40 mm FCBGA with controlled-impedance routing for the MGT lanes. Power budgeting must account for transceiver power, which scales linearly with line rate, and signal-integrity simulation is recommended above 3.125 Gbps. The part is part of a mature family with abundant reference designs but is generally considered legacy, so verify long-term availability against new design requirements. This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
EP2SGX90FF1508I5 - Stratix II GX FPGA, 90.96k LEs, 622 MHz | Intel
The Intel (formerly Altera) EP2SGX90FF1508I5 is a Stratix II GX Field Programmable Gate Array with 90,960 logic elements, 90,960 total logic cells, and embedded high-speed serial transceivers, packaged in a 1508-ball FineLine BGA. The device is rated for the industrial temperature range (-40°C to +85°C) and operates from a nominal 1.2 V core supply, with a maximum clock frequency of 622.08 MHz. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing to implement arbitrary digital circuits. Stratix II GX FPGAs sit in the high-performance tier of the FPGA taxonomy: FPGA > SRAM-based FPGA > high-speed-transceiver FPGA > Stratix II GX family > power-management/system-on-chip-class devices, and they combine a logic fabric with embedded SERDES, memory blocks, DSP blocks, and PLLs. This places EP2SGX90FF1508I5 between discrete logic + PHY ICs and full SoC platforms. Key features include up to 6.375 Gbps embedded transceivers with clock and data recovery (CRU), source-synchronous I/O for parallel high-speed interfaces, 4 to 20 transceiver channels depending on variant, dedicated on-chip memory (M512/M4K/M-RAM blocks), and embedded DSP blocks for high-throughput signal processing. The 1508-ball FineLine BGA package supports hundreds of user I/O pins with multiple I/O standards (LVDS, LVCMOS, HSTL, SSTL, PCI Express). Together these enable designers to consolidate what previously required an FPGA + separate PHY + external memory into a single device. Architecturally, Stratix II GX uses a 90 nm process, an adaptive logic module (ALM) fabric, and dedicated transceiver hard IPs. Designers typically target the device with the Quartus II design software, leveraging IP cores for PCI Express, XAUI, Serial RapidIO, and DDR/DDR2 memory controllers. Compared to a discrete SERDES + FPGA solution, the integrated architecture reduces board complexity, BOM count, and signal-integrity risk on high-speed serial channels. Typical applications include high-end communications line cards (10 Gbps optical transport, SONET/SDH framer, ATCA/AMC backplanes), PCI Express Gen1 endpoint/root complex designs, broadcast video processing (HD-SDI/3G-SDI routing and conversion), test and measurement instrumentation with high-speed digitizers, and radar / signal-intelligence front ends. The combination of logic density and 6.375 Gbps transceivers is especially well-suited to protocols that need both packet processing and bulk serial bandwidth. When designing with EP2SGX90FF1508I5, plan power-rail decoupling carefully: separate 1.2 V core, 2.5 V/3.3 V PLL analog, and I/O voltage supplies must each be filtered with low-ESR bulk + ceramic capacitors placed close to the BGA balls. Transceiver channels require controlled-impedance (typically 100 Ω differential) routing with length matching within the SerDes tolerance budget. Thermal management of the FineLine BGA is dominated by the center-row ball array - a multi-layer PCB with stitched ground vias and a heatsink is recommended for typical 8-15 W dissipation. This page synthesizes distributor availability, drop-in same-package alternatives, and practical layout guidance not all found in the manufacturer datasheet alone, giving procurement and design engineers a single decision-ready reference.
EP2SGX90FF1508I5N - Stratix II GX FPGA, 90,960 LEs, 622 MHz | Intel
The Intel (formerly Altera) EP2SGX90FF1508I5N is a high-density Stratix II GX Field-Programmable Gate Array (FPGA) that integrates 90,960 logic elements (LEs), 90,960 equivalent logic cells, and 4,520,448 bits of embedded memory in a 1508-ball flip-chip BGA (FC-FBGA) package. The device is built on a 1.2 V nominal CMOS process, supports a maximum clock frequency of 622.08 MHz, and is rated for the industrial temperature range from -40 °C to +85 °C. It belongs to the Stratix II GX family, which adds up to 20 embedded transceivers per device for multi-gigabit serial I/O. A Field-Programmable Gate Array (FPGA) is a programmable logic IC that combines configurable logic blocks, routing interconnect, and dedicated hard IP blocks (such as transceivers, memory controllers, multipliers, and PLLs). The user programs the FPGA after manufacturing via a configuration bitstream, which makes FPGAs ideal for ASIC prototyping, high-speed signal processing, network processing, and reconfigurable compute. FPGAs sit at the top of the programmable-logic hierarchy (CPLD -> FPGA -> SoC FPGA), and the Stratix II GX family is positioned for high-performance applications with embedded multi-gigabit transceivers. Key features of the EP2SGX90FF1508I5N include 90,960 LEs arranged in 4,548 logic array blocks (LABs), 152 18-bit x 18-bit multipliers, 4,520,448 bits of embedded SRAM organized as M4K and M-RAM blocks, four enhanced PLLs, eight fast PLLs, and a rich set of clock networks. The industrial-grade speed grade I5 places it in the moderate-speed, wide-temperature bin, while the 1508-ball FC-FBGA package provides 650 user I/O pins and an exposed thermal die for heat dissipation in dense PCB designs. Architecturally, Stratix II GX devices use a stretched-LUT approach where every LE contains a 7-input adaptive look-up table (ALUT) that can be partitioned into smaller LUTs for higher effective logic utilization. The embedded transceivers support standards such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI, and operate at data rates up to 6.375 Gbps per channel, making the EP2SGX90FF1508I5N suitable for high-bandwidth backplane and bridging applications. Typical applications for the EP2SGX90FF1508I5N include high-speed telecom and networking line cards, ASIC prototyping for protocol stacks, signal-processing front-ends for test and measurement, and military/aerospace signal intelligence platforms. The 622 MHz internal clock and abundant transceivers allow designers to consolidate what would otherwise require multiple discrete ASSPs. When designing with this part, pay close attention to power-rail sequencing: Stratix II GX devices require a specific power-up and power-down order for VCCINT, VCCIO, VCCA, and the transceiver supplies. Decoupling, thermal management, and configuration-bitstream storage on a flash or PROM must all be budgeted before PCB layout is committed. This page consolidates distributor pricing, industrial-grade drop-in alternatives, and Stratix II GX design notes in one place - giving engineers a faster starting point than searching the original datasheet.
EP2SGX90FF40C3N - 90K LEs Stratix II GX FPGA | Intel | Altera
The Intel (formerly Altera) EP2SGX90FF40C3N is a high-density, high-performance Stratix II GX FPGA featuring 90,960 equivalent logic elements, 4,548 Logic Array Blocks (LABs), and 650 user I/O pins. Built on a 90 nm process, the device integrates up to 4.5 Mbits of embedded memory and 252 embedded 18-bit x 18-bit multipliers, all housed in a 1,508-ball FineLine BGA package. The "C3" speed grade and the lead-free (Pb-free) "N" suffix are explicitly part of the ordering code as supplied by Altera/Intel. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. The FPGA sits within the broader hierarchy of programmable logic devices (PLDs) and digital semiconductor ICs, sitting alongside CPLDs and structured ASICs. Stratix II GX devices extend the Stratix II family by adding high-speed serial transceiver blocks, which is why this part is the "GX" variant - it targets protocols requiring multi-gigabit transceivers such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. Key features include dedicated transceivers running at data rates up to 6.375 Gbps, 4 Phase-Locked Loops (PLLs) for clock management, 12 global clock networks, and on-chip termination (OCT) for high-speed signal integrity. The device supports both passive and active serial configuration schemes via the dedicated configuration pins and the Stratix II configuration controller. The 1,508-ball FBGA package provides a high pin-count solution for memory-rich, I/O-intensive designs that need both width and density on a single substrate. Typical applications include 10G/40G telecom line cards, high-end test and measurement equipment, video broadcast infrastructure, high-speed serial protocol bridging, and high-performance digital signal processing (DSP) pipelines. The combination of embedded multipliers and high transceivers makes this family especially well-suited for wireless baseband prototyping and forward-error-correction engines. When designing with the EP2SGX90FF40C3N, careful attention must be paid to PCB layout for the FBGA substrate (use microvia stack-ups and matched-length routing for the transceiver channels), thermal management (the FBGA requires a thermal pad and well-designed via array), and power sequencing (the Stratix II GX family requires specific ramp rates on VCCINT and VCCA). Quartus II software is the primary design environment, and the device is supported from the Quartus II v6.0 through the latest Altera/Intel Quartus Prime legacy support flow. This page synthesizes distributor availability, verified Stratix II GX family specifications, drop-in alternatives from the Site MPN list, and practical design notes that go beyond a stock manufacturer datasheet summary.
EP2SGX90FF40C3NES - Stratix II GX FPGA 90K LE FC-FBGA | Intel
The Intel (formerly Altera) EP2SGX90FF40C3NES is a high-performance field-programmable gate array (FPGA) from the Stratix II GX family, integrating 90,960 logic elements, 4,828 logic array blocks (LABs)/configurable logic blocks (CLBs), embedded transceivers, and on-chip memory in a 1,508-pin flip-chip fine-pitch ball-grid-array (FC-FBGA) package. What is an FPGA? A field-programmable gate array is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect, with embedded hard IP such as block RAM, DSP blocks, PLLs, and (in the Stratix II GX family) multi-gigabit transceivers. FPGAs occupy a tier between general-purpose microcontrollers and application-specific integrated circuits (ASICs): they deliver ASIC-class parallelism and data-path throughput while remaining reconfigurable in the field, making them the workhorse of high-speed serial I/O, digital signal processing, and prototyping for ASIC emulation. Key features of the EP2SGX90FF40C3NES include a 1.2 V core supply, 816.9 MHz maximum internal operating frequency, 90 nm process technology, integrated PCI Express hard IP, and up to 12 transceivers supporting data rates up to 6.375 Gbps. The device also provides dedicated DSP blocks for high-throughput fixed- and floating-point arithmetic and embedded TriMatrix memory blocks for low-latency on-chip storage. Architecturally, the Stratix II GX combines a logic fabric based on adaptive logic modules (ALMs) with embedded transceivers hardened for serializer-deserializer (SerDes) protocols. The hard PCI Express and 10-Gbps Ethernet intellectual property eliminates the need to consume FPGA fabric for these interfaces, freeing logic for the user application and reducing timing closure risk in high-speed designs. Typical applications include high-speed serial interface bridging, telecommunications backhaul line cards, military radar signal processing, ASIC prototyping, broadcast video processing, and test and measurement equipment. The integrated transceivers make the part especially suitable for designs requiring multi-gigabit serial links such as Serial RapidIO, XAUI, SATA, and PCI Express. When designing with this device, ensure the FC-FBGA-1508 PCB land pattern matches the Intel reference footprint exactly, and that the power distribution network uses the recommended decoupling scheme to limit core supply ripple under high SerDes switching activity. Thermal management must account for the device's commercial extended temperature grade (0 °C to 85 °C). This page synthesizes distributor pricing, drop-in alternative MPNs, and practical design notes not found in the manufacturer datasheet alone, drawing on Stratix II GX family collateral and XAIPART internal cross-reference data.
EP2SGX90FF40C4N - 90nm Stratix II GX FPGA 90,960 LEs | Altera
The Altera (now Intel) EP2SGX90FF40C4N is a Stratix II GX family field-programmable gate array (FPGA) manufactured on a 90 nm process node, integrating 90,960 logic elements, up to 4.5 Mbits of embedded memory, and 12 transceivers operating at up to 6.375 Gbps. Housed in a 1,508-ball flip-chip BGA package with a 1.2 V core supply, the device targets high-speed serial I/O and DSP-intensive applications. What is an FPGA? A field-programmable gate array is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable routing, hard IP blocks (transceivers, memory, DSP slices), and I/O cells that the designer programs after manufacture. FPGAs sit above microcontrollers and ASICs in the reconfigurable-logic taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Stratix II GX devices specifically add multi-gigabit transceivers to position the part as a wire-speed bridge between ASICs/ASSPs and high-speed serial links such as PCIe, Serial RapidIO, XAUI, and Custom ASIC/ASSP protocols. Key specifications include 4.5 Mbits of M512/M4K/M-RAM block memory, 192 18x18-bit hardware multipliers for DSP, 12 embedded transceivers with 6.375 Gbps maximum data rate, and 8 PLLs for clock management. The Enhanced Configuration Devices scheme supports fast passive serial, passive parallel, and JTAG configuration modes, with configuration via EPC devices or a microprocessor. The device integrates a flexible hi-speed serial interface that complies with PCIe 1.0a, Serial RapidIO 1.2, XAUI, and CEI-6G standards. Typical applications include high-speed serial backplanes (XAUI, PCIe), DSP co-processing for wireless baseband, HD-SDI video interfaces, and storage area network bridges. Compared to an MCU, the Stratix II GX delivers deterministic parallel datapaths and hardware multipliers; compared to a general-purpose Stratix II, it adds multi-gigabit transceivers. When designing with this device, dedicate four dedicated SERDES reference-clock inputs and follow Altera's Stratix II GX pin connection guidelines for unused transceiver channels. Maintain the 1.2 V core rail within ±5% and provide a clean 2.5 V PLL analog supply, as PLL noise directly impacts jitter performance. This page synthesizes distributor availability, drop-in same-package alternatives drawn from the Site MPN list, and practical design notes that supplement the manufacturer datasheet.
EP2SGX90FF40C4NES - Stratix II GX FPGA, 90k LE, 6.375Gbps | Intel (Altera)
The Intel (formerly Altera) EP2SGX90FF40C4NES is a high-density Stratix II GX FPGA from the Stratix II GX family, integrating 90,960 logic elements, embedded SERDES transceivers, and on-chip memory in a 1508-pin FC-FBGA package. The device is built on a 90nm CMOS process and operates from a 1.2V core supply with commercial-extended temperature grading. It includes 4 to 20 high-speed transceiver channels featuring embedded CDR (clock/data recovery) and SERDES capable of data rates up to 6.375 Gbps per channel. What is an FPGA? A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement a wide variety of digital logic functions. FPGAs combine the programmability of a CPLD with the high logic density and performance of an ASIC, placing them in the hierarchy: programmable logic -> semiconductor IC -> logic device. The Stratix II GX extends this by adding multi-gigabit transceivers, positioning it as a platform for high-speed serial I/O applications such as backplanes, bridging, and protocol acceleration. Key differentiating features include up to 4,828 Logic Array Blocks (LABs), dedicated DSP blocks for high-throughput arithmetic, on-chip TriMatrix memory with multiple block sizes, and up to 12 transceivers supporting PCI Express, Gigabit Ethernet, Serial RapidIO, XAUI, and other serial protocols. Configuration is supported via JTAG boundary-scan and active serial/parallel configuration schemes, allowing flexible in-system programming for prototyping and production. The architecture pairs a high-performance logic fabric with embedded transceivers operating up to 6.375 Gbps, deterministic latency PLLs, and rich clock networks. On-chip memory and DSP density make it suitable for parallel data-path processing alongside serial I/O aggregation. The 1508-pin FC-FBGA package exposes the full I/O and transceiver count needed for high-bandwidth designs. Typical applications include high-speed serial interface bridging (PCIe, XAUI, Serial RapidIO), telecom backplane aggregation, broadcast video processing, military radar signal processing, ASIC prototyping, and high-end test & measurement instrumentation. Designers frequently use this device when multi-gigabit transceivers and large logic capacity must coexist on a single silicon. When designing with the EP2SGX90FF40C4NES, plan power architecture carefully because the 1.2V core and multiple transceiver/auxiliary rails can exceed 20W under full load. Quartus II is the primary design toolchain, and proper PCB stackup with controlled-impedance lanes is mandatory for transceiver signal integrity. This page synthesizes verified distributor stock, Stratix II GX drop-in equivalents, and Quartus II design considerations not collected in any single vendor datasheet.
EP2SGX90FF40C5N - Stratix II GX FPGA 90K LE, 40Gbps Tranceivers | Altera
The Altera (now Intel) EP2SGX90FF40C5N is a high-density Stratix II GX FPGA delivering 90,960 logic elements, 4,548 LABs, and embedded 6.375 Gbps multi-gigabit transceivers, housed in a 1,508-ball FineLine BGA package with 1.00 mm ball pitch. It features 650 maximum user I/O pins and operates across industrial-grade temperature ranges with a 1.2 V core supply. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells. FPGAs belong to the broader category of programmable logic devices (PLDs), which also include simple CPLDs. Modern FPGAs like the Stratix II GX integrate hard IP cores (transceivers, memory controllers, DSP blocks, processors) alongside the programmable fabric, allowing system designers to implement custom digital logic, high-speed serial protocols, and parallel processing pipelines on a single chip. Key features of the EP2SGX90FF40C5N include up to 6.375 Gbps embedded transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, and CEI-6G; dedicated DSP blocks for high-throughput signal processing; TriMatrix memory with up to ~4.5 Mbits of block RAM; and support for external memory interfaces including DDR, DDR2, QDR, and RLDRAM. The device also integrates a hard PCIe endpoint and supports up to four PCIe lanes at Gen1 rates. Architecturally, the Stratix II GX uses a 90 nm process node and an ALM-based logic fabric that delivers improved performance and lower power compared to first-generation Stratix. The 6.375 Gbps transceivers feature adaptive equalization and pre-emphasis, enabling reliable serial link operation across backplanes and across long FR-4 PCB traces. Hard IP for PCI Express eliminates the need for soft IP licensing for that interface. Typical applications include 10 Gbps networking line cards, telecom baseband processing, high-speed serial interface bridging (PCIe to SRIO, XAUI conversion), military radar signal processing, and broadcast video transport. Designers also use the EP2SGX90 family for ASIC prototyping where high logic density and large memory bandwidth are required. When designing with this device, pay close attention to PCB BGA breakout routing, decoupling network placement, and transceiver channel utilization. The 1.00 mm ball pitch is workable but still demands 6-8 layer stackup with microvia or via-in-pad technology for clean signal integrity above 5 Gbps. This page synthesizes distributor pricing, drop-in alternatives within the Stratix II GX family, and practical design notes not found in the manufacturer datasheet.
EP2SGX90FF40C5NES - 90nm Stratix II GX FPGA 90,960 Cells | Altera
The Altera (now Intel) EP2SGX90FF40C5NES is a high-density Stratix II GX Field-Programmable Gate Array built on a 90 nm CMOS process, integrating 90,960 logic cells (4,828 Configurable Logic Blocks) with embedded transceivers and 1.2 V core operation in a 1,508-pin flip-chip BGA (FC-FBGA) package. It targets high-speed serial I/O and DSP-intensive applications, delivering up to 609.76 MHz core performance, multi-gigabit transceivers, and on-chip memory suitable for wireline, wireless backhaul, and high-end ASIC prototyping designs. The 1.2 V core supply, together with dedicated PLL and I/O banks, allows deterministic performance for clock-sensitive data-path logic. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O cells are defined at design-time by the user's bitstream rather than at wafer fab. Within the broader programmable-logic hierarchy, the Stratix II GX family sits in the high-performance transceiver-enabled tier: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The 'GX' suffix denotes integrated multi-gigabit transceivers, distinguishing the family from transceiver-less Stratix II 'E' variants and positioning the device above CPLD and low-density FPGA families such as Cyclone II in both logic capacity and serial bandwidth. Key features include 90,960 equivalent logic elements, 4,828 CLBs, embedded transceiver channels capable of multi-gigabit serial rates, dedicated DSP blocks for high-throughput arithmetic, and 90 nm process technology. The Stratix II GX architecture introduces an 'adaptive logic module' (ALM) that combines adaptive LUT and register structures, giving roughly 50 percent greater logic efficiency than previous-generation ALMs. The 1,508-pin FC-FBGA package provides high signal and power-pin density, which is essential for routing the parallel I/O, transceiver lanes, clock tree, and power rails without compromising signal integrity. Architecturally, the device combines a logic fabric of ALMs, embedded M512/M4K/M-RAM memory blocks, and DSP blocks arranged in columns. Multi-gigabit transceivers (CMU channels) sit on the periphery, supporting standard serial protocols and reference-clock forwarding, while PLLs generate the on-chip clocking backbone. The 90 nm process enables higher integration and lower dynamic power per MHz than older 130 nm or 180 nm nodes, although static power at 1.2 V core is non-negligible in dense designs. Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, XAUI, Fibre Channel), wireless baseband signal processing, high-definition video processing, and ASIC prototyping. It is also widely used in telecom line cards, military/aerospace signal processing, and test-and-measurement instrumentation where reconfigurable logic with on-chip transceivers reduces bill of materials. When designing with this device, plan for a robust multi-rail power architecture: 1.2 V core, dedicated PLL analog supply, transceiver supply, and reference-clock supply each require low-noise LDOs and decoupling. Use Altera's Quartus II design suite for synthesis, place-and-route, and timing closure, and consult the Stratix II GX Device Handbook for transceiver PCB layout guidelines. This page consolidates distributor pricing, package-level information, and design guidance for engineers evaluating the EP2SGX90FF40C5NES, including drop-in alternatives from the Stratix II GX family and comparable high-density FPGAs.
EP2SGX90GF1020 - Stratix II GX FPGA, 90K LE, 1020-Pin FCBGA | Altera
The Altera (now Intel) EP2SGX90GF1020 is a high-density Stratix II GX FPGA with approximately 90,560 logic elements, up to 4.5 Mbits of embedded memory, and integrated 3.125 Gbps transceivers, housed in a 1020-ball FineLine BGA (FCBGA) package. It is built on a 90 nm process and features adaptive logic modules (ALMs) that replace the older 4-input LUT architecture, delivering finer-grained logic packing and higher effective logic density per die area. A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit containing programmable logic blocks, routing interconnect, and embedded hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit within the semiconductor hierarchy as programmable logic devices -> reconfigurable digital ICs -> integrated circuits, and are used for prototyping, signal processing, and ASIC replacement where high parallelism, deterministic latency, or post-fabrication design changes are required. Key features of the EP2SGX90GF1020 include up to 12 transceiver channels at 3.125 Gbps, dedicated hardware multipliers for DSP, support for external memory interfaces including DDR/DDR2/QDRII, and a flexible phase-locked loop (PLL) network with up to 12 PLLs. The Stratix II GX family targets high-speed serial I/O applications such as backplane transceivers, chip-to-chip links, and protocol bridging. Architecture-wise the device uses an ALM-based fabric with eight-input fracturable lookup tables, embedded RAM blocks (M512/M4K/M-RAM tiers), and hard IP for PCI Express (x1/x4) and Gigabit Ethernet MAC. The transceiver blocks include built-in serializer/deserializer (SERDES), 8B/10B encoding, and word alignment, eliminating the need for external physical-layer chips on common protocols. Typical applications include high-speed serial protocol bridging, communications backplane aggregation, military/aerospace signal processing, test and measurement equipment, and video broadcast infrastructure. The integrated transceivers make it especially suitable for Serial RapidIO, XAUI, PCIe, and custom proprietary links. When designing with the EP2SGX90GF1020, plan for a multi-layer PCB (typically 8-12 layers) with controlled-impedance 100-ohm differential traces for transceiver channels and a solid ground reference plane; power decoupling requires multiple bulk and ceramic capacitors placed close to each ball grid array region per Stratix II GX handbook guidance. This page synthesizes distributor pricing tiers, drop-in same-package alternatives, and practical layout notes that are not consolidated in the manufacturer handbook, providing a single reference for engineers evaluating the EP2SGX90GF1020 for new designs or legacy board sustainment.
EP3C10E144C7N - Cyclone III FPGA, 10K LEs, 144-LQFP | Intel
The Intel (formerly Altera) EP3C10E144C7N is a low-power, low-cost Cyclone® III Field-Programmable Gate Array (FPGA) delivering 10,320 logic elements, 414 Kbits of embedded memory, and 23 embedded 18x18 multipliers, packaged in a 144-pin LQFP with exposed thermal pad (EQFP-144). It supports up to 94 user I/O pins with four general-purpose PLLs and operates from a 1.15 V to 1.25 V core supply, achieving up to 437.5 MHz internal clock performance. A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that lets engineers implement arbitrary digital logic, signal processing, and interconnect functions through a configurable array of logic elements (LEs), embedded multipliers, block RAM (BRAM), and programmable I/O. FPGAs sit hierarchically between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices), offering higher density than CPLDs and far lower NRE cost than ASICs - making them ideal for low- to mid-volume designs, prototyping, and time-to-market-critical applications. Key Cyclone III features include low static and dynamic power (TSMC 65 nm process), support for DDR/DDR2/QDRII memory interfaces, up to four PLLs for clock management, hot-socketing capability, and built-in configuration via JTAG, Active Serial, or Active Parallel modes. The EQFP-144 package supports up to 94 LVDS/LVCMOS user I/Os and a dedicated clock input pin structure. Architecturally, the EP3C10E144C7N combines a fabric of 10,320 LEs organized into Logic Array Blocks (LABs), 23 hardware 18x18 multipliers suited for DSP workloads (FIR, FFT, convolutions), 414 Kbits of M9K block RAM, and 4 PLLs for frequency synthesis and phase shifting. The 65 nm low-power process keeps quiescent current low, making it suitable for thermally constrained or battery-fed systems. Typical applications include industrial motor control, video processing bridges, communication protocol bridging (SPI/I2C/UART to parallel buses), low-density DSP accelerators, embedded controller glue logic, and educational/hobbyist digital-design platforms. The wide package, low price, and free Quartus Prime toolchain make it a popular choice for prototype and small-volume production. When designing with this device, allocate I/O bank voltages carefully (each bank has independent VCCIO rails supporting 1.2V/1.5V/1.8V/2.5V/3.3V), use the dedicated MSEL[3:0] pins to select configuration mode, and follow Intel's power-sequencing recommendations to prevent latch-up. The exposed pad must be soldered to the PCB ground plane for thermal dissipation. This page synthesizes distributor pricing from DigiKey, Mouser, and Octopart, drop-in replacement analysis from same-brand Cyclone III speed/pinout variants, and practical design notes not consolidated on any single manufacturer or distributor page.
EP3C10E144C8N - 10K LE Cyclone III FPGA, 144-LQFP | Intel / Altera
The Intel / Altera EP3C10E144C8N is a low-cost, low-power Cyclone III Field-Programmable Gate Array (FPGA) providing 10,320 logic elements, 423,936 bits of embedded memory, and 94 user I/O in a 144-pin LQFP Exposed Pad package. Operating at the commercial speed grade 8 with a commercial (0C to +85C) junction temperature rating, this device leverages a 65 nm TSMC process and targets cost-sensitive, high-volume designs where board space, power budget, and unit cost dominate the trade-off matrix. The 'C8' suffix denotes the speed grade, while the 'N' indicates a lead-free, RoHS-compliant package finish, and the '144' prefix specifies the LQFP-144 pin count. Cyclone III FPGAs occupy the entry-to-mid tier of the Altera/Intel programmable logic family hierarchy, sitting below the Cyclone IV and Cyclone V families in process node and absolute performance, but offering an unusually competitive dollar-per-logic-element ratio. The EP3C10E144C8N specifically is positioned for glue logic, custom peripheral interfacing, LED and video signal conditioning, motor control coprocessors, and mid-complexity DSP pipelines. Its built-in 18x18 multipliers, embedded RAM blocks, and PLL-based clock management make it well suited to small signal-processing farms where the flexibility of an FPGA outperforms a fixed-function MCU. The 144-pin LQFP with exposed pad provides a robust thermal path for the device's sub-watt typical power envelope and supports hand-solderable prototyping on 0.5 mm-pitch PCBs. Integrated features include 66 (7 for 9-bit) embedded 18x18 multipliers, two PLLs, and up to 414 Kbits of M9K block RAM distributed across the fabric. Designers benefit from Quartus II / Quartus Prime support, a mature IP library, and reference designs covering Nios II soft-core integration. Typical applications include industrial control and machine vision front-ends, low-cost video processing (e.g., LCD timing controllers and HDMI bridge boards), consumer electronics requiring custom I/O expansion, low-bandwidth software-defined radio front-ends, and educational / university FPGA training platforms. The exposed-pad LQFP package is especially useful for designs that need a 1.0 mm-pitch SMT footprint without the routing complexity of fine-pitch BGA alternatives. When designing with this part, allocate adequate copper area under the exposed pad for thermal dissipation and ensure I/O bank voltages match the 1.2 V / 2.5 V / 3.3 V supported standards. Engineers migrating from Cyclone II should note the 65 nm process change and updated configuration scheme, which requires a fresh Quartus project compilation. According to the Altera Cyclone III Device Handbook, configuration is supported via JTAG, Active Serial (EPCS), or Passive Serial modes, with dedicated MSEL[3:0] strap pins selecting the mode at power-up.
EP3C10E144I7 - Cyclone III FPGA, 10K LE, 144-LQFP | Intel
The Intel (formerly Altera) EP3C10E144I7 is a low-cost Cyclone III FPGA delivering 10,320 logic elements, 423,936 bits of embedded memory, and 23 embedded 18x18 multipliers in a 144-pin EQFP/LQFP-Exposed-Pad package. Built on a 65nm process and rated for the industrial temperature range (-40C to +100C), the device targets cost-sensitive high-volume applications where FPGAs were previously uneconomical. A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that can be reconfigured after manufacturing. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs, microcontrollers, and DSPs in the programmable logic domain, which itself belongs to the larger class of logic ICs and integrated circuits. Cyclone III devices specifically position the FPGA as a low-power, low-cost alternative to ASICs for volume production in industrial, consumer, and automotive subsystems. Key features of the EP3C10E144I7 include 10,320 logic elements, 46 M9K memory blocks totaling 414 Kbits, 23 dedicated 18x18 hardware multipliers for DSP workloads, and 94 user I/O pins with support for multiple I/O standards including LVDS, LVCMOS, SSTL, and PCI. The device includes four phase-locked loops (PLLs) for clock management and supports configuration via JTAG, Active Serial, or Active Parallel modes. The 144-LQFP package with exposed pad provides a thermal path for moderate-power dissipation and is suitable for both hand-soldered prototypes and automated SMT assembly. Cyclone III architecture uses a four-input LUT-based logic element, embedded memory blocks (M9K) that can be configured as RAM, ROM, or FIFO, and dedicated multiplier blocks for high-performance DSP pipelines. The device supports Nios II embedded processor soft cores, enabling fully integrated microcontroller-plus-custom-logic solutions on a single chip. Fabric routing is implemented in a hierarchical interconnect optimized for the 65nm process node, providing a balance of speed and density at very low static power. Typical applications include industrial motor control, video processing bridges, low-cost protocol bridging (PCI to local bus, UART to memory), consumer display controllers, and education/DIY development platforms. The Cyclone III family is also widely used as a prototyping vehicle before migrating designs to lower-cost Cyclone IV or Cyclone V derivatives, or to HardCopy III structured ASICs for high-volume production. When designing with the EP3C10E144I7, ensure proper decoupling (100nF plus 10uF bulk per supply rail) and that the exposed thermal pad is soldered to a sufficiently large copper pour to achieve the rated thermal performance. Plan configuration mode pins (MSEL) and JTAG chain ahead of PCB layout, since re-spinning a 144-pin LQFP is significantly more expensive than addressing configuration issues during schematic capture. This page synthesizes distributor pricing, drop-in FPGA alternatives (e.g., EP3C10E144C7N, EP3C10E144C8N), practical design notes, and pinout references not consolidated in the manufacturer datasheet alone.
EP3C10E144I7N - Cyclone III FPGA, 10K LE, 144-LQFP | Intel
The Intel (formerly Altera) EP3C10E144I7N is a low-power, low-cost Cyclone® III Field Programmable Gate Array (FPGA) built on a 65nm CMOS process, offering 10,320 logic elements, 423,936 bits of embedded memory, and 66 (9x9) multipliers, housed in a 144-pin LQFP package with exposed thermal pad. Key features include 94 user I/O pins, two general-purpose PLLs, 23 embedded 18x18 multipliers, 46 M9K memory blocks, and a core supply of 1.2V with I/O supply supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards. The device operates at a maximum internal clock frequency of approximately 472.5 MHz, supported by Cyclone III's low static and dynamic power architecture. The Cyclone III family (EP3C family) is a programmable logic device sitting in the broader hierarchy of FPGA -> programmable logic -> semiconductor. FPGAs contain configurable logic blocks (CLBs/LEs), programmable interconnect, embedded memory, and dedicated hardware such as PLLs and multipliers, enabling parallel hardware acceleration, custom peripheral interfacing, and glue-logic integration. The Cyclone III family in particular targets cost-sensitive, power-sensitive applications where higher-end Stratix devices are over-specified. This specific variant EP3C10E144I7N is the 144-LQFP / EQFP-144 commercial-grade option, with the 'I7' suffix indicating the industrial temperature range (-40°C to +100°C junction), and the 'N' suffix denoting lead-free / RoHS-compliant packaging. The 144-LQFP footprint enables low-cost PCB assembly using standard SMT lines, making it attractive for industrial control, motor drive, video processing, and consumer designs. Typical applications include industrial motor control (using the embedded multipliers for FOC algorithms), video surveillance image processing, automotive infotainment prototyping, low-cost software-defined radio front-ends, and display controllers for industrial HMMIs. The device's embedded M9K memory blocks efficiently buffer video line storage, while the PLLs synthesize the pixel clock from an external reference. When designing with this FPGA, pay attention to the bank-by-bank I/O supply voltage configuration, use the Quartus II (or newer Quartus Prime) toolchain for synthesis, place decoupling capacitors near each VCCINT/VCCIO supply pin, and follow the exposed-pad PCB layout guideline for the EPAD thermal dissipation pad. Consider migrating to the Cyclone IV E (EP4CE10) family for new designs because Cyclone III is approaching end-of-life. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes that complement - but do not duplicate - the manufacturer datasheet.
EP3C10F256C6 - Cyclone III FPGA, 10K LE, 256-FBGA | Intel
The Intel (Altera) EP3C10F256C6 is a low-cost, low-power Cyclone III FPGA delivering 10,320 logic elements, 423,936 bits of embedded memory, and 182 user I/Os in a 256-ball FineLine BGA (FBGA-256) package. It is built on a 60 nm process and is targeted at cost-sensitive applications where the high transceiver count and transceiver rate of mid-range Cyclone IV/V devices are unnecessary, but where a flexible programmable fabric is still required. A Field Programmable Gate Array (FPGA) is a type of programmable logic device that allows designers to configure the device's logic blocks, routing, and I/O behavior after manufacture. Within the programmable logic hierarchy, FPGAs sit at the top, above CPLDs (Complex Programmable Logic Devices), and are used to implement everything from simple glue logic to complete processor subsystems, DSP pipelines, and high-speed interface bridges. Key features of the EP3C10F256C6 include 23 embedded 18x18 multipliers, 2 PLLs for clock management, support for LVDS, LVCMOS, SSTL, and HSTL I/O standards, and a core voltage range that enables operation from typical 1.15 V to 1.25 V supplies with I/O voltages scalable to 3.3 V. It uses SRAM-based configuration, requiring an external configuration memory such as the EPCS4 or EPCS16 serial flash, and supports JTAG and Active Serial (AS) configuration modes. The device is fabricated on TSMC's 60 nm low-power process and consumes approximately 120 mW of static power under typical conditions, with dynamic power scaling with toggle rate and design utilization. Designers can use the free Quartus II Web Edition (and later Intel Quartus Prime Lite) toolchain to synthesize, place-and-route, and program the device using Verilog HDL or VHDL. Typical applications include industrial motor control, video processing bridges, low-cost I/O expansion, custom interface converters (UART to parallel, SPI to LVDS), test and measurement instrumentation, and educational or prototyping boards. The 256-FBGA package offers sufficient I/O density for mid-complexity designs while remaining hand-reworkable with proper hot-air rework equipment. When designing with this part, pay careful attention to decoupling: place 100 nF and 10 uF capacitors within 5 mm of every VCCINT and VCCIO pin pair, and follow Altera's Cyclone III hardware design guide for the PCB footprint. The configuration scheme (AS vs JTAG) must be selected via MSEL[3:0] pins during board bring-up. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical Quartus II design notes that complement - rather than duplicate - the manufacturer datasheet.