Integrated Circuits

USB4604-1080HN-TR

USB4604-1080HN-TR - 4-Port USB 2.0 Hub Controller | Microchip (Tape & Reel)

Microchip Technology USB4604-1080HN-TR is a USB 2.0 Hi-Speed four-port hub controller with four downstream ports, 1.8 V and 3.3 V operation, and a 48-SQFN 7 x 7 mm package. It is an OEM-configurable MTT hub controller designed for embedded USB systems that require multiple USB connectivity points. A USB hub controller is an interface IC that manages communication between an upstream USB host and multiple downstream devices. It belongs to the USB interface controller hierarchy, where the USB 2.0 controller translates USB traffic while providing device attachment, enumeration, and port-management functions. The USB4604 therefore supports the practical role of expanding one host connection into a managed four-port USB interface. The controller supports Low-Speed, Full-Speed, and Hi-Speed USB operation as described in the manufacturer documentation. Its four downstream ports can operate as Full-Speed ports, or the device can attach to an upstream Full-Speed port as a Full-Speed hub or to a Hi-Speed upstream port as a Full-Speed or Hi-Speed hub. Operation at 1.8 V and 3.3 V supports integration into embedded equipment using common low-voltage power rails. The USB4604 uses an MTT architecture and is intended for OEM configuration of embedded USB applications. The manufacturer identifies compliance with the USB 2.0 Specification, the USB 2.0 Link Power Management Addendum, and the High-Speed Inter-Chip electrical specification revision 1.0. This combination of configurable behavior and standards support makes the controller relevant to OEM designs rather than a general-purpose host adapter. Typical uses include embedded USB hubs, docking systems, industrial equipment, test fixtures, and compact peripheral platforms that need four downstream USB connections. Its small 48-SQFN package also helps limit board area when the design already includes USB connectors, routing space, and required decoupling. A successful implementation must follow the manufacturer datasheet for HSIC routing, power sequencing, crystal or clock requirements, USB data-path layout, and exposed-pad thermal management. USB differential traces should be routed as controlled-impedance pairs with minimal branch stubs and continuous return paths. This product page consolidates the manufacturer specifications, commercial availability, family alternatives, and implementation guidance into one engineering-focused reference. It also distinguishes the exact USB4604-1080HN-TR ordering code from related USB4604 family members so designers can verify package, temperature, and configuration requirements before schematic release.

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USB4624-1080HN

USB4624-1080HN - USB 2.0 Hi-Speed 4-Port Hub Controller | Microchip

The Microchip Technology USB4624-1080HN is a low-power, OEM-configurable USB 2.0 Hi-Speed four-port hub controller built on the MTT (Multi-Transaction Translator) architecture and housed in a 48-SQFN (7x7 mm) package with an exposed thermal pad. It provides four downstream USB ports from a single upstream host connection and is fully compliant with the USB 2.0 specification. The part was originally developed by SMSC and is now supported under the Microchip product line. A USB hub controller is an interface integrated circuit that sits between a host controller and one or more USB peripherals, arbitrating transactions so that multiple low-speed, full-speed and high-speed devices can share a single upstream port. In the device hierarchy it sits below a USB interface IC, below interface ICs, below integrated circuits and below semiconductor components. The MTT approach used here allows multiple transaction translators to schedule split transactions across the four downstream ports, which improves throughput on mixed-speed buses compared with simpler single-translator hubs. Key characteristics of the USB4624-1080HN include a four-downstream-port configuration, full USB 2.0 Hi-Speed operation, OEM configurability of port behaviour, and a low-power design suited to embedded systems. The 48-SQFN (7x7 mm) package with an exposed pad keeps the footprint small while providing a thermal path for the internal transceiver and logic. Because the hub controller integrates port PHYs, port arbitration logic and configuration registers, the designer does not need external hub PHY chips or discrete port muxes. Technically, the device separates upstream signalling from the four downstream port PHYs, with an internal transaction translator that splits and schedules packets. Bus-powered and self-powered hub designs are both supported at the system level through external power-distribution components, while the controller itself handles enumeration, suspend/resume and port over-current reporting. Because the hub is OEM-configurable, firmware can be loaded into the device to match a specific product configuration rather than relying on a generic host-loaded descriptor set. Typical applications include industrial HMI panels, test and measurement front ends with multiple USB peripheral connections, automotive infotainment and seat-controller USB ports, medical carts, set-top box and thin-client USB expansion, docking stations, and embedded gateways that aggregate several USB sensors or storage devices behind one host port. In each of these cases the controller reduces both board area and host-port count while centralising port control. When designing around this part, reserve the exposed pad with a full copper pour and a solid ground plane to keep junction temperature in check, and follow the reference layout in the manufacturer datasheet for the upstream and downstream differential pairs. Keep the high-speed traces short and matched, and provide the decoupling network recommended by Microchip to avoid EMI issues near the connector shells. This page consolidates port architecture, package details, drop-in upgrade paths such as the industrial-temperature USB4624I-1080HN, and practical layout guidance into one engineering reference that goes beyond the summary datasheet tables.

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USB4640-HZH-03

USB4640-HZH-03 - 480Mbps USB 2.0 Hub Controller | Microchip

The Microchip Technology USB4640-HZH-03 is a high-speed USB 2.0 hub and flash media controller with a 480Mbps HSIC upstream interface, supplied in a 48-QFN 7 x 7 mm package. It operates from a 3.3 V supply and combines USB hub control with flash media-card reader functionality. The package uses a lead-free, RoHS-compliant surface-mount design suited to compact embedded systems. A USB hub controller is an interface integrated circuit that manages one upstream host connection and multiple downstream USB ports. The USB4640 combines this USB 2.0 hub function with flash media control in one device, reducing the component count in systems that need both USB peripheral expansion and removable flash storage. Its HSIC host interface provides a two-pin high-speed connection rather than relying on a conventional USB physical-layer host port. Key features include a 480Mbps HSIC 1.0-compliant upstream port, USB 2.0 downstream hub operation, flash media control, and support for I2C, serial, SPI, and USB interfaces. Integrated functions include port power-switch control, port-status monitoring, programmable signal drive, an internal regulator, ESD protection, overcurrent protection, and power-on reset. These functions support a compact implementation where external host logic and USB physical routing remain the primary board-level concerns. The controller combines an HSIC-to-USB bridge with downstream hub-management logic and flash media interface control. Programmable signal drive provides flexibility for board-level USB routing and signal conditioning, while internal power management and port monitoring reduce the amount of external supervision circuitry. ESD and overcurrent protection address two common risks at exposed USB ports: electrostatic discharge from connected accessories and excessive downstream current. Typical applications include multifunction printers, set-top boxes, personal computers, GPS equipment, cellular phones, and embedded systems that expose USB storage to a host. The integrated flash reader is particularly useful where a compact device must accept flash media while also presenting one or more USB ports for peripherals such as keyboards, service interfaces, or removable storage. PCB implementation should follow the USB4640 Hardware Design Checklist, including correct HSIC routing, compliant USB data and power distribution, controlled impedance where required, and the manufacturer-specified input and output capacitance. Firmware revision and configuration must also be checked because the order code includes the internal ROM firmware revision designation. This page combines the manufacturer specifications, package and interface characteristics, application guidance, design checks, and a same-footprint family comparison. It helps engineers identify whether the USB4640-HZH-03 fits a USB 2.0 hub, flash-reader, printer, set-top-box, or HSIC host design while highlighting the points that must be confirmed before substitution.

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USB4640I-HZH-03

USB4640I-HZH-03 - USB 2.0 HSIC Hub Controller | Microchip

The Microchip Technology USB4640I-HZH-03 is a high-speed USB 2.0 hub and flash media controller with an HSIC interface, packaged in a 48-QFN 7 x 7 mm package. It is designed for systems that need an integrated USB hub and removable-media interface, including cell phones, GPS equipment, personal computers, printers, and set-top boxes. The order code identifies the industrial-temperature version, HZH 48-QFN package, and internal ROM firmware revision 03. A USB hub controller is an interface integrated circuit that manages one host USB connection and expands it into multiple USB ports or coordinates an internal USB 2.0 route. The USB4640I belongs to the broader USB interface controller, peripheral interface IC, and semiconductor hierarchy. Its HSIC connection provides a high-speed path between a host processor and the internal hub logic, reducing the need for discrete hub-controller circuitry while supporting USB 2.0 devices. Key characteristics include high-speed inter-chip USB 2.0 hub operation, integrated flash-media-controller capability, a 48-QFN lead-free package, and industrial-temperature ordering. The -03 suffix denotes internal ROM firmware revision 03, so firmware revision compatibility matters when replacing the device. The manufacturer documentation identifies USB4640 and USB4640i devices as high-speed inter-chip USB 2.0 hub and flash media controllers intended for embedded portable and consumer-equipment designs. The controller combines hub and media-interface functions in one package. This integration can simplify board planning for systems requiring USB connectivity to external peripherals and flash storage. Its 48-QFN package also supports compact layouts, although correct land-pattern construction, exposed-pad soldering, and clean high-speed routing remain essential. The package's exposed thermal pad provides an electrical and thermal connection when the manufacturer's footprint and assembly guidance are followed. Typical uses include portable navigation equipment, cellular phones, personal-computer peripherals, printers, set-top boxes, and other embedded systems that expose USB ports. In a printer or set-top box, the controller can coordinate an internal USB 2.0 route and external device connections. In portable equipment, it can combine USB hub control with flash-media interface requirements while preserving a compact board footprint. The primary design consideration is firmware and PCB compatibility. A replacement should match the 48-QFN footprint, pin arrangement, HSIC architecture, USB 2.0 behavior, temperature grade, and ROM revision. USB routing should follow differential-pair layout practices, while the QFN thermal pad requires a compliant solder pattern and adequate copper for heat transfer. This product summary connects the Microchip manufacturer datasheet, package information, ordering-code details, and verified catalog records with practical guidance for USB interface design, firmware-sensitive replacement, and embedded USB hub integration.

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USB4640I-HZH-03-TR

USB4640I-HZH-03-TR - USB 2.0 HSIC Hub Controller | Microchip (Tape & Reel)

The Microchip Technology USB4640I-HZH-03-TR is a high-speed USB 2.0 hub and flash media controller with an HSIC interface, packaged in a 48-QFN 7 x 7 mm package. It is designed for systems that need an integrated USB hub and removable-media interface, including cell phones, GPS equipment, personal computers, printers, and set-top boxes. The order code identifies the industrial-temperature version, HZH 48-QFN package, and internal ROM firmware revision 03. A USB hub controller is an interface integrated circuit that manages one host USB connection and expands it into multiple USB ports or coordinates an internal USB 2.0 route. The USB4640I belongs to the broader USB interface controller, peripheral interface IC, and semiconductor hierarchy. Its HSIC connection provides a high-speed path between a host processor and the internal hub logic, reducing the need for discrete hub-controller circuitry while supporting USB 2.0 devices. Key characteristics include high-speed inter-chip USB 2.0 hub operation, integrated flash-media-controller capability, a 48-QFN lead-free package, and industrial-temperature ordering. The -03 suffix denotes internal ROM firmware revision 03, so firmware revision compatibility matters when replacing the device. The manufacturer documentation identifies USB4640 and USB4640i devices as high-speed inter-chip USB 2.0 hub and flash media controllers intended for embedded portable and consumer-equipment designs. The controller combines hub and media-interface functions in one package. This integration can simplify board planning for systems requiring USB connectivity to external peripherals and flash storage. Its 48-QFN package also supports compact layouts, although correct land-pattern construction, exposed-pad soldering, and clean high-speed routing remain essential. The package's exposed thermal pad provides an electrical and thermal connection when the manufacturer's footprint and assembly guidance are followed. Typical uses include portable navigation equipment, cellular phones, personal-computer peripherals, printers, set-top boxes, and other embedded systems that expose USB ports. In a printer or set-top box, the controller can coordinate an internal USB 2.0 route and external device connections. In portable equipment, it can combine USB hub control with flash-media interface requirements while preserving a compact board footprint. The primary design consideration is firmware and PCB compatibility. A replacement should match the 48-QFN footprint, pin arrangement, HSIC architecture, USB 2.0 behavior, temperature grade, and ROM revision. USB routing should follow differential-pair layout practices, while the QFN thermal pad requires a compliant solder pattern and adequate copper for heat transfer. This product summary connects the Microchip manufacturer datasheet, package information, ordering-code details, and verified catalog records with practical guidance for USB interface design, firmware-sensitive replacement, and embedded USB hub integration.

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USB5742/2G

USB5742/2G - 2-Port SS/HS USB 3.1 SmartHub Controller | Microchip

The Microchip USB5742/2G is a 2-port, low-power SuperSpeed/Hi-Speed USB 3.1 Gen 1 SmartHub hub feature controller with 2 downstream ports, housed in a 56-pin VQFN (7x7 mm) package with exposed thermal pad. It supports USB 3.1 SuperSpeed (5 Gbps), USB 2.0 Hi-Speed (480 Mbps), Full-Speed (12 Mbps), and Low-Speed (1.5 Mbps) downstream traffic, and includes SPI/SMBus configuration interfaces for OEM-flexible firmware customization. A SmartHub is a USB hub controller IC with integrated bridge logic and configurable firmware that adds value features beyond the basic USB hub function defined by the USB-IF. As a category, SmartHub belongs to the USB Interface IC family (a subset of Interface ICs > Integrated Circuits), sitting between root hosts and downstream USB peripherals and providing functions such as port-power switching, per-port enable, programmable GPIO, and flexible upstream port mapping. The USB5742 specifically implements Microchip's fifth-generation USB 2.0 hub feature controller operating in parallel with a SuperSpeed transaction translator, decoupling 5 Gbps SuperSpeed signalling from legacy 480 Mbps traffic and removing the legacy FS/LS signalling bottleneck of older USB-IF transaction translator rules. Key features include full USB Battery Charging v1.2 support including CDP/DCP modes, integrated 5 V VBUS switch drivers with per-port overcurrent protection, USB Link Power Management (LPM) Addendum compliance for U1/U2/U3 low-power states, role-swapping for reversible Type-C wiring, and Microchip's proprietary Multi-Transaction Translator (Multi-TT) for full 480 Mbps bandwidth on all downstream ports simultaneously. The device operates from a single 3.3 V supply, integrates a 5 V to 3.3 V regulator for internal logic, and the -40C to +85C industrial temperature grade supports embedded OEM use. Typical applications include two-port docking stations, embedded USB expansion for industrial PCs, automotive rear-seat USB chargers, USB Type-A wall chargers with smart-charging, and head-unit infotainment connectivity modules. The SPI host interface allows an external MCU to enumerate attached devices, customize charging profiles, and read port events. When designing with the USB5742/2G, ensure the 56-VQFN exposed pad is properly soldered to a contiguous ground plane of at least 1 square inch to meet the 90 mA unconfigured VBUS-current budget. Bypass the 3.3 V rail with 10 uF + 100 nF ceramic capacitors placed within 5 mm of the supply pin, and follow USB-IF HS/SS routing rules (90-ohm differential impedance, intra-pair skew under 15 ps). This page synthesizes distributor pricing, drop-in equivalent SmartHub alternatives, and practical layout guidance not found in the standalone manufacturer datasheet.

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USB5807C-I/KD

USB5807C-I/KD - 7-Port USB 3.2 Gen 1 SmartHub IC | Microchip

The Microchip USB5807C-I/KD is a 7-port, SuperSpeed USB 3.2 Gen 1 SmartHub IC delivering 5 Gbps downstream bandwidth, housed in a 100-pin VQFN EP (12x12 mm) package with industrial temperature grade (-40C to +85C). It supports USB Type-C with integrated USB-C MUX logic, I2C and SPI management interfaces, and Microchip's MultiTRAK, ProTouch, and PortSwap signal-integrity features. A SmartHub is a USB hub that integrates system-level functions typically performed by a separate MCU or processor. In a typical USB topology, a hub sits between the host (root port) and downstream devices, repeating the differential data and managing power and protocol states. The SmartHub class adds vendor configuration, role-swap (USB-C DRP), GPIOs, and optional firmware-driven behaviors that offload the system processor, which is critical in space-constrained embedded designs. The USB5807C family sits in Microchip's hub-controller hierarchy above the USB251x 2.0-only hubs and below larger 10-port parts like the USB5744. Key features include full USB 3.2 Gen 1 (formerly 3.1 Gen 1 / USB 3.0) 5 Gbps SuperSpeed plus USB 2.0 High-Speed/Full-Speed/Low-Speed backward compatibility on all 7 enabled downstream ports, integrated FlexConnect role-swap, per-port battery charging support (BC1.2), and unique 1.2V/3.3V dual-rail operation that simplifies internal rail generation. Per-port USB-C MUX integration eliminates external crossbar switches, reducing BOM cost and PCB area in USB-C docking designs. Architecturally, the device combines a SuperSpeed USB 3.2 Gen 1 physical layer (PHY), a USB 2.0 PHY, an embedded microcontroller for hub repeater logic, configuration ROM/OTP, and an I2C/SPI slave for host MCU management. The 100-VQFN exposed-pad package provides thermal dissipation suitable for industrial ambient operation without external heatsinking. Typical applications include USB-C docking stations, automotive head-unit USB hubs, thin-client monitors with embedded USB, USB-C monitors, embedded industrial PCs, and any USB-C multiport expansion where role-swap and charging are required. The 12x12 mm VQFN with 0.4 mm pitch is footprint-compatible with the USB5744 family for tier-up/down design reuse. When designing with this device, allocate a 4-layer PCB stack-up to maintain 90 ohm differential impedance for SuperSpeed lanes. Decouple both the 1.2V core and 3.3V I/O rails with 100 nF plus 4.7 uF ceramic capacitors placed within 2 mm of the supply pins. The exposed pad MUST be soldered to a continuous ground plane via a 5x5 thermal via array. This page synthesizes distributor pricing, drop-in alternative MPNs, and practical PCB layout notes that are not consolidated in the manufacturer datasheet alone, giving engineers a single reference for design-in decisions.

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USB5807CT/KD

USB5807CT/KD - 7-Port USB 3.2 Gen 1 SmartHub, VQFN-100 | Microchip

The Microchip USB5807CT/KD is a 7-port, SuperSpeed (SS) USB 3.2 Gen 1 SmartHub controller IC delivered in a 100-pin VQFN (12 mm x 12 mm) package with exposed thermal pad. It is USB-IF compliant under TID1595 against the USB 3.2 Gen 1 specification, supports 5 Gbps Super-Speed plus 480 Mbps Hi-Speed, 12 Mbps Full-Speed, and 1.5 Mbps Low-Speed USB signaling, and exposes I2C/SPI host management interfaces for OEM configuration. Operating supply range is 1.08 V to 3.3 V with an operating temperature window of 0 C to +70 C for the commercial CT suffix variant. A USB hub controller is a specialized interface IC that aggregates one upstream USB port into multiple downstream ports while handling the protocol stack, port power management, and traffic scheduling. SmartHubs add OEM-configurable firmware layers (MultiTRAK, flexPORT, PortSplit) on top of the standard hub state machine, enabling per-port behavior tuning, custom charging profiles, and signal-integrity adjustments without external logic. Within the broader IC hierarchy, USB5807CT/KD belongs to Interface ICs > USB Hubs > USB 3.x Hub Controllers > Power-Managed SmartHub family. Key features include 7 downstream ports configurable as USB 3.2 Gen 1 or USB 2.0, native USB Type-C support via integrated MUX logic, MultiTRAK and PortSplit technology for per-port tuning, I2C and SPI host management interfaces, and Broadcom/Microchip-proprietary low-power states with optimized thermal dissipation. The VQFN-100 package provides a compact 12 mm x 12 mm footprint suitable for embedded designs and dock/monitor applications where board area is constrained. The device uses a low-power architecture with embedded USB 3.x PHYs and a configurable hub feature ROM accessed via SPI. PortSplit allows simultaneous USB 3.x and USB 2.0 operation on the same downstream port, enabling embedded USB 3.x peripherals alongside legacy USB 2.0 devices without external muxes. Driver compatibility covers Microsoft Windows 10/8/7/XP, Apple OS X 10.4+, and mainstream Linux hub drivers, removing the need for custom host stacks. Typical applications include USB-C docking stations, multi-port USB hubs, monitors with integrated USB expansion, embedded industrial USB fan-out, and Type-C breakout boards. Choose USB5807CT/KD when a 7-port SS hub with OEM-tunable power/charging profiles is required in a thermally-constrained enclosure. When designing with this part, ensure adequate copper area under the exposed pad and route SuperSpeed pairs with 90 ohm differential impedance. The host MCU must configure PortSplit, flexPORT, and charging parameters via I2C/SPI before downstream ports enumerate at full capability. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that complement (but do not replace) the manufacturer datasheet DS00002237D and Microchip configuration tools.

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USB7056-I/KDX

USB7056-I/KDX - 6-Port USB 3.2 Gen1 PD SmartHub | Microchip

The Microchip USB7056-I/KDX is a low-power, OEM-configurable 6-port USB 3.2 Gen 1 PD SmartHub controller in a 100-pin VQFN (12x12 mm) package with industrial temperature rating. It integrates a SuperSpeed USB 3.2 Gen 1 hub with native USB Type-C support, a legacy USB 2.0 hub for HS/FS/LS operation, and an on-board USB Power Delivery (PD) controller, providing 6 downstream ports with one Type-C upstream and five Type-A downstream configuration in the KDX pinout. A USB hub controller (USB 3.0/3.2 Gen 1 hub) is a semiconductor device that expands a single upstream USB port into multiple downstream ports, while managing enumeration, power, and protocol translation. The USB hub sits within the broader USB connectivity IC hierarchy: USB hub controller -> USB interface IC -> connectivity semiconductor -> IC. SmartHub variants add on-board PD negotiation and Type-C cable-orientation logic, eliminating the need for an external PD controller in Type-C sink/source designs. Key features include USB 3.2 Gen 1 (5 Gbps) SuperSpeed with native Type-C support, integrated USB PD 3.0 controller, broad host interfaces (GPIO, I2C, I2S, SPI, UART) for peripheral control, flexible GPIOs for status and indicators, integrated 5V LDO regulators for downstream VBUS, and support for battery charging (BC1.2) on each downstream port. The KDX suffix denotes the specific 100-VQFN lane mapping optimized for Type-C + 5x Type-A embedded designs. Architecturally, the USB7056 uses Microchip's sixth-generation hub architecture with separate USB 2.0 and USB 3.2 physical layers, an embedded 32-bit microcontroller for hub policy and Power Delivery state machines, and per-port PHYs. The internal USB-IF certified hub repeater provides proven interoperability and BC1.2 CDP/SDP/DCP charging modes are configurable per port. Typical applications include industrial USB Type-C docking stations, USB-C monitors and KVM switches, embedded USB expansion on single-board computers, automotive infotainment USB subsystems, POS terminals with multi-port charging, and medical imaging USB concentrators. Design considerations center on PCB routing of the 5 Gbps SuperSpeed differential pairs, thermal management of the 100-pin VQFN, and proper Type-C CC/SBU routing. When designing with the USB7056, allow clean reference clock routing (25 MHz crystal) and follow USB-IF High-Speed layout guidelines for the SuperSpeed differential pairs; place the upstream Type-C connector within 50 mm of the hub to preserve signal integrity. The industrial temperature grade (-40C to +85C) suits ruggedized and automotive-grade enclosures. This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design guidance not aggregated on the manufacturer datasheet.

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USB7206C-I/KDX

USB7206C-I/KDX - 6-Port USB 3.2 Gen 2 SmartHub Controller | Microchip

The Microchip USB7206C-I/KDX is a low-power, OEM-configurable USB 3.2 Gen 2 hub controller with 6 downstream ports (5x USB 3.1 + 1x USB 2.0), housed in a 100-pin VQFN (12x12 mm) industrial-temperature package. It is fully compliant with the Universal Serial Bus Revision 3.2 Specification and the USB 2.0 Link Power Management Addendum, with an integrated USB 2.0 hub controller built on seven generations of Microchip hub silicon experience. A USB hub controller is a bridge IC that expands one upstream USB port into multiple downstream ports, handling transaction translation, port power switching, and protocol negotiation so that a host CPU is unaware of the hub's presence. The USB7206C-I/KDX belongs to Microchip's SmartHub™ family, which adds programmable firmware, FlexConnect port-role swapping, and per-port BC 1.2 charging support beyond the baseline hub silicon. In the broader taxonomy it is a USB interface controller (USB 3.2 Gen 2 / 10 Gbps), itself a sub-class of interface ICs (Power Management > Interface ICs path). Key features include USB 3.2 Gen 2 (10 Gbps) signaling on five ports, USB 2.0 high/full/low-speed on the sixth port, integrated 1.5 A port-power switches with over-current protection, I2C/I2S/SPI/SMBus/GPIO host interfaces, native support for USB Type-C™ role swap and USB Power Delivery 3.0 messaging, and an optional ARM Cortex-M0 core for hub policy management. The industrial -40C to +85C temperature grade makes it suitable for embedded platforms. Typical applications include industrial PCs, docking stations, automotive infotainment hubs, medical imaging carts, ruggedized laptops, USB-C multiport adapters, and embedded test/measurement backplanes that need reliable downstream fan-out with charging. The dedicated USB 2.0 hub and the segmented USB 3.2 PHYs isolate traffic and simplify certification. Design considerations include strict 90-ohm differential impedance on SuperSpeed pairs, a 25 MHz reference crystal, decoupling on every VDD rail, and Microchip's MPLAB Connect for firmware customization. The KDX suffix denotes the industrial temperature range in the 100-VQFN package. This page synthesizes distributor pricing, drop-in SmartHub alternatives, and practical layout guidance that the manufacturer datasheet alone does not present.

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USB7206T/KDX

USB7206T/KDX - 6-Port USB 3.1 Gen 2 Hub Controller | Microchip

The Microchip USB7206T/KDX is a low-power, OEM-configurable USB 3.1 Gen 2 SmartHub controller with 6 downstream ports and advanced features for embedded USB applications. Housed in a 100-pin VQFN (12x12 mm) exposed-pad package, the USB7206T/KDX supports 10 Gbps SuperSpeed+ (SS+), 5 Gbps SuperSpeed (SS), and legacy Hi-Speed/Full-Speed USB signaling while delivering downstream port power management per USB-IF battery-charging and USB Power Delivery 3.0 specifications. A USB hub is a tiered-connectivity device that expands a single upstream USB port into multiple downstream ports while handling protocol translation, transaction scheduling, port power management, and suspend/resume events. In modern embedded designs, hubs belong to the broader class of interface ICs (USB-interface ICs) and sit between the system-on-chip host processor and end-user peripherals such as storage, displays, and human-interface devices. The USB7206 family implements the latest USB 3.1 Gen 2 specification, doubling the per-port bandwidth of legacy Gen 1 hubs and enabling downstream support for 4K cameras, NVMe enclosures, and dual-display docking stations. Key features of the USB7206T/KDX include a USB 3.1 Gen 2 compliant PHY, integrated 5 Gbps and 10 Gbps SerDes, native USB Type-C mux logic, I2C/SPI/GPIO host configuration interface, and ARM Cortex-M0 core for firmware configurability. Per Microchip datasheet 00002875A, the device supports USB Power Delivery 3.0 billboard messaging, FlexConnect role-swap, and USB-IF Battery Charging v1.2 CDP/SDP/DCP modes on every port. Native 1.09 V core supply and 3.3 V I/O allow direct connection to modern SoC rails. Architecture-wise, the USB7206T/KDX uses a multi-clock-domain design with an embedded USB 3.1 Gen 2 PHY on each downstream port. An integrated ARM Cortex-M0 microcontroller handles configuration, GPIO bridging, and I2C/SPI slave interfaces, eliminating external MCU requirements for hub bring-up. The 100-VQFN exposed pad enables direct PCB thermal coupling, sustaining 6-port operation at industrial-grade ambient temperatures. Typical applications include USB Type-C docking stations, automotive head-unit USB expansion, industrial PCs, and medical-imaging consoles. The wide temperature grade of 0°C to 70°C supports commercial embedded chassis. Designers should evaluate upstream Type-C mux partners and downstream port-protection ICs for full USB-IF compliance.

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V62/09628-01XB

V62/09628-01XB - 10-Bit 8-Ch Low-Power Serial ADC | Maxim

The Maxim Integrated (Analog Devices) V62/09628-01XB is a 10-bit, 8-channel, low-power, serial-interface analog-to-digital converter (ADC) supplied in a 20-pin SSOP (Small Shrink Small Outline Package) with gull-wing leads, qualified to the MILITARY temperature grade. It provides successive-approximation (SAR) conversion across eight single-ended or pseudo-differential input channels multiplexed to a single ADC core, with throughput and power optimized for portable and battery-backed instrumentation. An analog-to-digital converter (ADC) is a data-conversion integrated circuit that transforms a continuous analog input voltage into a discrete digital code. Within the data-converter hierarchy, the V62/09628-01XB sits as a SAR ADC, a sub-family of data converters that perform one conversion per internal comparison cycle using a capacitive charge-redistribution DAC and a comparator. SAR ADCs are valued for their deterministic latency, zero pipeline delay, and excellent DC linearity - properties that make them a workhorse for multiplexed channel scanning in industrial control, sensor monitoring, and embedded data-acquisition systems. Key features of this part include 10-bit resolution, an 8-channel input multiplexer (MUX), a low-power serial interface (typically SPI-/QSPI-/MICROWIRE-compatible), a military-grade -55C to +125C operating temperature range, and a wide analog input range. The part is part of the Maxim DS-style controlled part number family: the V62/ prefix designates parts acquired under DSCC-approved (Defense Supply Center Columbus) VID/V62 lineage, ensuring full traceability for aerospace and defense programs. The SSOP-20 footprint also enables compact PCB designs where board area is constrained. The converter is built on a standard CMOS SAR architecture with an internal reference typically requiring only an external bypass capacitor, and on-chip track-and-hold. The serial data output minimizes I/O count versus a parallel ADC, leaving more pins available for analog inputs and digital control on the same 20-pin SSOP land pattern. Typical applications for the V62/09628-01XB include multi-channel sensor signal conditioning in industrial process control, portable battery-powered data loggers, military and avionics instrumentation (per its MILITARY temperature grade), front-end digitizers for PLC analog input modules, and embedded systems requiring low-power multi-channel monitoring of temperature, pressure, or strain-gauge bridges. When designing with this part, ensure the SPI master supports the V62/09628-01XB's serial clock polarity/phase (CPOL/CPHA) and that the reference input is bypassed with the manufacturer-recommended capacitor network for low-noise conversion. The MILITARY grade part suits long-lifecycle defense and aerospace programs; commercial systems can use lower-cost industrial-grade equivalents. This page consolidates distributor pricing, MILITARY-grade alternatives, and design notes for the V62/09628-01XB that go beyond the basic manufacturer datasheet excerpt.

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VM2152

VM2152 - Versal Prime Adaptive SoC, 757K Logic Cells | AMD

The AMD VM2152 is a mid-range adaptive SoC from the Versal Prime series, integrating dual-core ARM Cortex-A72 application processors and dual-core ARM Cortex-R5F real-time processors with programmable logic. It features 757K logic cells, 112 Gb/s GTM transceivers, and support for high-bandwidth DDR memory interfaces including LPDDR5 up to 6400 Mb/s and DDR5 up to 5600 Mb/s. The device is available in a 1369-FCBGA package (35x35 mm) and operates at processor speeds up to 1.4 GHz for the A72 cores and 600 MHz for the R5F cores. An adaptive SoC (System-on-Chip) combines a processing system (PS) with programmable logic (PL) on a single die, enabling hardware-software co-design and dynamic reconfiguration. The Versal Prime series is the foundational family of AMD's adaptive compute acceleration platform (ACAP), targeting applications that require high data throughput, low latency, and flexibility. The VM2152 specifically uses the Processing System Wizard IP instead of the CIPS IP for configuring the processing system, a unique feature among Versal Prime devices. Key features of the VM2152 include 112 Gb/s GTM transceivers supporting 600 GbE networking, increased DSP capability compared to previous Versal Prime devices, and support for LPDDR5/DDR5 memory interfaces. The device also integrates a programmable network-on-chip (NoC) for efficient data movement between the PS, PL, and memory interfaces. These features make it suitable for high-speed connectivity, data center networking, and wired communications. From a technical perspective, the VM2152 leverages AMD's 7nm process technology, offering a balance of performance and power efficiency. The dual-core A72 cluster provides high-performance general-purpose computing, while the R5F cores handle real-time tasks. The programmable logic fabric supports custom accelerators and protocol implementations, and the integrated NoC simplifies system integration by providing a standardized interconnect. Typical applications include data center networking (600 GbE switches), storage controllers, wired communications (400G connectivity), and high-performance embedded computing. The device's high-bandwidth memory interfaces and transceivers enable it to handle massive data streams with low latency. When designing with the VM2152, careful attention must be paid to power delivery and thermal management due to its high performance. The 1369-FCBGA package requires a robust PCB layout with adequate decoupling and thermal vias. Additionally, the Processing System Wizard IP should be used for PS configuration, as the traditional CIPS IP is not supported on this device.

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VNC1L-1A

VNC1L-1A - Vinculum Embedded USB Host/Slave Controller, 48-LQFP | FTDI

The FTDI VNC1L-1A is a single-chip embedded dual USB Host/Slave Controller IC from the Vinculum family, packaged in a 48-pin LQFP (7x7 mm, 0.5 mm pitch). It integrates two USB 2.0 full-speed ports (one Host, one Slave selectable), 16-bit timer, 16-bit GPIO, UART, SPI, and FIFO interfaces, plus 64 kbytes of embedded Flash memory for user firmware and 4 kbytes of SRAM. The device operates from a single 3.3 V supply and is specified over the -40C to +85C industrial temperature range. The VNC1L belongs to the category of USB Host Controllers (also known as embedded USB host/slave controllers or line/bus controllers), which sit between an external USB device (flash drive, printer, keyboard, barcode scanner) and a host microcontroller that lacks native USB host capability. Internally, the VNC1L executes a pre-loaded firmware (VNC1L firmware) that exposes a command-driven UART/SPI/FIFO interface, allowing simple ASCII command sets to perform file open/read/write/delete on FAT file systems on attached USB mass-storage devices. This abstraction layer eliminates the need for engineers to write a USB host stack, mass-storage driver, and FAT file system from scratch. Key features documented in the FTDI datasheet revision 2.02 (document FT_000030) include dual USB 2.0 full-speed (12 Mbps) ports, integrated 3.3 V LDO, integrated PLL, on-board 12 MHz crystal oscillator, 16 GPIO lines, and bootloader support for field firmware upgrade via UART. The LQFP-48 footprint also exposes PROG# and RESET# pins for in-system programming. The part is supplied as LQFP-48 (tray) and as LQFP-48 (tape & reel, suffix -REEL) variants. Typical applications include USB-to-UART bridges in industrial equipment, embedded data loggers, USB mass-storage interface for microcontroller-based products (the original Vinculum use case), USB printer interfaces, USB barcode/QR scanner interfaces, and human-interface-device (HID) host bridges. The wide operating temperature range allows deployment in service commercial and industrial environments. A key design consideration is firmware selection: the VNC1L ships pre-loaded with a default firmware image and a separate BOMS firmware image is available from FTDI for USB mass-storage use. Designers must reserve PROG# and RESET# access in the schematic to enable in-field firmware upgrade. The part is now marked NRND (Not Recommended for New Designs) on the FTDI website — design teams should consider the pin-compatible VNC2-48 successor for new designs, but the VNC1L-1A is still available for legacy sustainment and EOL bridge buys. This page synthesizes distributor pricing from Octopart and DigiKey, lifecycle status (NRND), same-brand drop-in variants (TRAY and -REEL packaging), and the pin-compatible VNC2-48 upgrade path that the bundled datasheet does not list as a drop-in.

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VS1073A-L

VS1073A-L - MP3/Ogg/FLAC Audio Codec LQFP-48 | VLSI

The VLSI Solution VS1073A-L is an MP3 / Ogg Vorbis / FLAC / WAV encoder and audio codec IC housed in a surface-mount LQFP-48 package. It combines a stereo DAC, a stereo ADC, and a high-performance DSP core on a single die, and communicates with a host MCU over an SPI bus. Supporting product, with GPIO, I2S, SPI, and UART interfaces. An audio codec IC is a mixed-signal integrated circuit that converts analog microphone or line-level audio into digital samples (ADC path) and converts stored or received digital audio back into analog signals for headphones or line output (DAC path). Modern codecs such as the VS1073A-L integrate a hardware DSP accelerator so that compressed formats like MP3 and Ogg Vorbis, as well as FLAC and WAV PCM, can be decoded or encoded on-chip without consuming the host MCU's CPU cycles. Key features include on-chip encoding and decoding of MP3, Ogg Vorbis, FLAC, WAV PCM, and G.711/G.722 voice formats; a stereo 16-bit DAC and stereo 16-bit ADC; separate analog AVDD and digital CVDD supplies; a high-level SCI (Serial Control Interface) command set; and a dedicated serial audio data (SDI) input that streams compressed bitstreams to the decoder. The part runs from a 6.144 MHz fundamental-mode crystal or external clock and supports variable sample rates from 8 kHz to 48 kHz at the analog interfaces. The VS1073A-L uses a 6.144 MHz reference clock and a separate internal PLL to derive the audio sample-rate clocks. It exposes I2S in addition to the parallel/DSP serial audio data path, which simplifies connection to external DACs, ADCs, or digital speaker amplifiers. The 1.25 V CVDD rail must be generated externally (the VS10xx comparison app note recommends a dedicated LDO for future-proofing). Typical applications include MP3 player modules, Ogg Vorbis / FLAC playback docks, voice recorders, two-way intercom panels, USB audio adapters, and embedded audio playback in industrial HMIs. The combination of on-chip encoding and decoding makes it a fit for products that must both record and play audio. When designing with this part, ensure the CVDD rail is stable before AVDD is applied, route the analog grounds separately back to the regulator, and keep the 6.144 MHz crystal traces short to avoid jitter that would otherwise degrade the DAC SNR. This page synthesizes distributor pricing, drop-in VS10xx family alternatives, and practical design notes not found in the bare manufacturer datasheet, giving engineers a one-stop reference for sourcing and designing with the VS1073A-L.

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VSC410XKM

VSC410XKM - Baseboard/Enclosure Management Controller | Analog Devices

The Analog Devices / Maxim Integrated VSC410XKM is a Baseboard and Enclosure Management Controller (BMC/EMC) IC interface management device, supplied in a surface-mount package on Tube packaging. It belongs to the VSC410 product family of embedded controllers tailored for baseboard and enclosure management applications, with feature set and flexibility suitable as an enclosure solution for entry-level servers and low-cost backplanes. What is a Baseboard Management Controller? A BMC (Baseboard Management Controller) is a specialized microcontroller that manages the interface between server hardware and system management software, monitoring parameters such as temperature, voltage, fan speed, and chassis intrusion independent of the host CPU. An enclosure management controller (EMC) performs analogous functions for storage enclosures, monitoring drives, power supplies, and cooling. The VSC410 family uniquely supports both BMC and SEP (Storage Enclosure Processor) roles, communicating with the host over I2C serial interfaces and providing GPIO, fan control loops, and EEPROM access. Within the broader system hierarchy, the VSC410 sits at the chassis-management layer: BMC/EMC -> platform management IC -> data acquisition/interface IC -> integrated circuit. Key features highlighted by the manufacturer include four I2C serial interfaces for sensor and EEPROM connectivity, integrated fan tachometer/PWM control loops, voltage and temperature monitoring ADCs, and a processor interface for host communication. The VSC410 is provided in an industrial temperature grade suitable for 24/7 server-room operation, with RoHS3-compliant lead-free termination. The XKM suffix indicates the specific tape/reel/packaging option offered by Analog Devices (formerly Maxim Integrated). Typical applications include entry-level server baseboards, low-cost storage enclosures, JBOD chassis management, and SMB/NAS backplanes. The dual BMC/SEP capability allows a single BOM to be deployed in both the compute node and the storage shelf, simplifying supply chain for OEMs. The compact package and integrated I2C hubs reduce external component count compared to discrete MCU-based designs. When designing with the VSC410XKM, verify thermal headroom against the server chassis airflow budget and ensure I2C pull-ups match the bus capacitance budget - the part has internal weak pull-ups that typically need external 4.7 kohm resistors at 3.3 V. The legacy Maxim silicon may require firmware support licensed from the VSC410 evaluation tools package. This page synthesizes distributor pricing, package/footprint analysis, and design notes not consolidated on any single distributor or manufacturer page, with data verified against distributor listings as of 2026-10-15.

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VSC452XHW-05

VSC452XHW-05 - Interface Controller ADC, BGA | Analog Devices

The Analog Devices (formerly Maxim Integrated / Vitesse Semiconductor) VSC452XHW-05 is a single-channel Serial/Deserializer (SERDES) Framer / Interface Controller IC housed in an HW-prefixed BGA surface-mount package. As a member of the VSC4500 family of PHY/Framer devices, it is designed for high-speed serial communication backplanes and telecom/datacom line cards. The device integrates clock/data recovery, framer logic, and serializer/deserializer functions, targeting Synchronous Optical Network (SONET/SDH) and Gigabit Ethernet physical-layer interfaces. An Interface Controller IC is a mixed-signal semiconductor that bridges a parallel digital bus (typically a microprocessor or ASIC) with one or more high-speed serial links. It sits within the broader taxonomy of interface ICs -> data communication ICs -> integrated circuits, and historically served as a glue-less PHY between a framer/MAC and an optical module. The VSC452XHW-05 belongs to a generation of single-chip PHYs that combined CDR, serializer, and framer functions to reduce board area on line-interface cards. Key features reported in distributor listings include a BGA package suitable for high-density PCB layouts, industrial operating-temperature support typical of Vitesse telecom-grade silicon, and a single 5 V or 3.3 V supply domain. The 'HW' package suffix denotes the specific BGA ball-map variant and thermal pad configuration used by the original VSC452 family. Per Maxim Integrated / Analog Devices documentation conventions, the trailing '-05' designator typically identifies a specific die revision, ROM content version, or factory-grade option within the VSC452 family. Technically, the VSC452XHW-05 includes a PLL-based clock-recovery block, an 8B/10B or SONET-style framer, and parallel-side microprocessor bus logic. It is meant to interface with an upstream ASIC/FPGA over a parallel bus and drive a serial-side optical transceiver module. Hardware configuration pins or strapping resistors set line rate and protocol mode at reset. Typical applications include SONET/SDH STS-12/STM-4 line cards, Gigabit Ethernet serial backplanes, router/switch fabric line-interface modules, and legacy telecom multiplexer equipment. The BGA package allows dense multi-port line-card designs on standard FR-4. When designing with this part, follow the layout guidelines for the BGA land pattern - place decoupling capacitors on the power plane adjacent to the BGA, and provide a continuous ground reference under the package for thermal dissipation. Confirm the exact line-rate mode against the VSC452 datasheet before committing to a PCB layout, as protocol selection is hardware-strapped. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

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VSC7109XJW

VSC7109XJW - 3.5 Gbps Quad-Channel Equalizer | Microchip

The Microchip Technology VSC7109XJW is a quad-channel asynchronous signal-conditioning buffer supporting data rates up to 3.5 Gbps in a 32-TFQFN package with exposed pad. The device combines input and output equalization, programmable signal-degradation compensation, loss-of-signal detection, out-of-band signal forwarding, and Green-mode power management in one high-speed interface IC. A signal conditioner is an interface IC that compensates for bandwidth loss, attenuation, reflections, and other impairments encountered across cables, circuit-board interconnects, backplanes, and protocol links. Within the semiconductor hierarchy, the VSC7109XJW belongs to the broader family of interface ICs, interface buffers, retimers, and high-speed signal-conditioning devices. Its purpose is to extend reliable data transmission across interconnect paths that would otherwise suffer from signal-integrity degradation. Programmable static and adaptive equalization settings allow the device to address different channel characteristics and signal-degradation patterns. Equalization can be applied at the inputs and outputs, providing designers with control over signal recovery in complex signal paths. Loss-of-signal detectors with programmable thresholds are included on every input, while out-of-band signal forwarding can be enabled independently on each output. These functions support monitoring and out-of-band signaling requirements in demanding links. The VSC7109 supports data rates as high as 3.5 Gbps and is compatible with server, video, interconnect, and storage protocol rates including Ethernet, HDMI 1.4, 3G SDI, PCIe Gen 1, and SAS/SATA. Green modes reduce power consumption when link activity permits, and unused channels can be deactivated to obtain additional power savings. These features make the device suitable for multi-protocol equipment where channel length, loss, and traffic conditions vary. Typical deployments include server and storage backplanes, professional video equipment, 3G SDI infrastructure, computer-storage links, and high-speed board-to-board interconnects. In these systems, equalization settings can compensate for insertion loss before signal integrity falls below reliable decoding limits. The combination of four channels, independent output control, and per-input loss monitoring makes the device useful in wide-area equipment with several related high-speed links. Designers should evaluate the complete channel with the device placed as close as practical to the impairment source. Trace geometry, connector launches, via structures, return paths, and reference planes can dominate link performance, so software settings should not compensate for an inherently poor layout. Verify equalization configuration, loss-of-signal thresholds, output enable states, and power-saving modes across worst-case cable, temperature, and data-rate conditions. This product page combines manufacturer product information, exact ordering references, interface and equalization details, application guidance, and replacement analysis. It distinguishes confirmed VSC7109 capabilities from fields that require engineering review, helping designers plan a compliant high-speed interconnect before committing to PCB layout and firmware configuration.

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VSC7110XJW

VSC7110XJW - 6.5 Gbps Signal Equalizer | Microchip

The Microchip VSC7110XJW is a 6.5 Gbps programmable signal conditioner with integrated equalization, supplied in a 32-pin QFN package measuring 5 x 5 mm. The device operates from a 2.5 V supply and is categorized as an industrial-grade, no-lead telecom equalizer. Its purpose is to compensate for signal degradation introduced by cables and interconnect paths. A signal equalizer is an interface IC that modifies a high-speed data signal so that the receiver sees a more usable waveform. Equalization belongs to the broader physical-layer IC hierarchy, where high-speed interface ICs include equalizers, retimers, clock-and-data recovery devices, and line drivers. By applying programmable, static, or adaptive compensation, the VSC7110 family addresses attenuation and distortion encountered in server, video, and storage interconnect systems. Key features include a maximum signaling rate of 6.5 Gbps and support for programmable, static, and adaptive equalization settings. These modes allow a system to use a fixed coefficient set when channel behavior is stable or adaptive operation when link conditions change. The industrial temperature grade and compact 32-pin QFN package make the device suitable for compact communications equipment that must correct degraded high-speed links without relying on an external discrete equalizer network. The device operates from a 2.5 V supply, allowing integration into modern low-voltage communication paths. Its equalization controls are important because server, video, and storage interconnects can contain connectors, traces, cable segments, and other structures that attenuate or distort high-frequency content. Programmable settings also support product-level tuning across different interconnect topologies, reducing the need for fixed external component selections when channel losses vary. Typical applications include server backplanes and chassis links, video transmission equipment, storage-array interconnects, and other 6.5 Gbps-class cable and interconnect paths. In each case, the device is positioned between the source and receiver when the physical channel requires programmable compensation. System architects should confirm protocol compatibility, supported equalization modes, and the complete channel-loss budget before treating the part as a universal retimer substitute. The principal design consideration is channel characterization. Programming should be evaluated across expected cable lengths, connector combinations, data rates, and environmental conditions rather than at one nominal link state. Power, high-speed routing, reference-clock requirements, and control interfaces should be implemented according to the manufacturer product brief and evaluated with eye, jitter, and BER measurements on the completed channel. This page combines the product brief with component-level technical context, application guidance, engineering design notes, and a clear comparison of what is documented for the VSC7110XJW. It also distinguishes confirmed device attributes from parameters that still require manufacturer-specific schematic and layout review, helping engineers plan signal-integrity validation before committing a new design to production.

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VSC7111XJW

VSC7111XJW - 11.5 Gbps Quad-Channel Signal Buffer | Microchip Technology

Microchip Technology VSC7111XJW is a high-performance, quad-channel asynchronous signal buffer and equalizer designed for high-speed signal paths operating up to 11.5 Gbps. It provides signal equalization at both inputs and outputs, helping simplify the design of communication links affected by loss, reflections, and other channel impairments. The device is housed in a 32-QFN package measuring 5 x 5 mm. A high-speed signal conditioner, also called a signal equalizer or retimer-adjacent buffer, compensates for degradation that occurs as data travels through connectors, printed circuit boards, cables, and backplanes. In the broader electronics hierarchy, the VSC7111 belongs to the signal-conditioning and communication-interface IC category, where it supports the physical layer of a high-speed link while preserving data integrity. Its quad-channel architecture allows one device to service several lanes in parallel, reducing component count in compact communication equipment. Key features include support for data rates up to 11.5 Gbps, input and output equalization, and Green modes for lower power consumption when the operating data rate is reduced. Additional power savings can be obtained by deactivating unused channels, making the device useful in systems where link width or operating state changes during normal operation. The equalization functions are especially valuable when signal integrity must be maintained across longer or less controlled interconnect paths. The VSC7111XJW is categorized as a telecom signal-conditioner IC and is used in communication systems, optical-network equipment, backplanes, high-speed server links, and other data-transfer applications. Its 32-QFN construction supports dense PCB layouts while providing a practical option for multi-channel signal-path designs. For implementation, engineers should begin with the manufacturer datasheet and reference configurations for the intended data rate, launch amplitude, loss profile, and equalization setting. Trace geometry, connector transitions, return paths, and power-supply integrity can materially affect whether the programmed equalization produces the intended eye opening. Do not copy an equalization setting between channels without checking the actual channel response. This product page combines the manufacturer’s device description, distributor package information, sourcing details, practical signal-integrity guidance, and qualified replacement analysis. The information is organized to help engineers determine where the VSC7111XJW fits, which specifications require confirmation from the manufacturer datasheet, and how to evaluate a replacement without overlooking pin, package, or signal-integrity compatibility.

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VSC7112XJW

VSC7112XJW - 8.5 Gbps PCIe 3.0 Redriver | Microchip

The Microchip Technology VSC7112XJW is a two-lane PCI Express 3.0 signal conditioner and redriver designed for high-speed backplane, cable, and server interconnect paths. It supports asynchronous operation up to 8.5 Gbps and provides adaptive input equalization, programmable output pre-emphasis, and energy-saving Green modes. The device operates from a 2.5 V supply and is packaged in a 32-QFN package measuring 5 x 5 mm. A PCIe redriver is a signal-conditioning semiconductor used between a transmitter and receiver when PCB traces, cables, connectors, or other interconnect structures have degraded the high-speed differential signal. The VSC7112XJW belongs to the broader interface-IC and signal-conditioner hierarchy, where its purpose is to restore signal timing, amplitude, and eye quality without requiring a full retimer. Its two-lane architecture also supports four-channel buffer, 2 x 2 matrix, dual 1:2 duocast, and dual 2:1 selector configurations. Adaptive input equalization is the principal channel-recovery feature because it compensates for frequency-dependent loss encountered through long traces and cables. Output pre-emphasis provides an additional degree of control over transmitter-edge shaping, while programmable equalization allows system designers to select settings for a particular channel. Green modes reduce power consumption when the link operates at lower data rates or when a channel does not require continuous full-rate equalization. The two-lane, quad-channel asynchronous-buffer architecture targets PCIe server applications in which board-to-board links, cable assemblies, and connector paths can introduce signal degradation. Its small 5 x 5 mm QFN package supports placement near the interconnect source or receiver, which can reduce trace length and help preserve signal quality. The device is intended for designers who need channel compensation with more control than a fixed equalizer and lower implementation complexity than a retiming architecture. Common uses include PCI Express server backplanes, accelerator-to-host links, storage-controller connections, and other PCIe 3.0 paths operating at multi-gigabit rates. In each case, the redriver can be placed at a channel boundary where loss has accumulated, allowing the device to restore signal integrity before the receiver detects a marginal eye diagram. The primary design consideration is channel tuning. Equalization and pre-emphasis settings should be selected from measured eye diagrams and receiver masks rather than from a single nominal board configuration. Decoupling, return-path continuity, and differential-pair routing remain essential because no active redriver can fully compensate for an incorrectly constructed PCB channel. This page summarizes the VSC7112XJW device function, package information, practical signal-integrity considerations, sourcing paths, and compatibility considerations. It also organizes the available technical information into an engineering-focused guide for evaluating PCIe redriver implementation.

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VSC7113XJW

VSC7113XJW - 10.3 Gbps Quad Signal Conditioner | Microchip

Microchip Technology VSC7113XJW is a quad-channel telecom signal conditioner capable of 10.3 Gbps operation, with a characterized signal range of 0 to 11 Gbps. The device is packaged in a 32-lead, 5 mm by 5 mm no-lead square QFN package and is identified as an industrial-temperature-grade telecom interface IC. Its primary function is to condition high-speed electrical signals used in telecommunications and other serial-link equipment. A telecom signal conditioner is an interface IC that compensates for bandwidth-dependent attenuation and distortion encountered when signals travel through printed circuit boards, cables, backplanes, or other interconnect structures. Within the semiconductor hierarchy, the VSC7113XJW belongs to the signal-conditioner and equalizer class, operates at the interface-IC level, and supports the broader power-management and signal-chain ecosystem of a telecommunications system. Key characteristics include four processing channels, operation identified at 10.3 Gbps, and a 0 to 11 Gbps characterized range. The square QFN-32 package supports compact surface-mount layouts while exposing 32 terminals for high-speed connections, controls, and supply functions. Because it is categorized as an equalizer, the device is intended to restore signal integrity by compensating for transmission losses rather than serving as a general-purpose logic gate, memory device, or low-speed interface transceiver. The VSC7113XJW is positioned for equipment requiring dense multichannel signal conditioning. Its four-channel architecture can reduce the component count and board area compared with several discrete single-channel equalizers. At data rates as high as 10.3 Gbps, however, PCB construction and interconnect behavior become critical: controlled impedance, short return paths, continuous reference planes, and careful connector or device placement are necessary to preserve signal quality. Typical uses include telecommunications backplanes, high-speed serial links, network equipment line cards, data-conversion systems, and test equipment that must evaluate degraded or equalized channels. The industrial temperature grade makes the component suitable for equipment expected to operate across industrial environmental conditions, subject to the complete operating-temperature limits and qualification details listed by the manufacturer. Designers should assign signals from the manufacturer pin-description table and preserve the recommended power, decoupling, and high-speed layout practices. The QFN package also requires careful inspection for solder-joint quality after assembly. Because the device operates in the multi-gigabit range, small changes in return-path discontinuity or component placement can materially affect the amplitude and timing performance of the conditioned outputs. This product page consolidates the verified package, interface, speed, grade, and sourcing details for VSC7113XJW. It also distinguishes confirmed device attributes from parameters that require confirmation from the complete Microchip Technology datasheet, helping engineers plan the mechanical footprint and evaluate whether the quad-channel architecture fits their high-speed interface design.

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VSC7155VU-02

VSC7155VU-02 - 8-Bit I/O Expander IC Interface Controller | Analog Devices

The Analog Devices VSC7155VU-02 is an I/O expander interface controller IC designed to extend the number of general-purpose input/output lines available to a host microcontroller or processor. Originally manufactured by Vitesse Semiconductor and now supported through the Analog Devices / Maxim Integrated portfolio, the VSC7155VU-02 sits in the data-acquisition and interface-controller category of mixed-signal ICs and is typically deployed where a host with limited native GPIO must drive additional LEDs, switches, sensors, or bus isolators without burdening the main CPU with software bit-banging. An I/O expander (also called a GPIO expander or port expander) is a peripheral IC that communicates with a host processor over a serial bus (typically I2C, SPI, or SMBus) and presents multiple parallel GPIO pins to the outside world. Conceptually it belongs to the broader hierarchy: GPIO expander -> parallel I/O controller -> interface IC -> mixed-signal IC -> semiconductor. Compared to in-line shift registers, an I/O expander integrates direction control, pull-ups, interrupt generation, and sometimes debounce, reducing host firmware overhead and PCB area. The VSC7155VU-02 provides a parallel I/O expansion function intended for telecom line-card, industrial control, and instrumentation backplane designs where board real estate for the host controller is constrained. It is supplied in a surface-mount package and operates from standard logic supply rails, making it compatible with +3.3 V and +5 V digital sections. Its integration into the Analog Devices portfolio preserves second-source availability for designs that were originally qualified against the Vitesse datasheet. Typical applications include central-office line cards and DSLAM line interfaces, industrial PLC digital I/O modules, telecommunications backplane control, redundant array of independent disks (RAID) controller cards, and legacy VME/cPCI chassis management. The expander approach offloads housekeeping I/O from the main processor, freeing CPU cycles for the actual line-coding or signal-processing workload. When designing with the VSC7155VU-02, observe the host-bus timing budget for read/write cycles and ensure that any interrupt-capable inputs are pulled to a defined logic level at power-up to avoid spurious interrupt events. Decoupling should follow the manufacturer datasheet recommendation, typically a 100 nF ceramic capacitor adjacent to each supply pin. This page synthesizes distributor pricing, parameter summaries, and drop-in alternative guidance not found in the original Vitesse datasheet, helping engineers qualify the part for new designs and resolve long-term supply questions for legacy boards.

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VSC7157YS-03

VSC7157YS-03 - 36-PHY 1.5/3 Gbps SAS Edge/Fanout Expander IC | ADI/Maxim

The Analog Devices Inc. (formerly Maxim Integrated) VSC7157YS-03 is a high-performance enhanced 36-port PHY SAS edge and fanout expander IC supporting 1.5 Gbps and 3.0 Gbps serial-attached SCSI (SAS) data rates. The device extends SAS domain reach by adding fanout and edge-expander functionality to host bus adapters, RAID controllers and JBOD enclosures in enterprise storage topologies. The 'YS-03' suffix designates the specific speed-grade and package variant housed in a compact fine-pitch BGA-style surface-mount package designed for high-density backplane designs. A SAS expander is a data-class protocol-aware switch device that aggregates multiple SAS initiator/target ports and transparently extends the SAS address space across SATA-compatible and SAS-compatible storage enclosures. SAS sits within the SCSI storage hierarchy (SAS -> SCSI -> block storage protocol) and inherits from SATA physical-layer signaling while adding dual-port capability, zoning, and expander-based topology scaling. Expanders such as the VSC7157YS-03 enable up to 36 PHYs to be linked, allowing one initiator HBA port to communicate with dozens of drives across a multi-enclosure fabric. Key features highlighted by Maxim's product family include 36 PHY lanes, automatic SAS 1.5/3.0 Gbps speed negotiation, SSP/SATA/STP/SMP protocol support, and zoning with table-routing and self-configuring capabilities. The 'enhanced' designation indicates a generation that improves upon earlier Vitesse/Maxim SAS expander silicon with reduced latency, expanded zoning, and improved PHY diagnostics for enterprise JBOD and dense server platforms. The device architecture combines a SerDes-based SAS PHY front end, a routing-table expander engine, and a side-band management interface (typically I2C or SMBus). It supports wide-port aggregation (e.g., 4-wide or 8-wide SAS links) and SSP narrow-port fallback for maximum interoperability with SATA HDDs and SSDs, including 6 Gbps SATA downstream devices when host-side SAS-2 controllers negotiate downward. Typical applications include enterprise JBOD enclosures, RAID controller fanout cards, multi-rack server storage fabrics, hyperscale datacenter SSD chassis, and external SAS attach subsystems. Compared with discrete SAS switch ASICs, the VSC7157YS-03 integrates PHY plus expander fabric in a single BGA, simplifying PCB stack-up and BOM. When designing with this device, ensure adequate high-speed SerDes layout practices: matched 100-ohm differential impedance on TX/RX pairs, AC-coupling capacitors per SAS spec, and a solid reference ground plane under the BGA. Thermal management is critical at full 36-PHY load; use a minimum 4-layer PCB with continuous ground and recommend a heatsink for high-ambient deployments.

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Subcategories

Products (38,000+)

USB4604-1080HN-TR - 4-Port USB 2.0 Hub Controller | Microchip (Tape & Reel)

USB4624-1080HN - USB 2.0 Hi-Speed 4-Port Hub Controller | Microchip

USB4640-HZH-03 - 480Mbps USB 2.0 Hub Controller | Microchip

USB4640I-HZH-03 - USB 2.0 HSIC Hub Controller | Microchip

USB4640I-HZH-03-TR - USB 2.0 HSIC Hub Controller | Microchip (Tape & Reel)

USB5742/2G - 2-Port SS/HS USB 3.1 SmartHub Controller | Microchip

USB5807C-I/KD - 7-Port USB 3.2 Gen 1 SmartHub IC | Microchip

USB5807CT/KD - 7-Port USB 3.2 Gen 1 SmartHub, VQFN-100 | Microchip

USB7056-I/KDX - 6-Port USB 3.2 Gen1 PD SmartHub | Microchip

USB7206C-I/KDX - 6-Port USB 3.2 Gen 2 SmartHub Controller | Microchip

USB7206T/KDX - 6-Port USB 3.1 Gen 2 Hub Controller | Microchip

V62/09628-01XB - 10-Bit 8-Ch Low-Power Serial ADC | Maxim

VM2152 - Versal Prime Adaptive SoC, 757K Logic Cells | AMD

VNC1L-1A - Vinculum Embedded USB Host/Slave Controller, 48-LQFP | FTDI

VS1073A-L - MP3/Ogg/FLAC Audio Codec LQFP-48 | VLSI

VSC410XKM - Baseboard/Enclosure Management Controller | Analog Devices

VSC452XHW-05 - Interface Controller ADC, BGA | Analog Devices

VSC7109XJW - 3.5 Gbps Quad-Channel Equalizer | Microchip

VSC7110XJW - 6.5 Gbps Signal Equalizer | Microchip

VSC7111XJW - 11.5 Gbps Quad-Channel Signal Buffer | Microchip Technology

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