10AX090R3F40E2SG vs 10AX090R3F40E2LG Comparison
Detailed side-by-side comparison of 10AX090R3F40E2SG by Intel and 10AX090R3F40E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AX090R3F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $5,400.00 | $5,750.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Logic Array Blocks (LABs) | 339,620 | — |
| Embedded Memory (Bits) | 59,234,304 | — |
| DSP Blocks | 2,713 (18x19 multipliers) | Hardened fixed/floating-point DSP blocks (on-die) |
| User I/O | 342 | — |
| Process Technology | 20 nm | 20 nm |
| Core Voltage | 0.85 V | — |
| Auxiliary Voltage | 0.9 V | — |
| Speed Grade | -E2 (extended, mid-tier) | — |
| Temperature Grade | Extended (-40C to +100C) | — |
| Package | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) | 1517-Ball FCBGA |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| MSL Level | 3 (168 hours) | — |
| RoHS Status | Compliant | Compliant |
| Embedded Memory | — | 59,234,304 bits |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Transceivers | — | Multi-gigabit serial transceivers (on-die) |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |