10AX090R3F40E2SG vs 10AX090R3F40E2LG Vergleich
Detaillierter Direktvergleich von 10AX090R3F40E2SG von Intel und 10AX090R3F40E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX090R3F40E2SG | 10AX090R3F40E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.400,00 | $5.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements | 900,000 | 900,000 |
| Adaptive Logic Modules (ALMs) | 339,620 | — |
| Logic Array Blocks (LABs) | 339,620 | — |
| Embedded Memory (Bits) | 59,234,304 | — |
| DSP Blocks | 2,713 (18x19 multipliers) | Hardened fixed/floating-point DSP blocks (on-die) |
| User I/O | 342 | — |
| Process Technology | 20 nm | 20 nm |
| Core Voltage | 0.85 V | — |
| Auxiliary Voltage | 0.9 V | — |
| Speed Grade | -E2 (extended, mid-tier) | — |
| Temperature Grade | Extended (-40C to +100C) | — |
| Gehäuse | 1517-ball FCBGA, F40 (40x40 mm, 1.0 mm pitch) | 1517-Ball FCBGA |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 (168 hours) | — |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory | — | 59,234,304 bits |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| Transceivers | — | Multi-gigabit serial transceivers (on-die) |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |