10AX115R2F40E2LG vs 10AX090R3F40E2LG Comparison
Detailed side-by-side comparison of 10AX115R2F40E2LG by Intel and 10AX090R3F40E2LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AX115R2F40E2LG | 10AX090R3F40E2LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $10,300.00 | $5,750.00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,856 | — |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks (18x19 Multipliers) | 1,518 | — |
| User I/O Pins | 342 | — |
| Transceivers | 24 (up to 17.4 Gbps, 28.3 Gbps with -3 speed grade) | Multi-gigabit serial transceivers (on-die) |
| PCIe Hard IP | Gen3 x8 hard IP blocks | — |
| Memory Controllers | 2x hard DDR4/DDR3/RLDRAM3 controllers | — |
| PLLs | 24 fractional PLLs | — |
| Speed Grade | -2 | — |
| Temperature Grade | E2 (Extended) | — |
| Package | 1517-ball FCBGA (F40) | 1517-Ball FCBGA |
| Process Technology | TSMC 20 nm | 20 nm |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 900,000 |
| Embedded Memory | — | 59,234,304 bits |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| DSP Blocks | — | Hardened fixed/floating-point DSP blocks (on-die) |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |