10AX115R2F40E2LG vs 10AX090R3F40E2LG Vergleich
Detaillierter Direktvergleich von 10AX115R2F40E2LG von Intel und 10AX090R3F40E2LG von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | 10AX115R2F40E2LG | 10AX090R3F40E2LG |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10.300,00 | $5.750,00 |
| Family | Arria 10 GX | Arria 10 GX |
| Logic Elements (LE) | 1,150,000 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory Bits | 68,857,856 | — |
| Embedded Memory Blocks (M20K) | [DATA_NEEDED: M20K count] | — |
| DSP Blocks (18x19 Multipliers) | 1,518 | — |
| User I/O Pins | 342 | — |
| Transceivers | 24 (up to 17.4 Gbps, 28.3 Gbps with -3 speed grade) | Multi-gigabit serial transceivers (on-die) |
| PCIe Hard IP | Gen3 x8 hard IP blocks | — |
| Memory Controllers | 2x hard DDR4/DDR3/RLDRAM3 controllers | — |
| PLLs | 24 fractional PLLs | — |
| Speed Grade | -2 | — |
| Temperature Grade | E2 (Extended) | — |
| Gehäuse | 1517-ball FCBGA (F40) | 1517-Ball FCBGA |
| Process Technology | TSMC 20 nm | 20 nm |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements | — | 900,000 |
| Embedded Memory | — | 59,234,304 bits |
| User I/O Count | — | 342 |
| Core Supply Voltage | — | 0.9 V |
| Package Type | — | Flip-Chip Ball Grid Array |
| Number of Terminals | — | 1517 |
| DSP Blocks | — | Hardened fixed/floating-point DSP blocks (on-die) |
| Memory Interfaces | — | Hardened DDR3/DDR4 memory controller IP |
| Hard IP | — | PCI Express Gen3, 10/40/100 GbE Ethernet |
| Configuration | — | Partial reconfiguration supported |