10AX115U3F45E2LG vs 10AX115U4F45E3LG Comparison
Detailed side-by-side comparison of 10AX115U3F45E2LG by Intel and 10AX115U4F45E3LG by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10AX115U3F45E2LG | 10AX115U4F45E3LG |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $8,500.00 | $5,650.00 |
| Series | Arria 10 GX | — |
| Family | Arria 10 | Arria 10 GX |
| Logic Elements | 1,150,000 | 1,150,000 |
| Embedded Memory Bits | 68,857,856 | 68,857,856 |
| User I/O Count | 480 | — |
| Speed Grade | U3 (medium-performance, transceiver-focused) | E3 (fastest commercial) |
| Package Code | F45 (45 × 45 mm FCBGA) | — |
| Package Type | 1932-ball FCBGA (Flip-Chip BGA) | — |
| Process Technology | 20 nm TSMC | — |
| Transceiver Data Rate | Up to 28.05 Gbps | — |
| DSP Blocks | Variable-precision, 1.5 TFLOPs FP32 | 1,518 (variable-precision) |
| PCIe Hard IP | Gen3 x8/x16 | — |
| Memory Interfaces | DDR4, DDR3, QDR IV, RLDRAM 3 | — |
| Operating Temperature | 0C to +100C (Industrial, E2 grade) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Method | SRAM-based, loaded via JTAG / AS / PS | — |
| RoHS Status | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| User I/Os | — | 480 |
| Package | — | 1932-ball FCBGA |
| Process Node | — | 20 nm TSMC |
| Transceiver Channels | — | Up to 96 |
| Max Transceiver Data Rate | — | 17.4 Gbps |
| Hard PCIe Gen3 Cores | — | Yes (x8 capable) |
| Hard Memory Controllers | — | Yes (DDR3/DDR4, QDR IV, RLDRAM 3) |
| Temperature Grade | — | L (extended commercial) |
| MSL Level | — | [DATA_NEEDED: MSL level] |