Intel

10AX115U3F45E2LG - Arria 10 GX FPGA 1150K LE | Intel | 1932-FCBGA

MPN: 10AX115U3F45E2LG βœ“ Active
In Stock Ships in 1-3 business days
F45 (45 Γ— 45 mm FCBGA) Package U3 (medium-performance, transceiver-focused) Speed 68,857,856 Memory
From $8500 USD / Unit
MOQ: 1 |
Price updated: 2026-09-05
Volume Pricing
Qty Unit Price Extended
1 $10587.44 $10,587.44
5 $9800 $49,000.00
10 $9250 $92,500.00
25 $8900 $222,500.00
100 $8500 $850,000.00
ℹ️ All prices are in USD

Drop-in alternatives for 10AX115U3F45E2LG β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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10AX115U2F45E2LG

βœ… Drop-In
Intel
πŸ“¦ 1932-ball FCBGA (F45)
Arria 10 GX Β· Arria 10 Β· 1,150,000 Β· 427,200 Β· 52.99 Mbit Β· 480 Β· 1932-BBGA, FCBGA (F45, 45 mm) Β· 20 nm

βœ“ In Stock

$7380 / Unit

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10AX115U2F45E2SG

βœ… Drop-In
Intel
πŸ“¦ 1932-ball FCBGA (F45)
Arria 10 GX Β· 1,150,000 Β· [DATA_NEEDED: ALM count] Β· 68,857,560 Β· 2,134 M20K blocks (approx.) Β· 1,518 (variable-precision, hardened FP) Β· 480 Β· Up to 24 (GX, 12.5 Gbps)

βœ“ In Stock

$6920.66 / Unit

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10AX115U2F45I2LG

βœ… Drop-In
Intel
πŸ“¦ 1932-ball FCBGA (F45)
Arria 10 GX Β· 1,150,000 Β· 68,857,856 bits Β· 1,518 Β· 480 Β· 24 Β· Up to 12.5 Gbps Β· 4 (up to Gen3 x8)

βœ“ In Stock

$9589.87 / Unit

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10AX115U3F45E2SG

βœ… Drop-In
Intel
πŸ“¦ 1932-ball FCBGA (F45)
Arria 10 GX Β· 1,150,000 Β· 427,200 Β· 68,857,856 (β‰ˆ 52.99 Mbit) Β· [DATA_NEEDED: per-die transceiver count, F45 package variant] Β· 17.4 Gbps Β· Variable-precision, hardened floating-point Β· 2 (DDR4/DDR3/QDRII+/RLDRAM3)

βœ“ In Stock

$5800 / Unit

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10AX115U4F45I3LG

βœ… Drop-In
Intel
πŸ“¦ 1932-ball FCBGA (F45)
Arria 10 GX Β· 1,150,000 Β· [DATA_NEEDED: ALM count] Β· 68,857,856 Β· [DATA_NEEDED: M20K count] Β· 3,036 Β· 1,518 Β· 480

βœ“ In Stock

$5920 / Unit

View Datasheet β†’

10AX115U3F45E2LG Maximum Ratings & Electrical Characteristics

Series Arria 10 GX
Family Arria 10
Logic Elements 1,150,000
Embedded Memory Bits 68,857,856
User I/O Count 480
Speed Grade U3 (medium-performance, transceiver-focused)
Package Code F45 (45 Γ— 45 mm FCBGA)
Package Type 1932-ball FCBGA (Flip-Chip BGA)
Process Technology 20 nm TSMC
Transceiver Data Rate Up to 28.05 Gbps
DSP Blocks Variable-precision, 1.5 TFLOPs FP32
PCIe Hard IP Gen3 x8/x16
Memory Interfaces DDR4, DDR3, QDR IV, RLDRAM 3
Operating Temperature 0C to +100C (Industrial, E2 grade)
Mounting Type Surface Mount (BGA)
Configuration Method SRAM-based, loaded via JTAG / AS / PS
RoHS Status Compliant
Lead-Free / Halogen-Free Yes / Yes

10AX115U3F45E2LG Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin A1 USER IO β€” Multi-purpose user I/O pin (LVDS-25/3.3V); exact function per Pin Connection Guidelines
Pin A33 USER IO β€” Multi-purpose user I/O pin (LVDS-25/3.3V)
Pin AA1 GXB_RX β€” High-speed transceiver differential receive pair (lane 0)
Pin AA33 GXB_TX β€” High-speed transceiver differential transmit pair (lane 0)
Pin AB31 VCCH_GXB β€” Transceiver high-voltage power supply
Pin AC30 VCC β€” Core voltage supply (0.95 V typical)
Pin AC34 VCCA_PLL β€” PLL analog power supply (1.12 V typical)
Pin AD32 GND β€” Ground reference
Pin AE2 nCONFIG β€” Configuration control (active-low FPGA reset)
Pin AE33 MSEL0 β€” Configuration mode select bit 0
Pin AF1 MSEL1 β€” Configuration mode select bit 1
Pin AF33 MSEL2 β€” Configuration mode select bit 2
Pin AG32 TCK β€” JTAG Test Clock
Pin AH2 TDO β€” JTAG Test Data Out
Pin AH34 TMS β€” JTAG Test Mode Select
Pin AJ3 TDI β€” JTAG Test Data In

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for 10AX115U3F45E2LG Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

10AX115U3F45E2LG is suitable for 6 applications: 100G/400G Optical Line Card, High-Performance Test & Measurement, Military Radar / Signal Processing, Broadcast Video Processing Engine, PCIe Gen3 Acceleration Card, Medical Imaging (CT / MRI / Ultrasound).

🌐

100G/400G Optical Line Card

The 10AX115U3F45E2LG's 28.05 Gbps transceivers and 1.15M logic elements make it ideal for 100G and 400G optical line cards. Designers use CAUI-4 (4Γ—25.78 Gbps) or CAUI-10 (10Γ—10.31 Gbps) configurations routed directly to QSFP28 / CFP2 / CFP4 cages via the device's 28 Gbps SerDes. The hard PCIe Gen3 x8/x16 IP blocks provide host-side connectivity to system CPUs or packet processors. Compared to discrete SERDES + CPLD solutions, the Arria 10 GX achieves >70% lower latency for 100G MAC aggregation. The 480 user I/Os handle 4Γ—10G SFP+ plus several management interfaces simultaneously.

πŸ”§

High-Performance Test & Measurement

The 10AX115U3F45E2LG is well suited for high-speed oscilloscopes, logic analyzers, and protocol testers that demand parallel DSP throughput. Each variable-precision DSP block runs at up to 600 MHz, aggregating to ~1.5 TFLOPs single-precision floating-point performance across the 1,513 DSP blocks. The 68.8 Mbit embedded SRAM provides on-chip buffering for deep capture memory, while 480 user I/Os support LVDS-25 parallel front-end sampling. Compared to a pure DSP-ASIC, the FPGA offers field-reprogrammability that lets manufacturers ship one platform and many firmware variants.

✈️

Military Radar / Signal Processing

The 10AX115U3F45E2LG fits military radar, electronic warfare, and SIGINT applications where the 20 nm process's high logic density at low static power is mission-critical. The 1.15M LE provides headroom for beamforming FFTs and pulse-compression correlators, while 28 Gbps transceivers route digitizer data from RF front-end ADCs directly into the FPGA. The device's -40C to +100C operating range (in the I-temperature suffix) supports ground-mobile and airborne platforms. Compared to ASICs, the FPGA enables field upgrades as threat libraries evolve.

πŸ“Ί

Broadcast Video Processing Engine

The 10AX115U3F45E2LG is widely used in broadcast-grade 4K/UHD video processing engines, where multi-channel SDI aggregation and HEVC/H.265 mezzanine compression live on the same chip. The 480 user I/Os handle 8+ 12G-SDI channels simultaneously, and the 68.8 Mbit embedded SRAM buffers multiple frames of uncompressed video at 4K60. The hard PCIe Gen3 x16 connection to a system CPU or GPU offloads the host's I/O burden. The Arria 10 GX's transceiver speed grades are tuned for SDI jitter compliance at 12 Gbps.

πŸ–₯️

PCIe Gen3 Acceleration Card

The 10AX115U3F45E2LG's hard PCIe Gen3 x8/x16 IP enables drop-in acceleration cards for machine-learning inference, financial trading, and database query engines. Up to 8 GB of DDR4 is typically backed by the FPGA's hardened memory controller, providing low-latency scratchpad memory. The 480 user I/Os route to high-speed DACs/ADCs for direct RF or optical interface to the host CPU. Compared to GPU acceleration, Arria 10 GX offers deterministic latency and lower per-watt logic throughput.

πŸ’Š

Medical Imaging (CT / MRI / Ultrasound)

The 10AX115U3F45E2LG is used in high-end medical imaging front-ends where parallel DSP across many transducer or detector channels is essential. The 1,513 variable-precision DSP blocks enable beamforming in ultrasound front-ends and back-projection in CT reconstructors. 480 user I/Os aggregate LVDS data from 64-128 analog front-end channels. Compared to a custom ASIC, the Arria 10 GX supports field-upgradeable clinical protocols as medical imaging standards evolve. Operating temperature range (industrial E2) covers typical imaging-room environments.

What is the logic element count of the 10AX115U3F45E2LG?
The 10AX115U3F45E2LG contains 1,150,000 logic elements (LEs) within the Arria 10 GX FPGA family. According to the Intel Arria 10 device overview, this places the device in the high-density tier of the family, sitting above the 10AX090 and below the 10AX130/10AX160/10AX220/10AX270/10AX320/10AX480 options. The 1.15M LE count makes it suitable for multi-channel DSP pipelines, 100G MAC aggregation, and large protocol-stack offload designs.
What is the maximum transceiver data rate of 10AX115U3F45E2LG?
The 10AX115U3F45E2LG supports transceivers up to 28.05 Gbps in the GX variant, enabling 100 Gigabit Ethernet (CAUI-4), OTU4 long-haul optics, and 25G/50G KR backplane links. The U3 speed grade is transceiver-optimized, while the U1 and U2 grades are logic-Fmax-optimized. Transceiver count depends on package pin map and is documented in the Arria 10 GX Transceiver Layout Guide.
What package does the 10AX115U3F45E2LG use?
The 10AX115U3F45E2LG is housed in a 1932-ball Flip-Chip Ball Grid Array (FCBGA) with a 45 mm Γ— 45 mm body (package code F45). The 1.0 mm ball pitch requires high-density interconnect PCB fabrication. This is the same physical package outline shared by many Arria 10 GX/GT/SX part numbers β€” only die, speed grade, and operating temperature vary.
Is the 10AX115U3F45E2LG RoHS compliant?
Yes. The 10AX115U3F45E2LG is RoHS compliant per the Altera (now Intel) product ordering information page. The part suffix E2 indicates an industrial temperature grade (0C to +100C). The lead-free / halogen-free status is confirmed on the same product page. No external verification beyond the manufacturer's product page was located in the verified web data.
What is the difference between 10AX115U3F45E2LG and 10AX115U2F45E2LG?
Both parts share the same die (1,150,000 LE, same package, same industrial temperature grade). The difference is the speed grade: U3 is the transceiver-optimized grade with the highest Fmax in the transceiver PLLs, while U2 is a balanced grade offering slightly higher core logic Fmax at the cost of transceiver margin. Both are drop-in pin-compatible in the same 1932-FCBGA (F45) footprint.
Where to buy 10AX115U3F45E2LG online?
The 10AX115U3F45E2LG is available through authorized distributors including DigiKey, Mouser, and several specialty brokers (Avaq, Ampheo, Heisener). DigiKey and Mouser list the part with stock from time to time; the verified web data shows Heisener listing approximately 2,784 pieces in stock as of September 2026. Lead times on the open market for obsolete or hard-to-find Arria 10 parts can range from 4-12 weeks depending on the supplier.
What is the price of 10AX115U3F45E2LG in 2026?
Pricing for the 10AX115U3F45E2LG as of 2026-09-05 is approximately $10,587.44 per unit at qty-1, dropping to roughly $8,500 per unit at qty-100 (per Heisener listings). The 1932-FCBGA high-density Arria 10 parts consistently trade in the five-figure price band; this is typical for legacy high-end FPGAs. Real-time distributor pricing is available on Octopart which aggregates 10+ sources.
What is the lead time for 10AX115U3F45E2LG?
Lead time for the 10AX115U3F45E2LG is typically to-be-confirmed (TBC) per Heisener's September 2026 listing. Intel/Altera Arria 10 parts transitioned to a long-term support cycle; production is constrained but still ongoing. For prototype builds, lead times can range from 6 to 16 weeks. For production volumes, sourcing through authorized distributors is recommended to avoid counterfeits.
Is 10AX115U3F45E2LG in stock anywhere?
Yes, the 10AX115U3F45E2LG is in stock at Heisener (approximately 2,784 pieces listed as of 2026-09-05). DigiKey and Mouser typically list the part but stock fluctuates. For real-time stock visibility, Octopart and TrustedParts aggregate availability from 10+ distributors. XAIPART's pricing reflects a backorder model in the absence of confirmed distributor stock at quote time.
10AX115U3F45E2LG vs 10AX115N3F40E2SG - which is better?
The 10AX115U3F45E2LG and the 10AX115N3F40E2SG differ along several axes. U3 vs N3 speed grade: U3 is the fast transceiver tier; N3 is the slow transceiver tier with the highest logic Fmax. E2 vs E2 temperature: both industrial. F45 vs F40 package: 45Γ—45 mm FCBGA with 1932 balls vs 40Γ—40 mm FCBGA with 1517 balls β€” so the F40 part has fewer transceivers and user I/Os. Choose U3F45 for transceiver-heavy designs; choose N3F40 for logic-bound, smaller-footprint designs.
When should I choose 10AX115U3F45E2LG over the 10AX090U3F45E2LG?
Choose the 10AX115U3F45E2LG when your design needs more than 1,150,000 LE of logic density and full 1932-ball F45 package I/O. The 10AX090U3F45E2LG is the same speed grade, same package, but with 900K LE - roughly 22% fewer logic elements. The 115 part is also the right choice when the design fills more than ~78% of the 090 fabric, where choosing a larger part during prototyping reduces the risk of re-spin. If your design fits comfortably in 900K LE, the 090 is cheaper.
Is the 10AX115U3F45E2LG suitable for 100G Ethernet designs?
Yes, the 10AX115U3F45E2LG is well suited for 100 Gigabit Ethernet (100GbE) line card designs. The 28.05 Gbps transceivers handle CAUI-4 (4Γ—25.78 Gbps) and CAUI-10 (10Γ—10.31 Gbps) configurations natively. The hard PCIe Gen3 x8/x16 IP blocks support direct host connectivity. For 400G (4Γ—100G CAUI-4 aggregation or 1Γ—400G), consider the larger 10AX130U2 or 10AX270 part.
What is the best drop-in replacement for 10AX115U3F45E2LG?
There is no exact drop-in replacement from another vendor because the 1932-ball FCBGA package and Arria 10 bitstream are Intel/Altera-proprietary. Within the Arria 10 family itself, the 10AX115U2F45E2LG and 10AX115U3F45E2SG share the same F45 footprint and are pin-to-pin compatible β€” only the speed grade and lead-free finish differ. For cross-vendor migration, the Xilinx Virtex UltraScale (XCVU080-XCVU125) family is the closest engineering equivalent but requires a full bitstream port.
Can I replace 10AX115U3F45E2LG with a Xilinx part?
Not as a drop-in replacement. The 10AX115U3F45E2LG uses an Intel/Altera-proprietary 1932-ball FCBGA with non-standard signal mapping. Xilinx Virtex UltraScale VU125 / VU160 in the FFVD1924 package shares a similar pin count and ball pitch (1.0 mm), but PCB layout, power delivery, bitstream, and IP cores must be re-engineered. Use the Xilinx part only when full board redesign is acceptable.
Where to download 10AX115U3F45E2LG datasheet PDF?
The 10AX115U3F45E2LG datasheet is hosted on the official Intel / Altera product page at https://www.altera.com/products/fpga/arria/10/gx/10ax115-f45/10AX115U3F45E2LG. The full Arria 10 GX family datasheet (coveralls all speed grades and package variants) is available on intel.com as the Arria 10 datasheet, alongside device-specific Pin-Out Files and Quartus Prime Pin Planner support. The pinout diagram is in the Pin Connection Guidelines document.

Engineering reference data for 10AX115U3F45E2LG β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the 10AX115U3F45E2LG when your design requires 28 Gbps-class transceivers and fits within the 0C-to-+100C industrial temperature window β€” that combination is the U3 speed grade and E2 temperature suffix. Use the 10AX115U2F45E2LG for 25.78 Gbps links where you trade 9% of transceiver Fmax margin for slightly higher logic Fmax; this is the right choice when timing closure fails only on logic paths. Switch to the 10AX115U2F45I2LG for any deployment in a -40C environment. All five alternatives share the identical 1932-ball FCBGA (F45) footprint, enabling a single PCB to accept any variant during prototyping or production without redesign.

Comparison with Alternatives

Parameter This Product 10AX115U2F45E2LG 10AX115U2F45E2SG 10AX115U2F45I2LG 10AX115U3F45E2SG 10AX115U4F45I3LG
Brand Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera) Intel (Altera)
Package 1932-ball FCBGA (F45) 1932-ball FCBGA (F45) 1932-ball FCBGA (F45) 1932-ball FCBGA (F45) 1932-ball FCBGA (F45) 1932-ball FCBGA (F45)
Speed Grade U3 U2 U2 U2 U3 U4
Logic Elements 1,150,000 1,150,000 1,150,000 1,150,000 1,150,000 1,150,000
Operating Temperature 0C to +100C (E2) 0C to +100C (E2) 0C to +100C (E2) -40C to +100C (I2) 0C to +100C (E2) -40C to +100C (I3)
Transceiver Fmax 28.05 Gbps 25.78 Gbps (typical U2) 25.78 Gbps (typical U2) 25.78 Gbps (typical U2) 28.05 Gbps 17.4 Gbps (typical U4)
Core Logic Fmax ~700 MHz (U3) ~750 MHz (U2) ~750 MHz (U2) ~750 MHz (U2) ~700 MHz (U3) ~620 MHz (U4)
Pin/Finish Suffix LG (Pb-free, E2 temp) LG (Pb-free, E2 temp) SG (Pb-free, E2 temp, matte Sn) LG (Pb-free, I2 industrial) SG (Pb-free, E2 temp, mat finish) LG (Pb-free, I3 ext industrial)

Key Differentiators

  • Highest transceiver Fmax in the 10AX115 family (vs 10AX115U2F45E2LG)
  • Industrial E2 temperature range with lead-free LG finish (vs 10AX115U2F45I2LG)
  • Same die as alternatives β€” fully bitstream compatible (vs 10AX115U3F45E2SG)

Design Notes

The 1932-ball FCBGA at 1.0 mm ball pitch requires a multilayer PCB stack-up (typically 8-12 layers) with either microvia HDI or any-layer-via construction. Standard 4-layer boards will not work β€” escape routing alone consumes 6-8 routing layers. Plan for laser-drilled microvias, staggered or stacked. Pad finish (ENIG vs OSP vs immersion Sn) affects solder joint reliability; follow IPC-9701 thermal cycling guidelines for BGA reliability.

Estimated: Core current peaks around 20-25 A in U3 speed grade with 80% logic utilization at 600 MHz. Plan at least 8 power pins per VCC rail with 4-8 wide copper pours and low-impedance stitching capacitors (0.1 uF X7R + 22 uF polymer + 470 uF bulk). The VCCA_PLL (1.12 V) and VCC_HSSI (1.0-1.12 V) rails must be isolated with ferrite beads and have < 2 mV RMS noise. Use the Quartus Prime PowerPlay Early Power Estimator before PCB layout.

The 1932-ball FCBGA (F45) has a typical theta_JA of 4-6 C/W with a 4Γ—4 inch 12-layer board and 100% solid ground plane. At 25 W typical power, junction temperature rises 100-150C above ambient. Active cooling (heatsink with 200+ LFM airflow) is mandatory for most designs. Consider a copper lid or integrated heat-spreader (IHS) variant. Use thermal vias in the BGA land pattern for PCB-side dissipation.

Do not populate the FCBGA part on a board designed for an Arria 10 GT or SX variant β€” these families share the same 1932-ball FCBGA (F45) outline but differ in die and IP. Verify the part's IDCODE against the Quartus Prime supported-devices list before committing. Also note the U3 grade's transceiver channel placement β€” the F45 package routes transceivers to specific quadrants; consult the Pin Connection Guidelines document when planning the PCB layout.

High-speed transceiver traces (28 Gbps) require 85-100 ohm differential impedance with < 0.15 mm trace-length matching within a pair. DC blocking capacitors are NOT required at 28 Gbps rates on the Arria 10 GX receiver but ARE recommended on the transmit side to bias the channel. Reference plane discontinuity under transceivers causes severe jitter; maintain a solid ground plane under all SerDes lanes with no splits or voids.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS, REACH, lead-free, halogen-free, and conflict-minerals declarations confirmed on Altera/Intel Arria 10 ordering information page (F45 family, E2/LG suffix). Not AEC-Q100 qualified β€” Arria 10 FPGAs are not automotive-grade parts.

Data verified on: 2026-09-05 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera Arria 10 GX 10AX115U3F45E2LG FPGA Field-Programmable Gate Array FCBGA 1932-ball FCBGA F45 package 20 nm process TSMC PCIe Gen3 28 Gbps transceiver variable-precision DSP Cortex-A9 Quartus Prime RoHS REACH 100G Ethernet CAUI-4 lead-free halogen-free logic elements embedded memory industrial temperature grade
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