10M02DCU324A7G vs 10M02DCV36C7G Comparison
Detailed side-by-side comparison of 10M02DCU324A7G by Intel and 10M02DCV36C7G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | 10M02DCU324A7G | 10M02DCV36C7G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $6.30 | $2.34 |
| Family | MAX 10 | — |
| Logic Elements (LE) | 2,000 | — |
| Embedded Memory | 110,592 bits | 110,592 bits |
| User I/O Count | 160 | — |
| Embedded 18x18 Multipliers | 16 | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| User Flash Memory | Integrated (on-chip flash configuration) | — |
| Integrated ADC | 12-bit, 1 Msps+, successive approximation | — |
| Core Voltage | 1.15 V to 1.25 V | — |
| Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Operating Junction Temperature | -40 C to +125 C (TJ) | — |
| Package Type | 324-UBGA (Ultra FineLine BGA) | — |
| Package Dimensions | 15 x 15 mm | — |
| Mounting Type | Surface Mount | Surface Mount |
| Process Technology | 55 nm embedded flash (TSMC) | 55 nm |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| Device Type | — | Non-volatile field-programmable gate array |
| Series | — | MAX 10 |
| Logic Elements | — | 2,000 |
| I/O Pins | — | 27 |
| Operating Voltage | — | 1.2 V |
| Package | — | 36-WFBGA, WLCSP |
| FPGA Configuration | — | Non-volatile |
| Logic Architecture | — | Field-programmable gate array |
| Product Category | — | Embedded FPGA |
| Package Pin Count | — | 36 balls |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |